HW-SPAR3E-SK-UK-G

ONE GENERATION – MULTIPLE DOMAIN All the Choice You Need to Solve Any Design Challenge With the introduction of the Spartan™-3AN and Spartan-3A DSP platforms, the Spartan-3 Generation of FPGAs now offers a choice of five platforms, each delivering a unique cost-optimized balance of programmable logic, connectivity, and dedicated hard IP for your low-cost applications. Mainstream FPGAs Multiple platforms — Each optimized to a specific application domain for lowest system cost • Spartan-3A platform — For applications where I/O count and capabilities matter more than logic density • Ideal for bridging, differential signaling and memory interfacing applications • Spartan-3E platform — For applications where logic densities matter more than I/O count • Ideal for logic integration, DSP co-processing and embedded control • Spartan-3 platform — For applications where both high logic density and high I/O count are important • Ideal for highly integrated data-processing applications Logic I/Os Spartan-3 Generation FPGAs -OPTIMIZED PLATFORMS Non-Volatile FPGAs Delivering the Best of Both Worlds Non-Volatile Secure FPGAs for Highest System Integration • Spartan-3AN Platform — For applications where non-volatile system integration, security or large user Flash is required • Breakthrough marriage of uncompromised SRAM FPGA and Flash technologies • Outperforms non-volatile FPGAs with unparalleled Flash reliability combined with performance and features previously available only in SRAM FPGAs • Industry-leading security helps prevent reverse engineering, cloning, and unauthorized overbuilding • Superior system flexibility with up to 11 Mb of on-chip user Flash Digital Signal Processing FPGAs Breakthrough Price for High Performance DSP • Spartan-3A DSP Platform — For applications where integrated DSP MACs and expanded memory are required • Supports high-density designs with up to 53K logic cells and robust on-chip memory • Over 20 GMACS DSP performance for under $30 utilizing cost-optimized integrated DSP48A slices • Ideal for designs requiring low-cost FPGAs for signal processing applications such as military radio, surveillance cameras, medical imaging, etc. • Significant gains in application efficiency using highly parallel architectures Algorithmic Complexity – As demand for processing power rapidly increases, sequential processing cannot support algorithmic complexities within required response times. To overcome these architectural limitations, the parallel processing offered by Virtex™ DSP and Spartan™ DSP FPGAs is essential. THE LOWEST TOTAL-COST. Up to 50% Lower Total Cost Lowest cost devices for your application • Industry’s largest selection of low-cost devices and packages • Allows an optimal match for any customer requirement • Small form-factor packages for extremely cost-sensitive consumer applications Reduced Bill of Materials cost • High on-chip integration reduces number of external components including voltage regulators, buffers, and line drivers • More tolerant Vcc specification allows use of inexpensive voltage regulators • Noise-resistant circuits eliminate or minimize need for expensive filtering components such as ferrite beads and decoupling capacitors Cost-effective engineering design Competitive Solution • Fewer components simplify and shrink board designs • Comprehensive IP library (8X bigger than nearest competitor), extensive portfolio of boards/kits and software tools significantly reduce time-to-market Lower Inventory and manufacturing costs • Fewer components minimize ordering, reduce material holding cost, and simplify logistics • Use of standard components allow reuse of excess inventory Improved quality and reliability • Decreased PCB complexity with fewer components, Spartan Low-cost Solution lower layer count and increased signal integrity • Reduced device count significantly decreases failures from misalignment and cold solder joint failures, etc. Spartan-3 Generation FPGAs . PERIOD. Lower Power, Lower Cost On-chip power management • No complex design requirements • Fewer external components such as heat sinks, fans, etc. • Suspend Mode lowers static power by more than 40% • Hibernate Mode offers maximum power savings by lowering static power by up to 99% Industry-leading power management tools • ISE™ 10.1 delivers automatic dynamic power reduction • XPower analyzer tools with full environment, voltage, and worst-case evaluation Robust, Low-cost Design Security Helps prevent unauthorized manufacturing • Protects revenues from cloning, overbuilding and reverse-engineering • Design security to safeguard both hardware and software IP • Cost-based flexible security solutions based on unique requirements • Unique Device DNA serial number • Customizable algorithms for security as well as responses to failures The Right Fit for the Right Application The comprehensive portfolio of Spartan platforms allows customers to choose the best solution for their unique design requirements. Platform Spartan-3 Spartan-3E Spartan-3A Spartan-3AN Spartan-3A DSP Cost Optimization High logic density and I/O count Logic density I/O count & Capabilities Non-volatile Capabilities DSP Capabilities Ideal Applications High logic and I/O densities– Lowest-cost density– highly integrated datalogic integration, DSP processing co-processing, embedded control Wide or multiple interfaces– Space-critical or secure bridging, differential applications as well as low signaling, memory interfaces cost embedded controllers Signal Processing applications such as military radio, cameras, medical imaging, etc. Logic Cells 1,728 to 74,880 2,160 to 33,192 1,584 to 25,344 1,584 to 25,344 37,440 to 53,712 I/Os 63 to 633 66 to 376 108 to 502 108 to 502 309 to 519 User Flash — — — Up to 11Mb — Security External with secure PROM External with secure PROM Internal with Device DNA Internal with on-chip configuration, Device DNA, and Factory Flash ID Internal with Device DNA Power Management • XPower Analyzer and Web Power Tools • XPower Estimator and XPower Analyzer Tools • Suspend–more than • Suspend–more than • Suspend–more than 40% reduction • Hibernate–up to 99% reduction • XPower Estimator and XPower Analyzer Tools 40% reduction • Hibernate–up to 99% reduction • XPower Estimator and XPower Analyzer Tools 99% reduction • XPower Estimator and XPower Analyzer Tools 40% reduction • Hibernate–up to SelectIO™ Technology • Supports 24 differential and single-ended I/O standards • Up to 24mA drive • DDR and DDR2 memory interfaces • Supports 18 differential and single-ended I/O standards • Enhanced differential signaling with on-chip termination • Up to 16mA drive • DDR memory interfaces • Supports 26 differential and single-ended I/O standards • Enhanced differential signaling with on-chip termination • TMDS, PPDS, RSDS, LVDS, DDR, DDR2 and SSTL3 class I & II • Full 3.3V and hot swap compliance • Supports 26 differential and single-ended I/O standards • Enhanced differential signaling with on-chip termination • TMDS, PPDS, RSDS, LVDS, DDR, DDR2 and SSTL3 class I & II • Full 3.3V and hot swap compliance • Supports 26 differential and single-ended I/O standards • Enhanced differential signaling with on-chip termination • TMDS, PPDS, RSDS, LVDS, DDR, DDR2 and SSTL3 class I & II • Full 3.3V and hot swap compliance DSP Resources • Embedded 18 x 18 • Pipelined, embedded • Pipelined, embedded • Pipelined, embedded • Integrated XtremeDSP™ multipliers • 18 Kbit dual-port RAM • Distributed RAM and shift registers 18 x 18 multipliers • 18 Kbit dual-port RAM • Distributed RAM and shift registers 18 x 18 multipliers • 18 Kbit dual-port RAM • Distributed RAM and shift registers 18 x 18 multipliers • 18 Kbit dual-port RAM • Distributed RAM and shift registers • DSP48A provides an 18-bit x 18-bit multiplier, 18-bit pre-adder, 48-bit post-adder/accumulator • Platform Flash with full support • Parallel Flash with MultiBoot plus watchdog • SPI Flash • JTAG and ISE tool support • Platform Flash with full support • Parallel Flash with MultiBoot plus watchdog • SPI Flash • JTAG and ISE tool support • Platform Flash with full support • Parallel Flash with MultiBoot plus watchdog • SPI Flash • JTAG and ISE tool support Configuration • Platform Flash, with easy • Platform Flash with in-system reprogramma- full support • Parallel Flash with bility, and compression • JTAG and ISE™ MultiBoot • SPI Flash tool support • JTAG and ISE tool support Fast, Flexible System Implement Customizable Low-Cost Solutions with Pre-Engineered IP Optimized silicon and application-specific IP enables optimized solutions with popular low-cost interface standards. PCI Express® • Fully-compliant to PCIe® Specification v1.1 • Starter Kit for PCI Express including development board • LogiCORE™ PIPE Endpoint for PCI Express • Reference Design with third-party PHY • Bundled solution pricing PCI ™ 33 and 66MHz, fully PCI 3.0-compliant • PCI32 and PCI64 LogiCORE IP cores • Customizable back-end functionality Ethernet • Designed to the IEEE 802.3-2002 specification for 1000 Mbps, 100 Mbps, and 10 Mbps modes • Customizable LogiCORE Tri-Mode Ethernet MAC • Integrates with the Ethernet 1000BASE-X PCS/PMA or SGMII LogiCORE for implementation of Ethernet Link and Physical layers • Trimode Ethernet MAC and Ethernet Lite Peripherals for Embedded Processing Applications DSP SPI-4.2, functionally compliant with OIF and SATURN® specifications • FEC blocks including Viterbi, Reed Solomon, Convolution Encoder and standard specific IP blocks such as WIMAX, W-CDMA, DOCSIS • Video Codecs: MPEG4, H.264, etc. Embedded Processing • SPI4.2(PL4) Lite LogiCORE delivers Sink and Source cores selected and configured through Xilinx CORE Generator™ CAN, designed to ISO 11898-1, CAN2.0A and CAN2.0B specifications • User-configurable CAN LogiCORE IP • Stand-alone mode or connected to Xilinx MicroBlaze processor • Customizable 32-bit MicroBlaze soft processor with complete ™ set of Peripheral IP cores • Platform Studio tool suite simplifies embedded processing system design • Comprehensive embedded software tools & RTOS ecosystem providers • Small footprint PicoBlaze for 8-bit controller for assembly programmed applications Memory Interfaces Dynamic Input Delay Technology and the Memory Interface Generator tool make it easy to build reliable interfaces to the latest low-cost memories, including DDR2 and DDR Memory Device Electrical Interface Clock Rate Data Rate DDR2 SDRAM SSTL 1.8V 200 MHz 400 Mbps DDR SDRAM SSTL 2.5V 166 MHz 333 Mbps Over 300 IP Blocks Available Today – www.xilinx.com/ipcenter Spartan-3 Generation FPGAs Integration Accelerate Time-to-Market with Development Boards and Starter Kits The Spartan boards and Starter Kits provide a complete development solution giving designers instant access to the capabilities of the Spartan FPGAs. The Starter Kit includes a development board, power supply with universal adaptors, and much more. Board/Kit Part numbers Price Spartan-3AN Starter Kit HW-SPAR3AN-SK-UNI-G $199 Spartan-3A Starter Kit HW-SPAR3A-SK-UNI-G $189 Spartan-3E Starter Kit HW-SPAR3E-SK-UNI-G $149 Spartan-3 Starter Kit HW-SPAR3-SK-UNI-G $149 Spartan-3A DDR2 SDRAM Interface Development Kit HW-SPAR3ADDR2-DK-UNI-G $235 Spartan-3E PCI Express Starter Kit HW-S3PCIE-DK $349 Automotive ECU Development Kit HW-XA3S1600E-UNI-G $1495 Spartan-3E Display Development Kit HW-SPAR3E-DISP-DK-UNI-G $1595 Embedded Development HW/SW Kit – MicroBlaze Processor Edition DO-SD1800A-EDK-DK-UNI-G $595 XtremeDSP Starter Platform – Spartan-3A DSP 1800A Edition HW-SD1800A-DSP-SB-UNI-G $295 XtremeDSP Starter Kit – Spartan-3A DSP Edition DO-SD1800A-DSP-SK-UNI-G-PROMO $495 XtremeDSP Development Board – Spartan-3A DSP 3400A Edition HW-SD3400A-DSP-DB-UNI-G $995 XtremeDSP Video Starter Kit — Spartan-3A DSP Edition DO-S3ADSP-VIDEO-SK-UNI-G $1595 Note: For more information on development boards, please visit www.xilinx.com/spartankits Spartan-3A DSP Development Board Spartan-3A Starter Kit Flexibility and Low Cost – The Ultimate Choice for Volume Applications Systems designers worldwide are leveraging the unique advantages of Spartan-3 Generation FPGAs across a wide range of end applications, adapting their products to rapidly changing interface and data standards, differentiating functionality with minimum design time, and reducing risk as they ramp to higher production volumes. Examples Application Challenges Spartan-3 Generation Advantages Flat Panel Displays • Panel board and video/tuner board cost • Constantly evolving I/O requirements • Shorter product life cycles with higher amortized cost risk for new ASICs • Constantly evolving, subjective image quality requirements • Differentiating vs. competing hardware • 5 domain-optimized platforms for lowest-cost fit to each application • SelectIO Technology with on-chip differential termination and widest I/O standards compliance, including LVDS, RSDS, mini-LVDS, PPDS and TMDS • Pre- or post-processing video enhancement, LVDS TxRx (FPDLink), and peripheral interface bridging solutions • TCON (timing control) and video co-processing flexibility • Flexible peripheral interfacing and video switching • Reference designs for precise gamma correction, image dithering, color temperature correction and other video-enhancement functions Set-Top Boxes • Evolving interface standards for memory, disks, and other components • Managing inventory with multiple product feature sets • Differentiating video processing capability at lower power and cost • Accelerating and updating algorithms for conditional access/security • SelectIO Technology with support for up to 26 different I/O standards • MultiBoot reconfigurability and density migration within a single package • XtremeDSP Technology with industry-leading price/performance for digital video decoding • Fast, compact IP cores for authentication and content encryption Wireless Access • Low-level MAC-layer co-processing in Customer Premises Equipment • Forward Error Correction and DSP co-processing efficiency • Peripheral bridging and interfacing • IP cores for MAC, FEC, encryption, digital up/down conversion and security • XtremeDSP Technology with flexible high performance • SelectIO Technology with on-chip termination and wide I/O standards support Industrial Ethernet and Motion Control • Bridging multiple connectivity protocols • Customizing PWM and control algorithms • Accelerating motion control algorithms • IP cores for EtherCAT, SerCOS III, CAN, Ethernet, PCI and PCI Express • Flexible Xilinx Embedded Processing Technology • Hardware acceleration with Fast Simplex Link and XtremeDSP Technology Automotive • Full compliance to industry production process and quality standards • Interconnecting different automotive/multimedia standards • Extended Automotive temperature ranges, both Industrial and Q-Grade; full PPAP support and AEC-Q100 qualification for Spartan-3 and Spartan-3E platforms • IP cores for bridging CAN, LIN and MOST®, as well as USB 2.O and Ethernet • XtremeDSP Technology with industry-leading price/performance/power and IP for filtering, edge detection, and codes • SelectIO Technology with on-chip termination for LVDS, RSDS and other standards • DSP performance need for object recognition, motion detection and advanced compression algorithms • Changing industry standards • Rapidly evolving technology such as automated scene analysis • XtremeDSP performance through parallelism in FPGA fabric • FPGA flexibility and scalability • Field upgradeability Video Surveillance TAKE THE NEXT STEP Visit us online at www.xilinx.com/spartan I/O optimized Spartan-3A Non-volatile Spartan-3AN 200K 4 487 221 4 391 175 4 264 116 4 173 76 63 2 124 56 63 141 173 141 173 124 264 221 97 97 97 221 333 487 221 333 391 173 208K 120K 56K 30K 12K 32 576K 24 432K 16 288K 32 24 12 89 2000K 489 633 565 300 633 4 432K 1,728K 96 96 62,208 4000K 489 333 270 565 4 320K 720K 40 40 29,952 46,080 1500K 216K 16 8,064 17,280 1000K 4 12 400K 72K 4 1,728 4,320 50K 633 489 300 633 4 520K 1,872K 104 104 74,880 5000K 172 158 92 108 83 66 108 68 66 172 4 38K 216K 12 12 5,508 250K 40 108 2 15K 72K 4 4 2,160 100K 232 190 158 92 92 232 4 73K 360K 20 20 10,476 500K 304 250 190 124 304 8 136K 504K 28 28 19,512 1,200K 376 304 250 156 376 8 231K 648K 36 36 33,192 1,600K 144 108 68 64 144 2 11K 54K 3 3 1,584 50K 248 195 68 112 248 4 28K 288K 16 16 4,032 200K 311 251 195 142 311 4 56K 360K 20 20 8,064 400K 372 311 161 165 372 8 92K 360K 20 20 13,248 700K 502 375 161 227 502 8 176K 576K 32 32 25,344 1400K 108 50 108 627K 2 11K 54K 3 3 1,584 50K 195 90 195 2M 4 28K 288K 16 16 4,032 200K 311 142 311 2M 4 56K 360K 20 20 8,064 400K 372 165 372 5M 8 92K 360K 20 20 13,248 700K 502 227 502 11M 8 176K 576K 32 32 25,344 1400K 519 309 227 519 8 260K 1512K 84 84* 37,440 1800K 469 309 213 469 8 373K 2268K 126 126* 53,712 3400K XC3SD3400A DSP optimized Spartan-3A DSP XC3S50 XC3S200 XC3S400 XC3S1000 XC3S1500 XC3S2000 XC3S4000 XC3S5000 XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E XC3S50A XC3S200A XC3S400A XC3S700A XC3S1400A XC3S50AN XC3S200AN XC3S400AN XC3S700AN XC3S1400AN XC3SD1800A Logic optimized Optimized for High Density and High I/O Designs Note: 1. System Gates include 20-30% of CLBs used as RAMs. 2. Numbers in table across device packages indicate maximum number of user I/Os. 3. For detailed information on device and package offerings, please check the data sheet for the specific platform at www.xilinx.com/spartan * Integrated in the DSP48A slices (Advanced Multiply Accumulate Element) FG900 31 x 31 mm FG676 27 x 27 mm CS484 19 x 19 mm FG484 23 x 23 mm FG456 23 x 23 mm FG400 21 x 21 mm FG320 19 x 19 mm FT256 17 x 17 mm PQ208 30.6 x 30.6 mm TQ144 22 x 22 mm CP132 8 x 8 mm VQ100 16 x 16 mm Max Diff. I/O Pairs Max Single Ended I/O User Flash Bits DCMs Distributed RAM Bits Block RAM Bits Block RAM Blocks Dedicated Multipliers Logic Cells System Gates Part Number Spartan-3E Spartan-3 Corporate Headquarters Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124 USA Tel: +1-408-559-7778 Web: www.xilinx.com Europe Xilinx Europe One Logic Drive Citywest Business Campus Saggart, County Dublin Ireland Tel: +353-1-464-0311 Web: www.xilinx.com Japan Xilinx K.K. Art Village Osaki Central Tower 4F 1-2-2 Osaki, Shinagawa-ku Tokyo 141-0032 Japan Tel: +81-3-6744-7777 Web: japan.xilinx.com Asia Pacific Pte. Ltd. Xilinx, Asia Pacific 5 Changi Business Park Singapore 486040 Tel: +65-6407-3000 Web: www.xilinx.com www.xilinx.com Pb-free devices available now ©2008 Xilinx Inc. All rights reserved. XILINX, the Xilinx logo, are other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners. Printed in U.S.A. PN 2027-2