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885012108019

885012108019

  • 厂商:

    WURTH(伍尔特)

  • 封装:

    1206

  • 描述:

    贴片电容(MLCC) 1206 2.2µF ±20% 25V X5R

  • 数据手册
  • 价格&库存
885012108019 数据手册
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: 4,0 1,6 2,2 0,6 ±0,2 Properties Test conditions Capacitance C 1 ±0.2 VRMS, 1 kHz ±10% @25 °C Rated Voltage VR Value Unit Tol. 2.2 µF ±20% 25 V (DC) max. 3.5 % max. 0.2 GΩ min. 1 ±0.2 VRMS, 1 kHz ±10% @25 °C Dissipation Factor DF Insulation Resistance RISO Apply VR for 120 s max. T F Precondition for Class II MLCC measurement: Apply a preheat treatment @150 ±10 °C for 1 hour. The measurement should be applied after 24 ±2 hrs the part was stored under ambient conditions. There is not any precondition necessary for Class I MLCC. +0,3 -0,1 1,6 +0,3 -0,1 3,2 Scale 10:1 A R 1,6 +0,3 -0,1 Schematic: D General Information: General Purpose MLCC Ceramic Type X5R Class II Temperature Coefficient ± 15 % max. Operating Temperature -55 up to +85 °C Storage Conditions (in original packaging) 5 °C up to + 35 °C; 10 % up to 75 % RH Moisture Sensitivity Level (MSL) Dielectric Strength Test conditions of electrical properties: +20 °C, 35 % RH if not specified differently Scale - 10:1 Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com 1 5 sec. @250 % VR; Charge & Discharge Current 0603 10 ±1 sec; 10 N all 3 directions, 2 hours each @ 10 - 55 Hz/ min., amplitude 0.75 mm or 10 g Vibration Resistance Resistance to Solder Heat Specific Refer to Soldering Profile Certification: RoHS Approval Compliant [2011/65/EU&2015/863] REACh Approval Conform or declared [(EC)1907/2006] Halogen Free Conform [JEDEC JS709B] Halogen Free Conform [IEC 61249-2-21] D A R Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com T F CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE FPu 003.000 2030-01-01 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION TECHNICAL REFERENCE WCAP-CSGP Ceramic Capacitors 1206 X5R1206225M025DFCT10000 SIZE/TYPE BUSINESS UNIT STATUS PAGE 1206 eiCap Valid from 2030-01-01 due to PCN 2/8 ORDER CODE 885012108019 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Packaging Specification - Tape: [mm] Packaging Specification - Reel: [mm] P0 A K0 P2 T W3 E1 D0 B0 E2 A P1 T1 A0 T2 End Feeding direction A R Start Carrier Tape Cover Tape No Component min.160mm Components 2a A0 (mm) typ. 2,30 B0 (mm) typ. 4,00 W (mm) +0,3/ -0,1 8,00 T (mm) ref. 0,23 D T1 (mm) ref. 0,10 165° - 180° T2 (mm) typ. 2,91 K0 (mm) typ. 2,50 P0 (mm) ±0,1 4,00 8 mm A detail B Cover Tape Chip Cavity Sprocket Hole Embossment Cover Tape min. 400mm P1 (mm) ±0,1 4,00 P2 (mm) ±0,05 2,00 Pull-of force Tape width W2 B No Component min.100mm Packaging is referred to the international standard IEC 60286-3:2019 Tape Type D T F C Top Cover Tape D1 N W F B W1 close to center 0,1 N - 1,0 N D0 (mm) +0,1/ -0,0 1,50 D1 (mm) min. 0,30 E1 (mm) ±0,1 1,75 E2 (mm) min. 6,25 F (mm) ±0,05 3,50 Material Qty. (pcs.) Polycarbonate 2000 Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com A (mm) ± 2,0 178 B (mm) min. 1.5 C (mm) min. 12.8 D (mm) min. 20.2 N (mm) min. 50 W1 (mm) +1,5 8.4 W2 (mm) max. 14.4 CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE FPu 003.000 2030-01-01 DIN ISO 2768-1m W3 (mm) min. 7.9 W3 (mm) max. 10.9 Material Polystyrene PROJECTION METHOD DESCRIPTION TECHNICAL REFERENCE WCAP-CSGP Ceramic Capacitors 1206 X5R1206225M025DFCT10000 SIZE/TYPE BUSINESS UNIT STATUS PAGE 1206 eiCap Valid from 2030-01-01 due to PCN 3/8 ORDER CODE 885012108019 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Packaging Specification - Outer Carton: [mm] W IC LIC (mm) typ. 120,00 WIC (mm) typ. 180,00 D HIC (mm) typ. 180,00 A R L No. of Reel (pcs.) 10 C T F H H IC Packaging Specification - Inner Carton: [mm] W C L C IC Qty. (pcs.) Material 20000 Paper Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 1 74638 Waldenburg Germany Tel. +49 (0) 79 42 945 - 0 www.we-online.com eiSos@we-online.com LC (mm) typ. 393,00 WC (mm) typ. 393,00 HC (mm) typ. 203,00 No. of Inner Carton (pcs.) Qty. (pcs.) Material 6 120000 Paper CHECKED REVISION DATE (YYYY-MM-DD) GENERAL TOLERANCE FPu 003.000 2030-01-01 DIN ISO 2768-1m PROJECTION METHOD DESCRIPTION TECHNICAL REFERENCE WCAP-CSGP Ceramic Capacitors 1206 X5R1206225M025DFCT10000 SIZE/TYPE BUSINESS UNIT STATUS PAGE 1206 eiCap Valid from 2030-01-01 due to PCN 4/8 ORDER CODE 885012108019 This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH & Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance. Classification Reflow Profile for SMT components: Classification Reflow Soldering Profile: Profile Feature Tp tp Max. Ramp Up Rate Max. Ramp Down Rate TL Temperature Ts max Ts min 150 °C Preheat Temperature Max Ts max 200 °C Preheat Time ts from Ts min to Ts max 3 °C/ second max. T F 217 °C tL 60 - 150 seconds Peak package body temperature Tp Tp ≤ Tc, see Table below Time within 5°C of actual peak temperature tp 20 - 30 seconds Time tL maintained above TL 6 °C/ second max. Time 25°C to peak temperature refer to IPC/ JEDEC J-STD-020E tS 60 - 120 seconds TL Ramp-down Rate (TP to TL) Ts min ts Ramp-up Rate (TL to TP) Liquidous Temperature tL Preheat Area TC –5°C Value Preheat Temperature Min A R 8 minutes max. Package Classification Reflow Temperature (Tc): Volume mm³ 350-2000 Volume mm³ >2000 PB-Free Assembly | Package Thickness 260 °C < 1.6 mm 260 °C 260 °C PB-Free Assembly | Package Thickness 260 °C 1.6 mm - 2.5 mm 250 °C 245 °C PB-Free Assembly | Package Thickness 250 °C > 2.5 mm 245 °C 245 °C Properties 25 Time 25°C to Peak Time D Volume mm³
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