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DESCRIPTION
The WM8750L is a low power, high quality stereo CODEC designed for portable digital audio applications. The device integrates complete interfaces to stereo or mono microphones and a stereo headphone. External component requirements are drastically reduced as no separate microphone or headphone amplifiers are required. Advanced on-chip digital signal processing performs graphic equaliser, 3-D sound enhancement and automatic level control for the microphone or line input. The WM8750L can operate as a master or a slave, with various master clock frequencies including 12 or 24MHz for USB devices, or standard 256fs rates like 12.288MHz and 24.576MHz. Different audio sample rates such as 96kHz, 48kHz, 44.1kHz are generated directly from the master clock without the need for an external PLL. The WM8750L operates at supply voltages down to 1.8V, although the digital core can operate at voltages down to 1.42V to save power, and the maximum for all supplies is 3.6 Volts. Different sections of the chip can also be powered down under software control. The WM8750L is supplied in a very small and thin 5x5mm QFN package, ideal for use in hand-held and portable systems.
WM8750L
Stereo CODEC for Portable Audio Applications
FEATURES
• • • • • DAC SNR 98dB (‘A’ weighted), THD –84dB at 48kHz, 3.3V ADC SNR 95dB (‘A’ weighted), THD -82dB at 48kHz, 3.3V Complete Stereo / Mono Microphone Interface - Programmable ALC / Noise Gate On-chip 400mW BTL Speaker Driver (mono) On-chip Headphone Driver - >40mW output power on 16Ω / 3.3V - THD –80dB at 20mW, SNR 90dB with 16Ω load - No DC blocking capacitors required (capless mode) Separately mixed mono output Digital Graphic Equaliser Low Power - 7mW stereo playback (1.8V / 1.5V supplies) - 14mW record & playback (1.8V / 1.5V supplies) Low Supply Voltages - Analogue 1.8V to 3.6V - Digital core: 1.42V to 3.6V - Digital I/O: 1.8V to 3.6V 256fs / 384fs or USB master clock rates: 12MHz, 24MHz Audio sample rates: 8, 11.025, 16, 22.05, 24, 32, 44.1, 48, 88.2, 96kHz generated internally from master clock 5x5x0.9mm QFN package
• • • •
• • •
APPLICATIONS
• • • • MP3 Player / Recorder AAC/WMA/Multi-Format Player / Recorder Minidisc Player / Recorder Portable Digital Music Systems
BLOCK DIAGRAM
WOLFSON MICROELECTRONICS plc
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Production Data, August 2005, Rev 4.2
Copyright 2005 Wolfson Microelectronics plc
WM8750L TABLE OF CONTENTS
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DESCRIPTION .......................................................................................................1 FEATURES.............................................................................................................1 APPLICATIONS .....................................................................................................1 BLOCK DIAGRAM .................................................................................................1 TABLE OF CONTENTS .........................................................................................2 PIN CONFIGURATION...........................................................................................4 ORDERING INFORMATION ..................................................................................4 PIN DESCRIPTION ................................................................................................5 ABSOLUTE MAXIMUM RATINGS.........................................................................6 RECOMMENDED OPERATION CONDITIONS .....................................................6 ELECTRICAL CHARACTERISTICS ......................................................................7
OUTPUT PGA’S LINEARITY ......................................................................................... 9 HEADPHONE OUTPUT THD VERSUS POWER......................................................... 10 SPEAKER THD AND NOISE VERSUS POWER ......................................................... 11
POWER CONSUMPTION ....................................................................................12 SIGNAL TIMING REQUIREMENTS .....................................................................13
SYSTEM CLOCK TIMING............................................................................................ 13 AUDIO INTERFACE TIMING – MASTER MODE ......................................................... 13 AUDIO INTERFACE TIMING – SLAVE MODE ............................................................ 14
INTERNAL POWER ON RESET CIRCUIT ..........................................................17 DEVICE DESCRIPTION.......................................................................................18
INTRODUCTION.......................................................................................................... 18 INPUT SIGNAL PATH.................................................................................................. 18 AUTOMATIC LEVEL CONTROL (ALC) ....................................................................... 25 OUTPUT SIGNAL PATH.............................................................................................. 29 ANALOGUE OUTPUTS ............................................................................................... 34 ENABLING THE OUTPUTS ......................................................................................... 36 HEADPHONE SWITCH ............................................................................................... 36 THERMAL SHUTDOWN .............................................................................................. 38 HEADPHONE OUTPUT ............................................................................................... 38 DIGITAL AUDIO INTERFACE...................................................................................... 39 AUDIO INTERFACE CONTROL .................................................................................. 43 CLOCKING AND SAMPLE RATES .............................................................................. 45 CONTROL INTERFACE .............................................................................................. 47 POWER SUPPLIES ..................................................................................................... 48 POWER MANAGEMENT ............................................................................................. 48
REGISTER MAP...................................................................................................51 DIGITAL FILTER CHARACTERISTICS ...............................................................52
TERMINOLOGY........................................................................................................... 52 DAC FILTER RESPONSES ......................................................................................... 53 ADC FILTER RESPONSES ......................................................................................... 54 DE-EMPHASIS FILTER RESPONSES ........................................................................ 55 HIGHPASS FILTER ..................................................................................................... 56
APPLICATIONS INFORMATION .........................................................................57
RECOMMENDED EXTERNAL COMPONENTS........................................................... 57 LINE INPUT CONFIGURATION................................................................................... 58 MICROPHONE INPUT CONFIGURATION .................................................................. 58 MINIMISING POP NOISE AT THE ANALOGUE OUTPUTS ........................................ 58 POWER MANAGEMENT EXAMPLES ......................................................................... 59
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IMPORTANT NOTICE ..........................................................................................61
ADDRESS.................................................................................................................... 61
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WM8750L PIN CONFIGURATION
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ORDERING INFORMATION
ORDER CODE W M8750LSEFL W M8750LSEFL/R Note: Reel quantity = 3500 TEMPERATURE RANGE -25°C to +85°C -25°C to +85°C PACKAGE 32-lead QFN (5x5x0.9mm) (Pb-free) 32-lead QFN (5x5x0.9mm) (Pb-free, tape and reel) MOISTURE PEAK SOLDERING SENSITIVITY LEVEL TEMPERATURE MSL1 MSL1 260oC 260oC
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PIN DESCRIPTION
PIN NO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Note: It is recommended that the QFN ground paddle should be connected to analogue ground on the application PCB. NAME MCLK DCVDD DBVDD DGND BCLK DACDAT DACLRC ADCDAT ADCLRC MONOOUT OUT3 ROUT1 LOUT1 HPGND ROUT2 LOUT2 HPVDD AVDD AGND VREF VMID MICBIAS RINPUT3 / HPDETECT LINPUT3 RINPUT2 LINPUT2 RINPUT1 LINPUT1 MODE CSB SDIN SCLK Supply Supply Supply Digital Input / Output Digital Input Digital Input / Output Digital Output Digital Input / Output Analogue Output Analogue Output Analogue Output Analogue Output Supply Analogue Output Analogue Output Supply Supply Supply Analogue Output Analogue Output Analogue Output Analogue Input Analogue Input Analogue Input Analogue Input Analogue Input Analogue Input Digital Input Digital Input Digital Input/Output Digital Input TYPE Digital Input Master Clock Digital Core Supply Digital Buffer (I/O) Supply Digital Ground (return path for both DCVDD and DBVDD) Audio Interface Bit Clock DAC Digital Audio Data Audio Interface Left / Right Clock/Clock Out ADC Digital Audio Data Audio Interface Left / Right Clock Mono Output Analogue Output 3 (can be used as Headphone Pseudo Ground) Right Output 1 (Line or Headphone) Left Output 1 (Line or Headphone) Supply for Analogue Output Drivers (LOUT1/2, ROUT1/2) Right Output 1 (Line or Headphone or Speaker) Left Output 1 (Line or Headphone or Speaker) Supply for Analogue Output Drivers (LOUT1/2, ROUT1/2, MONOUT) Analogue Supply Analogue Ground (return path for AVDD) Reference Voltage Decoupling Capacitor Midrail Voltage Decoupling Capacitor Microphone Bias Right Channel Input 3 or Headphone Plug-in Detection Left Channel Input 3 Right Channel Input 2 Left Channel Input 2 Right Channel Input 1 Left Channel Input 1 Control Interface Selection Chip Select / Device Address Selection Control Interface Data Input / 2-wire Acknowledge output Control Interface Clock Input DESCRIPTION
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WM8750L ABSOLUTE MAXIMUM RATINGS
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Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device. Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage conditions prior to surface mount assembly. These levels are: MSL1 = unlimited floor life at 0.5465fs 0.5465fs -50 dB f > 0.584fs +/- 0.03dB -6dB 0.584fs -50 0 0.5fs +/- 0.03 dB 0.4535fs dB +/- 0.03dB -6dB 0 0.5fs +/-0.03 dB 0.416fs -60 3.7 10.4 21.6 dB Hz -60 0 0.5fs +/- 0.05 dB 0.4535fs dB dB
ADC Filter Type 1 (USB mode, 272fs or Normal mode operation)
DAC Filter Type 1 (USB mode, 272fs or Normal mode operation)
Table 47 ADC/DAC Digital Filters Group Delay
TERMINOLOGY
1. 2. Stop Band Attenuation (dB) – the degree to which the frequency spectrum is attenuated (outside audio band) Pass-band Ripple – any variation of the frequency response in the pass-band region
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WM8750L
0.02
DAC FILTER RESPONSES
0
0.01
-20
0
Response (dB)
-40
Response (dB)
0 0.5 1 1.5 Frequency (Fs) 2 2.5 3
-0.01 -0.02 -0.03 -0.04 -0.05
-60
-80
-100
-0.06 0 0.05 0.1 0.15 0.2 0.25 0.3 Frequency (Fs) 0.35 0.4 0.45 0.5
Figure 28 DAC Digital Filter Frequency Response – Type 0 Figure 29 DAC Digital Filter Ripple – Type 0
0.02
0
0.01
-20
0
Response (dB)
-40
Response (dB)
-0.01 -0.02 -0.03 -0.04
-60
-80
-0.05
-100 0 0.5 1 1.5 Frequency (Fs) 2 2.5 3
-0.06 0 0.05 0.1 0.15 0.2 0.25 0.3 Frequency (Fs) 0.35 0.4 0.45 0.5
Figure 30 DAC Digital Filter Frequency Response – Type 1 Figure 31 DAC Digital Filter Ripple – Type 1
0.02
0
0.01
-20
0
Response (dB)
-40
Response (dB)
-0.01 -0.02 -0.03 -0.04
-60
-80
-0.05
-100 0 0.5 1 1.5 Frequency (Fs) 2 2.5 3
-0.06 0 0.05 0.1 0.15 Frequency (Fs) 0.2 0.25
Figure 32 DAC Digital Filter Frequency Response – Type 2 Figure 33 DAC Digital Filter Ripple – Type 2
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0.25
0
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0.2
-20
0.15 0.1
Response (dB)
Response (dB)
-40
0.05 0 -0.05 -0.1
-60
-80
-0.15 -0.2
-100 0 0.5 1 1.5 Frequency (Fs) 2 2.5 3
-0.25 0 0.05 0.1 0.15 Frequency (Fs) 0.2 0.25
Figure 34 DAC Digital Filter Frequency Response – Type 3 Figure 35 DAC Digital Filter Ripple – Type 3
ADC FILTER RESPONSES
0.04
0
0.03
-20
0.02
Response (dB)
Response (dB)
0.01 0 -0.01 -0.02
-40
-60
-80
-0.03
-100 0 0.5 1 1.5 Frequency (Fs) 2 2.5 3
-0.04 0 0.05 0.1 0.15 0.2 0.25 0.3 Frequency (Fs) 0.35 0.4 0.45 0.5
Figure 36 ADC Digital Filter Frequency Response – Type 0
0
Figure 37 ADC Digital Filter Ripple – Type 0
0.02 0.01
-20
0
Response (dB)
-40
Response (dB)
-0.01 -0.02 -0.03 -0.04
-60
-80
-0.05
-100 0 0.5 1 1.5 Frequency (Fs) 2 2.5 3
-0.06 0 0.05 0.1 0.15 0.2 0.25 0.3 Frequency (Fs) 0.35 0.4 0.45 0.5
Figure 38 ADC Digital Filter Frequency Response – Type 1
Figure 39 ADC Digital Filter Ripple – Type 1
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0.25
0
WM8750L
0.2
-20
0.15 0.1
Response (dB)
Response (dB)
-40
0.05 0 -0.05 -0.1
-60
-80
-0.15 -0.2
-100 0 0.5 1 1.5 Frequency (Fs) 2 2.5 3
-0.25 0 0.05 0.1 0.15 Frequency (Fs) 0.2 0.25
Figure 40 ADC Digital Filter Frequency Response – Type 2
Figure 41 ADC Digital Filter Ripple – Type 2
0.25
0
0.2 0.15
-20
0.1
Response (dB)
Response (dB)
-40
0.05 0 -0.05 -0.1
-60
-80
-0.15 -0.2
-100 0 0.5 1 1.5 Frequency (Fs) 2 2.5 3
-0.25 0 0.05 0.1 0.15 Frequency (Fs) 0.2 0.25
Figure 42 ADC Digital Filter Frequency Response – Type 2
Figure 43 ADC Digital Filter Ripple – Type 3
DE-EMPHASIS FILTER RESPONSES
0
0.4 0.3
-2
0.2
Response (dB)
-4
Response (dB)
0.1 0 -0.1 -0.2
-6
-8
-0.3
-10 0 2000 4000 6000 8000 10000 Frequency (Fs) 12000 14000 16000
-0.4 0 2000 4000 6000 8000 10000 Frequency (Fs) 12000 14000 16000
Figure 44 De-emphasis Frequency Response (32kHz)
Figure 45 De-emphasis Error (32kHz)
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0
0.4 0.3
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-2
0.2
Response (dB)
-4
Response (dB)
0.1 0 -0.1 -0.2
-6
-8
-0.3 -0.4
-10 0 5000 10000 Frequency (Fs) 15000 20000
0
5000
10000 Frequency (Fs)
15000
20000
Figure 46 De-emphasis Frequency Response (44.1kHz)
0
Figure 47 De-emphasis Error (44.1kHz)
0.4 0.3
-2
0.2
Response (dB)
-4
Response (dB)
0.1 0 -0.1 -0.2
-6
-8
-0.3 -0.4
-10 0 5000 10000 Frequency (Fs) 15000 20000
0
5000
10000 Frequency (Fs)
15000
20000
Figure 48 De-emphasis Frequency Response (48kHz)
Figure 49 De-emphasis Error (48kHz)
HIGHPASS FILTER
The WM8750L has a selectable digital highpass filter in the ADC filter path to remove DC offsets. The filter response is characterised by the following polynomial:
H(z) =
1 - z-1 1 - 0.9995z-1
0
Response (dB)
-5
-10
-15
0
0.0005
0.001 Frequency (Fs)
0.0015
0.002
Figure 50 ADC Highpass Filter Response
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APPLICATIONS INFORMATION
RECOMMENDED EXTERNAL COMPONENTS
Figure 51 Recommended External Components Diagram
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WM8750L
LINE INPUT CONFIGURATION
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W hen LINPUT1/RINPUT1 or LINPUT2/RINPUT2 are used as line inputs, the microphone boost and ALC functions should normally be disabled. In order to avoid clipping, the user must ensure that the input signal does not exceed AVDD. This may require a potential divider circuit in some applications. It is also recommended to remove RF interference picked up on any cables using a simple first-order RC filter, as high-frequency components in the input signal may otherwise cause aliasing distortion in the audio band. AC signals with no DC bias should be fed to the WM8750L through a DC blocking capacitor, e.g. 1µF.
MICROPHONE INPUT CONFIGURATION
MICBIAS R1 680 Ohm to 2.2kOhm check microphone's specification LINPUT1/2/3 RINPUT1/2/3
FROM MICROPHONE
C2 1uF AGND R2 47kOhm C1 220pF
AGND
AGND
Figure 52 Recommended Circuit for Line Input For interfacing to a microphone, the ALC function should be enabled and the microphone boost switched on. Microphones held close to a speaker’s mouth would normally use the 13dB gain setting, while tabletop or room microphones would need a 29dB boost. The recommended application circuit is shown above. R1 and R2 form part of the biasing network (refer to Microphone Bias section). R1 connected to MICBIAS is necessary only for electret type microphones that require a voltage bias. R2 should always be present to prevent the microphone input from charging to a high voltage which may damage the microphone on connection. R1 and R2 should be large so as not to attenuate the signal from the microphone, which can have source impedance greater than 2kOhm. C1 together with the source impedance of the microphone and the WM8750L input impedance forms an RF filter. C2 is a DC blocking capacitor to allow the microphone to be biased at a different DC voltage to the MICIN signal.
MINIMISING POP NOISE AT THE ANALOGUE OUTPUTS
To minimise any pop or click noise when the system is powered up or down, the following procedures are recommended.
POWER UP
• Switch on power supplies. By default the WM8750L is in Standby Mode, the DAC is digitally muted and the Audio Interface, Line outputs and Headphone outputs are all OFF (DACMU = 1 Power Management registers 1 and 2 are all zeros). Enable Vmid and VREF. Enable DACs as required Enable line and / or headphone output buffers as required. Set DACMU = 0 to soft-un-mute the audio DACs.
• • • • • • •
POWER DOWN
Set DACMU = 1 to soft-mute the audio DACs. Disable all output buffers. Switch off the power supplies. PD Rev 4.2 August 2005 58
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POWER MANAGEMENT EXAMPLES
OPERATION MODE
VREF
POWER MANAGEMENT (1)
AINL/R
POWER MANAGEMENT (2) DACs
MBI DAL DAR LO1
PGAs
ADCs
ADR
Output Buffers
RO1 LO2 RO2 MO HPD
PGL PGR ADL
Stereo Headphone Playback Stereo Line-in Record Stereo Microphone Record Mono Microphone Record Stereo Line-in to Headphone Out Phone Call Speaker Phone Call [ROUT2INV = 1] Record Phone Call [L channel = mic with boost, R channel = RX, enable mono mix]
1 1 1 1 1 1 1 1
0 1 1 1 1 1 1 1
0 1 1 1 0 1 1 1
0 1 1 0 0 0 0 1
0 1 1 1 0 0 0 1
0 1 1 0 0 0 0 1
0 0 1 1 0 1 1 1
1 0 0 0 0 0 0 0
1 0 0 0 0 0 0 0
1 0 0 0 1 1 0 1
1 0 0 0 1 1 0 1
0 0 0 0 0 0 1 0
0 0 0 0 0 0 1 0
0 0 0 0 0 1 1 1
x 0 0 0 x x 0 x
Table 48 Register Settings for Power Management
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WM8750L PACKAGE DIMENSIONS
FL: 32 PIN QFN PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm LEAD PITCH DM030.E
Production Data
CORNER TIE BAR 5 25
D2 B D2/2 32
SEE DETAIL A
D
L 24 EXPOSED GROUND 6 PADDLE A 1 INDEX AREA (D/2 X E/2) E2/2
E2
SEE DETAIL B
E
17
8 2X 16 e 15 B 9 b 2X aaa C aaa C
BOTTOM VIEW
ccc C (A3) 1 A 0.08 C bbb M C A B 1
TOP VIEW
DETAIL A
32x b
CORNER TIE BAR 5
C
SIDE VIEW
SEATING PLANE
1 e/2 TERMINAL TIP
A1
L
0. 43 m m 0.5
32x K
DETAIL B
DATUM
66 m m
EXPOSED GROUND PADDLE
R
1 L1
e
Symbols A A1 A3 b D D2 E E2 e L L1 R K aaa bbb ccc REF: MIN 0.85 0 0.18 4.90 3.2 4.90 3.2 0.35
1 b(min)/2 0.20 Tolerances of Form and Position 0.15 0.10 0.10 JEDEC, MO-220, VARIATION VHHD-2
Dimensions (mm) NOM MAX 0.90 1.00 0.02 0.05 0.2 REF 0.23 0.30 5.00 5.10 3.3 3.4 5.00 5.10 3.3 3.4 0.5 BSC 0.4 0.45 0.1
L1
R
NOTE
1 2 2
NOTES: 1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. DIMENSION L1 REPRESENTS TERMINAL PULL BACK FROM PACKAGE SIDE WALL. MAXIMUM OF 0.1mm IS ACCEPTABLE. WHERE TERMINAL PULL BACK EXISTS, ONLY UPPER HALF OF LEAD IS VISIBLE ON PACKAGE SIDE WALL DUE TO HALF ETCHING OF LEADFRAME. 2. FALLS WITHIN JEDEC, MO-220 WITH THE EXCEPTION OF D2, E2: D2,E2: LARGER PAD SIZE CHOSEN WHICH IS JUST OUTSIDE JEDEC SPECIFICATION 3. ALL DIMENSIONS ARE IN MILLIMETRES 4. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE. 5. SHAPE AND SIZE OF CORNER TIE BAR MAY VARY WITH PACKAGE TERMINAL COUNT. CORNER TIE BAR IS CONNECTED TO EXPOSED PAD INTERNALLY. 6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
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IMPORTANT NOTICE
W olfson Microelectronics plc (WM) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current. All products are sold subject to the WM terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. WM warrants performance of its products to the specifications applicable at the time of sale in accordance with WM’s standard warranty. Testing and other quality control techniques are utilised to the extent WM deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. In order to minimise risks associated with customer applications, adequate design and operating safeguards must be used by the customer to minimise inherent or procedural hazards. Wolfson products are not authorised for use as critical components in life support devices or systems without the express written approval of an officer of the company. Life support devices or systems are devices or systems that are intended for surgical implant into the body, or support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided, can be reasonably expected to result in a significant injury to the user. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. WM assumes no liability for applications assistance or customer product design. WM does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of WM covering or relating to any combination, machine, or process in which such products or services might be or are used. WM’s publication of information regarding any third party’s products or services does not constitute WM’s approval, license, warranty or endorsement thereof. Reproduction of information from the WM web site or datasheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation or reproduction of this information with alteration voids all warranties provided for an associated WM product or service, is an unfair and deceptive business practice, and WM is not responsible nor liable for any such use. Resale of WM’s products or services with statements different from or beyond the parameters stated by WM for that product or service voids all express and any implied warranties for the associated WM product or service, is an unfair and deceptive business practice, and WM is not responsible nor liable for any such use.
ADDRESS
W olfson Microelectronics plc Westfield House 26 Westfield Road Edinburgh EH11 2QB United Kingdom Tel :: +44 (0)131 272 7000 Fax :: +44 (0)131 272 7001 Email :: sales@wolfsonmicro.com
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WM8750L
Revision History DATE RELEASE May 2002 Rev 1.5 DESCRIPTION OF CHANGES Added Power Management section Added MICBIAS off switch Modified ADC mono mixing Moved and clarified 3D enhance function Updated register map 18 Sept 2002 Rev 1.62 Pinout Added differential input option Added DATSEL function Updated register map Added filter characteristics 26 Sept 2002 2 Oct 2002 Rev 1.63 Thermal Shutdown added Headset Switch added ADCDIV2 and DACDIV2 control bits added Rev 1.64 Separate DAC and ADC 3D filters removed – 3D now available on DAC or ADC VSEL register and description added ROUT2 invert added MONOMIX register description updated VMIDSEL Vmid divider select added 9 Oct 2002 Rev 1.65 Added DSP mode diagram and modified LRP description Updated table for DACMONOMIX Register Map address for 3D corrected 15 Nov 2002 Rev 1.7 LIVU & RIVU named correctly and description updated in table 8 DACINV DAC phase invert description added BCLKINV bit added Added page references to register map De-emphasis & Highpass filter characteristics added 19 Nov 2002 22 Nov 2002 20 Jan 2003 Rev 1.71 Rev 1.72 Rev 1.73 Max. soldering temperature raised to 260°C Updated package diagram Updated package diagram (dimensions A, D, D2, E, E2) Updated THD/output power data, inserted THD vs power graphs Updated power consumption data L/RMICBOOST function corrected (added 20dB gain) Mixer Gains inverted L/RINMUTE: added note saying L/RIVU must be set for un-muting 22 Jan 2003 11 Feb 2003 Rev 1.74 Rev 1.75 Updated THD versus output power graphs Added line-out modification: updated block diagram, OUT3 description, line-out description and diagram Order Codes: Tape and reel + lead free options added Pin Description, pin 9 Electrical Characteristics, Headphone Output Headphone/Speaker Output Power Consumption 3D Stereo Enhancement, Important Note added Headphone Switch, note added LINEOUTPUT Audio Interface Output Tri-state, Master Mode ADCLRC/DACLRC Enable and Clock Output added 2-Wire Serial Control Interface, Fig 18 and Table 36 updates Power Management Table Register Map, R27 added, R20 and R24 updated Added recommended external components diagram and description Updated package diagram 27 Feb 2003 Rev 1.76 Added VROI bit and description
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