B9S

B9S

  • 厂商:

    WTE

  • 封装:

  • 描述:

    B9S - 0.5A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER - Won-Top Electronics

  • 详情介绍
  • 数据手册
  • 价格&库存
B9S 数据手册
WTE POWER SEMICONDUCTORS B1S – B10S Pb 0.5A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Features ! Glass Passivated Die Construction G ! Low Forward Voltage Drop ! High Current Capability ! High Surge Current Capability ! Designed for Surface Mount Application B ! Plastic Material – UL Flammability 94V-O ! Recognized File # E157705  ~ + ~ H D C E A L MB-S Dim Min Max 4.50 4.90 A 3.80 4.20 B 0.15 0.35 C — 0.20 D — 7.00 E 0.70 1.10 G 1.30 1.70 H 2.30 2.70 J 2.30 2.70 K — 3.00 L All Dimensions in mm Mechanical Data ! ! ! ! ! ! ! Case: MB-S, Molded Plastic Terminals: Plated Leads Solderable per MIL-STD-202, Method 208 Polarity: As Marked on Case Weight: 0.22 grams (approx.) Mounting Position: Any Marking: Type Number Lead Free: For RoHS / Lead Free Version, Add “-LF” Suffix to Part Number, See Page 4 J K Maximum Ratings and Electrical Characteristics Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. @TA=25°C unless otherwise specified Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current (Note 1) @TA = 40°C Average Rectified Output Current (Note 2) @TA = 40°C Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) I2t Rating for Fusing (t < 8.3ms) Forward Voltage per element Peak Reverse Current At Rated DC Blocking Voltage @IF = 0.5A @TA = 25°C @TA = 125°C Symbol VRRM VRWM VR VR(RMS) IO B1S B2S B4S B6S B8S B10S Unit 100 70 200 140 400 280 0.5 0.8 30 5.0 1.0 5.0 500 25 85 20 600 420 800 560 1000 700 V V A IFSM I2t VFM IRM Cj RJA RJL Tj, TSTG A A2s V µA pF °C/W °C Typical Junction Capacitance per leg (Note 3) Typical Thermal Resistance per leg (Note 1) Operating and Storage Temperature Range -55 to +150 Note: 1. Mounted on glass epoxy PC board with 1.3mm2 solder pad. 2. Mounted on aluminum substrate PC board with 1.3mm2 solder pad. 3. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C. B1S – B10S 1 of 4 © 2006 Won-Top Electronics I(AV), AVERAGE FORWARD RECTIFIED CURRENT (A) 0.6 Al. Substrate PC Board IF, INSTANTANEOUS FORWARD CURRENT (A) 0.8 10 1.0 0.4 Glass Epoxy PC Board 0.1 0.2 0 Resistive or Inductive Load 0.01 0.2 0.4 0.6 0.8 1.0 Tj = 25°C Pulse Width = 300µs 0 40 80 120 160 1.2 1.4 1.6 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Output Current Derating Curve VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics (per leg) IFSM, PEAK FORWARD SURGE CURRENT (A) 35 30 Cj, JUNCTION CAPACITANCE (pF) 100 Tj = 25°C f = 1.0MHz 20 10 10 TA = 25°C Single Half Sine-Wave Pulse Width = 5.3ms (JEDEC Method) 0 1 1.0 10 1 10 VR, REVERSE VOLTAGE (V) Fig. 4 Typical Junction Capacitance 100 NUMBER OF CYCLES AT 60 Hz Fig. 3 Maximum Peak Forward Surge Current (per leg) IR, INSTANTANEOUS REVERSE CURRENT (µA) 100 10 Tj = 125°C 1.0 0.1 Tj = 25°C 0.01 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 5 Typical Reverse Characteristics (per element) B1S – B10S 2 of 4 © 2006 Won-Top Electronics MARKING INFORMATION RECOMMENDED FOOTPRINT 0.03 MIN (0.76 MIN) inches(mm) - WTE BxS + 0.272 MAX (6.91 MAX) WTE BxS x Polarity = Manufacturer’s Logo = Device Number = 1, 2, 4, 6, 8 or 10 = As Marked on Body 0.105(2.67) 0.095(2.41) 0.023 MIN (0.58 MIN) PACKAGING INFORMATION TAPE & REEL Direction of Unreeling 8mm 330mm 12mm 4mm 12mm Product ID Label 1.6mm Reel Diameter (mm) 330 Quantity (PCS) 3,000 Inner Box Size L x W x H (mm) 340 x 337 x 45 Quantity (PCS) 6,000 Carton Size L x W x H (mm) 370 x 370 x 420 Quantity (PCS) 48,000 Approx. Gross Weight (KG) 15.0 Note: 1. Paper reel, white or gray color. 2. Components are packed in accordance with EIA standard 481-1 and 481-2. B1S – B10S 3 of 4 © 2006 Won-Top Electronics ORDERING INFORMATION Product No. B1S-T3 B2S-T3 B4S-T3 B6S-T3 B8S-T3 B10S-T3 1. 2. Package Type Mini Bridge SMD Mini Bridge SMD Mini Bridge SMD Mini Bridge SMD Mini Bridge SMD Mini Bridge SMD Shipping Quantity 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel Shipping quantity given is for minimum packing quantity only. For minimum order quantity, please consult the Sales Department. To order Lead Free version (with Lead Free finish), add “-LF” suffix to part number above. For example, B1S-T3-LF. Won-Top Electronics Co., Ltd (WTE) has checked all information carefully and believes it to be correct and accurate. However, WTE cannot assume any responsibility for inaccuracies. Furthermore, this information does not give the purchaser of semiconductor devices any license under patent rights to manufacturer. WTE reserves the right to change any or all information herein without further notice. WARNING: DO NOT USE IN LIFE SUPPORT EQUIPMENT. WTE power semiconductor products are not authorized for use as critical components in life support devices or systems without the express written approval. Won-Top Electronics Co., Ltd. No. 44 Yu Kang North 3rd Road, Chine Chen Dist., Kaohsiung, Taiwan Phone: 886-7-822-5408 or 886-7-822-5410 Fax: 886-7-822-5417 Email: sales@wontop.com Internet: http://www.wontop.com We power your everyday. B1S – B10S 4 of 4 © 2006 Won-Top Electronics
B9S
### 物料型号 - B1S – B10S:表示这是一系列不同型号的桥式整流器,其中“B”后跟的数字表示不同型号。

### 器件简介 - 0.5A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER:描述了这是一种0.5安培的表面贴装式玻璃钝化桥式整流器。

### 引脚分配 - Polarity: As Marked on Case:指出极性标记在器件本体上。 - Terminals: Plated Leads Solderable per MIL-STD-202, Method 208 K:引脚为镀层引线,符合MIL-STD-202标准方法208K。

### 参数特性 - Glass Passivated Die Construction:玻璃钝化芯片结构。 - Low Forward Voltage Drop:低正向电压降。 - High Current Capability:高电流能力。 - High Surge Current Capability:高浪涌电流能力。 - Designed for Surface Mount Application:为表面贴装应用设计。

### 功能详解 - Plastic Material – UL Flammability 94V-O:塑料材料,UL可燃性等级94V-O。 - Recognized File # E157705 C:认可文件编号E157705 C。

### 应用信息 - Designed for Surface Mount Application:为表面贴装应用设计,适用于需要高电流和高浪涌电流能力的电路。

### 封装信息 - Case: MB-S, Molded Plastic:封装类型为MB-S,塑封。 - Marking: Type Number:标记包括类型编号。 - Lead Free: For RoHS / Lead Free Version, Add “-LF” Suffix to Part Number, See Page 4:无铅版本,在型号后加“-LF”后缀。

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