0
XA2C384 CoolRunner-II
Automotive CPLD
R
DS556 (v1.1) May 5, 2007
0
0
Features
•
•
•
•
•
•
AEC-Q100 device qualification and full PPAP support
available in both I-grade and extended temperature
Q-grade
Guaranteed to meet full electrical specifications over
TA = -40° C to +105° C with TJ Maximum = +125° C
(Q-grade)
Optimized for 1.8V systems
Industry’s best 0.18 micron CMOS CPLD
- Optimized architecture for effective logic synthesis
- Multi-voltage I/O operation — 1.5V to 3.3V
Available in the following package option
- 144-pin TQFP with 118 user I/O
- Pb-free only for this package
Advanced system features
- Fastest in system programming
·
1.8V ISP using IEEE 1532 (JTAG) interface
- IEEE1149.1 JTAG Boundary Scan Test
- Optional Schmitt-trigger input (per pin)
- Unsurpassed low power management
·
DataGATE enable (DGE) signal control
- Four separate I/O banks
- RealDigital 100% CMOS product term generation
- Flexible clocking modes
·
Optional DualEDGE triggered registers
·
Clock divider (divide by 2,4,6,8,10,12,14,16)
·
CoolCLOCK
- Global signal options with macrocell control
·
Multiple global clocks with phase selection per
macrocell
·
Multiple global output enables
·
Global set/reset
- Advanced design security
- PLA architecture
·
Superior pinout retention
·
100% product term routability across function
block
- Open-drain output option for Wired-OR and LED
drive
- Optional bus-hold, 3-state or weak pullup on
selected I/O pins
- Optional configurable grounds on unused I/Os
- Mixed I/O voltages compatible with 1.5V, 1.8V,
2.5V, and 3.3V logic levels
- Hot pluggable
Refer to the CoolRunner™-II Automotive CPLD family data
sheet for architecture description.
Product Specification
WARNING: Programming temperature range of
TA = 0° C to +70° C.
Description
The CoolRunner-II Automotive 384-macrocell device is
designed for both high performance and low power applications. This lends power savings to high-end communication
equipment and high speed to battery operated devices. Due
to the low power stand-by and dynamic operation, overall
system reliability is improved
This device consists of twenty four Function Blocks
inter-connected by a low power Advanced Interconnect
Matrix (AIM). The AIM feeds 40 true and complement inputs
to each Function Block. The Function Blocks consist of a 40
by 56 P-term PLA and 16 macrocells which contain numerous configuration bits that allow for combinational or registered modes of operation.
Additionally, these registers can be globally reset or preset
and configured as a D or T flip-flop or as a D latch. There
are also multiple clock signals, both global and local product
term types, configured on a per macrocell basis. Output pin
configurations include slew rate limit, bus hold, pull-up,
open drain and programmable grounds. A Schmitt-trigger
input is available on a per input pin basis. In addition to storing macrocell output states, the macrocell registers may be
configured as direct input registers to store signals directly
from input pins.
Clocking is available on a global or Function Block basis.
Three global clocks are available for all Function Blocks as
a synchronous clock source. Macrocell registers can be
individually configured to power up to the zero or one state.
A global set/reset control line is also available to asynchronously set or reset selected registers during operation.
Additional local clock, synchronous clock-enable, asynchronous set/reset and output enable signals can be formed
using product terms on a per-macrocell or per-Function
Block basis.
A DualEDGE flip-flop feature is also available on a per macrocell basis. This feature allows high performance synchronous operation based on lower frequency clocking to help
reduce the total power consumption of the device.
Circuitry has also been included to divide one externally
supplied global clock (GCK2) by eight different selections.
This yields divide by even and odd clock frequencies.
The use of the clock divide (division by 2) and DualEDGE
flip-flop gives the resultant CoolCLOCK feature.
© 2006, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS556 (v1.1) May 5, 2007
Product Specification
www.xilinx.com
1
XA2C384 CoolRunner-II Automotive CPLD
R
DataGATE is a method to selectively disable inputs of the
CPLD that are not of interest during certain points in time.
By mapping a signal to the DataGATE function, lower power
can be achieved due to reduction in signal switching.
CPLDs achieve both high-performance and low power
operation.
Another feature that eases voltage translation is I/O banking. Four I/O banks are available on the CoolRunner-II
Automotive 384 macrocell device that permit easy interfacing to 3.3V, 2.5V, 1.8V, and 1.5V devices.
The CoolRunner-II Automotive 384-macrocell device features LVCMOS and LVTTL I/O implementations. See
Table 1 for I/O standard voltages. The LVTTL I/O standard
is a general purpose EIA/JEDEC standard for 3.3V applications that use an LVTTL input buffer and Push-Pull output
buffer. The LVCMOS standard is used in 3.3V, 2.5V, 1.8V
applications. CoolRunner-II Automotive CPLDs are also
1.5V I/O compatible with the use of Schmitt-trigger inputs.
Supported I/O Standards
The CoolRunner-II Automotive 384-macrocell CPLD is I/O
compatible with various I/O standards (see Table 1). This
device is also 1.5V I/O compatible with the use of
Schmitt-trigger inputs.
Table 1: I/O Standards for XA2C384
RealDigital Design Technology
IOSTANDARD Attribute Output VCCIO
Xilinx CoolRunner-II Automotive CPLDs are fabricated on a
0.18 micron process technology which is derived from leading edge FPGA product development. CoolRunner-II Automotive CPLDs employ RealDigital a design technique that
makes use of CMOS technology in both the fabrication and
design methodology. RealDigital design technology
employs a cascade of CMOS gates to implement sum of
products instead of traditional sense amplifier methodology.
Due to this technology, Xilinx CoolRunner-II Automotive
Input VCCIO
LVTTL
3.3
3.3
LVCMOS33
3.3
3.3
LVCMOS25
2.5
2.5
LVCMOS18
1.8
1.8
LVCMOS15(1)
1.5
1.5
(1) LVCMOS15 requires Schmitt-trigger inputs.
ICC (mA)
100
50
0
25
0
50
75
125
100
Frequency (MHz)
DS556_01_092106
Figure 1: ICC vs Frequency
Table 2: ICC vs Frequency (LVCMOS 1.8V TA = 25°C)(1)
Frequency (MHz)
Typical ICC (mA)
0
25
50
75
100
125
0.023
17.5
35.03
52.53
70.03
87.53
Notes:
1. 16-bit up/down, Resetable binary counter (one counter per function block).
2
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DS556 (v1.1) May 5, 2007
Product Specification
XA2C384 CoolRunner-II Automotive CPLD
R
Absolute Maximum Ratings (1)
Symbol
Description
Value
Units
VCC
Supply voltage relative to ground
–0.5 to 2.0
V
VCCIO
Supply voltage for output drivers
–0.5 to 4.0
V
JTAG input voltage limits
–0.5 to 4.0
V
JTAG input supply voltage
–0.5 to 4.0
V
VJTAG
(2)
VCCAUX
VIN
(1)
Input voltage relative to ground
–0.5 to 4.0
V
VTS(1)
Voltage applied to 3-state output
–0.5 to 4.0
V
TSTG(3)
Storage Temperature (ambient)
–65 to +150
°C
+125
°C
TJ
Junction Temperature
Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easiest to achieve. During transitions,
the device pins may undershoot to –2.0v or overshoot to +4.5V, provided this over or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA.
2. Valid over commercial temperature range.
3. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. For Pb-free
packages, see XAPP427.
Recommended Operating Conditions
Symbol
VCC
VCCIO
VCCAUX
Parameter
Min
Max
Units
Industrial TA = –40°C to +85°C
1.7
1.9
V
Q-Grade TA = -40° C to +105° C
TJ Maximum = +125° C
1.7
1.9
V
Supply voltage for output drivers @ 3.3V operation
3.0
3.6
V
Supply voltage for output drivers @ 2.5V operation
2.3
2.7
V
Supply voltage for output drivers @ 1.8V operation
1.7
1.9
V
Supply voltage for output drivers @ 1.5V operation
1.4
1.6
V
Supply voltage for JTAG programming
1.7
3.6
V
Supply voltage for internal logic
and input buffers
DC Electrical Characteristics (Over Recommended Operating Conditions)
Symbol
Parameter
Test Conditions
Typical
Max.
Units
ICCSB
Standby current Industrial
VCC = 1.9V, VCCIO = 3.6V
79
350
μA
ICCSB
Standby current Q-grade
VCC = 1.9V, VCCIO = 3.6V
79
4.0
mA
ICC (1)
Dynamic current
f = 1 MHz
6.0
mA
f = 50 MHz
50
mA
CJTAG
JTAG input capacitance
f = 1 MHz
-
10
pF
CCLK
Global clock input capacitance
f = 1 MHz
-
12
pF
CIO
I/O capacitance
f = 1 MHz
-
10
pF
IIL(2)
Input leakage current
VIN = 0V or VCCIO to 3.9V
-
+/–10
μA
IIH(2)
I/O High-Z leakage
VIN = 0V or VCCIO to 3.9V
-
+/–10
μA
Notes:
1. 16-bit up/down, Resetable binary counter (one counter per function block).
DS556 (v1.1) May 5, 2007
Product Specification
www.xilinx.com
3
XA2C384 CoolRunner-II Automotive CPLD
R
LVCMOS and LVTTL 3.3V DC Voltage Specifications
Symbol
Parameter
Min.
Max.
Units
3.0
3.6
V
High level input voltage
2
3.9
V
VIL
Low level input voltage
–0.3
0.8
V
VOH
High level output voltage,
Industrial grade
VCCIO
Input source voltage
VIH
High level output voltage,
Q-grade
VOL
High level output voltage,
Industrial grade
High level output voltage,
Q-grade
Test Conditions
IOH = –8 mA, VCCIO = 3V
VCCIO – 0.4V
-
V
IOH = –0.1 mA, VCCIO = 3V
VCCIO – 0.2V
-
V
IOH = –4 mA, VCCIO = 3V
VCCIO – 0.4V
-
V
IOH = –0.1 mA, VCCIO = 3V
VCCIO – 0.2V
-
V
IOL = 8 mA, VCCIO = 3V
-
0.4
V
IOL = 0.1 mA, VCCIO = 3V
-
0.2
V
IOL = 4 mA, VCCIO = 3V
-
0.4
V
IOL = 0.1 mA, VCCIO = 3V
-
0.2
V
Min.
Max.
Units
2.3
2.7
V
LVCMOS 2.5V DC Voltage Specifications
Symbol
VCCIO
Parameter
Test Conditions
Input source voltage
0.3(1)
VIH
High level input voltage
1.7
VIL
Low level input voltage
–0.3
0.7
V
VOH
High level output voltage,
Industrial grade
IOH = –8 mA, VCCIO = 2.3V
VCCIO – 0.4V
-
V
IOH = –0.1 mA, VCCIO = 2.3V
VCCIO – 0.2V
-
V
High level output voltage,
Q-grade
IOH = –4 mA, VCCIO = 2.3V
VCCIO – 0.4V
-
V
IOH = –0.1 mA, VCCIO = 2.3V
VCCIO – 0.2V
-
V
High level output voltage,
Industrial grade
IOL = 8 mA, VCCIO = 2.3V
-
0.4
V
IOL = 0.1 mA, VCCIO = 2.3V
-
0.2
V
IOL = 4 mA, VCCIO = 2.3V
-
0.4
V
IOL = 0.1 mA, VCCIO = 2.3V
-
0.2
V
VOL
High level output voltage,
Q-grade
VCCIO +
V
1. The VIH Max value represents the JEDEC specification for LVCMOS25. The CoolRunner-II input buffer can tolerate up to 3.9V without
physical damage.
4
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DS556 (v1.1) May 5, 2007
Product Specification
XA2C384 CoolRunner-II Automotive CPLD
R
LVCMOS 1.8V DC Voltage Specifications
Symbol
VCCIO
Parameter
Test Conditions
Input source voltage
Min.
Max.
Units
1.7
1.9
V
+ 0.3(1)
V
VIH
High level input voltage
0.65 x VCCIO
VIL
Low level input voltage
–0.3
0.35 x VCCIO
V
VOH
High level output voltage,
Industrial grade
IOH = –8 mA, VCCIO = 1.7V
VCCIO – 0.45
-
V
IOH = –0.1 mA, VCCIO = 1.7V
VCCIO – 0.2
-
V
High level output voltage, Q-grade
IOH = –4 mA, VCCIO = 1.7V
VCCIO – 0.45
-
V
IOH = –0.1 mA, VCCIO = 1.7V
VCCIO – 0.2
-
V
VOL
High level output voltage,
Industrial grade
High level output voltage, Q-grade
VCCIO
IOL = 8 mA, VCCIO = 1.7V
-
0.45
V
IOL = 0.1 mA, VCCIO = 1.7V
-
0.2
V
IOL = 4 mA, VCCIO = 1.7V
-
0.45
V
IOL = 0.1 mA, VCCIO = 1.7V
-
0.2
V
1. The VIH Max value represents the JEDEC specification for LVCMOS18. The CoolRunner-II input buffer can tolerate up to 3.9V without
physical damage.
LVCMOS 1.5V DC Voltage Specifications(1)
Symbol
Parameter
VCCIO
Input source voltage
VT+
Input hysteresis threshold voltage
Test Conditions
VTVOH
VOL
Min.
Max.
Units
1.4
1.6
V
0.5 x VCCIO
0.8 x VCCIO
V
0.2 x VCCIO
0.5 x VCCIO
V
High level output voltage,
Industrial grade
IOH = –8 mA, VCCIO = 1.4V
VCCIO – 0.45
-
V
IOH = –0.1 mA, VCCIO = 1.4V
VCCIO – 0.2
-
V
High level output voltage, Q-grade
IOH = –4 mA, VCCIO = 1.4V
VCCIO – 0.45
-
V
IOH = –0.1 mA, VCCIO = 1.4V
VCCIO – 0.2
-
V
High level output voltage,
Industrial grade
IOL = 8 mA, VCCIO = 1.4V
-
0.4
V
IOL = 0.1 mA, VCCIO = 1.4V
-
0.2
V
High level output voltage, Q-grade
IOL = 4 mA, VCCIO = 1.4V
-
0.4
V
IOL = 0.1 mA, VCCIO = 1.4V
-
0.2
V
Min.
Max.
Units
1.4
3.9
V
0.5 x VCCIO
0.8 x VCCIO
V
0.2 x VCCIO
0.5 x VCCIO
V
Notes:
1. Hysteresis used on 1.5V inputs.
Schmitt Trigger Input DC Voltage Specifications
Symbol
Parameter
VCCIO
Input source voltage
VT+
Input hysteresis threshold voltage
Test Conditions
VT-
DS556 (v1.1) May 5, 2007
Product Specification
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5
XA2C384 CoolRunner-II Automotive CPLD
R
AC Electrical Characteristics Over Recommended Operating Conditions
-10
Symbol
Parameter
Min.
-11
Max.
Min.
Max.
Units
TPD1
Propagation delay single p-term
-
9.2
-
9.2
ns
TPD2
Propagation delay OR array
-
10.0
-
10.0
ns
TSUD
Direct input register set-up time
4.2
-
4.5
-
ns
TSU1
Setup time fast (single p-term)
3.3
-
3.8
-
ns
TSU2
Setup time (OR array)
4.1
-
4.6
-
ns
THD
Direct input register hold time
0.0
-
0.0
-
ns
TH
Hold time (OR array or p-term)
0.0
-
0.3
-
ns
Clock to output
-
7.9
-
7.9
ns
TCO
FTOGGLE
(1)
Internal toggle rate
-
166
-
166
MHz
FSYSTEM1(2)
Maximum system frequency
-
125
-
118
MHz
FSYSTEM2(2)
Maximum system frequency
-
114
-
108
MHz
FEXT1
(3)
Maximum external frequency
-
89
-
85
MHz
FEXT2
(3)
Maximum external frequency
-
83
-
80
MHz
TPSUD
Direct input register p-term clock setup time
2.5
-
2.7
-
ns
TPSU1
P-term clock setup time (single p-term)
1.9
-
2.1
-
ns
TPSU2
P-term clock setup time (OR array)
2.7
-
2.9
-
ns
TPHD
Direct input register p-term clock hold time
0.4
-
1.2
-
ns
TPH
P-term clock hold
1.3
-
1.7
-
ns
TPCO
P-term clock to output
-
9.3
-
9.3
ns
TOE/TOD
Global OE to output enable/disable
-
9.2
-
9.2
ns
TPOE/TPOD
P-term OE to output enable/disable
-
10.2
-
10.4
ns
TMOE/TMOD
Macrocell driven OE to output enable/disable
-
12.5
-
12.5
ns
TPAO
P-term set/reset to output valid
-
11.6
-
11.6
ns
TAO
Global set/reset to output valid
-
11.5
-
11.5
ns
TSUEC
Register clock enable setup time
3.4
-
4.0
-
ns
THEC
Register clock enable hold time
0.0
-
0.3
-
ns
TCW
Global clock pulse width High or Low
3.0
-
3.0
-
ns
TPCW
P-term pulse width High or Low
10.0
-
10.0
-
ns
TAPRPW
Asynchronous preset/reset pulse width (High or Low)
10.0
-
10.0
-
ns
TDGSU
Set-up before DataGATE latch assertion
0.0
-
0.0
-
ns
TDGH
Hold to DataGATE latch assertion
6.0
-
6.0
-
ns
TDGR
DataGATE recovery to new data
11.0
ns
TDGW
DataGATE low pulse width
5.0
-
5.0
-
ns
TCDRSU
CDRST setup time before falling edge GCLK2
2.5
-
2.5
-
ns
TCDRH
CDRST hold time before falling edge GCLK2
0.0
-
0.2
-
ns
TCONFIG
Configuration time
-
200
-
200
μs
11.0
Notes:
1. FTOGGLE is the maximum frequency of a T flip-flop can reliably toggle (see CoolRunner-II Automotive CPLD family data sheet).
2. FSYSTEM1 (1/TCYCLE) is the internal operating frequency for a device with 16-bit Resetable binary counter through one p-term per
macrocell while FSYSTEM2 is through the OR array (one counter per function block)
3. FEXT1(1/TSU1+TCO) is the maximum external frequency using one p-term while FEXT2 is through the OR array
4. Typical configuration current during TCONFIG is 25 mA.
6
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DS556 (v1.1) May 5, 2007
Product Specification
XA2C384 CoolRunner-II Automotive CPLD
R
Internal Timing Parameters
-10
Parameter(1)
-11
Min.
Max.
Input buffer delay
-
3.8
-
3.8
ns
Direct data register input delay
-
5.5
-
5.3
ns
TGCK
Global Clock buffer delay
-
3.3
-
3.3
ns
TGSR
Global set/reset buffer delay
-
4.6
-
4.6
ns
TGTS
Global 3-state buffer delay
-
3.7
-
3.5
ns
TOUT
Output buffer delay
-
3.9
-
3.9
ns
TEN
P-term Delays
TCT
Output buffer enable/disable delay
-
5.5
-
5.7
ns
Control term delay
-
0.9
-
0.9
ns
TLOGI1
Single P-term delay adder
-
0.8
-
0.8
ns
-
0.8
ns
0.7
ns
Symbol
Buffer Delays
TIN
TDIN
Min.
Max.
Units
TLOGI2
Multiple P-term delay adder
Macrocell Delay
TPDI
Input to output valid
-
0.8
-
0.7
TLDI
Setup before clock (transparent latch)
-
2.5
-
2.5
ns
TSUI
Setup before clock
2.0
-
2.5
-
ns
THI
Hold after clock
0.0
-
0.0
-
ns
TECSU
Enable clock setup time
2.0
-
2.6
-
ns
TECHO
Enable clock hold time
0.0
-
1.7
-
ns
TCOI
Clock to output valid
-
0.7
-
0.7
ns
TAOI
Set/reset to output valid
Feedback Delays
TF
Feedback delay
-
3.0
-
3.0
ns
-
4.5
-
4.5
ns
TOEM
Macrocell to global OE delay
I/O Standard Time Adder Delays 1.5V CMOS
THYS15
Hysteresis input adder
-
3.0
-
2.8
ns
-
4.0
-
4.0
ns
TOUT15
-
1.0
-
1.0
ns
-
4.0
-
4.0
ns
-
4.0
-
4.0
ns
Output adder
TSLEW15
Output slew rate adder
I/O Standard Time Adder Delays 1.8V CMOS
THYS18
Hysteresis input adder
TOUT18
Output adder
TSLEW
Output slew rate adder
I/O Standard Time Adder Delays 2.5V CMOS
TIN25
Standard input adder
-
0.0
-
0.0
ns
-
4.0
-
4.0
ns
-
1.0
-
1.0
ns
THYS25
Hysteresis input adder
-
3.0
-
3.0
ns
TOUT25
Output adder
-
3.0
-
3.0
ns
TSLEW25
Output slew rate adder
-
4.0
-
5.6
ns
DS556 (v1.1) May 5, 2007
Product Specification
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7
XA2C384 CoolRunner-II Automotive CPLD
R
Internal Timing Parameters (Continued)
-10
Parameter(1)
Symbol
-11
Min.
Max.
Min.
Max.
Units
I/O Standard Time Adder Delays 3.3V CMOS/TTL
TIN33
Standard input adder
-
2.0
-
2.0
ns
THYS33
Hysteresis input adder
-
3.0
-
3.0
ns
TOUT33
Output adder
-
3.0
-
3.0
ns
TSLEW33
Output slew rate adder
-
4.0
-
4.0
ns
Notes:
1. 1.5 ns input pin signal rise/fall.
Switching Characteristics
Switching Test Conditions
VCC
VCC = VCCIO = 1.8V, 25oC
R1
Device
Under Test
6.0
R2
5.5
TPD2 (ns)
Test Point
CL
5.0
Output Type
4.5
4.0
1
2
4
8
16
Number of Outputs Switching
DS095_02_053103
Figure 2: Derating Curve for TPD
LVTTL33
R1
268Ω
R2
235Ω
CL
35 pF
LVCMOS33
275Ω
275Ω
35 pF
LVCMOS25
188Ω
188Ω
35 pF
LVCMOS18
112.5Ω
112.5Ω
35 pF
LVCMOS15
150Ω
150Ω
35 pF
Notes:
1. CL includes test fixtures and probe capacitance.
2. 1.5 nsec maximum rise/fall times on inputs.
DS092_03_092302
Figure 3: AC Load Circuit
8
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DS556 (v1.1) May 5, 2007
Product Specification
XA2C384 CoolRunner-II Automotive CPLD
R
Typical I/V Output Curves
3.3V
60
IO (Output Current mA)
50
2.5V
40
1.8V
Iol
30
20
1.5V
10
0
.5
0
1.0
1.5
2.0
2.5
VO (Output Volts)
3.0
3.5
XC384_IV_050703
Figure 4: Typical I/V Curves for XA2C384
Pin Descriptions (Continued)
Pin Descriptions
11
Function Block
Macrocell
TQG144
I/O Bank
Function Block
Macrocell
TQG144
I/O Bank
1
1
-
2
2(GTS2)
1
2
2
1
2
-
2
2
2
-
2
1(GSR)
3
143
2
2(GTS3)
3
3
2
1
4
142
2
2
4
4
2
1
5
-
2
2(GTS0)
5
5
2
1
6
-
-
2
6
-
-
1
7
-
-
2
7
-
-
1
8
-
-
2
8
-
-
1
9
-
-
2
9
-
-
1
10
-
-
2
10
-
-
1
11
-
-
2
11
-
-
1
12
140
2
2
12
-
2
1
13
139
2
2
13
-
2
1
14
-
2
2
14
-
2
1
15
-
2
2(GTS1)
15
6
2
1
16
-
2
2
16
7
2
DS556 (v1.1) May 5, 2007
Product Specification
www.xilinx.com
9
XA2C384 CoolRunner-II Automotive CPLD
R
Pin Descriptions (Continued)
10
Pin Descriptions (Continued)
Function Block
Macrocell
TQG144
I/O Bank
Function Block
Macrocell
TQG144
I/O Bank
3
1
-
2
5
1
-
2
3
2
-
2
5
2
133
2
3
3
138
2
5
3
132
2
3
4
137
2
5
4
-
2
3
5
136
2
5
5
-
2
3
6
-
-
5
6
-
-
3
7
-
-
5
7
-
-
3
8
-
-
5
8
-
-
3
9
-
-
5
9
-
-
3
10
-
-
5
10
-
-
3
11
-
-
5
11
-
-
3
12
135
2
5
12
-
2
3
13
-
2
5
13
131
2
3
14
-
2
5
14
-
2
3
15
-
2
5
15
130
2
3
16
134
2
5
16
129
2
4
1
9
2
6
1
-
2
4
2
10
2
6
2
13
2
4
3
11
2
6
3
14
2
4
4
12
2
6
4
15
2
4
5
-
2
6
5
-
2
4
6
-
-
6
6
-
-
4
7
-
-
6
7
-
-
4
8
-
-
6
8
-
-
4
9
-
-
6
9
-
-
4
10
-
-
6
10
-
-
4
11
-
-
6
11
-
-
4
12
-
2
6
12
-
2
4
13
-
2
6
13
16
2
4
14
-
2
6
14
17
2
4
15
-
2
6
15
-
2
4
16
-
2
6
16
18
2
www.xilinx.com
DS556 (v1.1) May 5, 2007
Product Specification
XA2C384 CoolRunner-II Automotive CPLD
R
Pin Descriptions (Continued)
Pin Descriptions (Continued)
Function Block
Macrocell
TQG144
I/O Bank
Function Block
Macrocell
TQG144
I/O Bank
7(CDRST)
1
35
1
9
1
-
1
7
2
-
1
9
2
28
1
7
3
-
1
9
3
-
1
7
4
34
1
9
4
-
1
7
5
33
1
9
5
-
1
7
6
-
-
9
6
-
-
7
7
-
-
9
7
-
-
7
8
-
-
9
8
-
-
7
9
-
-
9
9
-
-
7
10
-
-
9
10
-
-
7
11
-
-
9
11
--
-
7(GCK1)
12
32
1
9
12
-
1
7
13
-
1
9
13
-
1
7
14
31
1
9
14
-
1
7(GCK0)
15
30
1
9
15
26
1
7
16
-
1
9
16
25
1
8
1
-
1
10
1
44
1
8(GCK2)
2
38
1
10
2
45
1
8
3
-
1
10
3
-
1
8
4
-
1
10
4
46
1
8(DGE)
5
39
1
10
5
-
1
8
6
-
-
10
6
-
-
8
7
-
-
10
7
-
-
8
8
-
-
10
8
-
-
8
9
-
-
10
9
-
-
8
10
-
-
10
10
-
-
8
11
-
-
10
11
-
-
8
12
-
1
10
12
-
1
8
13
40
1
10
13
-
1
8
14
41
1
10
14
48
1
8
15
42
1
10
15
49
1
8
16
43
1
10
16
50
1
DS556 (v1.1) May 5, 2007
Product Specification
www.xilinx.com
11
XA2C384 CoolRunner-II Automotive CPLD
R
Pin Descriptions (Continued)
12
Pin Descriptions (Continued)
Function Block
Macrocell
TQG144
I/O Bank
Function Block
Macrocell
TQG144
I/O Bank
11
1
24
1
13
1
-
4
11
2
23
1
13
2
-
4
11
3
22
1
13
3
112
4
11
4
21
1
13
4
113
4
11
5
20
1
13
5
-
4
11
6
-
-
13
6
-
-
11
7
-
-
13
7
-
-
11
8
-
-
13
8
-
-
11
9
-
-
13
9
-
-
11
10
-
-
13
10
-
-
11
11
-
-
13
11
-
-
11
12
19
1
13
12
114
4
11
13
-
1
13
13
115
4
11
14
-
1
13
14
-
4
11
15
-
1
13
15
-
4
11
16
-
1
13
16
-
4
12
1
51
1
14
1
111
4
12
2
52
1
14
2
110
4
12
3
53
1
14
3
107
4
12
4
-
1
14
4
106
4
12
5
54
1
14
5
105
4
12
6
-
-
14
6
-
-
12
7
-
-
14
7
-
-
12
8
-
-
14
8
-
-
12
9
-
-
14
9
-
-
12
10
-
-
14
10
-
-
12
11
-
-
14
11
-
-
12
12
-
1
14
12
-
4
12
13
-
1
14
13
104
4
12
14
-
1
14
14
-
4
12
15
-
1
14
15
-
4
12
16
-
1
14
16
-
4
www.xilinx.com
DS556 (v1.1) May 5, 2007
Product Specification
XA2C384 CoolRunner-II Automotive CPLD
R
Pin Descriptions (Continued)
Pin Descriptions (Continued)
Function Block
Macrocell
TQG144
I/O Bank
Function Block
Macrocell
TQG144
I/O Bank
15
1
-
4
17
1
-
4
15
2
116
4
17
2
121
4
15
3
-
4
17
3
-
4
15
4
-
4
17
4
-
4
15
5
117
4
17
5
-
4
15
6
-
-
17
6
-
-
15
7
-
-
17
7
-
-
15
8
-
-
17
8
-
-
15
9
-
-
17
9
-
-
15
10
-
-
17
10
-
-
15
11
-
-
17
11
-
-
15
12
-
4
17
12
124
4
15
13
118
4
17
13
125
4
15
14
-
4
17
14
126
4
15
15
119
4
17
15
-
4
15
16
120
4
17
16
128
4
16
1
103
4
18
1
-
4
16
2
-
4
18
2
-
4
16
3
102
4
18
3
98
4
16
4
-
4
18
4
97
4
16
5
-
4
18
5
96
4
16
6
-
-
18
6
-
-
16
7
-
-
18
7
-
-
16
8
-
-
18
8
-
-
16
9
-
-
18
9
-
-
16
10
-
-
18
10
-
-
16
11
-
-
18
11
-
-
16
12
-
4
18
12
95
4
16
13
-
4
18
13
94
4
16
14
101
4
18
14
-
4
16
15
-
4
18
15
-
4
16
16
100
4
18
16
-
4
DS556 (v1.1) May 5, 2007
Product Specification
www.xilinx.com
13
XA2C384 CoolRunner-II Automotive CPLD
R
Pin Descriptions (Continued)
14
Pin Descriptions (Continued)
Function Block
Macrocell
TQG144
I/O Bank
Function Block
Macrocell
TQG144
I/O Bank
19
1
-
3
21
1
80
3
19
2
-
3
21
2
-
3
19
3
74
3
21
3
81
3
19
4
75
3
21
4
-
3
19
5
76
3
21
5
-
3
19
6
-
-
21
6
-
-
19
7
-
-
21
7
-
-
19
8
-
-
21
8
-
-
19
9
-
-
21
9
-
-
19
10
-
-
21
10
-
-
19
11
-
-
21
11
-
-
19
12
77
3
21
12
82
3
19
13
78
3
21
13
-
3
19
14
79
3
21
14
-
3
19
15
-
3
21
15
83
3
19
16
-
3
21
16
-
3
20
1
71
3
22
1
-
3
20
2
70
3
22
2
61
3
20
3
69
3
22
3
-
3
20
4
68
3
22
4
-
3
20
5
66
3
22
5
-
3
20
6
-
-
22
6
-
-
20
7
-
-
22
7
-
-
20
8
-
-
22
8
-
-
20
9
-
-
22
9
-
-
20
10
-
-
22
10
-
-
20
11
-
-
22
11
-
-
20
12
-
3
22
12
60
3
20
13
64
3
22
13
-
3
20
14
-
3
22
14
59
3
20
15
-
3
22
15
-
3
20
16
-
3
22
16
-
3
www.xilinx.com
DS556 (v1.1) May 5, 2007
Product Specification
XA2C384 CoolRunner-II Automotive CPLD
R
Pin Descriptions (Continued)
Pin Descriptions (Continued)
Function Block
Macrocell
TQG144
I/O Bank
Function Block
Macrocell
TQG144
I/O Bank
23
1
-
3
24
1
-
3
23
2
-
3
24
2
58
3
23
3
85
3
24
3
-
3
23
4
86
3
24
4
-
3
23
5
87
3
24
5
-
3
23
6
-
-
24
6
-
-
23
7
-
-
24
7
-
-
23
8
-
-
24
8
-
-
23
9
-
-
24
9
-
-
23
10
-
-
24
10
-
-
23
11
-
-
24
11
-
-
23
12
88
3
24
12
57
3
23
13
91
3
24
13
-
3
23
14
92
3
24
14
56
3
23
15
-
3
24
15
-
3
23
16
-
3
24
16
-
3
Notes:
1. GTS = global output enable, GSR = global reset/set, GCK =
global clock, CDRST = clock divide reset, DGE = DataGATE
enable.
2. GCK, GSR, and GTS pins can also be used for general
purpose I/O.
XA2C384 JTAG, Power/Ground, No Connect Pins and Total User I/O
Pin Type
TQG144
TCK
67
TDI
63
TDO
122
TMS
65
VCCAUX (JTAG supply voltage)
8
Power internal (VCC)
1, 37, 84
Power Bank 1 I/O (VCCIO1)
27, 55
Power Bank 2 I/O (VCCIO2)
141
Power Bank 3 I/O (VCCIO3)
73, 93
Power Bank 4 I/O (VCCIO4)
109, 127
Ground
29, 36, 47, 62, 72, 89, 90, 99, 108, 123, 144
No connects
-
Total user I/O (includes dual function pins)
DS556 (v1.1) May 5, 2007
Product Specification
118
www.xilinx.com
15
XA2C384 CoolRunner-II Automotive CPLD
R
Ordering Information
Pin/Ball
Spacing
Part Number
θJC
θJA
(C/Watt) (C/Watt)
Package Type
Package Body
Dimensions
I/O
Ind. (I)(1)
Hi-T (Q)
XA2C384-10TQG144I
0.5mm
34.1
6.5
Plastic Quad Flat Pack;
Pb-free
20mm x 20mm
118
I
XA2C384-11TQG144Q
0.5mm
34.1
6.5
Plastic Quad Flat Pack;
Pb-free
20mm x 20mm
118
Q
Notes:
1. I = Industrial (TA = –40° C to +85° C); Q = Automotive (TA = -40° C to +105° C with TJ Maximum = +125° C)..
Pb-Free Example: XA2C384
-10 TQ
G
144
I
Device
Speed Grade
Package Type
Pb-Free
Number of Pins
Temperature Range
Device Part Marking
R
Device Type
Package
Speed
Operating Range
XA2Cxxx
TQG144
10I
This line not
related to device
part number
Figure 5: Sample Package with Part Marking
16
www.xilinx.com
DS556 (v1.1) May 5, 2007
Product Specification
XA2C384 CoolRunner-II Automotive CPLD
VCC
I/O(1)
I/O(1)
I/O
I/O(1)
I/O(1)
I/O
VAUX
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
TQG144
Top View
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
VCCIO3
I/O
I/O
GND
GND
I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCIO3
VCCIO1
I/O
I/O
I/O
I/O
I/O
I/O
GND
TDI
I/O
TMS
I/O
TCK
I/O
I/O
I/O
I/O
GND
VCC
I/O(2)
I/O(5)
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
VCCIO1
I/O
GND
I/O(2)
I/O
I/O(2)
I/O
I/O
I/O(4)
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
GND
I/O(3)
I/O
VCCIO2
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCIO4
I/O
I/O
I/O
GND
TDO
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCIO4
R
(1) - Global Output Enable
(2) - Global Clock
(3) - Global Set/Reset
(4) - Clock Divide Reset
(5) - DataGATE Enable
Figure 6: TQ144 Thin Quad Flat Pack
CoolRunner-II Automotive Requirements and Recommendations
Requirements
The following requirements are for all automotive applications:
1. Use a monotonic, fast ramp power supply to power up
CoolRunner-II . A VCC ramp time of less than 1 ms is
required.
2. Do not float I/O pins during device operation. Floating
I/O pins can increase ICC as input buffers will draw
DS556 (v1.1) May 5, 2007
Product Specification
1-2 mA per floating input. In addition, when I/O pins are
floated, noise can propagate to the center of the CPLD.
I/O pins should be appropriately terminated with
bus-hold or pull-up. Unused I/Os can also be configured
as CGND (programmable GND).
3. Do not drive I/O pins without VCC/VCCIO powered.
4. Sink current when driving LEDs. Because all Xilinx
CPLDs have N-channel pull-down transistors on
outputs, it is required that an LED anode is sourced
www.xilinx.com
17
XA2C384 CoolRunner-II Automotive CPLD
R
through a resistor externally to VCC. Consequently, this
will give the brightest solution.
5. Avoid pull-down resistors. Always use external pull-up
resistors if external termination is required. This is
because the CoolRunner-II Automotive CPLD, which
includes some I/O driving circuits beyond the input and
output buffers, may have contention with external
pull-down resistors, and, consequently, the I/O will not
switch as expected.
6. Do not drive I/Os pins above the VCCIO assigned to its
I/O bank.
a. The current flow can go into VCCIO and affect a user
voltage regulator.
b. It can also increase undesired leakage current
associated with the device.
c.
If done for too long, it can reduce the life of the
device.
7. Do not rely on the I/O states before the CPLD
configures. During power up, the CPLD I/Os may be
affected by internal or external signals.
8. Use a voltage regulator which can provide sufficient
current during device power up. As a rule of thumb, the
regulator needs to provide at least three times the peak
current while powering up a CPLD in order to guarantee
the CPLD can configure successfully.
9. Ensure external JTAG terminations for TMS, TCK, TDI,
TDO should comply with the IEEE 1149.1. All Xilinx
CPLDs have internal weak pull-ups on TDI, TMS, and
TCK.
10. Attach all CPLD VCC and GND pins in order to have
necessary power and ground supplies around the
CPLD.
11. Decouple all VCC and VCCIO pins with capacitors of
0.01 μF and 0.1 μF closest to the pins for each
VCC/VCCIO-GND pair.
12. Configure I/Os properly. CoolRunner-II Automotive
CPLDs have I/O banks; therefore, signals must be
assigned to appropriate banks (LVCMOS33,
LVCMOS18 …)
Recommendations
The following recommendations are for all automotive applications.
1. Use strict synchronous design (only one clocking event)
if possible. A synchronous system is more robust than
an asynchronous one.
2. Include JTAG stakes on the PCB. JTAG stakes can be
used to test the part on the PCB. They add benefit in
reprogramming part on the PCB, inspecting chip
internals with INTEST, identifying stuck pins, and
inspecting programming patterns (if not secured).
3. CoolRunner-II Automotive CPLDs work with any power
sequence, but it is preferable to power the VCCI
(internal VCC) before the VCCIO for the applications in
which any glitches from device I/Os are unwanted.
4. Do not disregard report file warnings. Software
identifies potential problems when compiling, so the
report file is worth inspecting to see exactly how your
design is mapped onto the logic.
5. Understand the Timing Report. This report file provides
a speed summary along with warnings. Read the timing
file (*.tim) carefully. Analyze key signal chains to
determine limits to given clock(s) based on logic
analysis.
6. Review Fitter Report equations. Equations can be
shown in ABEL-like format, or can also be displayed in
Verilog or VHDL formats. The Fitter Report also
includes switch settings that are very informative of
other device behaviors.
7. Let design software define pinouts if possible. Xilinx
CPLD software works best when it selects the I/O pins
and manages resources for users. It can spread signals
around and improve pin-locking. If users must define
pins, plan resources in advance.
8. Perform a post-fit simulation for all speeds to identify
any possible problems (such as race conditions) that
might occur when fast-speed silicon is used instead of
slow-speed silicon.
9. Distribute SSOs (Simultaneously Switching Outputs)
evenly around the CPLD to reduce switching noise.
10. Terminate high speed outputs to eliminate noise caused
by very fast rising/falling edges.
Automotive Warranty Disclaimer
THIS WARRANTY DOES NOT EXTEND TO ANY IMPLEMENTATION IN AN APPLICATION OR ENVIRONMENT THAT IS
NOT CONTAINED WITHIN XILINX SPECIFICATIONS. PRODUCTS ARE NOT DESIGNED TO BE FAIL-SAFE AND ARE
NOT WARRANTED FOR USE IN THE DEPLOYMENT OF AIRBAGS. FURTHER, PRODUCTS ARE NOT WARRANTED
FOR USE IN APPLICATIONS THAT AFFECT CONTROL OF THE VEHICLE UNLESS THERE IS A FAIL-SAFE OR
REDUNDANCY FEATURE AND ALSO A WARNING SIGNAL TO THE OPERATOR OF THE VEHICLE UPON FAILURE.
18
www.xilinx.com
DS556 (v1.1) May 5, 2007
Product Specification
XA2C384 CoolRunner-II Automotive CPLD
R
USE OF PRODUCTS IN SUCH APPLICATIONS IS FULLY AT THE RISK OF CUSTOMER SUBJECT TO APPLICABLE
LAWS AND REGULATIONS GOVERNING LIMITATIONS ON PRODUCT LIABILITY.
Additional Information
Additional information is available for the following CoolRunner-II topics:
•
•
•
•
•
•
XAPP784: Bulletproof CPLD Design Practices
XAPP375: Timing Model
XAPP376: Logic Engine
XAPP378: Advanced Features
XAPP382: I/O Characteristics
XAPP389: Powering CoolRunner-II
•
XAPP399: Assigning VREF Pins
To access these and all application notes with their associated reference designs, click the following link and scroll
down the page until you find the document you want:
CoolRunner-II Data Sheets and Application Notes
Device Packages
Revision History
The following table shows the revision history for this document.
Date
Version
10/31/06
1.0
Initial Xilinx release
05/05/07
1.1
Change to VIH specification for 3.3V, 2.5V and 1.8V LVCMOS.
DS556 (v1.1) May 5, 2007
Product Specification
Revision
www.xilinx.com
19
