171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
2.5V – 5.5V / 1A / 0.8V – 5.5V Output
DESCRIPTION
FEATURES
The VDMM 171010502 MagI3C MicroModule provides a
fully integrated DC-DC power supply including the
switching regulator
with
integrated
MOSFETs ,
compensation, shielded inductor and input capacitor in one
package.
The 171010502 offers high efficiency and delivers up to 1A
of output current. It operates with an input voltage from
2.5V to 5.5V and is designed for a small solution size.
The selectable forced PWM or PFM/PWM mode allows for
the choice between high efficiency and low output voltage
ripple at light load.
It is available in an LGA-6EP package (3.2 x 2.5 x
1.55mm).
This module has integrated protection circuitry that guards
against thermal overstress with thermal shutdown and
protects against electrical damage using overcurrent,
short-circuit and undervoltage protections.
Peak efficiency up to 96%
Current capability up to 1A
Input voltage range: 2.5V to 5.5V
Output voltage range: 0.8V to 5.5V
25 µA typical quiescent current
Integrated shielded inductor and input capacitor
Low output voltage ripple: ±6mV typ.
Output voltage accuracy over temperature: 2% max.
Fixed switching frequency: 4 MHz
Constant On-Time control
Synchronous operation
Selectable forced PWM or PFM/PWM mode
Undervoltage lockout protection (UVLO)
Embedded soft-start
Thermal shutdown
Short-circuit protection
Cycle-by-cycle current limit
RoHS und REACh compliant
Operating ambient temperature up to 85°C
Operating junction temp. range: -40 to 125°C
Complies with EN55032 class B radiated emissions
standard
TYPICAL APPLICATIONS
General point of load power supply for low power
systems
Replacement of linear regulators
DSP and FPGA power supply auxiliary voltages
Portable instruments
Battery powered equipment
TYPICAL CIRCUIT DIAGRAM
VIN
4
5
CIN
2
Module
VIN
VOUT
1
VOUT
RFBT
EN
FB
MODE
PGND
EP
PGND
CFF
3
COUT
RFBB
6
GND
GND
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
PACKAGE
FB
3
MODE
2
VOUT
1
T56
yw
5
EN
4
VIN
6
PGND
Top View
VOUT
1
MODE
2
PGND
EP
PGND
EP
PGND
EP
PGND
EP
5
EN
6
PGND
FB
3
4
VIN
Bottom view
MARKING DESCRIPTION
MARKING
T56
y
w
DESCRIPTION
Marking Coder
Date Code (year)
Date Code (month)
PIN DESCRIPTION
SYMBOL
NUMBER
TYPE
VOUT
1
Power
MODE
2
Input
FB
3
Input
VIN
4
Power
EN
5
Input
PGND
6
Power
PGND
EP
Exposed Pads
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DESCRIPTION
Output voltage. Place output capacitors as close as possible. For best
thermal performance use copper plane(s) at this pin.
Forced PWM or PFM/PWM mode selection pin. Setting this pin high, the
forced PWM mode is selected for any load current. Setting this pin low,
PFM/PWM is selected, with the transition automatically between the two
operations according to the load. This pin must not be left floating.
Feedback pin. This pin must be connected to the external resistor divider
(between VOUT and GND) to adjust the output voltage.
Input voltage. Place the input capacitor as close as possible.
Enable pin. Setting this pin high enables the device, while setting this pin low
shuts down the device. This pin must not be left floating.
Power Ground. It must be connected to the ground plane and the Thermal
Pads.
Exposed Pads. These pins are internally electrically connected to PGND. It is
recommended to connect them to the ground plane for device heat
dissipation
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
ORDERING INFORMATION
ORDER CODE
SPECIFICATIONS
PACKAGE
PACKAGING UNIT
171010502
1A / 0.8-5.5Vout version
LGA-6EP
Reel (2000 pieces)
178010502
1A / 0.8-5.5Vout version
Eval Board
SALES INFORMATION
SALES CONTACTS
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 7942 945 0
www.we-online.com/powermodules
Technical support: powermodules@we-online.com
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
ABSOLUTE MAXIMUM RATINGS
Caution:
Exceeding the listed absolute maximum ratings may affect the device negatively and may cause permanent damage.
SYMBOL
VIN
PARAMETER
LIMITS
MIN
(1)
MAX
UNIT
(1)
Input voltage
-0.3
6
V
VOUT
Output voltage
-0.3
VIN+0.3
V
FB
Feedback pin
-0.3
VIN+0.3
V
EN
Enable pin
-0.3
VIN+0.3
V
MODE
Mode pin
-0.3
VIN+0.3
V
Tstorage
Assembled, non-operating storage temperature
-65
150
°C
-4
4
kV
VESD
ESD voltage (HBM), all pins (C=100pF, R= 1.5kΩ)
OPERATING CONDITIONS
Operating conditions are conditions under which the device is intended to be functional. All values are referenced to GND.
MIN and MAX limits are valid for the recommended ambient temperature range of -40°C to 85°C. Typical values represent
statistically the utmost probable values at the following conditions: VIN = 5V, VOUT = 1.8V, C IN = 4.7µF, COUT =10µF ceramic,
unless otherwise noted.
SYMBOL
VIN
VOUT
PARAMETER
MIN (1)
TYP
(2)
MAX
(1)
UNIT
Input voltage
2.5
-
5.5
V
Output voltage (depending on the external resistor divider)
0.8
-
5.5
V
(3)
TA
Ambient temperature range
-40
-
85
TJOP
Junction temperature range
-40
-
125
°C
°C
IOUT
Nominal output current
1
A
THERMAL SPECIFICATIONS
SYMBOL
ӨJA
TSD
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PARAMETER
TYP
(2)
UNIT
Junction-to-ambient thermal resistance (4)
150
°C/W
Thermal shutdown, rising
160
°C
Thermal shutdown hysteresis, falling
10
°C
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
ELECTRICAL SPECIFICATIONS
MIN and MAX limits are valid for the recommended ambient temperature range of -40°C to 85°C. Typical values represents
statistically the utmost probable values at the following conditions: VIN = 5V, VOUT = 1.8V, C IN = 4.7µF, COUT =10µF ceramic,
unless otherwise noted.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN (1)
TYP
(2)
MAX
(1)
UNIT
Output current
IOCP
1.5
2.3
3.0
A
TA = 25°C
0.784
0.8
0.816
V
Temperature variation
Input current feedback
pin
Line regulation
-40°C ≤ TA ≤ 85°C
0.784
0.8
0.816
V
-50
0
50
nA
VIN = VOUT+1 to 5.5V, MODE = low
-
0.05
-
%/V
Load regulation
500mA < ILOAD < 1A
VIN = 3.6V, VOUT = 1.8V, IOUT = 100mA
MODE = high, 20MHz BW,
TA = 25°C (5)
VIN = 3.6V, VOUT = 1.8V, IOUT = 100mA
MODE = low, 20MHz BW,
TA = 25°C (5)
-
-0.9
-
%/A
-
6
-
mV
-
65
-
mV
3.6
4
4.4
MHz
VIN increasing
2
2.2
2.4
V
TA = 25°C
-
170
-
mV
1.2
-
-
V
-
-
0.4
V
-1
-
1
µA
1.2
-
-
V
-
-
0.4
V
Overcurrent protection
TA = 25°C
Reference voltage
Output accuracy
VFB
IFB
VOUT
Output voltage ripple
Switching frequency
fSW
Switching frequency
Enable and undervoltage lockout
VUVLO
VENABLE
IENABLE
VMODE
IMODE
VIN undervoltage
threshold
VIN undervoltage
hysteresis
Enable threshold trip
point
Enable logic high voltage
TA = 25°C
Enable logic low voltage
TA = 25°C
Enable input current
MODE threshold trip
point
MODE current
consumption
MODE selection
Mode logic high voltage
TA = 25°C
Mode logic low voltage
TA = 25°C
MODE = high, TA = 25°C
75
nA
MODE = low, TA = 25°C
-60
nA
128
µs
Soft-Start
tSS
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Soft-start duration
TA = 25°C (rising edge to 95% of VOUT)
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
ELECTRICAL SPECIFICATIONS
MIN and MAX limits are valid for the recommended ambient temperature ran ge of -40°C to 85°C. Typical values represents
statistically the utmost probable values at the following conditions: VIN = 5V, VOUT = 1.8V, C IN = C OUT =10µF ceramic, unless
otherwise noted.
SYMBOL
η
PARAMETER
TEST CONDITIONS
Efficiency
VIN = 3.6V, VOUT = 1.8V,
IOUT = 50mA MODE = low
VIN = 5V, VOUT = 3.3V,
IOUT = 50mA MODE = low
VIN = 3.6V, VOUT = 1.8V,
IOUT = 200mA, MODE = high
VIN = 5V, VOUT = 3.3V,
IOUT = 200mA, MODE = high
VIN = 3.6V, VOUT = 3.3V,
IOUT = 200mA, MODE = low
Efficiency
MIN (1)
TYP
(2)
MAX
(1)
UNIT
-
87
-
%
-
90
-
%
-
88
-
%
-
90
-
%
-
96
-
%
-
0.5
-
µA
-
13
-
mA
-
25
-
µA
-
25
-
µA
-
25
-
µA
Input quiescent/shutdown current
ISD
IIN
IQ
Shutdown quiescent
current
No load input current
Quiescent current
VENABLE = 0V, TA = 25°C, VIN = 5V
MODE = high, EN = high,
switching with no load,
VOUT = 1.8V, TA = 25°C
MODE = low, EN = high,
switching with no load,
VOUT = 1.8V, TA = 25°C
MODE = high, EN = high,
no switching,
VOUT = 1.8V, TA = 25°C
MODE = low, EN = high,
no switching,
VOUT = 1.8V, TA = 25°C
RoHS, REACh
RoHS
directive
Directive 2011/65/EU of the European Parliament and the Council of June
8th, 2011 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
REACh
directive
Directive 1907/2006/EU of the European Parliament and the Council of
June 1st, 2007 regarding the Registration, Evaluation, Authorization and
Restriction of Chemicals (REACh).
PACKAGE SPECIFICATIONS
Weight
Molding compound
UL class
Certificate number
0.0416g
None
Not applicable
Not applicable
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
NOTES
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed
through correlation using Statistical Quality Control (SQC) methods.
(2) Typical numbers are valid at 25°C ambient temperature and represent statistically the utmost probable values assuming
a Gaussian distribution.
(3) Depending on heat sink design, number of PCB layers, copper thickness and air flow.
(4) Measured on a 101.5 x 114.5 mm one layer board, with 70µm (2 ounce) copper, no air flow, according to JESD51-9.
(5) The industry standard for comparison of the output voltage ripple between switching regulators or modules requires a
10µF ceramic (sometimes additional 1µF ceramic in parallel) at the point of load where the voltage measurement is done
using an oscilloscope with its probe and probe jack designed for low voltage/high frequency (low impedance)
measurement. The oscilloscopes bandwidth is limited at 20MHz.
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
TYPICAL PERFORMANCE CURVES
If not otherwise specified, the following conditions apply: VIN = 5V; C IN = 4.7µF X5R ceramic; C OUT = 10µF X5R ceramic,
CFF = 22pF, TAMB = 25°C.
RADIATED EMISSIONS EN55032 (CISPR-32) CLASS B COMPLIANT
Measured with module on an Evaluation Board 178010502 in a Fully Anechoic Room (FAR) at 3m antenna distance.
Without input filter
70
Radiated Emissions 171010502 (3m Antenna Distance)
VIN = 5V, VOUT = 3.3V, ILOAD = 1A without input filter
Horizontal
Vertical
Radiated Emissions [dBµV/m]
60
EN55032 Class A limit
50
EN55032 Class B limit
40
30
20
10
0
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30
100
Frequency [MHz]
1000
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
With input filter
Radiated Emissions 171010502 (3m Antenna Distance)
VIN = 5V, VOUT = 3.3V, ILOAD = 1A
Input Pi-FIlter: 22µF (885012107011), 1.5µH (74438343015)
and 4.7µF (885012107013)
Horizontal
Vertical
70
Radiated Emissions [dBµV/m]
60
EN55032 Class A limit
50
EN55032 Class B limit
40
30
20
10
0
30
100
Frequency [MHz]
1000
The diagram above refers only to forced PWM mode. Nevertheless similar results would be obtained in PFM/PWM mode
because at this load current (1A) there is no difference between the two modes .
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
EFFICIENCY
171010502 V IN = 5V, Forced PWM Mode TA = 25 C
100
95
90
Efficiency [%]
85
80
Vout = 3.3V
75
Vout = 2.5V
70
Vout = 1.8V
Vout = 1.5V
65
Vout = 1.2V
60
55
50
0.00
0.25
0.50
0.75
1.00
Output Current [A]
171010502 V IN = 5V, PFM/PWM Mode TA = 25 C
100
95
90
Efficiency [%]
85
80
Vout = 3.3V
75
Vout = 2.5V
70
Vout = 1.8V
Vout = 1.5V
65
Vout = 1.2V
60
55
50
0.00
0.25
0.50
0.75
1.00
Output Current [A]
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
EFFICIENCY
171010502 V IN = 3.6V, Forced PWM Mode TA = 25 C
100
95
90
Efficiency [%]
85
80
Vout = 3.3V
75
Vout = 2.5V
70
Vout = 1.8V
Vout = 1.5V
65
Vout = 1.2V
60
55
50
0.00
0.25
0.50
0.75
1.00
Output Current [A]
171010502 V IN = 3.6V, PFM/PWM Mode TA = 25 C
100
95
90
Efficiency [%]
85
80
Vout = 3.3V
75
Vout = 2.5V
70
Vout = 1.8V
Vout = 1.5V
65
Vout = 1.2V
60
55
50
0,00
0,25
0,50
0,75
1,00
Output Current [A]
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
EFFICIENCY
171010502 V IN = 3.3V, Forced PWM Mode TA = 25 C
100
95
90
Efficiency [%]
85
80
Vout = 2.5V
75
Vout = 1.8V
70
Vout = 1.5V
65
Vout = 1.2V
60
55
50
0.00
0.25
0.50
0.75
1.00
Output Current [A]
171010502 VIN = 3.3V, PFM/PWM Mode TA = 25 C
100
95
90
Efficiency [%]
85
80
Vout = 2.5V
75
Vout = 1.8V
70
Vout = 1.5V
65
Vout = 1.2V
60
55
50
0.00
0.25
0.50
0.75
1.00
Output Current [A]
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
POWER DISSIPATION
171010502 V IN = 5V, Forced PWM Mode TA = 25 C
0.50
0.45
Power Dissipation [W]
0.40
0.35
0.30
Vout = 3.3V
0.25
Vout = 2.5V
0.20
Vout = 1.8V
Vout = 1.5V
0.15
Vout = 1.2V
0.10
0.05
0.00
0.00
0.25
0.50
0.75
1.00
Output Current [A]
171010502 V IN = 5V, PFM/PWM Mode TA = 25 C
0.50
0.45
Power Dissipation [W]
0.40
0.35
0.30
Vout = 3.3V
0.25
Vout = 2.5V
0.20
Vout = 1.8V
Vout = 1.5V
0.15
Vout = 1.2V
0.10
0.05
0.00
0.00
0.25
0.50
0.75
1.00
Output Current [A]
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
POWER DISSIPATION
171010502 V IN = 3.6V, Forced PWM Mode TA = 25 C
0.50
0.45
Power Dissipation [W]
0.40
0.35
0.30
Vout = 3.3V
0.25
Vout = 2.5V
0.20
Vout = 1.8V
Vout = 1.5V
0.15
Vout = 1.2V
0.10
0.05
0.00
0.00
0.25
0.50
0.75
1.00
Output Current [A]
171010502 V IN = 3.6V, PFM/PWM Mode TA = 25 C
0.50
0.45
Power Dissipation [W]
0.40
0.35
0.30
Vout = 3.3V
0.25
Vout = 2.5V
0.20
Vout = 1.8V
Vout = 1.5V
0.15
Vout = 1.2V
0.10
0.05
0.00
0.00
0.25
0.50
0.75
1.00
Output Current [A]
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
POWER DISSIPATION
171010502 V IN = 3.3V, Forced PWM Mode TA = 25 C
0.50
0.45
Power Dissipation [W]
0.40
0.35
0.30
Vout = 2.5V
0.25
Vout = 1.8V
0.20
Vout = 1.5V
0.15
Vout = 1.2V
0.10
0.05
0.00
0.00
0.25
0.50
0.75
1.00
Output Current [A]
171010502 V IN = 3.3V, PFM/PWM Mode TA = 25 C
0.50
0.45
Power Dissipation [W]
0.40
0.35
0.30
Vout = 2.5V
0.25
Vout = 1.8V
0.20
Vout = 1.5V
0.15
Vout = 1.2V
0.10
0.05
0.00
0.00
0.25
0.50
0.75
1.00
Output Current [A]
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
OUTPUT POWER DERATING
171010502 Current Thermal Derating
VIN = 3.6V, V OUT = 1.8V, θJA = 150 C/W
1.2
Output current [A]
1.0
0.8
0.6
0.4
0.2
70 C
120 C
0.0
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Ambient Temperature [ C]
171010502 Current Thermal Derating
VIN = 5V, VOUT = 3.3V, θJA = 150 C/W
1.2
Output current [A]
1.0
0.8
0.6
0.4
0.2
70 C
116 C
0.0
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Ambient Temperature [ C]
Note: see TA limits in Operating Conditions on page 4.
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
LOAD REGULATION
171010502 Load Regulation V IN = 3.6V, VOUT = 1.8V, TA = 25 C
1.85
Output voltage [V]
1.83
1.81
Forced PWM Mode
PFM/PWM Mode
1.79
1.77
PFM/PWM Mode
Forced PWM Mode
1.75
0
0.25
0.5
0.75
1
Output Current [A]
LINE REGULATION
171010502 Line Regulation VOUT = 1.8V, IOUT = 1A , TA = 25 C
1.85
1.84
Output voltage [V]
1.83
1.82
1.81
1.80
1.79
1.78
1.77
Forced PWM Mode
1.76
PFM/PWM Mode
1.75
2.5
2.7
2.9
3.1
3.3
3.5
3.7
3.9
4.1
4.3
4.5
4.7
4.9
5.1
5.3
5.5
Input Voltage [V]
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
BLOCK DIAGRAM
VIN
4
0.54µH
VIN
VOUT
VOUT
1
4.7µF
SS
UVLO
PWM Controller
Driver
Protections
Compensation network
RFBT
FB
CIN
OTP
SS
3
CFF
COUT
EA
VREF
0.8V
2
RFBB
MODE
SS
SS
PGND
6
PGND
EP
EN
5
CIRCUIT DESCRIPTION
The MagI³C MicroModule 171010502 is a synchronous step down regulator with integrated MOSFETs, a power inductor and
an input capacitor. The control scheme is based on a Constant On-Time (COT) regulation loop. An additional mode for light
load operation can be engaged based on the condition applied to the MODE pin.
The VOUT of the regulator is divided by the feedback resistor network RFBT and R FBB and fed into the FB pin. The internal
comparator compares this signal with the internal 0.8V reference. If the feedback voltage is below the reference, the high side
MOSFET is turned on for a fixed on-time.
The constant on-time control scheme does not require compensation circuitry which makes the overall design very simple.
Nevertheless , it requires a certain minimum ripple at the feedback pin. The MagI³C Power Module 171010502 generates this
ripple internally and is supported by the C FF capacitor which bypasses AC ripple directly to the feedback pin from the output.
With this architecture very small output ripple values under 10mV (similar to current or voltage mode devices) can be achieved.
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
DESIGN FLOW
The next four simple steps will show how to select the external components to design the 171010502 application.
Essential Steps
1.
2.
3.
4.
Set output voltage
Select input capacitor
Select output capacitor
Select the feed-forward capacitor
VIN
4
MODULE
VIN
VOUT
1
5 EN
CIN
2
VOUT
RFBT
FB
2 MODE
1
RFBB
6
GND
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COUT
3
PGND PGND
EP
3
CFF
4
GND
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
Step 1 Setting the output voltage (V OUT)
The output voltage is selected with an external resistor divider between VOUT and GND (see circuit below). The voltage
across the lower resistor of the divider is provided to the FB pin and compared with a reference voltage of 0.8V (VFB). The
output voltage adjustment range is from 0.8V to 5.5V. The output voltage can be calculated according to the following formula:
VOUT = VFB ∙ (
R FBT
R FBB
+ 1)
One resistor must be chosen and then the other resistor can be calculated. For example, if RFBT = 100kΩ then the resistance
value of the lower resistor in the feedback network is indicated in the table below for common output voltag es.
VOUT
1.2V
1.5V
1.8V
2.5V
3.3V
3.6 V
4.2V
RFBB (E96)
200kΩ
115kΩ
80.6kΩ
47.5kΩ
32.4kΩ
28.7kΩ
23.7kΩ
MODULE VOUT
1
VOUT
RFBT
3
PGND
FB
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RFBB
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
Step 2 Select input capacitor (CIN )
The energy at the input of the MicroModule is stored in the input capacitor. An input capacitor (4.7µF) is integrated inside the
171010502 MagI³C MicroModule, ensuring good EMI performance and helping protect the internal circuitry from possible
voltage transients. Additional input capacitance is required externally to provide cycle-by-cycle switching current and to support
load transients. The external input capacitor must be placed directly at the VIN pin. For this MagI³C MicroModule it is
recommended to use a MLCC (Mutli Layer Ceramic Capacitor) of 4.7µF. Attention must be paid to the voltage, frequency and
temperature deratings of the selected capacitor.
Step 3 Select output capacitor (COUT)
The output capacitor should be selected in order to minimize the output voltage ripple and to provide a stable voltage at the
output. It also affects the loop stability. An external MLCC of 10µF is recommended for all application conditions. Attention
must be paid to the voltage, frequency and temperature deratings of the selected capacitor.
In general, the output voltage ripple can be calculated using the following equation:
VOUT ripple = ∆IL ∙ ESR+∆IL ∙
1
8∙fSW ∙COUT
(1)
where ∆IL is the inductor current ripple and can be calculated with the following equation:
∆IL =
VOUT ∙ (VIN -VOUT )
fSW ∙ L ∙ VIN
(2)
Example
In the section OUTPUT VOLTAGE RIPPLE on page 27 a ripple measurement is shown under the following conditions:
VIN = 3.6V
VOUT = 1.8V
L = 540nH
fSW = 4MHz
COUT = 10µF (external, Würth Elektronik, part number 885012107014)
Assuming a reduction of the capacitance of about 10% due to the bias voltage, a remaining capacitance of around 9µF can
be considered. Another assumption can be done for the ESR, which can be considered lower than 5mΩ.
Using equations (1) and (2), the expected ripple is VOUT ripple ≤ 2mV, which matches the results obtained with the measurement.
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
Step 4 Select the feed-forward capacitor (CFF )
The 171010502 MagI³C Micromodule allows for the selection of a feed forward capacitor, C FF, providing a trade-off between
response time and efficiency while also affecting the transition current threshold between the PFM and PWM modes. A
lower value of C FF will increase the efficiency of the module at light load while slowing down the response time. Increasing
the C FF value will speed up the response time while decreasing efficiency. Increasing the value of CFF results in higher
values of current needed to leave PFM mode.
22pF has been evaluated experimentally as a value with suitable efficiency and transient characteristics for most
applications.
The pictures below show the transient behavior of the 171 010502 in response to a load transition from 0A to 1A using the
recommended CFF = 22pF, as well as other values of C FF.
A higher value of C FF helps to reduce the over and undershoot just after the load transitions and allows the module to settle
to the regulated output voltage in less time.
200
150
IOUT
100
50
0
-50
CFF =
CFF =
CFF =
CFF =
Vout
10pF
22pF
100pF
220pF
-100
Output voltage AC [mV]
Output current [A]
Load Transient V IN = 5V, V OUT = 3.3V, from 0A to 1A, Forced PWM Mode, TA = 25 C
1,6
1,4
1,2
1,0
0,8
0,6
0,4
0,2
0,0
-0,2
-0,4
-0,6
-0,8
-1,0
-1,2
-1,4
-1,6
-150
-200
0
10
20
30
40
50
60
Time [µs]
200
VOUT
150
IOUT
100
50
0
-50
CFF =
CFF =
CFF =
CFF =
10pF
22pF
100pF
220pF
-100
Output voltage AC [mV]
Output current [A]
Load Transient V IN = 5V, V OUT = 3.3V, from 1A to 0A, Forced PWM Mode, TA = 25 C
1,6
1,4
1,2
1,0
0,8
0,6
0,4
0,2
0,0
-0,2
-0,4
-0,6
-0,8
-1,0
-1,2
-1,4
-1,6
-150
-200
0
10
20
30
40
50
60
Time [µs]
This behavior is valid only for this test under the specified conditions and must be verified in the real application.
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
The C FF value only affects the efficiency during light load conditions when the PFM/PWM mo de is chosen.
As explained in the section LIGHT LOAD OPERATION on page 23, under light load operation while PFM/PWM mode is
selected (MODE pin tied to GND), the device does not continuously switch, instead delivering energy to the load in bursts.
The frequency between bursts is influenced by various parameters, including the C FF value. The LIGHT LOAD OPERATION
section provides a more in-depth explanation of the additional parameters which affect behavior in this region.
VIN = 3.6V, VOUT = 1.8V, IOUT = 50mA, CFF = 220pF PFM Mode
VIN = 3.6V, VOUT = 1.8V, IOUT = 50mA, CFF = 22pF PFM Mode
5
5
9µs → 110kHz
6.5µs → 150kHz
4
Switch Node Voltage [V]
Switch Node Voltage [V]
4
3
2
1
3
2
1
0
0
-1
-1
-2
-2
0
4
8
12
16
20
24
0
4
8
12
16
20
24
Time [µs]
Time [µs]
Increasing C FF will cause the module to burst more often (shown in the two images above) resulting in a decrease in light
load efficiency as depicted in the diagram below. In addition, increasing the C FF value will result in an increase in the current
threshold required to exit PFM mode, also shown below as a difference of almost 100mA.
VIN = 5.5V , VOUT = 3.3V Graph, TA = 25°C
92
90
88
86
84
Efficiency [%]
82
80
78
76
74
72
70
68
22pF
66
220pF
64
0,001
0,01
Output Current [A]
0,1
While the recommended C FF value of 22pF will work for most applications, the user can adjust the performance of the module
based on their application by trading between light load efficiency and transient response. This customization tailors the
behavior of the module to the application’s needs.
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
MODES OF OPERATION
The MODE pin of the 171010502 can be pulled either high or low to alter the light load performance of the module based on
the application requirements.
Forced PWM mode
Pulling the MODE pin high selects the forced PWM mode. In this mode the device constantly functions in PWM mode, switching
at the default 4 MHz fixed switching frequency, independently of the load (see figure below). This mode of operation eases
the filtering requirements to help with noise sensitive applications.
VIN = 3.6V, VOUT = 1.8V, I OUT = 100mA, forced PWM Mode
0,6
1
Inductor Current [A]
0,4
0,2
0,0
-0,2
=
-0,4
-0,6
0
1
2
3
4
5
Time [µs]
Behavior at varying input voltages
During PWM operation, if the duty cycle is under a certain value, typically 76%, the module controls the off-time based on the
feedback ripple compared to an internal reference that utilizes the inductor ripple. The on-time is fixed and depends on VIN
and VOUT as well as the fixed switching frequency of 4MHz, as indicated by the following equation:
𝑡𝑜𝑛 =
𝑉𝑜𝑢𝑡
𝑉𝑖𝑛 ∗ 𝑓𝑠𝑤
When the input voltage decreases (such as with a discharging battery) the duty cycle will increase to deliver the same amount
of power to the load. When the duty cycle reaches a critical point, typically 76%, the module transitions to a fixed off-time mode
where it controls the low-side switch using the feedback ripple and internal comparator, keeping the low-side switch off for a
fixed 60ns and varying the on-time to meet the duty cycle requirements and output voltage. This results in a decrease of
switching frequency as the duty cycle continues to increase.
If the input voltage decreases further and the difference between the input voltage and output voltage is not significantly large,
such that the duty cycle approaches 100% operation, the module enters a drop-out mode of operation, leaving the high-side
switch on continuously and regulating the output voltage using the combined DC resistance of the high -side switch and the
integrated inductor.
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
PFM/PWM mode
Setting the MODE pin low selects the PFM/PWM mode. This mode provides a much higher efficiency at light loads (shown in
the picture below) by using PFM mode to save energy.
171010502 Vin = 5V Vout = 1.8V, PFM vs Forced PWM Mode, TA = 25°C
100
90
80
Efficiency [%]
70
60
50
40
30
20
10
PFM Mode
Forced PWM Mode
0
0,001
0,01
0,1
Output Current [A]
During PFM mode the module delivers energy in short bursts to the load (see the figure below). Within each burs t the device
switches at the default switching frequency and the energy is delivered to both the load and the output capacitor. In between
bursts, the device experiences a period where both the high side and low side switches are in an off state. The load demands
are supplied exclusively by the output capacitor during this time and the current consumption of the device drops dramatically
until the feedback system triggers the next cycle. This behavior results in higher efficiency than traditional PWM operation can
deliver.
20
0,9
10
Inductor Current [A]
0,8
0
1
0,7
-10
1
BU
0,6
T
-20
0,5
-30
0,4
-40
0,3
-50
=
0,2
-60
BU
0,1
T
=
-70
0,0
-80
0
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FB Voltage AC coupled [mV]
VIN = 3.6V, VOUT = 1.8V, I OUT = 50mA, PFM Mode
1,0
2
4
6
8
10
12
14
Time [µs]
16
18
20
22
24
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
20
0,9
10
Inductor Current [A]
0,8
0
1
0,7
-10
1
BU
0,6
T
-20
0,5
-30
0,4
-40
0,3
-50
0,2
-60
=
BU
T
FB Voltage (AC coupled) [mV]
VIN = 3.6V, VOUT = 1.8V, IOUT = 100mA, PFM Mode
1,0
=1
0,1
-70
0,0
-80
0
2
4
6
8
10
12
14
Time [µs]
16
18
20
22
24
Please consider that the dead times shown above are examples and measured values are heavily dependent on several
parameters including the output capacitor, routing techniques, distance between the output capacitor and load, and the feedforward capacitor.
The device transitions from PFM to PWM mode automatically when the dead time approaches zero, resuming constant
switching behavior at the default switching frequency of 4MHz.
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
OUTPUT VOLTAGE RIPPLE
The output voltage ripple is also influenced by the selection of the MODE pin. If the forced PWM mode is selected and the
duty cycle is below 76%, the ripple is very low and it always has the same frequency as the internal oscillator (4 MHz). If the
PFM/PWM mode is selected and the load current is low enough to be in the PFM mode of operation or if the duty cycle is high
enough to enter the constant off-time mode of operation then the output voltage ripple will be higher and the frequency lower
than the nominal switching frequency (see pictures below).
Ripple in PFM/PWM mode
VIN = 3.6V, VOUT = 1.8V, IOUT = 100mA C OUT = 10µF PFM Mode
100
Output Voltage Ripple [mV]
80
1
1
BU
60
T
65mV
40
20
0
-20
-40
-60
=
BU
T
=1
-80
-100
0
10
20
30
40
50
Time [µs]
Ripple in forced PWM mode
VIN = 3.6V, VOUT = 1.8V, IOUT = 100mA COUT = 10µF Forced PWM Mode
20
Output Voltage Ripple [mV]
15
1
10
5
0
6mV
-5
-10
=
-15
-20
0,0
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0,5
1,0
1,5
Time [µs]
2,0
2,5
3,0
Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
PROTECTIVE FEATURES
Overcurrent protection (OCP)
For protection agains t load faults, the MagI³C MicroModule incorporates a cycle-by-cycle current limiting (see IOCP in “Electrical
Specification” on page 5). During switching, the output current is limited by turning off the high-side switch when the current
limit value is detected. This switching behavior continues, limiting the on-time of the device until the overcurrent condition is
removed. When the overcurrent condition is removed normal switching times resume s. The output voltage is reduced to zero
until the current no longer exceeds the limit.
VIN = 3.6V, VOUT = 1.8V, IOUT > 2A
10
3
Output Voltage [V]
2
6
4
1
output voltage drop
Output Current [A]
overcurrent
8
2
0
0
0
2
4
6
8
10
12
Time [ms]
Short-circuit protection (SCP)
When the MagI³C MicroModule experiences a short-circuit condition at the output it will limit the current, typically to 2.2A,
until the thermal protection circuit shuts the module off. If the short-circuit condition is removed, normal switching operation
will begin if the module temperature is not exceeding the thermal shutdown threshold.
VIN = 3.6V, V OUT = 1.8V, short circuit
10
3
short circuit event
Output Voltage [V]
2
6
4
1
output voltage drop
Output Current [A]
current limited
8
2
0
0
0
2
4
6
8
10
12
Time [ms]
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
Over temperature protection (OTP)
Thermal protection helps prevent catastrophic failures due to accidental device overheating . The junction temperature of the
MagI³C MicroModule should not be allowed to exceed its maximum ratings. Thermal protection is implemented by an internal
thermal shutdown circuit, which activates when the junction temperature reaches 160°C (typ). Under the thermal shutdown
condition both MOSFETs remain off causing VOUT to drop. When the junction temperature falls below 150°C the internal softstart is released, VOUT rises smoothly, and normal operation resumes.
Input undervoltage lockout
The device incorporates undervoltage lockout (UVLO) to protect unexpected behavior at input voltages below the
recommended values . The thresholds of the UVLO are indicated in the Electrical Specifications on page 5.
Soft-Start
The 171010502 implements an internal soft-start in order to limit the inrush current and avoid output voltage overshoot during
start-up. The typical duration of the soft-start is around 100µs (see figure below).
VIN = 3.6V, VOUT = 1.8V
5
VEN, VOUT [V]
4
VEN
3
VOUT
2
1
tSS
0
0
100
200
300
Time [µs]
400
500
600
Enable
The 171010502 MagI³C MicroModule is enabled by setting the pin EN high. After setting EN high the module prepares for
operation, a process which takes roughly 100µsec. Once prepared, the module begins switching and the internal soft-start
regulates the output voltage rise until the desired output voltage is met allowing normal operation to take place .
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
LAYOUT RECOMMENDATION
4
VIN
VIN
MagI³C Power Module
3
FB
5
EN
2
MODE
6
PGND
1
VOUT
CFF RFBT RFBB
CIN
GND
VOUT
COUT
Bottom
GROUND PLANE
GND
Bottom layer
Top layer
Pads
The picture above shows a possible layout for the 171010502 MagI3C MicroModule. Nevertheless , some recommendations
should be followed when designing the layout:
1. The exposed pad should be connected to the bottom copper layer of the circuit board with enough vias to assist the
module in dissipating heat during operation. The above example uses 9 vias each with a drill diameter of 200µm .
2. The input and output capacitors should be placed as close as possible to the VIN and VOUT pins of the device.
3. The feedback resistor divider should be placed as close as possible to the FB pin
4. Pins 5 and 2 (EN and MODE respectively) must be always connected to either VIN or ground and they cannot be left
floating (an example is shown in the layout depicted above, where EN and MODE pins are respectively connected to
VIN and ground).
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
EVALUATION BOARD SCHEMATIC
4
VIN
J2
C1
+
C2
MODULE
VOUT
VIN
1
RFBT
5 EN
FB
J1
2
VOUT
CFF
3
C3
MODE
PGND PGND
EP
RFBB
6
GND
GND
Operational Requirements
The additional aluminum polymer capacitor C1 is only for evaluation board protection purposes. It is mounted at the termination
of the supply line and provides slight damping of possible oscillations of the series resonance circuit represented by the
inductance of the supply line and the input capacitance. It is not essential for operation but will provide better performance in
a testing environment.
Bill of Material
Designator
IC1
C1
C2
C3
C FF
R FBT
R FBB
Description
MagI3C MicroModule
Aluminum Polymer Capacitor 220µF/10V
Ceramic chip capacitor 4.7µF/16V X5R, 0805
Ceramic chip capacitor 10µF/16V X5R, 0805
Ceramic chip capacitor 10µF/10V X5R, 0805(*)
Ceramic chip capacitor 22pF/25V NP0/COG 0603
24.9 kΩ
open for VOUT = 0.8V
97.6 kΩ for VOUT = 1.0V
48.7 kΩ for VOUT = 1.2V
28 kΩ for VOUT = 1.5V
Set
19.6 kΩ for VOUT = 1.8V
by
11.5 kΩ for VOUT = 2.5V
jumper
7.87 kΩ for VOUT = 3.3V
To be soldered for adjustable output
voltage RFBB=
© January 2019
Manufacturer
Würth Elektronik
Würth Elektronik
Würth Elektronik
Würth Elektronik
Würth Elektronik
1
1
1
1
1
1
1
1
-1
Jumper for MODE connection to either
VIN (Forced PWM) or GND (PFM/PWM)
Jumper for EN connection to either
J2
VIN (device enabled) or GND (device disabled)
(*) alternative recommended part
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Order Code
171010502
875105244013
885012107013
885012107014
885012107010
R FBT
V OUT
V FB
J1
Quantity
1
1
1
1
1
1
Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
HANDLING RECOMMENDATIONS
1.
2.
3.
4.
The power module is classified as MSL1 (JEDEC Moisture Sensitivity Level 1) and requires special handling due to
moisture sensitivity (JEDEC J-STD033).
The parts are delivered in a sealed bag (Moisture Barrier Bags = MBB) and should be processed within one year.
When opening the moisture barrier bag check the Humidity Indicator Card (HIC) for color sta tus. Bake parts prior to
soldering in case indicator color has changed according to the notes on the card.
Parts must be processed after 168 hour (7 days) of floor life. Once this time has been exceeded, bake parts prior to
soldering per JEDEC J-STD033 recommendation.
SOLDER PROFILE
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
Only Pb-Free assembly is recommended according to JEDEC J-STD020.
Measure the peak reflow temperature of the MagI³C MicroModule in the middle of the top view.
Ensure that the peak reflow temperature does not exceed 235°C ±5°C as per JEDEC J-STD020.
The reflow time period during peak temperature of 235°C ±5°C must not exceed 20 seconds.
Reflow time above liquidus (217°C) must not exceed 90 seconds.
Maximum ramp up is rate 3°C per second.
Maximum ramp down rate is 3°C per second.
Reflow time from room (25°C) to peak must not exceed 8 minutes as per JEDEC J-STD020.
Maximum numbers of reflow cycles is three.
For minimum risk, solder the module in the last reflow cycle of the PCB production.
For soldering process please consider lead material copper (Cu) and lead finish tin (Sn).
For solder paste use a LFM-48W or Indium based SAC 305 alloy (Sn 96.5 / Ag 3.0 / Cu 0.5 / Indium 8.9HF / Type 3
/ 89%) type 3 or higher.
The profile shown below is valid for convection reflow only.
Other soldering methods (e.g.vapor phase) are not verified and have to be validated by the customer at their own
risk.
Max 240
Max 20 sec
Peak
230°C
Temperature [°C]
Ramp Up Rate
Max 3°C/sec
217
Ramp Down Rate
Max 3°C/sec
Max 90 sec
Min 60 sec
180
150
Liquidus
Preheat
Max 90 sec
Min 60 sec
Max 3 solder cycles !
Time [sec]
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
PHYSICAL DIMENSIONS
Bottom view
All dimensions in mm, tolerances ±0.1mm
All dimensions in mm
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
EXAMPLE FOOTPRINT DESIGN
All dimensions in mm
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
PACKAGING
Reel (mm)
tolerance
Tape width 24mm
A
B
C
D
N
W1
W2
W3
typ.
178.00
min.
1.50
± 0.8
13.00
min.
20.20
min.
50.00
+1.5
8.40
max.
14.40
min.
7.90
20P
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
Tape (mm)
tolerance
size
1210
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A0
B0
W
P1
T
T1
T2
D0
E1
E2
F
P0
P2
±0.1
±0.1
±0.1
±0.1
±0.05
max.
typ.
±0.1
±0.1
min.
±0.1
±0.1
±0.05
2.75
3.45
8.00
4.00
0.22
0.10
2.20
1.50
1.75
6.25
3.50
4.00
2.00
Tape
Packaging Unit
Polystyrene
2000
Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
DOCUMENT HISTORY
Revision
Date
Description
1.0
January 2019
Initial datasheet released
we-online.com
© January 2019
Comment
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171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
CAUTIONS AND WARNINGS
The following conditions apply to all goods within the product series of MagI³C of
Würth Elektronik eiSos GmbH & Co. KG:
General:
• All recommendations according to the general technical specifications of the data -sheet have to be complied with.
• The usage and operation of the product within ambient conditions which probably alloy or harm the component surface has
to be avoided.
• Electronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the
customer.
• The component is designed and manufactured to be used within the datasheet specified values. If the usage and operation
conditions specified in the datasheet are not met,the component may be damaged or dissolved.
• Do not drop or impact the components as material of the body, pins or termination may flake apart.
• Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report.
Würth Elektronik does not warrant any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for
its validity and sustainability over time.
• The responsibility for the applicability of the customer specific products and use in a particular customer design is always
within the authority of the customer. All technical specifications for standard products also apply to customer specific products.
• Customer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related
requirements concerning its products, and any use of Würth Elektronik eiSos GmbH & Co. KG components in its applications,
notwithstanding any applications-related information or support that may be provided by Würth Elektronik eiSos GmbH & Co.
KG. Customer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences lessen the likelihood of failures that
might cause harm and take appropriate remedial actions. Customer will fully indemnify Würth Elektronik eiSos and its
representatives against any damages arising out of the use of any Würth Elektronik eiSos GmbH & Co. KG components in
safety-critical applications.
Product specific:
Follow all instructions mentioned in the datasheet, especially:
• The solder profile has to comply with the technical reflow or wave soldering specification, otherwise this will void the wa rranty.
• All products are supposed to be used before the end of the peri od of 12 months based on the product date-code.
• Violation of the technical product specifications such as exceeding the absolute maximum ratings will void the warranty.
• It is also recommended to return the body to the original moisture proof bag and r eseal the moisture proof bag again.
• ESD prevention methods need to be followed for manual handling and processing by machinery.
• Residual washing varnish agent that is used during the production to clean the application might change the characteristics
of the body, pins or termination. The washing varnish agent could have a negative effect on the long term function of the
product.
• Direct mechanical impact to the product shall be prevented as the material of the body, pins or termination could flake or in
the worst case it could break. As these devices are sensitive to electrostatic discharge customer shall follow proper IC Handling
Procedures.
DISCLAIMER
This electronic component has been designed and developed for usage in general electronic equipme nt only. This product is
not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a
failure of the product is reasonably expected to cause severe personal injury or death, unless the partie s have executed an
agreement specifically governing such use.
Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as
military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control),
transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG
must be informed about the intent of such usage before the design -in stage. In addition, s ufficient reliability evaluation
checks for safety must be performed on every electronic component which is used in electrical circuits that require high
safety and reliability functions or performance.
These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate
and reliable. However, no responsibility is assumed for inaccuracies or incompleteness.
.
we-online.com
© January 2019
Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
38/39
171010502
MagI3C Power Module
VDMM – Variable Step Down MicroModule
IMPORTANT NOTES
The following conditions apply to all goods within the product range of Wür th Elektronik eiSos GmbH & Co. KG:
1. General Customer Responsibility
Some goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general
suitability for certain application areas. These statements about suitab ility are based on our knowledge and experience of
typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about
the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is
always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to
investigate and decide whether the device with the specific product characteristics described in the product specification is
valid and suitable for the respective customer application or not. Accordingly, the customer is cautioned to verify that the
datasheet is current before placing orders.
2. Customer Responsibility related to Specific, in particular Safety-Relevant Applications
It has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the
usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range
of the specifications. In certain customer applications requiring a very high level of safety and especially in customer
applications in which the malfunction or failure of an electronic component could endanger human life or health it must be
ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused
to third parties in the event of malfunction or failure of an electronic component.
3. Best Care and Attention
Any product-specific notes, warnings and cautions must be strictly observed. Any disregard will result in the loss of warranty.
4. Customer Support for Product Specifications
Some products within the product range may contain substances which are subject to restrictions in certain jurisdictions in
order to serve specific technical requirements. Necessary information is available on request. In this case the field sales
engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.
5. Product R&D
Due to constant product improvement product specifications may change from time to time. As a standard reporting procedure
of the Product Change Notification (PCN) according to the JEDEC -Standard we inform about minor and major changes. In
case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted.
The basic responsibility of the customer as per Section 1 and 2 remains unaffected.
6. Product Life Cycle
Due to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of
products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC -Standard
we will inform at an early stage about inevitable product discontinuance. According to this we cannot guar antee that all products
within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the int ernal
sales person in charge about the current product availability expectancy before or when the product for application design-in
disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
7. Property Rights
All the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development
contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer
will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent
that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intell ectual
property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components
or services are used.
8. General Terms and Conditions
Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and
Conditions of Würth Elektronik eiSos Group”, last version available at www.we -online.com.
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© January 2019
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