Dimensions: [mm]
Recommended Land Pattern: [mm]
Electrical Properties:
Properties
Value
Unit
Tol.
Inductance
L
Test conditions
500 MHz
18
nH
±2%
Q-Factor
Q
500 MHz
13
Q
0,5
Q-Factor
0,2 ± 0,1
0,4
min.
500 MHz
18.13
DC Resistance
RDC @ 20 °C
1.53
Ω
typ.
DC Resistance
RDC @ 20 °C
2
Ω
max.
100
mA
max.
3100
MHz
min.
Rated Current
IR
Self Resonant Frequency
fres
ΔT = 30 K
typ.
0,5
Certification:
Scale - 30:1
1,0 ± 0,05
RoHS Approval
Compliant [2011/65/EU&2015/863]
REACh Approval
Conform or declared [(EC)1907/2006]
Halogen Free
Conform [JEDEC JS709B]
Halogen Free
Conform [IEC 61249-2-21]
0,32 ± 0,05
Schematic:
General Information:
Ambient Temperature (referring
to IR)
-40 up to +95
0,5 ± 0,05
Operating Temperature
-40 up to +125 °C
Storage Conditions (in original
packaging)
< 40 °C ; < 75 % RH
Moisture Sensitivity Level (MSL)
1
Test conditions of Electrical Properties: +20 °C, 33 % RH if not specified differently
Scale - 30:1
CHECKED
REVISION
DATE (YYYY-MM-DD)
GENERAL TOLERANCE
JoMa
003.001
2021-04-21
DIN ISO 2768-1m
PROJECTION
METHOD
DESCRIPTION
WE-TCI Thinfilm Chip Inductor
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
ORDER CODE
744901118
SIZE/TYPE
BUSINESS UNIT
STATUS
PAGE
0402
eiSos
Valid
1/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Typical Inductance vs. Frequency Characteristics:
Q-Factor vs. Frequency:
100
25
Q
Inductance [nH]
20
15
10
10
5
0
1
1
10
100
1000
1
10
100
1000
Frequency [MHz]
Frequency [MHz]
CHECKED
REVISION
DATE (YYYY-MM-DD)
GENERAL TOLERANCE
JoMa
003.001
2021-04-21
DIN ISO 2768-1m
PROJECTION
METHOD
DESCRIPTION
WE-TCI Thinfilm Chip Inductor
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
ORDER CODE
744901118
SIZE/TYPE
BUSINESS UNIT
STATUS
PAGE
0402
eiSos
Valid
2/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Packaging Specification - Tape: [mm]
Packaging Specification - Reel: [mm]
P0
A
D0
W3
T (=K0)
E1
P2
W1
close to center
A0
A
P1
T1
W2
T1
Feeding direction
End
N
B0
E2
C
Top Cover
Tape
A
D
W
F
B
Start
Carrier Tape
detail B
Cover Tape
B
Top
Cover Tape
Chip Cavity
Sprocket Hole
No Component
min.160mm
Components
No Component
min.100mm
Embossment
Bottom
Cover Tape
Cover Tape
min. 400mm
Packaging is referred to the international standard IEC 60286-3:2019
Tape Type
1a
A0
(mm)
typ.
0,70
B0
(mm)
typ.
1,16
W
(mm)
+0,3/ -0,1
8,00
T
(mm)
ref.
0,40
T1
(mm)
ref.
0,10
P0
(mm)
±0,1
4,00
P1
(mm)
±0,1
2,00
P2
(mm)
+0,05
2,00
D0
(mm)
+0,1/-0,0
1,50
E1
(mm)
±0,1
1,75
E2
(mm)
min.
6,25
F
(mm)
±0,05
3,50
Material
Qty.
(pcs.)
Paper
10000
A
(mm)
± 2,0
178
B
(mm)
min.
1.5
C
(mm)
min.
12.8
D
(mm)
min.
20.2
N
(mm)
min.
50
W1
(mm)
+1,5
8.4
W2
(mm)
max.
14.4
CHECKED
REVISION
DATE (YYYY-MM-DD)
GENERAL TOLERANCE
JoMa
003.001
2021-04-21
DIN ISO 2768-1m
W3
(mm)
min.
7.9
W3
(mm)
max.
10.9
Material
Polystyrene
PROJECTION
METHOD
DESCRIPTION
WE-TCI Thinfilm Chip Inductor
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
ORDER CODE
744901118
SIZE/TYPE
BUSINESS UNIT
STATUS
PAGE
0402
eiSos
Valid
3/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Classification Reflow Profile for SMT components:
Classification Reflow Soldering Profile:
Profile Feature
Tp
tp
Max. Ramp Up Rate
Max. Ramp Down Rate
TL
Temperature
Ts max
tL
Preheat Area
Ts min
TC –5°C
Value
Preheat Temperature Min
Ts min 150 °C
Preheat Temperature Max
Ts max 200 °C
Preheat Time ts from Ts min to Ts max
ts
Ramp-up Rate (TL to TP)
60 - 120 seconds
3 °C/ second max.
Liquidous Temperature
TL
217 °C
Time tL maintained above TL
tL
60 - 150 seconds
Peak package body temperature
Tp
Tp ≤ Tc, see Table below
Time within 5°C of actual peak
temperature
tp
20 - 30 seconds
Ramp-down Rate (TP to TL)
6 °C/ second max.
Time 25°C to peak temperature
8 minutes max.
refer to IPC/ JEDEC J-STD-020E
tS
Package Classification Reflow Temperature (Tc):
Volume mm³
350-2000
Volume mm³
>2000
PB-Free Assembly | Package Thickness 260 °C
< 1.6 mm
260 °C
260 °C
PB-Free Assembly | Package Thickness 260 °C
1.6 mm - 2.5 mm
250 °C
245 °C
PB-Free Assembly | Package Thickness 250 °C
> 2.5 mm
245 °C
245 °C
Properties
25
Time 25°C to Peak
Time
Volume mm³
