3029100100150

Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Value RS Surface Resistance 10,0 10,2 3,5 Recommended Compression Height Tol. Ω/ square max. 11.25 - 12 mm 10,5 Certification: 3,5 15,0 Unit 0.1 RoHS Approval Compliant [2011/65/EU&2015/863] REACh Approval Conform or declared [(EC)1907/2006] Halogen Free Conform [JEDEC JS709B] Halogen Free Conform [IEC 61249-2-21] UL Approval E474708 Scale - 2.5:1 General Information: Operating Temperature -20 up to +90 °C 10,0 Storage Conditions (in original packaging) < 40 °C ; < 75 % RH Moisture Sensitivity Level (MSL) 1 Test conditions of Electrical Properties: +20 °C, 33 % RH if not specified differently Scale - 2.5:1 CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE WE 001.001 2022-06-27 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com WE-SMGS Surface Mount Solderable Gasket ORDER CODE 3029100100150 SIZE/TYPE BUSINESS UNIT STATUS PAGE Square eiSos Valid 1/5 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Surface Resistance vs. Compression: 0.16 0.14 Resistance [Ω] 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 10 20 30 40 Compression [%] 50 60 70 Ω CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE WE 001.001 2022-06-27 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com WE-SMGS Surface Mount Solderable Gasket ORDER CODE 3029100100150 SIZE/TYPE BUSINESS UNIT STATUS PAGE Square eiSos Valid 2/5 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Classification Reflow Profile for SMT components: Classification Reflow Soldering Profile: Profile Feature Tp tp Max. Ramp Up Rate Max. Ramp Down Rate TL Temperature Ts max tL Preheat Area Ts min TC –5°C Value Preheat Temperature Min Ts min 150 °C Preheat Temperature Max Ts max 200 °C Preheat Time ts from Ts min to Ts max ts Ramp-up Rate (TL to TP) 60 - 120 seconds 3 °C/ second max. Liquidous Temperature TL 217 °C Time tL maintained above TL tL 60 - 150 seconds Peak package body temperature Tp Tp ≤ Tc, see Table below Time within 5°C of actual peak temperature tp 20 - 30 seconds Ramp-down Rate (TP to TL) 6 °C/ second max. Time 25°C to peak temperature 8 minutes max. refer to IPC/ JEDEC J-STD-020E tS Package Classification Reflow Temperature (Tc): Volume mm³ 350-2000 Volume mm³ >2000 PB-Free Assembly | Package Thickness 260 °C < 1.6 mm 260 °C 260 °C PB-Free Assembly | Package Thickness 260 °C 1.6 mm - 2.5 mm 250 °C 245 °C PB-Free Assembly | Package Thickness 250 °C > 2.5 mm 245 °C 245 °C Properties 25 Time 25°C to Peak Time Volume mm³