885012007081

Dimensions: [mm] Recommended Land Pattern: [mm] 2,8 Electrical Properties: Properties Test conditions 1,3 1,0 Capacitance C Rated Voltage VR Q-Factor Q Reflow Insulation Resistance 3,2 0,5 ±0,2 1 ±0.2 VRMS, 1 MHz ±10% @25 °C 1 ±0.2 VRMS, 1 MHz ±10% @25 °C RISO Apply VR for 120 s max. Value Unit Tol. 68 pF ±5% 100 V (DC) max. 1000 min. 10 GΩ min. Precondition for Class II MLCC measurement: Apply a preheat treatment @150 ±10 °C for 1 hour. The measurement should be applied after 24 ±2 hrs the part was stored under ambient conditions. There is not any precondition necessary for Class I MLCC. 1,3 1,4 2,0 ±0,15 Wave 0,6 ±0,1 Schematic: General Information: 1,25 ±0,1 General Purpose MLCC Ceramic Type NP0 Class I Temperature Coefficient ± 30 ppm/ °C max. Operating Temperature -55 up to +125 °C Storage Conditions (in original packaging) 5 °C up to + 35 °C; 10 % up to 75 % RH Moisture Sensitivity Level (MSL) Dielectric Strength 1 5 sec. @250 % VR; Charge & Discharge Current 0603 10 ±1 sec; 10 N all 3 directions, 2 hours each @ 10 - 55 Hz/ min., amplitude 0.75 mm or 10 g Vibration Resistance Resistance to Solder Heat 10 ±1 sec; 2 N 0402 & 0603 Specific Refer to Soldering Profile Certification: RoHS Approval Compliant [2011/65/EU&2015/863] REACh Approval Conform or declared [(EC)1907/2006] Halogen Free Conform [JEDEC JS709B] Halogen Free Conform [IEC 61249-2-21] Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE PSL 002.000 2021-01-03 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION TECHNICAL REFERENCE WCAP-CSGP Ceramic Capacitors 0805 NP00805680J100DFCT10000 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0805 eiCap Valid 2/9 ORDER CODE 885012007081 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Packaging Specification - Tape: [mm] Packaging Specification - Reel: [mm] P0 A P2 T (=K0) W3 E1 D0 D A E2 B0 N W F B W1 close to center C Top Cover Tape A0 P1 W2 T1 T1 A Feeding direction End Start Carrier Tape Cover Tape detail B B Top Cover Tape Chip Cavity Sprocket Hole No Component min. 160mm Components No Component min.100mm Embossment Bottom Cover Tape Cover Tape min. 400mm Packaging is referred to the international standard IEC 60286-3:2019 Tape Type 1a A0 (mm) typ. 1,50 B0 (mm) typ. 2,30 W (mm) +0,3/ -0,1 8,00 T (mm) ref. 1,15 T1 (mm) ref. 0,10 P0 (mm) ±0,1 4,00 P1 (mm) ±0,1 4,00 P2 (mm) +0,05 2,00 D0 (mm) +0,1 / -0,0 1,50 E1 (mm) ±0,1 1,75 E2 (mm) min. 6,25 F (mm) ±0,05 3,50 Material Qty. (pcs.) Paper 4000 A (mm) ± 2,0 178 B (mm) min. 1.5 C (mm) min. 12.8 D (mm) min. 20.2 N (mm) min. 50 W1 (mm) +1,5 8.4 W2 (mm) max. 14.4 CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE PSL 002.000 2021-01-03 DIN ISO 2768-1m W3 (mm) min. 7.9 W3 (mm) max. 10.9 Material Polystyrene PROJECTION METHOD 165° - 180° Pull-of force Tape width 8 mm 0,1 N - 1,0 N Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com DESCRIPTION TECHNICAL REFERENCE WCAP-CSGP Ceramic Capacitors 0805 NP00805680J100DFCT10000 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0805 eiCap Valid 3/9 ORDER CODE 885012007081 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Packaging Specification - Outer Carton: [mm] H H IC C Packaging Specification - Inner Carton: [mm] W C L C W IC L LIC (mm) typ. 120,00 WIC (mm) typ. 180,00 HIC (mm) typ. 180,00 IC No. of Reel (pcs.) Qty. (pcs.) Material 10 40000 Paper Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com LC (mm) typ. 393,00 WC (mm) typ. 393,00 HC (mm) typ. 203,00 No. of Inner Carton (pcs.) Qty. (pcs.) Material 6 240000 Paper CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE PSL 002.000 2021-01-03 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION TECHNICAL REFERENCE WCAP-CSGP Ceramic Capacitors 0805 NP00805680J100DFCT10000 SIZE/TYPE BUSINESS UNIT STATUS PAGE 0805 eiCap Valid 4/9 ORDER CODE 885012007081 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Classification Reflow Profile for SMT components: Classification Reflow Soldering Profile: Profile Feature Tp tp Max. Ramp Up Rate Max. Ramp Down Rate TL Temperature Ts max Ts min Ts min 150 °C Preheat Temperature Max Ts max 200 °C Preheat Time ts from Ts min to Ts max ts Ramp-up Rate (TL to TP) Liquidous Temperature tL Preheat Area TC –5°C Value Preheat Temperature Min 60 - 120 seconds 3 °C/ second max. TL 217 °C Time tL maintained above TL tL 60 - 150 seconds Peak package body temperature Tp Tp ≤ Tc, see Table below Time within 5°C of actual peak temperature tp 20 - 30 seconds Ramp-down Rate (TP to TL) 6 °C/ second max. Time 25°C to peak temperature 8 minutes max. refer to IPC/ JEDEC J-STD-020E tS Package Classification Reflow Temperature (Tc): Volume mm³ 350-2000 Volume mm³ >2000 PB-Free Assembly | Package Thickness 260 °C < 1.6 mm 260 °C 260 °C PB-Free Assembly | Package Thickness 260 °C 1.6 mm - 2.5 mm 250 °C 245 °C PB-Free Assembly | Package Thickness 250 °C > 2.5 mm 245 °C 245 °C Properties 25 Time 25°C to Peak Time Volume mm³