Dimensions: [mm]
Recommended Land Pattern: [mm]
Properties:
Properties
Unit
Copper Beryllium (CuBe) gold-plated(AU)
Recommended Working Height
5,8
12.5 - 10
mm
Soldering Area
Reserved PCB Area
13,0 ±0,2
2,9 ref.
7,0 ±0,2
4,5
2,85
2,5
6,0 ref.
10,50
0,8 ref.
1,6 ref.
Value
Material
Scale - 3:1
5,1 ref.
2,5 ref.
General Information:
Operating Temperature
-40 up to +100 °C
Storage Conditions (in original
packaging)
< 40 °C ; < 75 % RH
Moisture Sensitivity Level (MSL)
1
Test conditions of Electrical Properties: +20 °C, 33 % RH if not specified differently
Scale - 3:1
CHECKED
REVISION
DATE (YYYY-MM-DD)
GENERAL TOLERANCE
JoV
003.002
2018-11-29
DIN ISO 2768-1m
PROJECTION
METHOD
DESCRIPTION
WE-SECF SMT EMI Contact Finger
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
ORDER CODE
331161702513
SIZE/TYPE
BUSINESS UNIT
STATUS
PAGE
1613
eiSos
Valid
1/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Force Deflection Diagram:
480
440
400
360
Loading [g]
320
280
240
200
160
120
80
40
0
0
0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2 2,2 2,4 2,6 2,8
Compression distance [mm]
Down
3
3,2
Up
CHECKED
REVISION
DATE (YYYY-MM-DD)
GENERAL TOLERANCE
JoV
003.002
2018-11-29
DIN ISO 2768-1m
PROJECTION
METHOD
DESCRIPTION
WE-SECF SMT EMI Contact Finger
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
ORDER CODE
331161702513
SIZE/TYPE
BUSINESS UNIT
STATUS
PAGE
1613
eiSos
Valid
2/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Packaging Specification - Tape: [mm]
Packaging Specification - Tape and Reel: [mm]
P0
P2
W3
T
E1
D0
W1
close to center
A
D
B0
E2
W
C
N
F
B
top cover
tape
A0
K0
P1
T2
Feeding direction
End
W2
T1
Start
detail B
Carriertape
Cover tape
B
Cover Tape
Chip Cavity
Sprocket Hole
No Component
min. 160mm
Components
No Component
min. 100mm
Embossment
Cover Tape
min. 400mm
Packaging is referred to the international standard IEC 60286-3:2019
tolerance
size
A0 B0 W
typ. typ. +0,3
1613 2,70 7,20 24,00
-0,1
T
T1 T2
K0
P0 P1
P2 D0
typ. typ. typ. typ. ±0,1 ±0,1 ±0,1 +0,1
0,50 0,10 13,90 13,30 4,00 16,00 2,00 1,50
-0,0
E1
+0,1
1,75
-0,0
E2
F
Tape Type 2a
min. ±0,1
22,25 11,50 Polystyrene
VPE / packaging unit
pcs.
150
165° - 180°
tolerance
Tape width
24 mm
A
±2,0
330
B
min.
1.5
C
±0,8
13
D
min.
20.2
N
min.
100
CHECKED
REVISION
DATE (YYYY-MM-DD)
GENERAL TOLERANCE
JoV
003.002
2018-11-29
DIN ISO 2768-1m
W1
+1.5
24.4
W2
max.
30.40
W3
min.
23.9
W3
max.
27.4
PROJECTION
METHOD
DESCRIPTION
WE-SECF SMT EMI Contact Finger
Pull-of force
Tape width
24 mm
0,1 N - 1,3 N
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
ORDER CODE
331161702513
SIZE/TYPE
BUSINESS UNIT
STATUS
PAGE
1613
eiSos
Valid
3/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Classification Reflow Profile for SMT components:
Classification Reflow Soldering Profile:
Profile Feature
Tp
tp
Max. Ramp Up Rate
Max. Ramp Down Rate
TL
Temperature
Ts max
tL
Preheat Area
Ts min
TC –5°C
Value
Preheat Temperature Min
Ts min 150 °C
Preheat Temperature Max
Ts max 200 °C
Preheat Time ts from Ts min to Ts max
ts
Ramp-up Rate (TL to TP)
60 - 120 seconds
3 °C/ second max.
Liquidous Temperature
TL
217 °C
Time tL maintained above TL
tL
60 - 150 seconds
Peak package body temperature
Tp
Tp ≤ Tc, see Table below
Time within 5°C of actual peak
temperature
tp
20 - 30 seconds
Ramp-down Rate (TP to TL)
6 °C/ second max.
Time 25°C to peak temperature
8 minutes max.
refer to IPC/ JEDEC J-STD-020E
tS
Package Classification Reflow Temperature (Tc):
Volume mm³
350-2000
Volume mm³
>2000
PB-Free Assembly | Package Thickness 260 °C
< 1.6 mm
260 °C
260 °C
PB-Free Assembly | Package Thickness 260 °C
1.6 mm - 2.5 mm
250 °C
245 °C
PB-Free Assembly | Package Thickness 250 °C
> 2.5 mm
245 °C
245 °C
Properties
25
Time 25°C to Peak
Time
Volume mm³
