74479275147

Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Inductance 1,45 Rated Current 1) 0,5 ±0,3 1,0 ±0,3 0,8 0,7 Value Unit Tol. 1 MHz/ 5 mA 0.47 µH ±15% IR ΔT = 40 K 5.25 A max. Saturation Current 1 ISAT 1 |ΔL/L| < 10 % 2.55 A typ. Saturation Current 2 ISAT 2 |ΔL/L| < 30 % 5.15 A typ. DC Resistance RDC @ 20 °C 40 mΩ typ. DC Resistance RDC @ 20 °C 44 mΩ max. Self Resonant Frequency fres 120 MHz typ. 1) 0,7 Test conditions L refer to IEC 62024-2-2020 Certification: 1,0 max. 2,0 ±0,2 Scale - 15:1 Schematic: RoHS Approval Compliant [2011/65/EU&2015/863] REACh Approval Conform or declared [(EC)1907/2006] Halogen Free Conform [JEDEC JS709B] Halogen Free Conform [IEC 61249-2-21] Component Qualification AEC-Q200 Grade 1 1,2 ±0,2 General Properties: Ambient Temperature (referring to IR) -40 up to +85 °C Operating Temperature -40 up to +125 °C Storage Conditions (in original packaging) < 40 °C ; < 75 % RH Moisture Sensitivity Level (MSL) 1 Test conditions of Electrical Properties: +20 °C, 33 % RH if not specified differently Test conditions of Rated Current: refer to IEC 62024-2-2020, Class C (PCB Copper Width: 40 mm; PCB Copper Thickness: 105 µm) Scale - 15:1 CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE JKe 003.000 2023-09-07 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com WE-PMCI Power Molded Chip Inductor ORDER CODE 74479275147 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0805 eiSos Valid 1/8 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation, transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Typical Inductance vs. Frequency Characteristics: Typical Inductance vs. Current Characteristics: 1000 0.5 0.45 0.4 0.35 Impedance [Ω] Inductance [µH] 100 10 0.3 0.25 0.2 0.15 0.1 0.05 1 0 1 10 100 1000 0 1 2 Frequency [MHz] Z 3 4 5 6 Current [A] CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE JKe 003.000 2023-09-07 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com WE-PMCI Power Molded Chip Inductor ORDER CODE 74479275147 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0805 eiSos Valid 2/8 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation, transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Typical Temperature Rise vs. Current Characteristics: 100 90 80 Temperature Rise [K] 70 60 50 40 30 20 10 0 0 2 4 6 8 10 Current [A] CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE JKe 003.000 2023-09-07 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com WE-PMCI Power Molded Chip Inductor ORDER CODE 74479275147 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0805 eiSos Valid 3/8 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation, transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Packaging Specification - Tape and Reel: [mm] W3 P0 P2 T W1 close to center A W F B0 E2 C Top Cover Tape A D1 P1 W2 T1 A0 T2 Feeding direction End N E1 B D D0 A K0 Start detail B Carrier Tape B Cover Tape Cover Tape Chip Cavity Sprocket Hole No Component min.160mm Components No Component min.100mm Cover Tape min. 400mm Embossment packaging is reffered to the international standard IEC 60286-3:2013 tolerance size A0 typ. 0805 1,5 B0 W typ. +0,3/ -0,1 2,25 8 T T1 T2 K0 max. max. typ. typ. 0,22 0,10 1,15 1,0 P0 P1 P2 ±0,1 ±0,1 ±0,05 4,00 4 2,00 D0 +0,1/ -0,0 1,50 D1 E1 E2 F min. ±0,1 min. ±0,05 0,3 1.75 6,25 3,5 Tape Type 2a Polystyrene VPE / packaging unit pcs. 3000 165° - 180° tolerance Tape width 8 mm A ±2,0 178,00 B min. 1,50 C ±0,8 13 D min. 20.2 N ±2,0 50 CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE JKe 003.000 2023-09-07 DIN ISO 2768-1m W1 +1,5 8.4 W2 max. 14.4 W3 min. 7.9 W3 max. 10.9 PROJECTION METHOD DESCRIPTION Pull-off force Tape width 8 mm 0,1 N - 1,0 N Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com WE-PMCI Power Molded Chip Inductor ORDER CODE 74479275147 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0805 eiSos Valid 4/8 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation, transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Classification Reflow Profile for SMT components: Classification Reflow Soldering Profile: Profile Feature Tp tp Max. Ramp Up Rate Max. Ramp Down Rate TL Temperature Ts max tL Preheat Area Ts min TC –5°C Value Preheat Temperature Min Ts min 150 °C Preheat Temperature Max Ts max 200 °C Preheat Time ts from Ts min to Ts max ts Ramp-up Rate (TL to TP) 60 - 120 seconds 3 °C/ second max. Liquidous Temperature TL 217 °C Time tL maintained above TL tL 60 - 150 seconds Peak package body temperature Tp Tp ≤ Tc, see Table below Time within 5°C of actual peak temperature tp 20 - 30 seconds Ramp-down Rate (TP to TL) 6 °C/ second max. Time 25°C to peak temperature 8 minutes max. refer to IPC/ JEDEC J-STD-020E tS Package Classification Reflow Temperature (Tc): Volume mm³ 350-2000 Volume mm³ >2000 PB-Free Assembly | Package Thickness 260 °C < 1.6 mm 260 °C 260 °C PB-Free Assembly | Package Thickness 260 °C 1.6 mm - 2.5 mm 250 °C 245 °C PB-Free Assembly | Package Thickness 250 °C > 2.5 mm 245 °C 245 °C Properties 25 Time 25°C to Peak Time Volume mm³