XA7A25T-1CPG238Q

10 XA Artix-7 FPGAs Data Sheet: Overview DS197 (v1.3) November 15, 2017 Product Specification General Description Xilinx® XA Artix®-7 (Automotive) FPGAs are optimized for the lowest cost and power with small form-factor packaging for high-volume automotive applications. Designers can leverage more logic per watt compared to the Spartan®-6 family. Built on a state-of-the-art high-performance/low-power (HPL) 28 nm high-k metal gate (HKMG) process technology, XA Artix-7 FPGAs redefine low-cost alternatives with more logic per watt. Unparalleled increase in system performance with 52 Gb/s I/O bandwidth, 100,000 logic cell capacity, 264 GMAC/s DSP, and flexible built-in DDR3 memory interfaces enable a new class of high-throughput, low-cost automotive applications. XA Artix-7 FPGAs also offer many high-end features, such as integrated advanced Analog Mixed Signal (AMS) technology. Analog becomes the next level of integration through the seamless implementation of independent dual 12-bit, 1 MSPS, 17-channel analog-to-digital converters. Most importantly, XA Artix-7 FPGAs proudly meet the high standards of the automotive grade with a maximum temperature of 125°C. Summary of XA Artix-7 FPGA Features • • • • • • • Automotive Temperatures: • I-Grade: Tj= –40°C to +100°C • Q-Grade: Tj= –40°C to +125°C Automotive Standards: • ISO-TS16949 compliant • AEC-Q100 qualification • Production Part Approval Process (PPAP) documentation • Beyond AEC-Q100 qualification is available upon request Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering Sub-watt performance in 100,000 logic cells High-performance SelectIO™ technology with support for DDR3 interfaces up to 800 Mb/s High-speed serial connectivity with built-in serial transceivers from 500 Mb/s to maximum rates of 6.25 Gb/s, enabling 50 Gb/s peak bandwidth (full duplex) • • • • • • • • • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors. Single-ended and differential I/O standards with speeds of up to 1.25 Gb/s 240 DSP48E1 slices with up to 264 GMACs of signal processing Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter Integrated block for PCI Express® (PCIe®), for up to x4 Gen2 Endpoint Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction Low-cost wire-bond packaging, offering easy migration between family members in the same package, all packages available Pb-free Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology Strong automotive-specific third-party ecosystem with IP, development boards, and design services XA Artix-7 FPGA Summary Tables Table 1: XA Artix-7 FPGA Device-Feature Table Configurable Logic Blocks (CLBs) Device Logic Cells Slices(1) Max Distributed RAM (Kb) Block RAM Blocks(3) DSP48E1 Slices(2) CMTs(4) 18 Kb 36 Kb Max (Kb) PCIe(5) GTPs XADC Blocks Total I/O Banks(6) Max User I/O(7) XA7A12T 12,800 2,000 171 40 40 20 720 3 1 2 1 3 150 XA7A15T 16,640 2,600 200 45 50 25 900 5 1 4 1 5 210 XA7A25T 23,360 3,650 313 80 90 45 1,620 3 1 4 1 3 150 XA7A35T 33,280 5,200 400 90 100 50 1,800 5 1 4 1 5 210 XA7A50T 52,160 8,150 600 120 150 75 2,700 5 1 4 1 5 210 XA7A75T 75,520 11,800 892 180 210 105 3,780 6 1 4 1 6 285 XA7A100T 101,440 15,850 1,188 240 270 135 4,860 6 1 4 1 6 285 Notes: 1. Each 7 series FPGA slice contains four LUTs and eight flip-flops; only some slices can use their LUTs as distributed RAM or SRLs. 2. Each DSP slice contains a pre-adder, a 25 x 18 multiplier, an adder, and an accumulator. 3. Block RAMs are fundamentally 36 Kb in size; each block can also be used as two independent 18 Kb blocks. 4. Each CMT contains one MMCM and one PLL. 5. XA Artix-7 FPGA Interface Blocks for PCI Express support up to x4 Gen 2. 6. Does not include configuration Bank 0. 7. This number does not include GTP transceivers. © Copyright 2014–2017 Xilinx, Inc., Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, UltraScale, Virtex, Vivado, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. PCI, PCIe, and PCI Express are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners. DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 1 XA Artix-7 FPGAs Data Sheet: Overview Table 2: XA Artix-7 FPGA Device-Package Combinations and Maximum I/Os Package(1) CPG236 CPG238 CSG324 CSG325 FGG484 Size (mm) 10 x 10 10 x 10 15 x 15 15 x 15 23 x 23 Ball Pitch (mm) 0.5 0.5 0.8 I/O Device GTP HR(2) XA7A12T XA7A15T 2 I/O GTP HR(2) 2 112 2 112 GTP 106 XA7A25T 0.8 I/O HR(2) GTP 2 0 210 1.0 I/O HR(2) I/O GTP HR(2) 150 4 150 4 150 XA7A35T 2 106 0 210 4 150 XA7A50T 2 106 0 210 4 150 XA7A75T 0 210 4 285 XA7A100T 0 210 4 285 Notes: 1. All packages listed are Pb-free. 2. HR = High Range I/O with support for I/O voltage from 1.2V to 3.3V. CLBs, Slices, and LUTs Some key features of the CLB architecture include: • Real 6-input look-up tables (LUTs) • Memory capability within the LUT • Register and shift register functionality The LUTs in 7 series FPGAs can be configured as either one 6-input LUT (64-bit ROMs) with one output, or as two 5-input LUTs (32-bit ROMs) with separate outputs but common addresses or logic inputs. Each LUT output can optionally be registered in a flip-flop. Four such LUTs and their eight flip-flops as well as multiplexers and arithmetic carry logic form a slice, and two slices form a configurable logic block (CLB). Four of the eight flip-flops per slice (one per LUT) can optionally be configured as latches. Between 25–50% of all slices can also use their LUTs as distributed 64-bit RAM or as 32-bit shift registers (SRL32) or as two SRL16s. Modern synthesis tools take advantage of these highly efficient logic, arithmetic, and memory features. Clock Management Some of the key highlights of the clock management architecture include: • High-speed buffers and routing for low-skew clock distribution • Frequency synthesis and phase shifting • Low-jitter clock generation and jitter filtering Each XA Artix-7 FPGA has three to six clock management tiles (CMTs), each consisting of one mixed-mode clock manager (MMCM) and one phase-locked loop (PLL). DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 2 XA Artix-7 FPGAs Data Sheet: Overview Mixed-Mode Clock Manager and Phase-Locked Loop The MMCM and PLL share many characteristics. Both can serve as a frequency synthesizer for a wide range of frequencies and as a jitter filter for incoming clocks. At the center of both components is a voltage-controlled oscillator (VCO), which speeds up and slows down depending on the input voltage it receives from the phase frequency detector (PFD). There are three sets of programmable frequency dividers: D, M, and O. The pre-divider D (programmable by configuration and afterwards via DRP) reduces the input frequency and feeds one input of the traditional PLL phase/frequency comparator. The feedback divider M (programmable by configuration and afterwards via DRP) acts as a multiplier because it divides the VCO output frequency before feeding the other input of the phase comparator. D and M must be chosen appropriately to keep the VCO within its specified frequency range. The VCO has eight equally-spaced output phases (0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315°). Each can be selected to drive one of the output dividers (six for the PLL, O0 to O5, and seven for the MMCM, O0 to O6), each programmable by configuration to divide by any integer from 1 to 128. The MMCM and PLL have three input-jitter filter options: low bandwidth, high bandwidth, or optimized mode. Low-bandwidth mode has the best jitter attenuation but not the smallest phase offset. High-bandwidth mode has the best phase offset, but not the best jitter attenuation. Optimized mode allows the tools to find the best setting. MMCM Additional Programmable Features The MMCM can have a fractional counter in either the feedback path (acting as a multiplier) or in one output path. Fractional counters allow non-integer increments of 1/8 and can thus increase frequency synthesis capabilities by a factor of 8. The MMCM can also provide fixed or dynamic phase shift in small increments that depend on the VCO frequency. At 1440 MHz, the phase-shift timing increment is 12.5 ps. Clock Distribution Each 7 series FPGA provides six different types of clock lines (BUFG, BUFR, BUFIO, BUFH, BUFMR, and the highperformance clock) to address the different clocking requirements of high fanout, short propagation delay, and extremely low skew. Global Clock Lines In each 7 series FPGA, 32 global clock lines have the highest fanout and can reach every flip-flop clock, clock enable, and set/reset, as well as many logic inputs. There are 12 global clock lines within any clock region driven by the horizontal clock buffers (BUFH). Each BUFH can be independently enabled/disabled, allowing for clocks to be turned off within a region, thereby offering fine-grain control over which clock regions consume power. Global clock lines can be driven by global clock buffers, which can also perform glitchless clock multiplexing and clock enable functions. Global clocks are often driven from the CMT, which can completely eliminate the basic clock distribution delay. Regional Clocks Regional clocks can drive all clock destinations in their region. A region is an area that is 50 I/O and 50 CLB high and half the chip wide. XA Artix-7 FPGAs have between six and eight regions. There are four regional clock tracks in every region. Each regional clock buffer can be driven from any of four clock-capable input pins, and its frequency can optionally be divided by any integer from 1 to 8. I/O Clocks I/O clocks are especially fast and serve only I/O logic and serializer/deserializer (SerDes) circuits, as described in the I/O Logic section. The 7 series devices have a direct connection from the MMCM to the I/O for low-jitter, high-performance interfaces. DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 3 XA Artix-7 FPGAs Data Sheet: Overview Block RAM Some of the key features of the block RAM include: • Dual-port 36 Kb block RAM with port widths of up to 72 • Programmable FIFO logic • Built-in optional error correction circuitry Every XA Artix-7 FPGA has between 20 and 135 dual-port block RAMs, each storing 36 Kb. Each block RAM has two completely independent ports that share nothing but the stored data. Synchronous Operation Each memory access, read or write, is controlled by the clock. All inputs, data, address, clock enables, and write enables are registered. Nothing happens without a clock. The input address is always clocked, retaining data until the next operation. An optional output data pipeline register allows higher clock rates at the cost of an extra cycle of latency. During a write operation, the data output can reflect either the previously stored data, the newly written data, or can remain unchanged. Programmable Data Width Each port can be configured as 32K × 1, 16K × 2, 8K × 4, 4K × 9 (or 8), 2K × 18 (or 16), 1K × 36 (or 32), or 512 × 72 (or 64). The two ports can have different aspect ratios without any constraints. Each block RAM can be divided into two completely independent 18 Kb block RAMs that can each be configured to any aspect ratio from 16K × 1 to 512 × 36. Everything described previously for the full 36 Kb block RAM also applies to each of the smaller 18 Kb block RAMs. Only in simple dual-port (SDP) mode can data widths of greater than 18 bits (18 Kb RAM) or 36 bits (36 Kb RAM) be accessed. In this mode, one port is dedicated to read operation, the other to write operation. In SDP mode, one side (read or write) can be variable, while the other is fixed to 32/36 or 64/72. Both sides of the dual-port 36 Kb RAM can be of variable width. Two adjacent 36 Kb block RAMs can be configured as one cascaded 64K × 1 dual-port RAM without any additional logic. Error Detection and Correction Each 64-bit-wide block RAM can generate, store, and utilize eight additional Hamming code bits and perform single-bit error correction and double-bit error detection (ECC) during the read process. The ECC logic can also be used when writing to or reading from external 64- to 72-bit-wide memories. FIFO Controller The built-in FIFO controller for single-clock (synchronous) or dual-clock (asynchronous or multirate) operation increments the internal addresses and provides four handshaking flags: full, empty, almost full, and almost empty. The almost full and almost empty flags are freely programmable. Similar to the block RAM, the FIFO width and depth are programmable, but the write and read ports always have identical width. First word fall-through mode presents the first-written word on the data output even before the first read operation. After the first word has been read, there is no difference between this mode and the standard mode. DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 4 XA Artix-7 FPGAs Data Sheet: Overview Digital Signal Processing — DSP Slice Some highlights of the DSP functionality include: • 25 × 18 two's complement multiplier/accumulator high-resolution (48 bit) signal processor • Power saving pre-adder to optimize symmetrical filter applications • Advanced features: optional pipelining, optional ALU, and dedicated buses for cascading DSP applications use many binary multipliers and accumulators, best implemented in dedicated DSP slices. All 7 series FPGAs have many dedicated, full custom, low-power DSP slices, combining high speed with small size while retaining system design flexibility. Each DSP slice fundamentally consists of a dedicated 25 × 18 bit twos complement multiplier and a 48-bit accumulator, both capable of operating up to 550 MHz. The multiplier can be dynamically bypassed, and two 48-bit inputs can feed a singleinstruction-multiple-data (SIMD) arithmetic unit (dual 24-bit add/subtract/accumulate or quad 12-bit add/subtract/accumulate), or a logic unit that can generate any one of ten different logic functions of the two operands. The DSP includes an additional pre-adder, typically used in symmetrical filters. This pre-adder improves performance in densely packed designs and reduces the DSP slice count by up to 50%. The DSP also includes a 48-bit-wide Pattern Detector that can be used for convergent or symmetric rounding. The pattern detector is also capable of implementing 96-bit-wide logic functions when used in conjunction with the logic unit. The DSP slice provides extensive pipelining and extension capabilities that enhance the speed and efficiency of many applications beyond digital signal processing, such as wide dynamic bus shifters, memory address generators, wide bus multiplexers, and memory-mapped I/O register files. The accumulator can also be used as a synchronous up/down counter. Input/Output Some highlights of the input/output functionality include: • High-performance SelectIO technology with support for 800 Mb/s DDR3 The number of I/O pins varies depending on device and package size. Each I/O is configurable and can comply with a large number of I/O standards. With the exception of the supply pins and a few dedicated configuration pins, all other package pins have the same I/O capabilities, constrained only by certain banking rules. The I/O in XA Artix-7 FPGAs are classed as High Range (HR). The HR I/Os offer the widest range of voltage support, from 1.2V to 3.3V. HR I/O pins in XA Artix-7 FPGAs are organized in banks, with 50 pins per bank. Each bank has one common VCCO output supply, which also powers certain input buffers. Some single-ended input buffers require an internally generated or an externally applied reference voltage (VREF). There are two VREF pins per bank (except configuration bank 0). A single bank can have only one VREF voltage value. I/O Electrical Characteristics Single-ended outputs use a conventional CMOS push/pull output structure driving High towards VCCO or Low towards ground, and can be put into a high-Z state. The system designer can specify the slew rate and the output strength. The input is always active but is usually ignored while the output is active. Each pin can optionally have a weak pull-up or a weak pulldown resistor. Most signal pin pairs can be configured as differential input pairs or output pairs. Differential input pin pairs can optionally be terminated with a 100Ω internal resistor. All 7 series devices support differential standards beyond LVDS: RSDS, BLVDS, differential SSTL, and differential HSTL. Each of the I/Os supports memory I/O standards, such as single-ended and differential HSTL as well as single-ended SSTL and differential SSTL. The SSTL I/O standard can support data rates of up to 800 Mb/s for DDR3 interfacing applications. Low Power I/O Features The I/Os have low power modes for IBUF and IDELAY to provide further power savings, especially when used to implement memory interfaces. DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 5 XA Artix-7 FPGAs Data Sheet: Overview I/O Logic I/O Registers and Input Delay All inputs and outputs can be configured as either combinatorial or registered. Double data rate (DDR) is supported by all inputs and outputs. Any input can be individually delayed by up to 32 increments of 78 ps, 52 ps, or 39 ps each. Such delays are implemented as IDELAY. The number of delay steps can be set by configuration and can also be incremented or decremented while in use. ISERDES and OSERDES Many applications combine high-speed, bit-serial I/O with slower parallel operation inside the device. This requires a serializer and deserializer (SerDes) inside the I/O structure. Each I/O pin possesses an 8-bit IOSERDES (ISERDES and OSERDES) capable of performing serial-to-parallel or parallel-to-serial conversions with programmable widths of 2, 3, 4, 5, 6, 7, or 8 bits. By cascading two IOSERDES from two adjacent pins (default from differential I/O), wider width conversions of 10 and 14 bits can also be supported. The ISERDES has a special oversampling mode capable of asynchronous data recovery for applications like a 1.25 Gb/s LVDS I/O-based SGMII interface. Low-Power Gigabit Transceivers Some highlights of the Low-Power Gigabit Transceivers include: • High-performance transceivers capable of up to 6.25 Gb/s (GTP). • Low-power mode optimized for chip-to-chip interfaces. • Advanced Transmit pre and post emphasis and receiver linear equalization (CTLE). Auto-adaption at receiver equalization and on-chip Eye Scan for easy serial link tuning. There are up to four transceiver circuits in the XA Artix-7 family, up to two transceiver circuits in the CPG236 and CPG238 packages, and up to four transceiver circuits in the CSG325 and FGG484 packages. Each serial transceiver is a combined transmitter and receiver. The serial transceivers use ring oscillators to generate a wide frequency tuning range. Lower data rates can be achieved using FPGA logic-based oversampling. The serial transmitter and receiver are independent circuits that use an advanced PLL architecture to multiply the reference frequency input by certain programmable numbers up to 25 to become the bit-serial data clock. Each transceiver has a large number of user-definable features and parameters. All of these can be defined during device configuration, and many can also be modified during operation. Transmitter The transmitter is fundamentally a parallel-to-serial converter with a conversion ratio of 16, 20, 32, or 40. This allows the designer to trade-off datapath width for timing margin in high-performance designs. These transmitter outputs drive the PC board with a single-channel differential output signal. TXOUTCLK is the appropriately divided serial data clock and can be used directly to register the parallel data coming from the internal logic. The incoming parallel data is fed through an optional FIFO and has additional hardware support for the 8B/10B, 64B/66B, or 64B/67B encoding schemes to provide a sufficient number of transitions. The bit-serial output signal drives two package pins with differential signals. This output signal pair has programmable signal swing as well as programmable pre- and post-emphasis to compensate for PC board losses and other interconnect characteristics. For shorter channels, the swing can be reduced to reduce power consumption. Receiver The receiver is fundamentally a serial-to-parallel converter, changing the incoming bit-serial differential signal into a parallel stream of words, each 16, 20, 32, or 40 bits. This allows the FPGA designer to trade-off internal datapath width versus logic timing margin. The receiver takes the incoming differential data stream, feeds it through programmable linear and decision feedback equalizers (to compensate for PC board and other interconnect characteristics), and uses the reference clock input to initiate clock recognition. There is no need for a separate clock line. The data pattern uses non-return-to-zero (NRZ) encoding and optionally guarantees sufficient data transitions by using the selected encoding scheme. Parallel data is then transferred into the FPGA logic using the RXUSRCLK clock. For short channels, the transceivers offers a special low power mode (LPM). DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 6 XA Artix-7 FPGAs Data Sheet: Overview Out-of-Band Signaling The transceivers provide out-of-band (OOB) signaling, often used to send low-speed signals from the transmitter to the receiver while high-speed serial data transmission is not active. This is typically done when the link is in a powered-down state or has not yet been initialized. This benefits PCI Express and SATA/SAS applications. Integrated Interface Blocks for PCI Express Designs Highlights of the integrated blocks for PCI Express include: • Compliant to the PCI Express Base Specification 2.1 with Endpoint and Root Port capability • Supports Gen1 (2.5 Gb/s) and Gen2 (5 Gb/s) • Advanced configuration options, Advanced Error Reporting (AER), and End-to-End CRC (ECRC) features All 7 series devices include at least one integrated block for PCI Express technology that can be configured as an Endpoint or Root Port, compliant to the PCI Express Base Specification Revision 2.1. The Root Port can be used to build the basis for a compatible Root Complex, to allow custom FPGA-to-FPGA communication via the PCI Express protocol, and to attach ASSP Endpoint devices, such as Ethernet Controllers or Fibre Channel HBAs, to the FPGA. This block is highly configurable to system design requirements and can operate 1, 2, or 4 lanes at the 2.5 Gb/s and 5.0 Gb/s data rates. For high-performance applications, advanced buffering techniques of the block offer a flexible maximum payload size of up to 1,024 bytes. The integrated block interfaces to the integrated high-speed transceivers for serial connectivity and to block RAMs for data buffering. Combined, these elements implement the Physical Layer, Data Link Layer, and Transaction Layer of the PCI Express protocol. Xilinx provides a light-weight, configurable, easy-to-use LogiCORE™ IP wrapper that ties the various building blocks (the integrated block for PCI Express, the transceivers, block RAM, and clocking resources) into an Endpoint or Root Port solution. The system designer has control over many configurable parameters: lane width, maximum payload size, FPGA logic interface speeds, reference clock frequency, and base address register decoding and filtering. Xilinx offers two wrappers for the integrated block: AXI4-Stream and AXI4 (memory mapped). Note that legacy TRN/Local Link is not available in 7 series devices for the integrated block for PCI Express. AXI4-Stream is designed for existing customers of the integrated block and enables easy migration to AXI4-Stream from TRN. AXI4 (memory mapped) is designed for Xilinx Platform Studio/EDK design flow and MicroBlaze™ processor based designs. More information and documentation on solutions for PCI Express designs can be found at: http://www.xilinx.com/technology/protocols/pciexpress.htm. Configuration There are many advanced configuration features, including: • High-speed SPI and BPI (parallel NOR) configuration • Built-in MultiBoot and safe-update capability • 256-bit AES encryption with HMAC/SHA-256 authentication • Built-in SEU detection and correction • Partial reconfiguration The XA Artix-7 FPGAs store their customized configuration in SRAM-type internal latches. The number of configuration bits is between 10 Mb and 31 Mb, depending on device size and user-design implementation options. The configuration storage is volatile and must be reloaded whenever the FPGA is powered up. This storage can also be reloaded at any time by pulling the PROGRAM_B pin Low. Several methods and data formats for loading configuration are available, determined by the three mode pins. The SPI interface (x1, x2, and x4 modes) and the BPI interface (parallel-NOR x8 and x16) are two common methods used for configuring the FPGA. Users can directly connect an SPI or BPI flash to the FPGA, and the FPGA's internal configuration logic reads the bitstream out of the flash and configures itself. The FPGA automatically detects the bus width on the fly, eliminating the need for any external controls or switches. Bus widths supported are x1, x2, and x4 for SPI, and x8 and x16 for BPI. The larger bus widths increase configuration speed and reduce the amount of time it takes for the FPGA to start up DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 7 XA Artix-7 FPGAs Data Sheet: Overview after power-on. Note that BPI is not supported in the CPG236 package used by XA7A12T, XA7A15T, XA7A25T, XA7A35T, and XA7A50T. Nor is it supported in the CPG238 package used by XA7A12T and XA7A25T. In master mode, the FPGA can drive the configuration clock from an internally generated clock, or for higher speed configuration, the FPGA can use an external configuration clock source. This allows high-speed configuration with the ease of use characteristic of master mode. Slave modes up to 32 bits wide are also supported by the FPGA that are especially useful for processor-driven configuration. The FPGA has the ability to reconfigure itself with a different image using SPI or BPI flash, eliminating the need for an external controller. The FPGA can reload its original design in case there are any errors in the data transmission, ensuring an operational FPGA at the end of the process. This is especially useful for updates to a design after the end product has been shipped. Customers can ship their products with an early version of the design, thus getting their products to market faster. This feature allows customers to keep their end users current with the most up-to-date designs while the product is already in the field. The dynamic reconfiguration port (DRP) gives the system designer easy access to the configuration and status registers of the MMCM, PLL, XADC, transceivers, and integrated block for PCI Express. The DRP behaves like a set of memory-mapped registers, accessing and modifying block-specific configuration bits as well as status and control registers. Encryption, Readback, and Partial Reconfiguration In all 7 series devices, the FPGA bitstream, which contains sensitive customer IP, can be protected with 256-bit AES encryption and HMAC/SHA-256 authentication to prevent unauthorized copying of the design. The FPGA performs decryption on the fly during configuration using an internally stored 256-bit key. This key can reside in battery-backed RAM or in nonvolatile eFUSE bits. Most configuration data can be read back without affecting the system's operation. Typically, configuration is an all-or-nothing operation, but Xilinx 7 series FPGAs support partial reconfiguration. This is an extremely powerful and flexible feature that allows the user to change portions of the FPGA while other portions remain static. Users can time-slice these portions to fit more IP into smaller devices, saving cost and power. Where applicable in certain designs, partial reconfiguration can greatly improve the versatility of the FPGA. XADC (Analog-to-Digital Converter) Highlights of the XADC architecture include: • Dual 12-bit 1 MSPS analog-to-digital converters (ADCs) • Up to 17 flexible and user-configurable analog inputs • On-chip or external reference option • On-chip temperature (±4°C max error) and power supply (±1% max error) sensors • Continuous JTAG access to ADC measurements All Xilinx 7 series FPGAs integrate a new flexible analog interface called XADC. When combined with the programmable logic capability of the 7 series FPGAs, the XADC can address a broad range of data acquisition and monitoring requirements. For more information, go to http://www.xilinx.com/ams. The XADC contains two 12-bit 1 MSPS ADCs with separate track and hold amplifiers, an on-chip analog multiplexer (up to 17 external analog input channels supported), and on-chip thermal and supply sensors. The two ADCs can be configured to simultaneously sample two external-input analog channels. The track and hold amplifiers support a range of analog input signal types, including unipolar, bipolar, and differential. The analog inputs can support signal bandwidths of at least 500 KHz at sample rates of 1MSPS. It is possible to support higher analog bandwidths using external analog multiplexer mode with the dedicated analog input (see UG480, 7 Series FPGAs and Zynq-7000 All Programmable SoC XADC Dual 12-Bit 1 MSPS Analog-to-Digital Converter User Guide). The XADC optionally uses an on-chip reference circuit (±1%), thereby eliminating the need for any external active components for basic on-chip monitoring of temperature and power supply rails. To achieve the full 12-bit performance of the ADCs, an external 1.25V reference IC is recommended. If the XADC is not instantiated in a design, then by default it digitizes the output of all on-chip sensors. The most recent measurement results (together with maximum and minimum readings) are stored in dedicated registers for access at any time via the JTAG interface. User-defined alarm thresholds can automatically indicate over-temperature events and unacceptable power supply variation. A user-specified limit (for example, 100°C) can be used to initiate an automatic powerdown. DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 8 XA Artix-7 FPGAs Data Sheet: Overview XA Artix-7 FPGA Ordering Information Table 3 shows the speed and temperature grades available in the different devices. Some devices might not be available in every speed and temperature grade. Table 3: XA Artix-7 Speed Grade and Temperature Ranges Speed Grade and Temperature Range XA Artix-7 Family Devices Industrial (I) –40°C to +100°C Automotive (Q) –40°C to +125°C XA Artix-7 All -1I, -2I -1Q The XA Artix-7 FPGA ordering information, shown in Figure 1, applies to all packages including Pb-Free. Refer to the Package Marking section of UG475, 7 Series FPGAs Packaging and Pinout for a more detailed explanation of the device markings. X-Ref Target - Figure 1 Example: X A 7 A 1 0 0 T - 1 F G G 4 8 4 Q Device Type Temperature Range: I = Industrial (Tj = –40°C to +100°C) Q = Q-Grade (Tj = –40°C to +125°C) Speed Grade (-1, -2) Number of Pins(1) Pb-Free Package Type 1) Some package names do not exactly match the number of pins present on that package. See UG475, 7 Series FPGAs Packaging and Pinout User Guide for package details. DS197_01_100213 Figure 1: Ordering Information DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 9 XA Artix-7 FPGAs Data Sheet: Overview Revision History The following table shows the revision history for this document: Date Version Description of Revisions 11/15/2017 1.3 Updated Table 2 with CPG238 package. 02/23/2017 1.2 Added XA7A12T and XA7A25T to Table 1 and Table 2. Updated Clock Management; Block RAM; Low Power I/O Features; and I/O Registers and Input Delay per the new devices. 10/10/2014 1.1 Changed document classification to Product Specification from Preliminary Product Specification. Added XA7A15T to Table 1 and Table 2 and updated other sections accordingly, including: Block RAM and Configuration. 01/20/2014 1.0 Initial Xilinx release. Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL WARRANTIES AND CONDITIONS, EXPRESS, IMPLIED, OR STATUTORY, INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE; and (2) Xilinx shall not be liable (whether in contract or tort, including negligence, or under any other theory of liability) for any loss or damage of any kind or nature related to, arising under, or in connection with, the Materials (including your use of the Materials), including for any direct, indirect, special, incidental, or consequential loss or damage (including loss of data, profits, goodwill, or any type of loss or damage suffered as a result of any action brought by a third party) even if such damage or loss was reasonably foreseeable or Xilinx had been advised of the possibility of the same. Xilinx assumes no obligation to correct any errors contained in the Materials or to notify you of updates to the Materials or to product specifications. You may not reproduce, modify, distribute, or publicly display the Materials without prior written consent. Certain products are subject to the terms and conditions of Xilinx’s limited warranty, please refer to Xilinx’s Terms of Sale which can be viewed at http://www.xilinx.com/legal.htm#tos; IP cores may be subject to warranty and support terms contained in a license issued to you by Xilinx. Xilinx products are not designed or intended to be fail-safe or for use in any application requiring fail-safe performance; you assume sole risk and liability for use of Xilinx products in such critical applications, please refer to Xilinx’s Terms of Sale which can be viewed at http://www.xilinx.com/ legal.htm#tos. Automotive Applications Disclaimer AUTOMOTIVE PRODUCTS (IDENTIFIED AS "XA" IN THE PART NUMBER) ARE NOT WARRANTED FOR USE IN THE DEPLOYMENT OF AIRBAGS OR FOR USE IN APPLICATIONS THAT AFFECT CONTROL OF A VEHICLE ("SAFETY APPLICATION") UNLESS THERE IS A SAFETY CONCEPT OR REDUNDANCY FEATURE CONSISTENT WITH THE ISO 26262 AUTOMOTIVE SAFETY STANDARD ("SAFETY DESIGN"). CUSTOMER SHALL, PRIOR TO USING OR DISTRIBUTING ANY SYSTEMS THAT INCORPORATE PRODUCTS, THOROUGHLY TEST SUCH SYSTEMS FOR SAFETY PURPOSES. USE OF PRODUCTS IN A SAFETY APPLICATION WITHOUT A SAFETY DESIGN IS FULLY AT THE RISK OF CUSTOMER, SUBJECT ONLY TO APPLICABLE LAWS AND REGULATIONS GOVERNING LIMITATIONS ON PRODUCT LIABILITY. DS197 (v1.3) November 15, 2017 Product Specification www.xilinx.com 10