331061603010

Dimensions: [mm] Recommended Land Pattern: [mm] Properties: Properties Value Material 9.7 - 8.3 mm 10,0 ±0,2 Soldering Area Reserved PCB Area Scale - 3:1 3,0 ref. 0,1 ref. 6,0 ±0,2 4,5 ref. Recommended Working Height 3,0 5,0 O 1,2 ref. 4,5 ref. 9,0 4,0 1,5 Unit Copper Beryllium (CuBe) gold-plated(AU) General Information: Operating Temperature -40 up to +100 °C Storage Conditions (in original packaging) < 40 °C ; < 75 % RH Moisture Sensitivity Level (MSL) 1 Test conditions of Electrical Properties: +20 °C, 33 % RH if not specified differently Scale - 3:1 CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE JoV 002.002 2018-11-29 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION WE-SECF SMT EMI Contact Finger Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com ORDER CODE 331061603010 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0610 eiSos Valid 1/6 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Force Deflection Diagram: 110 100 90 80 Loading [g] 70 60 50 40 30 20 10 0 0 0,2 0,4 0,6 0,8 1 1,2 Compression distance [mm] Down 1,4 1,6 1,8 Up CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE JoV 002.002 2018-11-29 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION WE-SECF SMT EMI Contact Finger Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com ORDER CODE 331061603010 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0610 eiSos Valid 2/6 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Packaging Specification - Tape: [mm] Packaging Specification - Tape and Reel: [mm] P0 P2 W3 T E1 D0 W1 close to center A D B0 E2 W C N F B top cover tape A0 K0 P1 T2 Feeding direction End W2 T1 Start detail B Carriertape Cover tape B Cover Tape Chip Cavity Sprocket Hole No Component min. 160mm Components No Component min. 100mm Embossment Cover Tape min. 400mm Packaging is referred to the international standard IEC 60286-3:2019 tolerance size 0610 A0 typ. 3.20 B0 typ. 6.2 W ±0,3 16 P1 ±0,1 12 T ±0,1 0.5 T1 max. 0.1 T2 typ. 10.7 D0 +0,1/ -0.0 1.5 E1 ±0,1 1.75 E2 min. 14.25 F ±0,05 7.5 P0 ±0,1 4 P2 ±0,05 2 Tape Polystyrene VPE / packaging unit pcs. 500 tolerance Tape width 16 mm A B C D N W1 ±­ ±­ m­ +1.5 2,0 0,8 in. 1­ 1­ 16.399999999999999 330 .5 13 2­ 0.2 00 CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE JoV 002.002 2018-11-29 DIN ISO 2768-1m W2 W3 W3 max. m­ in. max. 22.­ 1­ 19.399999999999999 40 5.9 PROJECTION METHOD DESCRIPTION WE-SECF SMT EMI Contact Finger Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com ORDER CODE 331061603010 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0610 eiSos Valid 3/6 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Classification Reflow Profile for SMT components: Classification Reflow Soldering Profile: Profile Feature Tp tp Max. Ramp Up Rate Max. Ramp Down Rate TL Temperature Ts max tL Preheat Area Ts min TC –5°C Value Preheat Temperature Min Ts min 150 °C Preheat Temperature Max Ts max 200 °C Preheat Time ts from Ts min to Ts max ts Ramp-up Rate (TL to TP) 60 - 120 seconds 3 °C/ second max. Liquidous Temperature TL 217 °C Time tL maintained above TL tL 60 - 150 seconds Peak package body temperature Tp Tp ≤ Tc, see Table below Time within 5°C of actual peak temperature tp 20 - 30 seconds Ramp-down Rate (TP to TL) 6 °C/ second max. Time 25°C to peak temperature 8 minutes max. refer to IPC/ JEDEC J-STD-020E tS Package Classification Reflow Temperature (Tc): Volume mm³ 350-2000 Volume mm³ >2000 PB-Free Assembly | Package Thickness 260 °C < 1.6 mm 260 °C 260 °C PB-Free Assembly | Package Thickness 260 °C 1.6 mm - 2.5 mm 250 °C 245 °C PB-Free Assembly | Package Thickness 250 °C > 2.5 mm 245 °C 245 °C Properties 25 Time 25°C to Peak Time Volume mm³