Artix‐7 FPGAs Data Sheet:
DC and AC Switching Characteristics
DS181 (v1.26) March 23, 2021
Product Specification
Introduction
Artix®-7 FPGAs are available in -3, -2, -1, -1LI, and -2L
speed grades, with -3 having the highest performance. The
Artix-7 FPGAs predominantly operate at a 1.0V core voltage.
The -1LI and -2L devices are screened for lower maximum
static power and can operate at lower core voltages for
lower dynamic power than the -1 and -2 devices,
respectively. The -1LI devices operate only at
VCCINT = VCCBRAM = 0.95V and have the same speed
specifications as the -1 speed grade. The -2L devices can
operate at either of two VCCINT voltages, 0.9V and 1.0V and
are screened for lower maximum static power. When
operated at VCCINT = 1.0V, the speed specification of a -2L
device is the same as the -2 speed grade. When operated at
VCCINT = 0.9V, the -2L static and dynamic power is reduced.
Artix-7 FPGA DC and AC characteristics are specified in
commercial, extended, industrial, expanded (-1Q), and
military (-1M) temperature ranges. Except the operating
temperature range or unless otherwise noted, all the DC
and AC electrical parameters are the same for a particular
speed grade (that is, the timing characteristics of a -1M
speed grade military device are the same as for a -1C speed
grade commercial device). However, only selected speed
grades and/or devices are available in each temperature
range. For example, -1M is only available in the
defense-grade Artix-7Q family and -1Q is only available in
XA Artix-7 FPGAs.
All supply voltage and junction temperature specifications
are representative of worst-case conditions. The parameters
included are common to popular designs and typical
applications.
Available device and package combinations can be found in:
•
7 Series FPGAs Overview (DS180)
•
Defense-Grade 7 Series FPGAs Overview (DS185)
•
XA Artix-7 FPGAs Overview (DS197)
This Artix-7 FPGA data sheet, part of an overall set of
documentation on the 7 series FPGAs, is available on the
Xilinx website at www.xilinx.com/documentation.
DC Characteristics
Table 1: Absolute Maximum Ratings(1)
Symbol
Description
Min
Max
Units
FPGA Logic
VCCINT
Internal supply voltage
–0.5
1.1
V
VCCAUX
Auxiliary supply voltage
–0.5
2.0
V
VCCBRAM
Supply voltage for the block RAM memories
–0.5
1.1
V
VCCO
Output drivers supply voltage for HR I/O banks
–0.5
3.6
V
VREF
Input reference voltage
–0.5
2.0
V
I/O input voltage
–0.4
VCCO + 0.55
V
VIN(2)(3)(4)
I/O input voltage (when VCCO = 3.3V) for VREF and differential I/O standards
except TMDS_33(5)
–0.4
2.625
V
VCCBATT
Key memory battery backup supply
–0.5
2.0
V
VMGTAVCC
Analog supply voltage for the GTP transmitter and receiver circuits
–0.5
1.1
V
VMGTAVTT
Analog supply voltage for the GTP transmitter and receiver termination circuits
–0.5
1.32
V
VMGTREFCLK
Reference clock absolute input voltage
–0.5
1.32
V
VIN
Receiver (RXP/RXN) and Transmitter (TXP/TXN) absolute input voltage
–0.5
1.26
V
GTP Transceiver
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 1: Absolute Maximum Ratings(1) (Cont’d)
Symbol
Description
Min
Max
Units
IDCIN-FLOAT
DC input current for receiver input pins DC coupled RX termination = floating
–
14
mA
IDCIN-MGTAVTT
DC input current for receiver input pins DC coupled RX termination = VMGTAVTT
–
12
mA
IDCIN-GND
DC input current for receiver input pins DC coupled RX termination = GND
–
6.5
mA
IDCOUT-FLOAT
DC output current for transmitter pins DC coupled RX termination = floating
–
14
mA
IDCOUT-MGTAVTT
DC output current for transmitter pins DC coupled RX termination = VMGTAVTT
–
12
mA
XADC
VCCADC
XADC supply relative to GNDADC
–0.5
2.0
V
VREFP
XADC reference input relative to GNDADC
–0.5
2.0
V
–65
150
°C
–
+220
°C
–
+260
°C
–
+125
°C
Temperature
Storage temperature (ambient)
TSTG
Maximum soldering temperature for Pb/Sn component
TSOL
bodies(6)
Maximum soldering temperature for Pb-free component
bodies(6)
Maximum junction temperature(6)
Tj
Notes:
1.
2.
3.
4.
5.
6.
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
The lower absolute voltage specification always applies.
For I/O operation, refer to 7 Series FPGAs SelectIO Resources User Guide (UG471).
The maximum limit applies to DC signals. For maximum undershoot and overshoot AC specifications, see Table 4.
See Table 9 for TMDS_33 specifications.
For soldering guidelines and thermal considerations, see 7 Series FPGA Packaging and Pinout Specification (UG475).
Table 2: Recommended Operating Conditions(1)(2)
Symbol
Description
Min
Typ
Max
Units
For -3, -2, -2LE (1.0V), -1, -1Q, -1M devices: internal supply voltage
0.95
1.00
1.05
V
For -1LI (0.95V) devices: internal supply voltage
0.92
0.95
0.98
V
For -2LE (0.9V) devices: internal supply voltage
0.87
0.90
0.93
V
Auxiliary supply voltage
1.71
1.80
1.89
V
For -3, -2, -2LE (1.0V), -2LE (0.9V), -1, -1Q, -1M devices: block RAM supply
voltage
0.95
1.00
1.05
V
For -1LI (0.95V) devices: block RAM supply voltage
0.92
0.95
0.98
V
Supply voltage for HR I/O banks
1.14
–
3.465
V
FPGA Logic
VCCINT(3)
VCCAUX
VCCBRAM(3)
VCCO(4)(5)
I/O input voltage
–0.20
–
VCCO + 0.20
V
VIN(6)
I/O input voltage (when VCCO = 3.3V) for VREF and differential I/O standards
except TMDS_33(7)
–0.20
–
2.625
V
IIN(8)
Maximum current through any pin in a powered or unpowered bank when
forward biasing the clamp diode.
–
–
10
mA
VCCBATT(9)
Battery voltage
1.0
–
1.89
V
GTP Transceiver
VMGTAVCC(10)
Analog supply voltage for the GTP transmitter and receiver circuits
0.97
1.0
1.03
V
VMGTAVTT(10)
Analog supply voltage for the GTP transmitter and receiver termination circuits
1.17
1.2
1.23
V
XADC supply relative to GNDADC
1.71
1.80
1.89
V
XADC
VCCADC
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 2: Recommended Operating Conditions(1)(2) (Cont’d)
Symbol
VREFP
Description
Min
Typ
Max
Units
1.20
1.25
1.30
V
Junction temperature operating range for commercial (C) temperature devices
0
–
85
°C
Junction temperature operating range for extended (E) temperature devices
0
–
100
°C
Junction temperature operating range for industrial (I) temperature devices
–40
–
100
°C
Junction temperature operating range for expanded (Q) temperature devices
–40
–
125
°C
Junction temperature operating range for military (M) temperature devices
–55
–
125
°C
Externally supplied reference voltage
Temperature
Tj
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
All voltages are relative to ground.
For the design of the power distribution system consult 7 Series FPGAs PCB Design and Pin Planning Guide (UG483).
If VCCINT and VCCBRAM are operating at the same voltage, VCCINT and VCCBRAM should be connected to the same supply.
Configuration data is retained even if VCCO drops to 0V.
Includes VCCO of 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, and 3.3V at ±5%.
The lower absolute voltage specification always applies.
See Table 9 for TMDS_33 specifications.
A total of 200 mA per bank should not be exceeded.
VCCBATT is required only when using bitstream encryption. If battery is not used, connect VCCBATT to either ground or VCCAUX.
Each voltage listed requires the filter circuit described in 7 Series FPGAs GTP Transceiver User Guide (UG482).
Table 3: DC Characteristics Over Recommended Operating Conditions
Symbol
Description
Min
Typ(1)
Max
Units
VDRINT
Data retention VCCINT voltage (below which configuration data might be lost)
0.75
–
–
V
VDRI
Data retention VCCAUX voltage (below which configuration data might be lost)
1.5
–
–
V
IREF
VREF leakage current per pin
–
–
15
µA
IL
Input or output leakage current per pin (sample-tested)
–
–
15
µA
CIN(2)
Die input capacitance at the pad
–
–
8
pF
Pad pull-up (when selected) @ VIN = 0V, VCCO = 3.3V
90
–
330
µA
Pad pull-up (when selected) @ VIN = 0V, VCCO = 2.5V
68
–
250
µA
Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.8V
34
–
220
µA
Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.5V
23
–
150
µA
Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.2V
12
–
120
µA
IRPD
Pad pull-down (when selected) @ VIN = 3.3V
68
–
330
µA
ICCADC
Analog supply current, analog circuits in powered up state
–
–
25
mA
IBATT(3)
Battery supply current
–
–
150
nA
Thevenin equivalent resistance of programmable input termination to VCCO/2
(UNTUNED_SPLIT_40)
28
40
55
Thevenin equivalent resistance of programmable input termination to VCCO/2
(UNTUNED_SPLIT_50)
35
50
65
Thevenin equivalent resistance of programmable input termination to VCCO/2
(UNTUNED_SPLIT_60)
44
60
83
IRPU
RIN_TERM(4)
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 3: DC Characteristics Over Recommended Operating Conditions (Cont’d)
Symbol
Description
Min
Typ(1)
Max
Units
n
Temperature diode ideality factor
–
1.010
–
–
r
Temperature diode series resistance
–
2
–
Notes:
1.
2.
3.
4.
Typical values are specified at nominal voltage, 25°C.
This measurement represents the die capacitance at the pad, not including the package.
Maximum value specified for worst case process at 25°C.
Termination resistance to a VCCO/2 level.
Table 4: VIN Maximum Allowed AC Voltage Overshoot and Undershoot for HR I/O Banks(1)(2)
AC Voltage Overshoot
VCCO + 0.55
% of UI @–55°C to 125°C
AC Voltage Undershoot
% of UI @–55°C to 125°C
–0.40
100
–0.45
61.7
–0.50
25.8
–0.55
11.0
100
VCCO + 0.60
46.6
–0.60
4.77
VCCO + 0.65
21.2
–0.65
2.10
VCCO + 0.70
9.75
–0.70
0.94
VCCO + 0.75
4.55
–0.75
0.43
VCCO + 0.80
2.15
–0.80
0.20
VCCO + 0.85
1.02
–0.85
0.09
VCCO + 0.90
0.49
–0.90
0.04
VCCO + 0.95
0.24
–0.95
0.02
Notes:
1.
2.
A total of 200 mA per bank should not be exceeded.
The peak voltage of the overshoot or undershoot, and the duration above VCCO + 0.20V or below GND – 0.20V, must not exceed the values
in this table.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 5: Typical Quiescent Supply Current
Speed Grade
Symbol
ICCINTQ
ICCOQ
Description
Quiescent VCCINT supply current
Quiescent VCCO supply current
DS181 (v1.26) March 23, 2021
Product Specification
Device
1.0V
0.95V
0.9V
Units
-3
-2
-2LE
-1
-1LI
-2LE
XC7A12T
48
48
48
48
43
38
mA
XC7A15T
95
95
95
95
58
66
mA
XC7A25T
48
48
48
48
43
38
mA
XC7A35T
95
95
95
95
58
66
mA
XC7A50T
95
95
95
95
58
66
mA
XC7A75T
155
155
155
155
96
108
mA
XC7A100T
155
155
155
155
96
108
mA
XC7A200T
328
328
328
328
203
232
mA
XA7A12T
N/A
48
N/A
48
N/A
N/A
mA
XA7A15T
N/A
95
N/A
95
N/A
N/A
mA
XA7A25T
N/A
48
N/A
48
N/A
N/A
mA
XA7A35T
N/A
95
N/A
95
N/A
N/A
mA
XA7A50T
N/A
95
N/A
95
N/A
N/A
mA
XA7A75T
N/A
155
N/A
155
N/A
N/A
mA
XA7A100T
N/A
155
N/A
155
N/A
N/A
mA
XQ7A50T
N/A
95
N/A
95
58
N/A
mA
XQ7A100T
N/A
155
N/A
155
96
N/A
mA
XQ7A200T
N/A
328
N/A
328
203
N/A
mA
XC7A12T
1
1
1
1
1
1
mA
XC7A15T
1
1
1
1
1
1
mA
XC7A25T
1
1
1
1
1
1
mA
XC7A35T
1
1
1
1
1
1
mA
XC7A50T
1
1
1
1
1
1
mA
XC7A75T
4
4
4
4
4
4
mA
XC7A100T
4
4
4
4
4
4
mA
XC7A200T
5
5
5
5
5
5
mA
XA7A12T
N/A
1
N/A
1
N/A
N/A
mA
XA7A15T
N/A
1
N/A
1
N/A
N/A
mA
XA7A25T
N/A
1
N/A
1
N/A
N/A
mA
XA7A35T
N/A
1
N/A
1
N/A
N/A
mA
XA7A50T
N/A
1
N/A
1
N/A
N/A
mA
XA7A75T
N/A
4
N/A
4
N/A
N/A
mA
XA7A100T
N/A
4
N/A
4
N/A
N/A
mA
XQ7A50T
N/A
1
N/A
1
1
N/A
mA
XQ7A100T
N/A
4
N/A
4
4
N/A
mA
XQ7A200T
N/A
5
N/A
5
5
N/A
mA
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 5: Typical Quiescent Supply Current (Cont’d)
Speed Grade
Symbol
ICCAUXQ
Description
Quiescent VCCAUX supply current
DS181 (v1.26) March 23, 2021
Product Specification
Device
1.0V
0.95V
0.9V
Units
-3
-2
-2LE
-1
-1LI
-2LE
XC7A12T
13
13
13
13
13
13
mA
XC7A15T
22
22
22
22
19
22
mA
XC7A25T
13
13
13
13
13
13
mA
XC7A35T
22
22
22
22
19
22
mA
XC7A50T
22
22
22
22
19
22
mA
XC7A75T
36
36
36
36
32
36
mA
XC7A100T
36
36
36
36
32
36
mA
XC7A200T
73
73
73
73
65
73
mA
XA7A12T
N/A
13
N/A
13
N/A
N/A
mA
XA7A15T
N/A
22
N/A
22
N/A
N/A
mA
XA7A25T
N/A
13
N/A
13
N/A
N/A
mA
XA7A35T
N/A
22
N/A
22
N/A
N/A
mA
XA7A50T
N/A
22
N/A
22
N/A
N/A
mA
XA7A75T
N/A
36
N/A
36
N/A
N/A
mA
XA7A100T
N/A
36
N/A
36
N/A
N/A
mA
XQ7A50T
N/A
22
N/A
22
19
N/A
mA
XQ7A100T
N/A
36
N/A
36
32
N/A
mA
XQ7A200T
N/A
73
N/A
73
65
N/A
mA
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 5: Typical Quiescent Supply Current (Cont’d)
Speed Grade
Symbol
Description
ICCBRAMQ Quiescent VCCBRAM supply current
Device
1.0V
0.95V
0.9V
Units
-3
-2
-2LE
-1
-1LI
-2LE
XC7A12T
1
1
1
1
1
1
mA
XC7A15T
2
2
2
2
1
2
mA
XC7A25T
1
1
1
1
1
1
mA
XC7A35T
2
2
2
2
1
2
mA
XC7A50T
2
2
2
2
1
2
mA
XC7A75T
4
4
4
4
2
4
mA
XC7A100T
4
4
4
4
2
4
mA
XC7A200T
11
11
11
11
6
11
mA
XA7A12T
N/A
1
N/A
1
N/A
N/A
mA
XA7A15T
N/A
2
N/A
2
N/A
N/A
mA
XA7A25T
N/A
1
N/A
1
N/A
N/A
mA
XA7A35T
N/A
2
N/A
2
N/A
N/A
mA
XA7A50T
N/A
2
N/A
2
N/A
N/A
mA
XA7A75T
N/A
4
N/A
4
N/A
N/A
mA
XA7A100T
N/A
4
N/A
4
N/A
N/A
mA
XQ7A50T
N/A
2
N/A
2
1
N/A
mA
XQ7A100T
N/A
4
N/A
4
2
N/A
mA
XQ7A200T
N/A
11
N/A
11
6
N/A
mA
Notes:
1.
2.
3.
Typical values are specified at nominal voltage, 85°C junction temperature (Tj) with single-ended SelectIO resources.
Typical values are for blank configured devices with no output current loads, no active input pull-up resistors, all I/O pins are 3-state and
floating.
Use the Xilinx Power Estimator (XPE) spreadsheet tool (download at http://www.xilinx.com/power) to estimate static power consumption for
conditions other than those specified.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Power‐On/Off Power Supply Sequencing
The recommended power-on sequence is VCCINT, VCCBRAM, VCCAUX, and VCCO to achieve minimum current draw and ensure
that the I/Os are 3-stated at power-on. The recommended power-off sequence is the reverse of the power-on sequence. If
VCCINT and VCCBRAM have the same recommended voltage levels then both can be powered by the same supply and ramped
simultaneously. If VCCAUX and VCCO have the same recommended voltage levels then both can be powered by the same
supply and ramped simultaneously.
For VCCO voltages of 3.3V in HR I/O banks and configuration bank 0:
•
The voltage difference between VCCO and VCCAUX must not exceed 2.625V for longer than TVCCO2VCCAUX for each
power-on/off cycle to maintain device reliability levels.
•
The TVCCO2VCCAUX time can be allocated in any percentage between the power-on and power-off ramps.
The recommended power-on sequence to achieve minimum current draw for the GTP transceivers is VCCINT, VMGTAVCC,
VMGTAVTT OR VMGTAVCC, VCCINT, VMGTAVTT. Both VMGTAVCC and VCCINT can be ramped simultaneously. The recommended
power-off sequence is the reverse of the power-on sequence to achieve minimum current draw.
If these recommended sequences are not met, current drawn from VMGTAVTT can be higher than specifications during powerup and power-down.
•
When VMGTAVTT is powered before VMGTAVCC and VMGTAVTT – VMGTAVCC > 150 mV and VMGTAVCC < 0.7V, the VMGTAVTT
current draw can increase by 460 mA per transceiver during VMGTAVCC ramp up. The duration of the current draw can be
up to 0.3 x TMGTAVCC (ramp time from GND to 90% of VMGTAVCC). The reverse is true for power-down.
•
When VMGTAVTT is powered before VCCINT and VMGTAVTT – VCCINT > 150 mV and VCCINT < 0.7V, the VMGTAVTT current
draw can increase by 50 mA per transceiver during VCCINT ramp up. The duration of the current draw can be up to
0.3 x TVCCINT (ramp time from GND to 90% of VCCINT). The reverse is true for power-down.
There is no recommended sequence for supplies not shown.
Table 6 shows the minimum current, in addition to ICCQ, that is required by Artix-7 devices for proper power-on and
configuration. If the current minimums shown in Table 5 and Table 6 are met, the device powers on after all four supplies
have passed through their power-on reset threshold voltages. The FPGA must not be configured until after VCCINT is applied.
Once initialized and configured, use the Xilinx Power Estimator (XPE) tools to estimate current drain on these supplies.
Table 6: Power-On Current for Artix-7 Devices
Device
ICCINTMIN
ICCAUXMIN
ICCOMIN
ICCBRAMMIN
Units
XC7A12T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XC7A15T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XC7A25T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XC7A35T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XC7A50T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XC7A75T
ICCINTQ + 170
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XC7A100T
ICCINTQ + 170
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XC7A200T
ICCINTQ + 340
ICCAUXQ + 50
ICCOQ + 40 mA per bank
ICCBRAMQ + 80
mA
XA7A12T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XA7A15T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XA7A25T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XA7A35T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XA7A50T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XA7A75T
ICCINTQ + 170
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XA7A100T
ICCINTQ + 170
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XQ7A50T
ICCINTQ + 120
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 6: Power-On Current for Artix-7 Devices (Cont’d)
Device
ICCINTMIN
ICCAUXMIN
ICCOMIN
ICCBRAMMIN
Units
XQ7A100T
ICCINTQ + 170
ICCAUXQ + 40
ICCOQ + 40 mA per bank
ICCBRAMQ + 60
mA
XQ7A200T
ICCINTQ + 340
ICCAUXQ + 50
ICCOQ + 40 mA per bank
ICCBRAMQ + 80
mA
Table 7: Power Supply Ramp Time
Symbol
Description
Conditions
Min
Max
Units
TVCCINT
Ramp time from GND to 90% of VCCINT
0.2
50
ms
TVCCO
Ramp time from GND to 90% of VCCO
0.2
50
ms
TVCCAUX
Ramp time from GND to 90% of VCCAUX
0.2
50
ms
TVCCBRAM
Ramp time from GND to 90% of VCCBRAM
0.2
50
ms
TJ = 125°C(1)
–
300
TJ = 100°C(1)
–
500
TJ = 85°C(1)
–
800
TVCCO2VCCAUX
Allowed time per power cycle for VCCO – VCCAUX 2.625V
ms
TMGTAVCC
Ramp time from GND to 90% of VMGTAVCC
0.2
50
ms
TMGTAVTT
Ramp time from GND to 90% of VMGTAVTT
0.2
50
ms
Notes:
1.
Based on 240,000 power cycles with nominal VCCO of 3.3V or 36,500 power cycles with worst case VCCO of 3.465V.
DC Input and Output Levels
Values for VIL and VIH are recommended input voltages. Values for IOL and IOH are guaranteed over the recommended
operating conditions at the VOL and VOH test points. Only selected standards are tested. These are chosen to ensure that all
standards meet their specifications. The selected standards are tested at a minimum VCCO with the respective VOL and VOH
voltage levels shown. Other standards are sample tested.
Table 8: SelectIO DC Input and Output Levels(1)(2)
I/O Standard
VIL
VIH
VOL
VOH
IOL
IOH
V, Min
V, Max
V, Min
V, Max
V, Max
V, Min
HSTL_I
–0.300
VREF – 0.100
VREF + 0.100
VCCO + 0.300
0.400
VCCO – 0.400
8.00
–8.00
HSTL_I_18
–0.300
VREF – 0.100
VREF + 0.100
VCCO + 0.300
0.400
VCCO – 0.400
8.00
–8.00
HSTL_II
–0.300
VREF – 0.100
VREF + 0.100
VCCO + 0.300
0.400
VCCO – 0.400
16.00
–16.00
HSTL_II_18
–0.300
VREF – 0.100
VREF + 0.100
VCCO + 0.300
0.400
VCCO – 0.400
16.00
–16.00
HSUL_12
–0.300
VREF – 0.130
VREF + 0.130
VCCO + 0.300
20% VCCO
80% VCCO
0.10
–0.10
LVCMOS12
–0.300
35% VCCO
65% VCCO
VCCO + 0.300
0.400
VCCO – 0.400
Note 3
Note 3
LVCMOS15
–0.300
35% VCCO
65% VCCO
VCCO + 0.300
25% VCCO
75% VCCO
Note 4
Note 4
LVCMOS18
–0.300
35% VCCO
65% VCCO
VCCO + 0.300
0.450
VCCO – 0.450
Note 5
Note 5
LVCMOS25
–0.300
0.7
1.700
VCCO + 0.300
0.400
VCCO – 0.400
Note 4
Note 4
LVCMOS33
–0.300
0.8
2.000
3.450
0.400
VCCO – 0.400
Note 4
Note 4
LVTTL
–0.300
0.8
2.000
3.450
0.400
2.400
Note 5
Note 5
MOBILE_DDR
–0.300
20% VCCO
80% VCCO
VCCO + 0.300
10% VCCO
90% VCCO
0.10
–0.10
PCI33_3
–0.400
30% VCCO
50% VCCO
VCCO + 0.500
10% VCCO
90% VCCO
1.50
–0.50
SSTL135
–0.300
VREF – 0.090
VREF + 0.090
VCCO + 0.300 VCCO/2 – 0.150 VCCO/2 + 0.150
13.00
–13.00
SSTL135_R
–0.300
VREF – 0.090
VREF + 0.090
VCCO + 0.300 VCCO/2 – 0.150 VCCO/2 + 0.150
8.90
–8.90
SSTL15
–0.300
VREF – 0.100
VREF + 0.100
VCCO + 0.300 VCCO/2 – 0.175 VCCO/2 + 0.175
13.00
–13.00
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 8: SelectIO DC Input and Output Levels(1)(2) (Cont’d)
VIL
I/O Standard
VIH
V, Max
VOL
VOH
IOL
V, Max
V, Min
IOH
V, Min
V, Max
V, Min
mA, Max mA, Min
SSTL15_R
–0.300
VREF – 0.100
VREF + 0.100
VCCO + 0.300 VCCO/2 – 0.175 VCCO/2 + 0.175
8.90
–8.90
SSTL18_I
–0.300
VREF – 0.125
VREF + 0.125
VCCO + 0.300 VCCO/2 – 0.470 VCCO/2 + 0.470
8.00
–8.00
SSTL18_II
–0.300
VREF – 0.125
VREF + 0.125
VCCO + 0.300 VCCO/2 – 0.600 VCCO/2 + 0.600
13.40
–13.40
Notes:
1.
2.
3.
4.
5.
6.
Tested according to relevant specifications.
3.3V and 2.5V standards are only supported in HR I/O banks.
Supported drive strengths of 4, 8, or 12 mA in HR I/O banks.
Supported drive strengths of 4, 8, 12, or 16 mA in HR I/O banks.
Supported drive strengths of 4, 8, 12, 16, or 24 mA in HR I/O banks.
For detailed interface specific DC voltage levels, see 7 Series FPGAs SelectIO Resources User Guide (UG471).
Table 9: Differential SelectIO DC Input and Output Levels
I/O Standard
BLVDS_25
VICM(1)
V, Min V, Typ
VID(2)
V, Max
VOCM(3)
V, Min V, Typ V, Max
VOD(4)
V, Min
V, Typ
V, Max
V, Min V, Typ V, Max
Note 5
0.300
1.200
1.425
0.100
–
–
–
1.250
–
MINI_LVDS_25 0.300
1.200
VCCAUX
0.200
0.400
0.600
1.000
1.200
1.400
0.300
0.450
0.600
PPDS_25
0.200
0.900
VCCAUX
0.100
0.250
0.400
0.500
0.950
1.400
0.100
0.250
0.400
RSDS_25
0.300
0.900
1.500
0.100
0.350
0.600
1.000
1.200
1.400
0.100
0.350
0.600
TMDS_33
2.700
2.965
3.230
0.150
0.675
1.200 VCCO–0.405 VCCO–0.300 VCCO–0.190 0.400
0.600
0.800
Notes:
1.
2.
3.
4.
5.
VICM is the input common mode voltage.
VID is the input differential voltage (Q – Q).
VOCM is the output common mode voltage.
VOD is the output differential voltage (Q – Q).
VOD for BLVDS will vary significantly depending on topology and loading.
Table 10: Complementary Differential SelectIO DC Input and Output Levels
I/O Standard
VICM(1)
VID(2)
V, Min V,Typ V, Max V,Min V, Max
VOL(3)
VOH(4)
IOL
IOH
V, Max
V, Min
mA, Max
mA, Min
DIFF_HSTL_I
0.300
0.750
1.125
0.100
–
0.400
VCCO–0.400
8.00
–8.00
DIFF_HSTL_I_18
0.300
0.900
1.425
0.100
–
0.400
VCCO–0.400
8.00
–8.00
DIFF_HSTL_II
0.300
0.750
1.125
0.100
–
0.400
VCCO–0.400
16.00
–16.00
DIFF_HSTL_II_18
0.300
0.900
1.425
0.100
–
0.400
VCCO–0.400
16.00
–16.00
DIFF_HSUL_12
0.300
0.600
0.850
0.100
–
20% VCCO
80% VCCO
0.100
–0.100
DIFF_MOBILE_DDR 0.300
0.900
1.425
0.100
–
10% VCCO
90% VCCO
0.100
–0.100
DIFF_SSTL135
0.300
0.675
1.000
0.100
–
(VCCO/2) – 0.150
(VCCO/2) + 0.150
13.0
–13.0
DIFF_SSTL135_R
0.300
0.675
1.000
0.100
–
(VCCO/2) – 0.150
(VCCO/2) + 0.150
8.9
–8.9
DIFF_SSTL15
0.300
0.750
1.125
0.100
–
(VCCO/2) – 0.175
(VCCO/2) + 0.175
13.0
–13.0
DIFF_SSTL15_R
0.300
0.750
1.125
0.100
–
(VCCO/2) – 0.175
(VCCO/2) + 0.175
8.9
–8.9
DIFF_SSTL18_I
0.300
0.900
1.425
0.100
–
(VCCO/2) – 0.470
(VCCO/2) + 0.470
8.00
–8.00
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 10: Complementary Differential SelectIO DC Input and Output Levels (Cont’d)
I/O Standard
DIFF_SSTL18_II
VICM(1)
VID(2)
V, Min V,Typ V, Max V,Min V, Max
0.300
0.900
1.425
0.100
–
VOL(3)
VOH(4)
IOL
IOH
V, Max
V, Min
mA, Max
mA, Min
(VCCO/2) – 0.600
(VCCO/2) + 0.600
13.4
–13.4
Notes:
1.
2.
3.
4.
VICM is the input common mode voltage.
VID is the input differential voltage (Q – Q).
VOL is the single-ended low-output voltage.
VOH is the single-ended high-output voltage.
LVDS DC Specifications (LVDS_25)
Table 11: LVDS_25 DC Specifications(1)
Symbol
DC Parameter
Conditions
Min
Typ
Max
Units
2.375
2.500
2.625
V
VCCO
Supply Voltage
VOH
Output High Voltage for Q and Q
RT = 100 across Q and Q signals
–
–
1.675
V
VOL
Output Low Voltage for Q and Q
RT = 100 across Q and Q signals
0.700
–
–
V
VODIFF
Differential Output Voltage:
(Q – Q), Q = High
(Q – Q), Q = High
RT = 100 across Q and Q signals
247
350
600
mV
VOCM
Output Common-Mode Voltage
RT = 100 across Q and Q signals
1.000
1.250
1.425
V
VIDIFF
Differential Input Voltage:
(Q – Q), Q = High
(Q – Q), Q = High
100
350
600
mV
VICM
Input Common-Mode Voltage
0.300
1.200
1.500
V
Notes:
1.
Differential inputs for LVDS_25 can be placed in banks with VCCO levels that are different from the required level for outputs. Consult the
7 Series FPGAs SelectIO Resources User Guide (UG471) for more information.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
AC Switching Characteristics
All values represented in this data sheet are based on the speed specifications from the ISE® Design Suite and
Vivado® Design Suite as outlined in Table 12.
Table 12: Artix-7 FPGA Speed Specification Version By Device
Version In:
Typical VCCINT
Device
ISE 14.7
Vivado 2018.2
(Table 2)
N/A
1.22
1.0V
XC7A12T, XC7A15T, XC7A25T, XC7A35T, XC7A50T, XC7A75T
N/A
1.22
0.95V
XC7A12T, XC7A15T, XC7A25T, XC7A35T, XC7A50T, XC7A75T, XC7A100T,
XC7A200T
N/A
1.14
0.9V
XC7A12T, XC7A15T, XC7A25T, XC7A35T, XC7A50T, XC7A75T
1.10
1.22
1.0V
XC7A100T, XC7A200T
1.07
1.14
0.9V
XC7A100T, XC7A200T
N/A
1.15
1.0V
XA7A12T, XA7A15T, XA725T, XA7A35T, XA7A50T, XA7A75T
1.07
1.15
1.0V
XA7A100T
1.06
1.11
1.0V
XQ7A100T, XQ7A200T
N/A
1.11
1.0V
XQ7A50T
Switching characteristics are specified on a per-speed-grade basis and can be designated as Advance, Preliminary, or
Production. Each designation is defined as follows:
Advance Product Specification
These specifications are based on simulations only and are typically available soon after device design specifications are
frozen. Although speed grades with this designation are considered relatively stable and conservative, some under-reporting
might still occur.
Preliminary Product Specification
These specifications are based on complete ES (engineering sample) silicon characterization. Devices and speed grades with
this designation are intended to give a better indication of the expected performance of production silicon. The probability
of under-reporting delays is greatly reduced as compared to Advance data.
Production Product Specification
These specifications are released once enough production silicon of a particular device family member has been
characterized to provide full correlation between specifications and devices over numerous production lots. There is no
under-reporting of delays, and customers receive formal notification of any subsequent changes. Typically, the slowest
speed grades transition to Production before faster speed grades.
Testing of AC Switching Characteristics
Internal timing parameters are derived from measuring internal test patterns. All AC switching characteristics are
representative of worst-case supply voltage and junction temperature conditions.
For more specific, more precise, and worst-case guaranteed data, use the values reported by the static timing analyzer and
back-annotate to the simulation net list. Unless otherwise noted, values apply to all Artix-7 FPGAs.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Speed Grade Designations
Since individual family members are produced at different times, the migration from one category to another depends
completely on the status of the fabrication process for each device. Table 13 correlates the current status of each Artix-7
device on a per speed grade basis.
Table 13: Artix-7 Device Speed Grade Designations
Speed Grade Designations
Device
Advance
Preliminary
Production
XC7A12T
-3, -2, -1, -1LI (0.95V), and -2LE (0.9V)
XC7A15T
-3, -2, -2LE (1.0V), -1, -1LI (0.95V), and -2LE (0.9V)
XC7A25T
-3, -2, -1, -1LI (0.95V), and -2LE (0.9V)
XC7A35T
-3, -2, -2LE (1.0V), -1, -1LI (0.95V), and -2LE (0.9V)
XC7A50T
-3, -2, -2LE (1.0V), -1, -1LI (0.95V), and -2LE (0.9V)
XC7A75T
-3, -2, -2LE (1.0V), -1, -1LI (0.95V), and -2LE (0.9V)
XC7A100T
-3, -2, -2LE (1.0V), -1, -1LI (0.95V), and -2LE (0.9V)
XC7A200T
-3, -2, -2LE (1.0V), -1, -1LI (0.95V), and -2LE (0.9V)
XA7A12T
-2I, -1I, and -1Q
XA7A15T
-2I, -1I, and -1Q
XA7A25T
-2I, -1I, and -1Q
XA7A35T
-2I, -1I, and -1Q
XA7A50T
-2I, -1I, and -1Q
XA7A75T
-2I, -1I, and -1Q
XA7A100T
-2I, -1I, and -1Q
XQ7A50T
-2I, -1I, -1LI (0.95V), and -1M
XQ7A100T
-2I, -1I, -1LI (0.95V), and -1M
XQ7A200T
-2I, -1I, -1LI (0.95V), and -1M
Production Silicon and Software Status
In some cases, a particular family member (and speed grade) is released to production before a speed specification is
released with the correct label (Advance, Preliminary, Production). Any labeling discrepancies are corrected in subsequent
speed specification releases.
Table 14 lists the production released Artix-7 device, speed grade, and the minimum corresponding supported speed
specification version and software revisions. The software and speed specifications listed are the minimum releases required
for production. All subsequent releases of software and speed specifications are valid.
Table 14: Artix-7 Device Production Software and Speed Specification Release
Speed Grade
Device
1.0V
-3
XC7A12T
Vivado tools
2018.2 v1.22
XC7A15T
XC7A25T
XC7A35T
-2
-2LE
-1Q
-1M
-1LI
-2LE
Vivado tools 2017.4 v1.20
N/A
N/A
Vivado tools
2017.4 v1.20
Vivado tools
2018.1 v1.14
N/A
N/A
Vivado tools
2014.4 v1.14
Vivado tools
2014.4 v1.10
N/A
N/A
Vivado tools
2017.4 v1.20
Vivado tools
2018.1 v1.14
N/A
N/A
Vivado tools
2014.4 v1.14
Vivado tools
2013.4 v1.08
Vivado tools 2017.4 v1.20
Vivado tools 2013.4 v1.11
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0.9V
-1
Vivado tools 2014.4 v1.14
Vivado tools
2018.2 v1.22
0.95V
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 14: Artix-7 Device Production Software and Speed Specification Release (Cont’d)
Speed Grade
Device
1.0V
-3
-2
-2LE
-1
0.95V
0.9V
-1Q
-1M
-1LI
-2LE
XC7A50T
Vivado tools 2013.4 v1.11
N/A
N/A
Vivado tools
2014.4 v1.14
Vivado tools
2013.4 v1.08
XC7A75T
Vivado tools 2013.3 v1.10
N/A
N/A
Vivado tools
2014.4 v1.14
Vivado tools
2013.3 v1.07
XC7A100T
ISE tools 14.4 or Vivado tools 2012.4 with the
14.4/2012.4 device pack v1.07
N/A
N/A
Vivado tools
2014.4 v1.14
XC7A200T
ISE tools 14.4 or Vivado tools 2012.4 with the
14.4/2012.4 device pack v1.07
N/A
N/A
Vivado tools
2014.4 v1.14
ISE tools 14.5
or Vivado
tools 2013.1
v1.05
XA7A12T
N/A
Vivado tools
2018.1 v1.15
N/A
Vivado tools 2018.1 v1.15
N/A
N/A
N/A
XA7A15T
N/A
Vivado tools
2014.4 v1.14
N/A
Vivado tools 2014.4 v1.14
N/A
N/A
N/A
XA7A25T
N/A
Vivado tools
2018.1 v1.15
N/A
Vivado tools 2018.1 v1.15
N/A
N/A
N/A
XA7A35T
N/A
Vivado tools
2014.1 v1.09
N/A
Vivado tools 2014.1 v1.09
N/A
N/A
N/A
XA7A50T
N/A
Vivado tools
2014.1 v1.09
N/A
Vivado tools 2014.1 v1.09
N/A
N/A
N/A
XA7A75T
N/A
Vivado tools
2014.1 v1.09
N/A
Vivado tools 2014.1 v1.09
N/A
N/A
N/A
XA7A100T
N/A
ISE tools 14.5
or Vivado tools
2013.1 v1.05
N/A
ISE tools 14.5 ISE tools 14.6
or Vivado tools or Vivado tools
2013.2 v1.06
2013.1 v1.05
N/A
N/A
N/A
XQ7A50T
N/A
Vivado tools
2014.2 v1.08
N/A
Vivado tools
2014.2 v1.08
N/A
Vivado tools
2014.2 v1.08
Vivado tools
2015.4 v1.11
N/A
XQ7A100T
N/A
ISE tools 14.5
or Vivado tools
2013.1 v1.04
N/A
ISE tools 14.5
or Vivado tools
2013.1 v1.04
N/A
ISE tools 14.6
or Vivado tools
2013.2 v1.05
Vivado tools
2015.4 v1.11
N/A
XQ7A200T
N/A
ISE tools 14.5
or Vivado tools
2013.1 v1.04
N/A
ISE tools 14.5
or Vivado tools
2013.1 v1.04
N/A
ISE tools 14.6
or Vivado tools
2013.2 v1.05
Vivado tools
2015.4 v1.11
N/A
Selecting the Correct Speed Grade and Voltage in the Vivado Tools
It is important to select the correct device speed grade and voltage in the Vivado tools for the device that you are selecting.
To select the 1.0V speed specifications in the Vivado tools, select the Artix-7, XA Artix-7, or Defense Grade Artix-7Q
sub-family, and then select the part name that is the device name followed by the package name followed by the speed
grade. For example, select the xc7a100tfgg676-3 part name for the XC7A100T device in the FGG676 package and -3 (1.0V)
speed grade or select the xc7a100tfgg676-2L part name for the XC7A100T device in the FGG676 package and -2LE (1.0V)
speed grade.
To select the -1LI (0.95V) speed specifications in the Vivado tools, select the Artix-7 sub-family and then select the part
name that is the device name followed by an “i” followed by the package name followed by the speed grade. For example,
select the xc7a100tifgg676-1L part name for the XC7A100T device in the FGG676 package and -1LI (0.95V) speed grade.
The -1LI (0.95V) speed specifications are not supported in the ISE tools.
To select the -2LE (0.9V) speed specifications in the Vivado tools, select the Artix-7 Low Voltage sub-family and then select
the part name that is the device name followed by an “l” followed by the package name followed by the speed grade. For
example, select the xc7a100tlfgg676-2L part name for the XC7A100T device in the FGG676 package and -2LE (0.9V) speed
grade.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
A similar part naming convention applies to the speed specifications selection in the ISE tools for supported devices. See
Table 14 for the subset of 7 series FPGAs supported in the ISE tools.
Performance Characteristics
This section provides the performance characteristics of some common functions and designs implemented in Artix-7
devices. The numbers reported here are worst-case values; they have all been fully characterized. These values are subject to
the same guidelines as the AC Switching Characteristics, page 12.
Table 15: Networking Applications Interface Performances
Speed Grade
Description
1.0V
0.95V
0.9V
Units
-3
-2/-2LE
-1
-1LI
-2LE
SDR LVDS transmitter (using OSERDES; DATA_WIDTH = 4 to 8)
680
680
600
600
600
Mb/s
DDR LVDS transmitter (using OSERDES; DATA_WIDTH = 4 to 14)
1250
1250
950
950
950
Mb/s
SDR LVDS receiver
(SFI-4.1)(1)
680
680
600
600
600
Mb/s
DDR LVDS receiver
(SPI-4.2)(1)
1250
1250
950
950
950
Mb/s
Notes:
1.
LVDS receivers are typically bounded with certain applications where specific dynamic phase-alignment (DPA) algorithms dominate
deterministic performance.
Table 16: Maximum Physical Interface (PHY) Rate for Memory Interfaces IP available with the Memory Interface
Generator(1)(2)
Speed Grade
Memory Standard
1.0V
0.95V
0.9V
Units
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
DDR3
1066(3)
800
800
667
800
800
Mb/s
DDR3L
800
800
667
N/A
667
667
Mb/s
DDR2
800
800
667
533
667
667
Mb/s
DDR3
800
700
620
620
620
620
Mb/s
DDR3L
800
700
620
N/A
620
620
Mb/s
DDR2
800
700
620
533
620
620
Mb/s
LPDDR2
667
667
533
400
533
533
Mb/s
4:1 Memory Controllers
2:1 Memory Controllers
Notes:
1.
2.
3.
VREF tracking is required. For more information, see 7 Series FPGAs Memory Interface Solutions User Guide (UG586).
When using the internal VREF, the maximum data rate is 800 Mb/s (400 MHz).
The maximum PHY rate is 800 Mb/s in the CPG238 package.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
IOB Pad Input/Output/3‐State
Table 17 summarizes the values of standard-specific data input delay adjustments, output delays terminating at pads (based
on standard) and 3-state delays.
•
TIOPI is described as the delay from IOB pad through the input buffer to the I-pin of an IOB pad. The delay varies
depending on the capability of the SelectIO input buffer.
•
TIOOP is described as the delay from the O pin to the IOB pad through the output buffer of an IOB pad. The delay varies
depending on the capability of the SelectIO output buffer.
•
TIOTP is described as the delay from the T pin to the IOB pad through the output buffer of an IOB pad, when 3-state is
disabled. The delay varies depending on the SelectIO capability of the output buffer. In HR I/O banks, the IN_TERM
termination turn-on time is always faster than TIOTP when the INTERMDISABLE pin is used.
Table 17: IOB High Range (HR) Switching Characteristics
TIOOP
TIOPI
Speed Grade
I/O Standard
1.0V
-3
-2/
-2LE
TIOTP
Speed Grade
0.95V 0.9V
-1
-1Q/
-1M
-1LI
-2LE
1.0V
-3
-2/
-2LE
-1
Speed Grade
0.95V 0.9V
-1Q/
-1M
-1LI -2LE
0.95V 0.9V Units
1.0V
-3
-2/
-2LE
-1
-1Q/
-1M
-1LI
-2LE
LVTTL_S4
1.26 1.34
1.41
1.53
1.41
1.58 3.80 3.93 4.18 4.18
4.18 4.41 3.82 3.96 4.20 4.20
4.20
4.05
ns
LVTTL_S8
1.26 1.34
1.41
1.53
1.41
1.58 3.54 3.66 3.92 3.92
3.92 4.15 3.56 3.69 3.93 3.93
3.93
3.78
ns
LVTTL_S12
1.26 1.34
1.41
1.53
1.41
1.58 3.52 3.65 3.90 3.90
3.90 4.13 3.54 3.68 3.91 3.91
3.91
3.77
ns
LVTTL_S16
1.26 1.34
1.41
1.53
1.41
1.58 3.07 3.19 3.45 3.45
3.45 3.68 3.09 3.22 3.46 3.46
3.46
3.31
ns
LVTTL_S24
1.26 1.34
1.41
1.53
1.41
1.58 3.29 3.41 3.67 3.67
3.67 3.90 3.31 3.44 3.68 3.68
3.68
3.53
ns
LVTTL_F4
1.26 1.34
1.41
1.53
1.41
1.58 3.26 3.38 3.64 3.64
3.64 3.86 3.28 3.41 3.65 3.65
3.65
3.50
ns
LVTTL_F8
1.26 1.34
1.41
1.53
1.41
1.58 2.74 2.87 3.12 3.12
3.12 3.35 2.76 2.90 3.13 3.13
3.13
2.99
ns
LVTTL_F12
1.26 1.34
1.41
1.53
1.41
1.58 2.73 2.85 3.10 3.10
3.10 3.33 2.74 2.88 3.12 3.12
3.12
2.97
ns
LVTTL_F16
1.26 1.34
1.41
1.53
1.41
1.58 2.56 2.68 2.93 2.93
2.93 3.16 2.57 2.71 2.95 2.95
2.95
2.80
ns
LVTTL_F24
1.26 1.34
1.41
1.53
1.41
1.58 2.52 2.65 2.90 3.23
2.90 3.22 2.54 2.68 2.91 3.24
2.91
2.86
ns
LVDS_25
0.73 0.81
0.88
0.89
0.88
0.90 1.29 1.41 1.67 1.67
1.67 1.86 1.31 1.44 1.68 1.68
1.68
1.50
ns
MINI_LVDS_25
0.73 0.81
0.88
0.89
0.88
0.90 1.27 1.40 1.65 1.65
1.65 1.88 1.29 1.43 1.66 1.66
1.66
1.52
ns
BLVDS_25
0.73 0.81
0.88
0.88
0.88
0.90 1.84 1.96 2.21 2.76
2.21 2.44 1.85 1.99 2.23 2.77
2.23
2.08
ns
RSDS_25 (point
to point)
0.73 0.81
0.88
0.89
0.88
0.90 1.27 1.40 1.65 1.65
1.65 1.88 1.29 1.43 1.66 1.66
1.66
1.52
ns
PPDS_25
0.73 0.81
0.88
0.89
0.88
0.90 1.29 1.41 1.67 1.67
1.67 1.88 1.31 1.44 1.68 1.68
1.68
1.52
ns
TMDS_33
0.73 0.81
0.88
0.92
0.88
0.90 1.41 1.54 1.79 1.79
1.79 1.99 1.43 1.57 1.80 1.80
1.80
1.63
ns
PCI33_3
1.24 1.32
1.39
1.52
1.39
1.57 3.10 3.22 3.48 3.48
3.48 3.71 3.12 3.25 3.49 3.49
3.49
3.34
ns
HSUL_12_S
0.67 0.75
0.82
0.88
0.82
0.87 1.81 1.93 2.18 2.18
2.18 2.41 1.82 1.96 2.20 2.20
2.20
2.05
ns
HSUL_12_F
0.67 0.75
0.82
0.88
0.82
0.87 1.29 1.41 1.67 1.67
1.67 1.90 1.31 1.44 1.68 1.68
1.68
1.53
ns
DIFF_HSUL_
12_S
0.68 0.76
0.83
0.86
0.83
0.88 1.81 1.93 2.18 2.18
2.18 2.21 1.82 1.96 2.20 2.20
2.20
1.84
ns
DIFF_HSUL_
12_F
0.68 0.76
0.83
0.86
0.83
0.88 1.29 1.41 1.67 1.67
1.67 1.79 1.31 1.44 1.68 1.68
1.68
1.42
ns
MOBILE_
DDR_S
0.76 0.84
0.91
0.91
0.91
0.96 1.68 1.80 2.06 2.06
2.06 2.24 1.70 1.83 2.07 2.07
2.07
1.88
ns
MOBILE_
DDR_F
0.76 0.84
0.91
0.91
0.91
0.96 1.38 1.51 1.76 1.76
1.76 1.97 1.40 1.54 1.77 1.77
1.77
1.61
ns
DIFF_MOBILE_
DDR_S
0.70 0.78
0.85
0.85
0.85
0.87 1.70 1.82 2.07 2.07
2.07 2.24 1.71 1.85 2.09 2.09
2.09
1.88
ns
DIFF_MOBILE_
DDR_F
0.70 0.78
0.85
0.85
0.85
0.87 1.45 1.57 1.82 1.82
1.82 2.00 1.46 1.60 1.84 1.84
1.84
1.64
ns
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 17: IOB High Range (HR) Switching Characteristics (Cont’d)
I/O Standard
TIOPI
TIOOP
TIOTP
Speed Grade
Speed Grade
Speed Grade
1.0V
-3
-2/
-2LE
0.95V 0.9V
-1
-1Q/
-1M
-1LI
-2LE
1.0V
-3
-2/
-2LE
-1
0.95V 0.9V
-1Q/
-1M
-1LI -2LE
0.95V 0.9V Units
1.0V
-3
-2/
-2LE
-1
-1Q/
-1M
-1LI
-2LE
HSTL_I_S
0.67 0.75
0.82
0.86
0.82
0.87 1.62 1.74 1.99 1.99
1.99 2.19 1.63 1.77 2.01 2.01
2.01
1.83
ns
HSTL_II_S
0.65 0.73
0.80
0.86
0.80
0.85 1.41 1.54 1.79 1.79
1.79 1.99 1.43 1.57 1.80 1.81
1.80
1.63
ns
HSTL_I_18_S
0.67 0.75
0.82
0.88
0.82
0.87 1.29 1.41 1.67 1.67
1.67 1.86 1.31 1.44 1.68 1.68
1.68
1.50
ns
HSTL_II_18_S
0.66 0.75
0.81
0.88
0.81
0.87 1.41 1.54 1.79 1.79
1.79 1.97 1.43 1.57 1.80 1.80
1.80
1.61
ns
DIFF_HSTL_I_S 0.68 0.76
0.83
0.86
0.83
0.85 1.59 1.71 1.96 1.96
1.96 2.13 1.60 1.74 1.98 1.98
1.98
1.77
ns
DIFF_HSTL_
II_S
0.68 0.76
0.83
0.86
0.83
0.85 1.51 1.63 1.88 1.88
1.88 2.07 1.52 1.66 1.90 1.90
1.90
1.70
ns
DIFF_HSTL_
I_18_S
0.71 0.79
0.86
0.86
0.86
0.87 1.38 1.51 1.76 1.76
1.76 1.96 1.40 1.54 1.77 1.77
1.77
1.59
ns
DIFF_HSTL_
II_18_S
0.70 0.78
0.85
0.88
0.85
0.87 1.46 1.58 1.84 1.84
1.84 2.00 1.48 1.61 1.85 1.85
1.85
1.64
ns
HSTL_I_F
0.67 0.75
0.82
0.86
0.82
0.87 1.10 1.22 1.48 1.49
1.48 1.69 1.12 1.25 1.49 1.51
1.49
1.33
ns
HSTL_II_F
0.65 0.73
0.80
0.86
0.80
0.85 1.12 1.24 1.49 1.49
1.49 1.71 1.13 1.27 1.51 1.51
1.51
1.34
ns
HSTL_I_18_F
0.67 0.75
0.82
0.88
0.82
0.87 1.13 1.26 1.51 1.54
1.51 1.72 1.15 1.29 1.52 1.56
1.52
1.36
ns
HSTL_II_18_F
0.66 0.75
0.81
0.88
0.81
0.87 1.12 1.24 1.49 1.51
1.49 1.71 1.13 1.27 1.51 1.52
1.51
1.34
ns
DIFF_HSTL_I_F 0.68 0.76
0.83
0.86
0.83
0.85 1.18 1.30 1.56 1.56
1.56 1.77 1.20 1.33 1.57 1.57
1.57
1.41
ns
DIFF_HSTL_
II_F
0.68 0.76
0.83
0.86
0.83
0.85 1.21 1.33 1.59 1.59
1.59 1.77 1.23 1.36 1.60 1.60
1.60
1.41
ns
DIFF_HSTL_
I_18_F
0.71 0.79
0.86
0.86
0.86
0.87 1.21 1.33 1.59 1.59
1.59 1.77 1.23 1.36 1.60 1.60
1.60
1.41
ns
DIFF_HSTL_
II_18_F
0.70 0.78
0.85
0.88
0.85
0.87 1.21 1.33 1.59 1.59
1.59 1.77 1.23 1.36 1.60 1.60
1.60
1.41
ns
LVCMOS33_S4
1.26 1.34
1.41
1.52
1.41
1.62 3.80 3.93 4.18 4.18
4.18 4.41 3.82 3.96 4.20 4.20
4.20
4.05
ns
LVCMOS33_S8
1.26 1.34
1.41
1.52
1.41
1.62 3.52 3.65 3.90 3.90
3.90 4.13 3.54 3.68 3.91 3.91
3.91
3.77
ns
LVCMOS33_S12 1.26 1.34
1.41
1.52
1.41
1.62 3.09 3.21 3.46 3.46
3.46 3.69 3.10 3.24 3.48 3.48
3.48
3.33
ns
LVCMOS33_S16 1.26 1.34
1.41
1.52
1.41
1.62 3.40 3.52 3.77 3.78
3.77 4.00 3.42 3.55 3.79 3.79
3.79
3.64
ns
LVCMOS33_F4
1.26 1.34
1.41
1.52
1.41
1.62 3.26 3.38 3.64 3.64
3.64 3.86 3.28 3.41 3.65 3.65
3.65
3.50
ns
LVCMOS33_F8
1.26 1.34
1.41
1.52
1.41
1.62 2.74 2.87 3.12 3.12
3.12 3.35 2.76 2.90 3.13 3.13
3.13
2.99
ns
LVCMOS33_F12 1.26 1.34
1.41
1.52
1.41
1.62 2.56 2.68 2.93 2.93
2.93 3.16 2.57 2.71 2.95 2.95
2.95
2.80
ns
LVCMOS33_F16 1.26 1.34
1.41
1.52
1.41
1.62 2.56 2.68 2.93 3.06
2.93 3.16 2.57 2.71 2.95 3.07
2.95
2.80
ns
LVCMOS25_S4
1.12 1.20
1.27
1.38
1.27
1.43 3.13 3.26 3.51 3.51
3.51 3.72 3.15 3.29 3.52 3.52
3.52
3.36
ns
LVCMOS25_S8
1.12 1.20
1.27
1.38
1.27
1.43 2.88 3.01 3.26 3.26
3.26 3.49 2.90 3.04 3.27 3.27
3.27
3.13
ns
LVCMOS25_S12 1.12 1.20
1.27
1.38
1.27
1.43 2.48 2.60 2.85 2.85
2.85 3.08 2.49 2.63 2.87 2.87
2.87
2.72
ns
LVCMOS25_S16 1.12 1.20
1.27
1.38
1.27
1.43 2.82 2.94 3.20 3.20
3.20 3.43 2.84 2.97 3.21 3.21
3.21
3.06
ns
LVCMOS25_F4
1.12 1.20
1.27
1.38
1.27
1.43 2.74 2.87 3.12 3.12
3.12 3.35 2.76 2.90 3.13 3.13
3.13
2.99
ns
LVCMOS25_F8
1.12 1.20
1.27
1.38
1.27
1.43 2.18 2.30 2.56 2.56
2.56 2.79 2.20 2.33 2.57 2.57
2.57
2.42
ns
LVCMOS25_F12 1.12 1.20
1.27
1.38
1.27
1.43 2.16 2.29 2.54 2.54
2.54 2.77 2.18 2.32 2.55 2.56
2.55
2.41
ns
LVCMOS25_F16 1.12 1.20
1.27
1.38
1.27
1.43 2.01 2.13 2.39 2.63
2.39 2.61 2.03 2.16 2.40 2.65
2.40
2.25
ns
LVCMOS18_S4
0.74 0.83
0.89
0.97
0.89
0.94 1.62 1.74 1.99 1.99
1.99 2.19 1.63 1.77 2.01 2.01
2.01
1.83
ns
LVCMOS18_S8
0.74 0.83
0.89
0.97
0.89
0.94 2.18 2.30 2.56 2.56
2.56 2.79 2.20 2.33 2.57 2.57
2.57
2.42
ns
LVCMOS18_S12 0.74 0.83
0.89
0.97
0.89
0.94 2.18 2.30 2.56 2.56
2.56 2.79 2.20 2.33 2.57 2.57
2.57
2.42
ns
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 17: IOB High Range (HR) Switching Characteristics (Cont’d)
I/O Standard
TIOPI
TIOOP
TIOTP
Speed Grade
Speed Grade
Speed Grade
1.0V
-2/
-2LE
0.95V 0.9V
-1
-1Q/
-1M
-1LI
-2LE
LVCMOS18_S16 0.74 0.83
0.89
0.97
0.89
LVCMOS18_S24 0.74 0.83
0.89
0.97
LVCMOS18_F4
0.74 0.83
0.89
LVCMOS18_F8
-3
1.0V
-2/
-2LE
0.95V 0.9V
-1Q/
-1M
0.95V 0.9V Units
1.0V
-2/
-2LE
-1Q/
-1M
-1LI
-2LE
0.94 1.52 1.65 1.90 1.90
1.90 2.13 1.54 1.68 1.91 1.91
1.91
1.77
ns
0.89
0.94 1.60 1.72 1.98 2.40
1.98 2.21 1.62 1.75 1.99 2.41
1.99
1.84
ns
0.97
0.89
0.94 1.45 1.57 1.82 1.82
1.82 2.05 1.46 1.60 1.84 1.84
1.84
1.69
ns
-3
-1
-1LI -2LE
-3
-1
0.74 0.83
0.89
0.97
0.89
0.94 1.68 1.80 2.06 2.06
2.06 2.29 1.70 1.83 2.07 2.07
2.07
1.92
ns
LVCMOS18_F12 0.74 0.83
0.89
0.97
0.89
0.94 1.68 1.80 2.06 2.06
2.06 2.29 1.70 1.83 2.07 2.07
2.07
1.92
ns
LVCMOS18_F16 0.74 0.83
0.89
0.97
0.89
0.94 1.40 1.52 1.77 1.78
1.77 2.00 1.42 1.55 1.79 1.79
1.79
1.64
ns
LVCMOS18_F24 0.74 0.83
0.89
0.97
0.89
0.94 1.34 1.46 1.71 2.28
1.71 1.94 1.35 1.49 1.73 2.29
1.73
1.58
ns
LVCMOS15_S4
0.77 0.86
0.93
0.96
0.93
0.98 2.05 2.18 2.43 2.43
2.43 2.50 2.07 2.21 2.45 2.45
2.45
2.14
ns
LVCMOS15_S8
0.77 0.86
0.93
0.96
0.93
0.98 2.09 2.21 2.46 2.46
2.46 2.69 2.10 2.24 2.48 2.48
2.48
2.33
ns
LVCMOS15_S12 0.77 0.86
0.93
0.96
0.93
0.98 1.59 1.71 1.96 1.96
1.96 2.19 1.60 1.74 1.98 1.98
1.98
1.83
ns
LVCMOS15_S16 0.77 0.86
0.93
0.96
0.93
0.98 1.59 1.71 1.96 1.96
1.96 2.19 1.60 1.74 1.98 1.98
1.98
1.83
ns
LVCMOS15_F4
0.77 0.86
0.93
0.96
0.93
0.98 1.85 1.97 2.23 2.23
2.23 2.27 1.87 2.00 2.24 2.24
2.24
1.91
ns
LVCMOS15_F8
0.77 0.86
0.93
0.96
0.93
0.98 1.60 1.72 1.98 1.98
1.98 2.21 1.62 1.75 1.99 1.99
1.99
1.84
ns
LVCMOS15_F12 0.77 0.86
0.93
0.96
0.93
0.98 1.35 1.47 1.73 1.73
1.73 1.96 1.37 1.50 1.74 1.74
1.74
1.59
ns
LVCMOS15_F16 0.77 0.86
0.93
0.96
0.93
0.98 1.34 1.46 1.71 2.07
1.71 1.94 1.35 1.49 1.73 2.09
1.73
1.58
ns
LVCMOS12_S4
0.87 0.95
1.02
1.19
1.02
1.08 2.57 2.69 2.95 2.95
2.95 3.18 2.59 2.72 2.96 2.96
2.96
2.81
ns
LVCMOS12_S8
0.87 0.95
1.02
1.19
1.02
1.08 2.09 2.21 2.46 2.46
2.46 2.69 2.10 2.24 2.48 2.48
2.48
2.33
ns
LVCMOS12_S12 0.87 0.95
1.02
1.19
1.02
1.08 1.79 1.91 2.17 2.17
2.17 2.40 1.81 1.94 2.18 2.18
2.18
2.03
ns
LVCMOS12_F4
0.87 0.95
1.02
1.19
1.02
1.08 1.98 2.10 2.35 2.35
2.35 2.58 1.99 2.13 2.37 2.37
2.37
2.22
ns
LVCMOS12_F8
0.87 0.95
1.02
1.19
1.02
1.08 1.54 1.66 1.92 1.92
1.92 2.15 1.56 1.69 1.93 1.93
1.93
1.78
ns
LVCMOS12_F12 0.87 0.95
1.02
1.19
1.02
1.08 1.38 1.51 1.76 1.76
1.76 1.97 1.40 1.54 1.77 1.77
1.77
1.61
ns
SSTL135_S
0.67 0.75
0.82
0.88
0.82
0.87 1.35 1.47 1.73 1.73
1.73 1.93 1.37 1.50 1.74 1.74
1.74
1.56
ns
SSTL15_S
0.60 0.68
0.75
0.75
0.75
0.80 1.30 1.43 1.68 1.71
1.68 1.88 1.32 1.46 1.69 1.73
1.69
1.52
ns
SSTL18_I_S
0.67 0.75
0.82
0.86
0.82
0.87 1.67 1.79 2.04 2.04
2.04 2.24 1.68 1.82 2.06 2.06
2.06
1.88
ns
SSTL18_II_S
0.67 0.75
0.82
0.88
0.82
0.85 1.31 1.43 1.68 1.68
1.68 1.91 1.32 1.46 1.70 1.70
1.70
1.55
ns
DIFF_SSTL135_
0.68 0.76
S
0.83
0.88
0.83
0.87 1.35 1.47 1.73 1.73
1.73 1.93 1.37 1.50 1.74 1.74
1.74
1.56
ns
DIFF_SSTL15_
S
0.68 0.76
0.83
0.88
0.83
0.87 1.30 1.43 1.68 1.71
1.68 1.88 1.32 1.46 1.69 1.73
1.69
1.52
ns
DIFF_SSTL18
_I_S
0.71 0.79
0.86
0.88
0.86
0.87 1.68 1.80 2.06 2.06
2.06 2.24 1.70 1.83 2.07 2.07
2.07
1.88
ns
DIFF_SSTL18
_II_S
0.71 0.79
0.86
0.88
0.86
0.87 1.38 1.51 1.76 1.76
1.76 1.94 1.40 1.54 1.77 1.77
1.77
1.58
ns
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 17: IOB High Range (HR) Switching Characteristics (Cont’d)
I/O Standard
TIOPI
TIOOP
TIOTP
Speed Grade
Speed Grade
Speed Grade
1.0V
-3
-2/
-2LE
0.95V 0.9V
-1
-1Q/
-1M
-1LI
-2LE
1.0V
-3
-2/
-2LE
-1
0.95V 0.9V
-1Q/
-1M
-1LI -2LE
0.95V 0.9V Units
1.0V
-3
-2/
-2LE
-1
-1Q/
-1M
-1LI
-2LE
SSTL135_F
0.67 0.75
0.82
0.88
0.82
0.87 1.12 1.24 1.49 1.49
1.49 1.71 1.13 1.27 1.51 1.51
1.51
1.34
ns
SSTL15_F
0.60 0.68
0.75
0.75
0.75
0.80 1.07 1.19 1.45 1.45
1.45 1.68 1.09 1.22 1.46 1.46
1.46
1.31
ns
SSTL18_I_F
0.67 0.75
0.82
0.86
0.82
0.87 1.12 1.24 1.49 1.53
1.49 1.72 1.13 1.27 1.51 1.54
1.51
1.36
ns
SSTL18_II_F
0.67 0.75
0.82
0.88
0.82
0.85 1.12 1.24 1.49 1.51
1.49 1.71 1.13 1.27 1.51 1.52
1.51
1.34
ns
DIFF_SSTL135
_F
0.68 0.76
0.83
0.88
0.83
0.87 1.12 1.24 1.49 1.49
1.49 1.71 1.13 1.27 1.51 1.51
1.51
1.34
ns
DIFF_SSTL15_F 0.68 0.76
0.83
0.88
0.83
0.87 1.07 1.19 1.45 1.45
1.45 1.68 1.09 1.22 1.46 1.46
1.46
1.31
ns
DIFF_SSTL18_I
_F
0.71 0.79
0.86
0.88
0.86
0.87 1.23 1.35 1.60 1.60
1.60 1.80 1.24 1.38 1.62 1.62
1.62
1.44
ns
DIFF_SSTL18_II
0.71 0.79
_F
0.86
0.88
0.86
0.87 1.21 1.33 1.59 1.59
1.59 1.79 1.23 1.36 1.60 1.60
1.60
1.42
ns
Table 18 specifies the values of TIOTPHZ and TIOIBUFDISABLE. TIOTPHZ is described as the delay from the T pin to the IOB pad through the
output buffer of an IOB pad, when 3-state is enabled (i.e., a high impedance state). TIOIBUFDISABLE is described as the IOB delay from
IBUFDISABLE to O output. In HR I/O banks, the internal IN_TERM termination turn-off time is always faster than TIOTPHZ when the
INTERMDISABLE pin is used.
Table 18: IOB 3-state Output Switching Characteristics
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
TIOTPHZ
T input to pad high-impedance
2.06
2.19
2.37
2.37
2.37
2.03
ns
TIOIBUFDISABLE
IBUF turn-on time from IBUFDISABLE to O
output
2.11
2.30
2.60
2.60
2.60
2.17
ns
VMEAS
VREF
(3)(5)
(2)(4)
I/O Standard Adjustment Measurement Methodology
Input Delay Measurements
Table 19 shows the test setup parameters used for measuring input delay.
Table 19: Input Delay Measurement Methodology
Description
I/O Standard Attribute
VL (1)
VH(1)
LVCMOS, 1.2V
LVCMOS12
0.1
1.1
0.6
–
LVCMOS, 1.5V
LVCMOS15
0.1
1.4
0.75
–
LVCMOS, 1.8V
LVCMOS18
0.1
1.7
0.9
–
LVCMOS, 2.5V
LVCMOS25
0.1
2.4
1.25
–
LVCMOS, 3.3V
LVCMOS33
0.1
3.2
1.65
–
LVTTL, 3.3V
LVTTL
0.1
3.2
1.65
–
MOBILE_DDR, 1.8V
MOBILE_DDR
0.1
1.7
0.9
–
PCI33, 3.3V
PCI33_3
0.1
3.2
1.65
–
HSTL (High-Speed Transceiver Logic), Class I, 1.2V
HSTL_I_12
VREF – 0.5
VREF + 0.5
VREF
0.60
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 19: Input Delay Measurement Methodology (Cont’d)
Description
I/O Standard Attribute
VL (1)
VH(1)
VMEAS
VREF
(3)(5)
(2)(4)
HSTL, Class I & II, 1.5V
HSTL_I, HSTL_II
VREF – 0.65
VREF + 0.65
VREF
0.75
HSTL, Class I & II, 1.8V
HSTL_I_18, HSTL_II_18
VREF – 0.8
VREF + 0.8
VREF
0.90
HSUL (High-Speed Unterminated Logic), 1.2V
HSUL_12
VREF – 0.5
VREF + 0.5
VREF
0.60
SSTL (Stub Terminated Transceiver Logic), 1.2V
SSTL12
VREF – 0.5
VREF + 0.5
VREF
0.60
SSTL, 1.35V
SSTL135, SSTL135_R
VREF – 0.575
VREF + 0.575
VREF
0.675
SSTL, 1.5V
SSTL15, SSTL15_R
VREF – 0.65
VREF + 0.65
VREF
0.75
SSTL, Class I & II, 1.8V
SSTL18_I, SSTL18_II
VREF – 0.8
VREF + 0.8
VREF
0.90
DIFF_MOBILE_DDR, 1.8V
DIFF_MOBILE_DDR
0.9 – 0.125
0.9 + 0.125
0(5)
–
DIFF_HSTL, Class I, 1.2V
DIFF_HSTL_I_12
0.6 – 0.125
0.6 + 0.125
0(5)
–
DIFF_HSTL, Class I & II,1.5V
DIFF_HSTL_I,
DIFF_HSTL_II
0.75 – 0.125
0.75 + 0.125
0(5)
–
DIFF_HSTL, Class I & II, 1.8V
DIFF_HSTL_I_18,
DIFF_HSTL_II_18
0.9 – 0.125
0.9 + 0.125
0(5)
–
DIFF_HSUL, 1.2V
DIFF_HSUL_12
0.6 – 0.125
0.6 + 0.125
0(5)
–
DIFF_SSTL135/DIFF_SSTL135_R, 1.35V
DIFF_SSTL135,
DIFF_SSTL135_R
0.675 – 0.125 0.675 + 0.125
0(5)
–
DIFF_SSTL15/DIFF_SSTL15_R, 1.5V
DIFF_SSTL15,
DIFF_SSTL15_R
0.75 – 0.125
0.75 + 0.125
0(5)
–
DIFF_SSTL18_I/DIFF_SSTL18_II, 1.8V
DIFF_SSTL18_I,
DIFF_SSTL18_II
0.9 – 0.125
0.9 + 0.125
0(5)
–
LVDS_25, 2.5V
LVDS_25
1.2 – 0.125
1.2 + 0.125
0(5)
–
1.25 + 0.125
0(5)
–
1.25 + 0.125
0(5)
–
1.25 + 0.125
0(5)
–
1.25 + 0.125
0(5)
–
3 + 0.125
0(5)
–
BLVDS_25, 2.5V
MINI_LVDS_25, 2.5V
PPDS_25
RSDS_25
TMDS_33
BLVDS_25
MINI_LVDS_25
PPDS_25
RSDS_25
TMDS_33
1.25 – 0.125
1.25 – 0.125
1.25 – 0.125
1.25 – 0.125
3 – 0.125
Notes:
1.
2.
3.
4.
5.
Input waveform switches between VLand VH.
Measurements are made at typical, minimum, and maximum VREF values. Reported delays reflect worst case of these measurements. VREF
values listed are typical.
Input voltage level from which measurement starts.
This is an input voltage reference that bears no relation to the VREF / VMEAS parameters found in IBIS models and/or noted in Figure 1.
The value given is the differential input voltage.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Output Delay Measurements
Output delays are measured with short output traces. Standard termination was used for all testing. The propagation delay
of the trace is characterized separately and subtracted from the final measurement, and is therefore not included in the
generalized test setups shown in Figure 1 and Figure 2.
X-Ref Target - Figure 1
VREF
RREF
FPGA Output
VMEAS
(Voltage Level When Taking
Delay Measurement)
CREF
(Probe Capacitance)
DS181_04_090514
Figure 1: Single-Ended Test Setup
X-Ref Target - Figure 2
FPGA Output
+
CREF
RREF VMEAS
–
DS181_05_090514
Figure 2: Differential Test Setup
Parameters VREF, RREF, CREF, and VMEAS fully describe the test conditions for each I/O standard. The most accurate prediction
of propagation delay in any given application can be obtained through IBIS simulation, using this method:
1.
Simulate the output driver of choice into the generalized test setup using values from Table 20.
2.
Record the time to VMEAS.
3.
Simulate the output driver of choice into the actual PCB trace and load using the appropriate IBIS model or capacitance
value to represent the load.
4.
Record the time to VMEAS.
5.
Compare the results of step 2 and step 4. The increase or decrease in delay yields the actual propagation delay of the
PCB trace.
Table 20: Output Delay Measurement Methodology
Description
I/O Standard Attribute
RREF
()
CREF(1)
(pF)
VMEAS
(V)
VREF
(V)
LVCMOS, 1.2V
LVCMOS12
1M
0
0.6
0
LVCMOS, 1.5V
LVCMOS15
1M
0
0.75
0
LVCMOS, 1.8V
LVCMOS18
1M
0
0.9
0
LVCMOS, 2.5V
LVCMOS25
1M
0
1.25
0
LVCMOS, 3.3V
LVCMOS33
1M
0
1.65
0
LVTTL, 3.3V
LVTTL
1M
0
1.65
0
PCI33, 3.3V
PCI33_3
25
10
1.65
0
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 20: Output Delay Measurement Methodology (Cont’d)
Description
I/O Standard Attribute
RREF
()
CREF(1)
(pF)
VMEAS
(V)
VREF
(V)
HSTL (High-Speed Transceiver Logic), Class I, 1.2V
HSTL_I_12
50
0
VREF
0.6
HSTL, Class I, 1.5V
HSTL_I
50
0
VREF
0.75
HSTL, Class II, 1.5V
HSTL_II
25
0
VREF
0.75
HSTL, Class I, 1.8V
HSTL_I_18
50
0
VREF
0.9
HSTL, Class II, 1.8V
HSTL_II_18
25
0
VREF
0.9
HSUL (High-Speed Unterminated Logic), 1.2V
HSUL_12
50
0
VREF
0.6
SSTL12, 1.2V
SSTL12
50
0
VREF
0.6
SSTL135/SSTL135_R, 1.35V
SSTL135, SSTL135_R
50
0
VREF
0.675
SSTL15/SSTL15_R, 1.5V
SSTL15, SSTL15_R
50
0
VREF
0.75
SSTL (Stub Series Terminated Logic),
Class I & Class II, 1.8V
SSTL18_I, SSTL18_II
50
0
VREF
0.9
DIFF_MOBILE_DDR, 1.8V
DIFF_MOBILE_DDR
50
0
VREF
0.9
DIFF_HSTL, Class I, 1.2V
DIFF_HSTL_I_12
50
0
VREF
0.6
DIFF_HSTL, Class I & II, 1.5V
DIFF_HSTL_I, DIFF_HSTL_II
50
0
VREF
0.75
DIFF_HSTL, Class I & II, 1.8V
DIFF_HSTL_I_18, DIFF_HSTL_II_18
50
0
VREF
0.9
DIFF_HSUL_12, 1.2V
DIFF_HSUL_12
50
0
VREF
0.6
DIFF_SSTL135/DIFF_SSTL135_R, 1.35V
DIFF_SSTL135, DIFF_SSTL135_R
50
0
VREF
0.675
DIFF_SSTL15/DIFF_SSTL15_R, 1.5V
DIFF_SSTL15, DIFF_SSTL15_R
50
0
VREF
0.75
DIFF_SSTL18, Class I & II, 1.8V
DIFF_SSTL18_I, DIFF_SSTL18_II
50
0
VREF
0.9
LVDS, 2.5V
LVDS_25
100
0
0(2)
0
BLVDS (Bus LVDS), 2.5V
BLVDS_25
100
0
0(2)
0
Mini LVDS, 2.5V
MINI_LVDS_25
100
0
0(2)
0
PPDS_25
PPDS_25
100
0
0(2)
0
RSDS_25
RSDS_25
100
0
0(2)
0
TMDS_33
TMDS_33
50
0
0(2)
3.3
Notes:
1.
2.
CREF is the capacitance of the probe, nominally 0 pF.
The value given is the differential output voltage.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Input/Output Logic Switching Characteristics
Table 21: ILOGIC Switching Characteristics
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
Setup/Hold
TICE1CK/
TICKCE1
CE1 pin setup/hold with respect to
CLK
0.48/0.02
0.54/0.02
0.76/0.02
0.76/0.02
0.76/0.02
0.50/–0.07
ns
TISRCK/
TICKSR
SR pin setup/hold with respect to
CLK
0.60/0.01
0.70/0.01
1.13/0.01
1.13/0.01
1.13/0.01
0.88/–0.35
ns
TIDOCK/
TIOCKD
D pin setup/hold with respect to CLK
without Delay
0.01/0.27
0.01/0.29
0.01/0.33
0.01/0.33
0.01/0.33
0.01/0.33
ns
TIDOCKD/
TIOCKDD
DDLY pin setup/hold with respect to
CLK (using IDELAY)
0.02/0.27
0.02/0.29
0.02/0.33
0.02/0.33
0.02/0.33
0.01/0.33
ns
Combinatorial
TIDI
D pin to O pin propagation delay, no
Delay
0.11
0.11
0.13
0.13
0.13
0.14
ns
TIDID
DDLY pin to O pin propagation delay
(using IDELAY)
0.11
0.12
0.14
0.14
0.14
0.15
ns
Sequential Delays
TIDLO
D pin to Q1 pin using flip-flop as a
latch without Delay
0.41
0.44
0.51
0.51
0.51
0.54
ns
TIDLOD
DDLY pin to Q1 pin using flip-flop as
a latch (using IDELAY)
0.41
0.44
0.51
0.51
0.51
0.55
ns
TICKQ
CLK to Q outputs
0.53
0.57
0.66
0.66
0.66
0.71
ns
TRQ_
ILOGIC
SR pin to OQ/TQ out
0.96
1.08
1.32
1.32
1.32
1.32
ns
TGSRQ_
ILOGIC
Global set/reset to Q outputs
7.60
7.60
10.51
10.51
10.51
11.39
ns
Minimum pulse width, SR inputs
0.61
0.72
0.72
0.72
0.72
0.72
ns, Min
Set/Reset
TRPW_
ILOGIC
Table 22: OLOGIC Switching Characteristics
Speed Grade
Symbol
Description
1.0V
-3
-2/-2LE
-1
-1Q/-1M
0.95V
0.9V
-1LI
-2LE
Units
Setup/Hold
TODCK/
TOCKD
D1/D2 pins setup/hold with respect
to CLK
0.67/–0.11 0.71/–0.11 0.84/–0.11 0.84/–0.06 0.84/–0.11
0.64/0.03
ns
TOOCECK/
TOCKOCE
OCE pin setup/hold with respect to
CLK
0.32/0.58
0.34/0.58
0.51/0.58
0.51/0.58
0.51/0.58
0.28/0.01
ns
TOSRCK/
TOCKSR
SR pin setup/hold with respect to
CLK
0.37/0.21
0.44/0.21
0.80/0.21
0.80/0.21
0.80/0.21
0.62/–0.25
ns
TOTCK/
TOCKT
T1/T2 pins setup/hold with respect to 0.69/–0.14 0.73/–0.14 0.89/–0.14 0.89/–0.11 0.89/–0.14
CLK
0.66/0.02
ns
TOTCECK/
TOCKTCE
TCE pin setup/hold with respect to
CLK
0.24/0.05
ns
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0.34/0.01
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0.51/0.01
0.51/0.10
0.51/0.01
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 22: OLOGIC Switching Characteristics (Cont’d)
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
Units
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
0.83
0.96
1.16
1.16
1.16
1.36
ns
Combinatorial
TODQ
D1 to OQ out or T1 to TQ out
Sequential Delays
TOCKQ
CLK to OQ/TQ out
0.47
0.49
0.56
0.56
0.56
0.63
ns
TRQ_OLOGIC
SR pin to OQ/TQ out
0.72
0.80
0.95
0.95
0.95
1.12
ns
7.60
7.60
10.51
10.51
10.51
11.39
ns
0.64
0.74
0.74
0.74
0.74
0.74
ns,
Min
0.95V
0.9V
Units
TGSRQ_OLOGIC Global set/reset to Q outputs
Set/Reset
TRPW_OLOGIC
Minimum pulse width, SR inputs
Input Serializer/Deserializer Switching Characteristics
Table 23: ISERDES Switching Characteristics
Speed Grade
Symbol
Description
1.0V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
0.01/0.14
0.02/0.15
0.02/0.17
0.02/0.17
0.02/0.17
Setup/Hold for Control Lines
TISCCK_BITSLIP/
TISCKC_BITSLIP
BITSLIP pin setup/hold with
respect to CLKDIV
0.02/0.21
ns
TISCCK_CE /
TISCKC_CE(2)
CE pin setup/hold with respect to 0.45/–0.01 0.50/–0.01 0.72/–0.01 0.72/–0.01 0.72/–0.01 0.45/–0.11
CLK (for CE1)
ns
TISCCK_CE2 /
TISCKC_CE2(2)
CE pin setup/hold with respect to –0.10/0.33 –0.10/0.36 –0.10/0.40 –0.10/0.40 –0.10/0.40 –0.17/0.40
CLKDIV (for CE2)
ns
Setup/Hold for Data Lines
TISDCK_D /
TISCKD_D
D pin setup/hold with respect to
CLK
–0.02/0.12 –0.02/0.14 –0.02/0.17 –0.02/0.17 –0.02/0.17 –0.04/0.19
ns
TISDCK_DDLY /
TISCKD_DDLY
DDLY pin setup/hold with respect –0.02/0.12 –0.02/0.14 –0.02/0.17 –0.02/0.17 –0.02/0.17 –0.03/0.19
to CLK (using IDELAY)(1)
ns
TISDCK_D_DDR /
TISCKD_D_DDR
D pin setup/hold with respect to
CLK at DDR mode
–0.02/0.12 –0.02/0.14 –0.02/0.17 –0.02/0.17 –0.02/0.17 –0.04/0.19
ns
TISDCK_DDLY_DDR/
TISCKD_DDLY_DDR
DDLY pin setup/hold with respect
to CLK at DDR mode (using
IDELAY)(1)
0.12/0.12
0.14/0.14
0.17/0.17
0.17/0.17
0.17/0.17
0.19/0.19
ns
0.53
0.54
0.66
0.66
0.66
0.67
ns
0.11
0.11
0.13
0.13
0.13
0.14
ns
Sequential Delays
TISCKO_Q
CLKDIV to out at Q pin
Propagation Delays
TISDO_DO
D input to DO output pin
Notes:
1.
2.
Recorded at 0 tap value.
TISCCK_CE2 and TISCKC_CE2 are reported as TISCCK_CE/TISCKC_CE in the timing report.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Output Serializer/Deserializer Switching Characteristics
Table 24: OSERDES Switching Characteristics
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
0.45/0.03
0.63/0.03
0.63/0.08
0.63/0.03
Units
Setup/Hold
TOSDCK_D/
TOSCKD_D
D input setup/hold with respect to
CLKDIV
0.42/0.03
0.44/–0.02
ns
TOSDCK_T/
TOSCKD_T(1)
T input setup/hold with respect to
CLK
0.69/–0.13 0.73/–0.13 0.88/–0.13 0.88/–0.13 0.88/–0.13 0.66/–0.25
ns
TOSDCK_T2/
TOSCKD_T2(1)
T input setup/hold with respect to
CLKDIV
0.31/–0.13 0.34/–0.13 0.39/–0.13 0.39/–0.13 0.39/–0.13 0.46/–0.25
ns
TOSCCK_OCE/
TOSCKC_OCE
OCE input setup/hold with respect
to CLK
0.32/0.58
0.34/0.58
0.51/0.58
0.51/0.58
0.51/0.58
0.28/–0.04
ns
TOSCCK_S
SR (reset) input setup with respect
to CLKDIV
0.47
0.52
0.85
0.85
0.85
0.70
ns
TOSCCK_TCE/
TOSCKC_TCE
TCE input setup/hold with respect
to CLK
0.32/0.01
0.34/0.01
0.51/0.01
0.51/0.10
0.51/0.01
0.24/0.00
ns
Sequential Delays
TOSCKO_OQ
Clock to out from CLK to OQ
0.40
0.42
0.48
0.48
0.48
0.54
ns
TOSCKO_TQ
Clock to out from CLK to TQ
0.47
0.49
0.56
0.56
0.56
0.63
ns
T input to TQ Out
0.83
0.92
1.11
1.11
1.11
1.18
ns
Combinatorial
TOSDO_TTQ
Notes:
1.
TOSDCK_T2 and TOSCKD_T2 are reported as TOSDCK_T/TOSCKD_T in the timing report.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Input/Output Delay Switching Characteristics
Table 25: Input/Output Delay Switching Characteristics
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
Units
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
3.67
3.67
3.67
3.67
3.67
3.67
µs
IDELAYCTRL
TDLYCCO_RDY
Reset to ready for IDELAYCTRL
FIDELAYCTRL_REF
Attribute REFCLK
frequency = 200.00(1)
200.00
200.00
200.00
200.00
200.00
200.00
MHz
Attribute REFCLK
frequency = 300.00(1)
300.00
300.00
300.00
300.00
300.00
300.00
MHz
Attribute REFCLK
frequency = 400.00(1)
400.00
400.00
N/A
N/A
N/A
N/A
MHz
±10
±10
±10
±10
±10
±10
MHz
59.28
59.28
59.28
59.28
59.28
59.28
ns
IDELAYCTRL_REF_
PRECISION
REFCLK precision
TIDELAYCTRL_RPW
Minimum Reset pulse width
IDELAY
TIDELAYRESOLUTION
IDELAY chain delay resolution
1/(32 x 2 x FREF)
µs
Pattern dependent period jitter in
delay chain for clock pattern.(2)
0
0
0
0
0
0
ps
per tap
Pattern dependent period jitter in
delay chain for random data
pattern (PRBS 23)(3)
±5
±5
±5
±5
±5
±5
ps
per tap
Pattern dependent period jitter in
delay chain for random data
pattern (PRBS 23)(4)
±9
±9
±9
±9
±9
±9
ps
per tap
TIDELAY_CLK_MAX
Maximum frequency of CLK input
to IDELAY
680.00
680.00
600.00
600.00
600.00
520.00
MHz
TIDCCK_CE /
TIDCKC_CE
CE pin setup/hold with respect to
C for IDELAY
0.12/0.11 0.16/0.13 0.21/0.16 0.21/0.16 0.21/0.16 0.14/0.16
ns
TIDCCK_INC/
TIDCKC_INC
INC pin setup/hold with respect to 0.12/0.16 0.14/0.18 0.16/0.22 0.16/0.23 0.16/0.22 0.10/0.23
C for IDELAY
ns
TIDCCK_RST/
TIDCKC_RST
RST pin setup/hold with respect
to C for IDELAY
ns
TIDDO_IDATAIN
Propagation delay through
IDELAY
TIDELAYPAT_JIT
0.15/0.09 0.16/0.11 0.18/0.14 0.18/0.14 0.18/0.14 0.22/0.19
Note 5
Note 5
Note 5
Note 5
Note 5
Note 5
ps
Notes:
1.
2.
3.
4.
5.
Average Tap Delay at 200 MHz = 78 ps, at 300 MHz = 52 ps, and at 400 MHz = 39 ps.
When HIGH_PERFORMANCE mode is set to TRUE or FALSE.
When HIGH_PERFORMANCE mode is set to TRUE.
When HIGH_PERFORMANCE mode is set to FALSE.
Delay depends on IDELAY tap setting. See the timing report for actual values.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 26: IO_FIFO Switching Characteristics
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
IO_FIFO Clock to Out Delays
TOFFCKO_DO
RDCLK to Q outputs
0.55
0.60
0.68
0.68
0.68
0.81
ns
TCKO_FLAGS
Clock to IO_FIFO flags
0.55
0.61
0.77
0.77
0.77
0.79
ns
0.51/0.02
0.58/0.02
0.58/0.18
0.58/0.02
Setup/Hold
TCCK_D/TCKC_D
D inputs to WRCLK
0.47/0.02
0.76/0.09
ns
TIFFCCK_WREN/
TIFFCKC_WREN
WREN to WRCLK
0.42/–0.01 0.47/–0.01 0.53/–0.01 0.53/–0.01 0.53/–0.01 0.70/–0.05
ns
TOFFCCK_RDEN/
TOFFCKC_RDEN
RDEN to RDCLK
0.53/0.02
0.58/0.02
0.66/0.02
0.66/0.02
0.66/0.02
0.79/–0.02
ns
Minimum Pulse Width
TPWH_IO_FIFO
RESET, RDCLK, WRCLK
1.62
2.15
2.15
2.15
2.15
2.15
ns
TPWL_IO_FIFO
RESET, RDCLK, WRCLK
1.62
2.15
2.15
2.15
2.15
2.15
ns
266.67
200.00
200.00
200.00
200.00
200.00
MHz
Maximum Frequency
FMAX
RDCLK and WRCLK
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
CLB Switching Characteristics
Table 27: CLB Switching Characteristics
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
Combinatorial Delays
TILO
An – Dn LUT address to A
0.10
0.11
0.13
0.13
0.13
0.15
ns, Max
TILO_2
An – Dn LUT address to
AMUX/CMUX
0.27
0.30
0.36
0.36
0.36
0.41
ns, Max
TILO_3
An – Dn LUT address to BMUX_A
0.42
0.46
0.55
0.55
0.55
0.65
ns, Max
TITO
An – Dn inputs to A – D Q outputs
0.94
1.05
1.27
1.27
1.27
1.51
ns, Max
TAXA
AX inputs to AMUX output
0.62
0.69
0.84
0.84
0.84
1.01
ns, Max
TAXB
AX inputs to BMUX output
0.58
0.66
0.83
0.83
0.83
0.98
ns, Max
TAXC
AX inputs to CMUX output
0.60
0.68
0.82
0.82
0.82
0.98
ns, Max
TAXD
AX inputs to DMUX output
0.68
0.75
0.90
0.90
0.90
1.08
ns, Max
TBXB
BX inputs to BMUX output
0.51
0.57
0.69
0.69
0.69
0.82
ns, Max
TBXD
BX inputs to DMUX output
0.62
0.69
0.82
0.82
0.82
0.99
ns, Max
TCXC
CX inputs to CMUX output
0.42
0.48
0.58
0.58
0.58
0.69
ns, Max
TCXD
CX inputs to DMUX output
0.53
0.59
0.71
0.71
0.71
0.86
ns, Max
TDXD
DX inputs to DMUX output
0.52
0.58
0.70
0.70
0.70
0.84
ns, Max
Sequential Delays
TCKO
Clock to AQ – DQ outputs
0.40
0.44
0.53
0.53
0.53
0.62
ns, Max
TSHCKO
Clock to AMUX – DMUX outputs
0.47
0.53
0.66
0.66
0.66
0.73
ns, Max
Setup and Hold Times of CLB Flip-Flops Before/After Clock CLK
TAS/TAH
AN – DN input to CLK on A – D
flip-flops
0.07/0.12
0.09/0.14
0.11/0.18
0.11/0.28
0.11/0.18
0.11/0.22
ns, Min
TDICK/
TCKDI
AX – DX input to CLK on A – D
flip-flops
0.06/0.19
0.07/0.21
0.09/0.26
0.09/0.35
0.09/0.26
0.09/0.33
ns, Min
AX – DX input through MUXs and/or
carry logic to CLK on A – D
flip-flops
0.59/0.08
0.66/0.09
0.81/0.11
0.81/0.20
0.81/0.11
0.97/0.15
ns, Min
TCECK_CLB/ CE input to CLK on A – D flip-flops
TCKCE_CLB
0.15/0.00
0.17/0.00
0.21/0.01
0.21/0.13
0.21/0.01
0.34/–0.01
ns, Min
SR input to CLK on A – D flip-flops
0.38/0.03
0.43/0.04
0.53/0.05
0.53/0.18
0.53/0.05
0.62/0.19
ns, Min
TSRCK/
TCKSR
Set/Reset
TSRMIN
SR input minimum pulse width
0.52
0.78
1.04
1.04
1.04
0.95
ns, Min
TRQ
Delay from SR input to AQ – DQ
flip-flops
0.53
0.59
0.71
0.71
0.71
0.83
ns, Max
TCEO
Delay from CE input to AQ – DQ
flip-flops
0.52
0.58
0.70
0.70
0.70
0.83
ns, Max
FTOG
Toggle frequency (for export
control)
1412
1286
1098
1098
1098
1098
MHz
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
CLB Distributed RAM Switching Characteristics (SLICEM Only)
Table 28: CLB Distributed RAM Switching Characteristics
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
Sequential Delays
TSHCKO
Clock to A – B outputs
0.98
1.09
1.32
1.32
1.32
1.54
ns, Max
TSHCKO_1
Clock to AMUX – BMUX outputs
1.37
1.53
1.86
1.86
1.86
2.18
ns, Max
Setup and Hold Times Before/After Clock CLK
TDS_LRAM/
TDH_LRAM
A – D inputs to CLK
0.54/0.28
0.60/0.30
0.72/0.35
0.72/0.37
0.72/0.35
0.96/0.40
ns, Min
TAS_LRAM/
TAH_LRAM
Address An inputs to clock
0.27/0.55
0.30/0.60
0.37/0.70
0.37/0.71
0.37/0.70
0.43/0.71
ns, Min
Address An inputs through MUXs
and/or carry logic to clock
0.69/0.18
0.77/0.21
0.94/0.26
0.94/0.35
0.94/0.26
1.11/0.31
ns, Min
TWS_LRAM/
TWH_LRAM
WE input to clock
0.38/0.10
0.43/0.12
0.53/0.17
0.53/0.17
0.53/0.17
0.62/0.13
ns, Min
TCECK_LRAM/
TCKCE_LRAM
CE input to CLK
0.39/0.10
0.44/0.11
0.53/0.17
0.53/0.17
0.53/0.17
0.63/0.12
ns, Min
Clock CLK
TMPW_LRAM
Minimum pulse width
1.05
1.13
1.25
1.25
1.25
1.61
ns, Min
TMCP
Minimum clock period
2.10
2.26
2.50
2.50
2.50
3.21
ns, Min
0.95V
0.9V
Units
Notes:
1.
TSHCKO also represents the CLK to XMUX output. Refer to the timing report for the CLK to XMUX path.
CLB Shift Register Switching Characteristics (SLICEM Only)
Table 29: CLB Shift Register Switching Characteristics
Speed Grade
Symbol
Description
1.0V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Sequential Delays
TREG
Clock to A – D outputs
1.19
1.33
1.61
1.61
1.61
1.89
ns, Max
TREG_MUX
Clock to AMUX – DMUX output
1.58
1.77
2.15
2.15
2.15
2.53
ns, Max
TREG_M31
Clock to DMUX output via M31
output
1.12
1.23
1.46
1.46
1.46
1.68
ns, Max
Setup and Hold Times Before/After Clock CLK
TWS_SHFREG/
TWH_SHFREG
WE input
0.37/0.10
0.41/0.12 0.51/0.17 0.51/0.17 0.51/0.17
0.59/0.13
ns, Min
TCECK_SHFREG/
TCKCE_SHFREG
CE input to CLK
0.37/0.10
0.42/0.11 0.52/0.17 0.52/0.17 0.52/0.17
0.60/0.12
ns, Min
TDS_SHFREG/
TDH_SHFREG
A – D inputs to CLK
0.33/0.34
0.37/0.37 0.44/0.43 0.44/0.44 0.44/0.43
0.54/0.55
ns, Min
Minimum pulse width
0.77
1.22
ns, Min
Clock CLK
TMPW_SHFREG
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0.98
0.98
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Block RAM and FIFO Switching Characteristics
Table 30: Block RAM and FIFO Switching Characteristics
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
Units
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Clock CLK to DOUT
output (without output
register)(2)(3)
1.85
2.13
2.46
2.46
2.46
2.87
ns, Max
Clock CLK to DOUT
output (with output
register)(4)(5)
0.64
0.74
0.89
0.89
0.89
1.02
ns, Max
Clock CLK to DOUT
output with ECC (without
output register)(2)(3)
2.77
3.04
3.84
3.84
3.84
5.30
ns, Max
Clock CLK to DOUT
output with ECC (with
output register)(4)(5)
0.73
0.81
0.94
0.94
0.94
1.11
ns, Max
TRCKO_DO_CASCOUT and Clock CLK to DOUT
TRCKO_DO_CASCOUT_REG output with cascade
(without output register)(2)
2.61
2.88
3.30
3.30
3.30
3.76
ns, Max
Clock CLK to DOUT
output with cascade (with
output register)(4)
1.16
1.28
1.46
1.46
1.46
1.56
ns, Max
TRCKO_FLAGS
Clock CLK to FIFO flags
outputs(6)
0.76
0.87
1.05
1.05
1.05
1.14
ns, Max
TRCKO_POINTERS
Clock CLK to FIFO
pointers outputs(7)
0.94
1.02
1.15
1.15
1.15
1.30
ns, Max
TRCKO_PARITY_ECC
Clock CLK to ECCPARITY
in ECC encode only mode
0.78
0.85
0.94
0.94
0.94
1.10
ns, Max
TRCKO_SDBIT_ECC and
TRCKO_SDBIT_ECC_REG
Clock CLK to BITERR
(without output register)
2.56
2.81
3.55
3.55
3.55
4.90
ns, Max
Clock CLK to BITERR
(with output register)
0.68
0.76
0.89
0.89
0.89
1.05
ns, Max
0.75
0.88
1.07
1.07
1.07
1.15
ns, Max
0.84
0.93
1.08
1.08
1.08
1.29
ns, Max
Block RAM and FIFO Clock-to-Out Delays
TRCKO_DO and
TRCKO_DO_REG(1)
TRCKO_DO_ECC and
TRCKO_DO_ECC_REG
TRCKO_RDADDR_ECC and Clock CLK to RDADDR
TRCKO_RDADDR_ECC_REG output with ECC (without
output register)
Clock CLK to RDADDR
output with ECC (with
output register)
Setup and Hold Times Before/After Clock CLK
TRCCK_ADDRA/
TRCKC_ADDRA
ADDR inputs(8)
0.45/0.31
0.49/0.33
0.57/0.36
0.57/0.52
0.57/0.36
0.77/0.45 ns, Min
TRDCK_DI_WF_NC/
TRCKD_DI_WF_NC
Data input setup/hold time
when block RAM is
configured in
WRITE_FIRST or
NO_CHANGE mode(9)
0.58/0.60
0.65/0.63
0.74/0.67
0.74/0.67
0.74/0.67
0.92/0.76 ns, Min
TRDCK_DI_RF/
TRCKD_DI_RF
Data input setup/hold time
when block RAM is
configured in
READ_FIRST mode(9)
0.20/0.29
0.22/0.34
0.25/0.41
0.25/0.50
0.25/0.41
0.29/0.38 ns, Min
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 30: Block RAM and FIFO Switching Characteristics (Cont’d)
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-2LE
-3
-2/-2LE
-1
-1Q/-1M
-1LI
Units
TRDCK_DI_ECC/
TRCKD_DI_ECC
DIN inputs with block RAM
ECC in standard mode(9)
0.50/0.43
0.55/0.46
0.63/0.50
0.63/0.50
0.63/0.50
0.78/0.54 ns, Min
TRDCK_DI_ECCW/
TRCKD_DI_ECCW
DIN inputs with block RAM
ECC encode only(9)
0.93/0.43
1.02/0.46
1.17/0.50
1.17/0.50
1.17/0.50
1.38/0.48 ns, Min
TRDCK_DI_ECC_FIFO/
TRCKD_DI_ECC_FIFO
DIN inputs with FIFO ECC
in standard mode(9)
1.04/0.56
1.15/0.59
1.32/0.64
1.32/0.64
1.32/0.64
1.55/0.77 ns, Min
TRCCK_INJECTBITERR/
TRCKC_INJECTBITERR
Inject single/double bit
error in ECC mode
0.58/0.35
0.64/0.37
0.74/0.40
0.74/0.52
0.74/0.40
0.92/0.48 ns, Min
TRCCK_EN/TRCKC_EN
Block RAM enable (EN)
input
0.35/0.20
0.39/0.21
0.45/0.23
0.45/0.41
0.45/0.23
0.57/0.26 ns, Min
TRCCK_REGCE/
TRCKC_REGCE
CE input of output register 0.24/0.15
0.29/0.15
0.36/0.16
0.36/0.39
0.36/0.16
0.40/0.19 ns, Min
TRCCK_RSTREG/
TRCKC_RSTREG
Synchronous RSTREG
input
0.29/0.07
0.32/0.07
0.35/0.07
0.35/0.17
0.35/0.07
0.41/0.07 ns, Min
TRCCK_RSTRAM/
TRCKC_RSTRAM
Synchronous RSTRAM
input
0.32/0.42
0.34/0.43
0.36/0.46
0.36/0.57
0.36/0.46
0.40/0.47 ns, Min
TRCCK_WEA/
TRCKC_WEA
Write enable (WE) input
(block RAM only)
0.44/0.18
0.48/0.19
0.54/0.20
0.54/0.42
0.54/0.20
0.64/0.23 ns, Min
TRCCK_WREN/
TRCKC_WREN
WREN FIFO inputs
0.46/0.30
0.46/0.35
0.47/0.43
0.47/0.43
0.47/0.43
0.77/0.44 ns, Min
TRCCK_RDEN/
TRCKC_RDEN
RDEN FIFO inputs
0.42/0.30
0.43/0.35
0.43/0.43
0.43/0.62
0.43/0.43
0.71/0.50 ns, Min
TRCO_FLAGS
Reset RST to FIFO
flags/pointers(10)
0.90
0.98
1.10
1.10
1.10
TRREC_RST/
TRREM_RST
FIFO reset recovery and
removal timing(11)
Reset Delays
1.25
ns, Max
1.87/–0.81 2.07/–0.81 2.37/–0.81 2.37/–0.58 2.37/–0.81 2.44/–0.71 ns, Max
Maximum Frequency
FMAX_BRAM_WF_NC
Block RAM (write first and
no change modes) when
not in SDP RF mode
509.68
460.83
388.20
388.20
388.20
315.66
MHz
FMAX_BRAM_RF_
Block RAM (read first,
performance mode) when
in SDP RF mode but no
address overlap between
port A and port B
509.68
460.83
388.20
388.20
388.20
315.66
MHz
Block RAM (read first,
delayed write mode) when
in SDP RF mode and
there is possibility of
overlap between port A
and port B addresses
447.63
404.53
339.67
339.67
339.67
268.96
MHz
PERFORMANCE
FMAX_BRAM_RF_
DELAYED_WRITE
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 30: Block RAM and FIFO Switching Characteristics (Cont’d)
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
FMAX_CAS_WF_NC
Block RAM cascade (write
first, no change mode)
when cascade but not in
RF mode
467.07
418.59
345.78
345.78
345.78
273.30
MHz
FMAX_CAS_RF_
Block RAM cascade (read
first, performance mode)
when in cascade with RF
mode and no possibility of
address overlap/one port
is disabled
467.07
418.59
345.78
345.78
345.78
273.30
MHz
When in cascade RF
mode and there is a
possibility of address
overlap between port A
and port B
405.35
362.19
297.35
297.35
297.35
226.60
MHz
FMAX_FIFO
FIFO in all modes without
ECC
509.68
460.83
388.20
388.20
388.20
315.66
MHz
FMAX_ECC
Block RAM and FIFO in
ECC configuration
410.34
365.10
297.53
297.53
297.53
215.38
MHz
PERFORMANCE
FMAX_CAS_RF_
DELAYED_WRITE
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
The timing report shows all of these parameters as TRCKO_DO.
TRCKO_DOR includes TRCKO_DOW, TRCKO_DOPR, and TRCKO_DOPW as well as the B port equivalent timing parameters.
These parameters also apply to synchronous FIFO with DO_REG = 0.
TRCKO_DO includes TRCKO_DOP as well as the B port equivalent timing parameters.
These parameters also apply to multirate (asynchronous) and synchronous FIFO with DO_REG = 1.
TRCKO_FLAGS includes the following parameters: TRCKO_AEMPTY, TRCKO_AFULL, TRCKO_EMPTY, TRCKO_FULL, TRCKO_RDERR, TRCKO_WRERR.
TRCKO_POINTERS includes both TRCKO_RDCOUNT and TRCKO_WRCOUNT.
The ADDR setup and hold must be met when EN is asserted (even when WE is deasserted). Otherwise, block RAM data corruption is possible.
These parameters include both A and B inputs as well as the parity inputs of A and B.
TRCO_FLAGS includes the following flags: AEMPTY, AFULL, EMPTY, FULL, RDERR, WRERR, RDCOUNT, and WRCOUNT.
RDEN and WREN must be held Low prior to and during reset. The FIFO reset must be asserted for at least five positive clock edges of the
slowest clock (WRCLK or RDCLK).
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
DSP48E1 Switching Characteristics
Table 31: DSP48E1 Switching Characteristics
Speed Grade
Symbol
Description
1.0V
-3
0.95V
0.9V
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
Setup and Hold Times of Data/Control Pins to the Input Register Clock
TDSPDCK_A_AREG/
TDSPCKD_A_AREG
A input to A register CLK
0.26/
0.12
0.30/
0.13
0.37/
0.14
0.37/
0.28
0.37/
0.14
0.45/
0.14
ns
TDSPDCK_B_BREG/
TDSPCKD_B_BREG
B input to B register CLK
0.33/
0.15
0.38/
0.16
0.45/
0.18
0.45/
0.25
0.45/
0.18
0.60/
0.19
ns
TDSPDCK_C_CREG/
TDSPCKD_C_CREG
C input to C register CLK
0.17/
0.17
0.20/
0.19
0.24/
0.21
0.24/
0.26
0.24/
0.21
0.34/
0.29
ns
TDSPDCK_D_DREG/
TDSPCKD_D_DREG
D input to D register CLK
0.25/
0.25
0.32/
0.27
0.42/
0.27
0.42/
0.42
0.42/
0.27
0.54/
0.23
ns
TDSPDCK_ACIN_AREG/
TDSPCKD_ACIN_AREG
ACIN input to A register CLK
0.23/
0.12
0.27/
0.13
0.32/
0.14
0.32/
0.17
0.32/
0.14
0.36/
0.14
ns
TDSPDCK_BCIN_BREG/
TDSPCKD_BCIN_BREG
BCIN input to B register CLK
0.25/
0.15
0.29/
0.16
0.36/
0.18
0.36/
0.18
0.36/
0.18
0.41/
0.19
ns
Setup and Hold Times of Data Pins to the Pipeline Register Clock
TDSPDCK_{A, B}_MREG_MULT/
TDSPCKD_{A, B}_MREG_MULT
{A, B} input to M register CLK
using multiplier
2.40/
–0.01
2.76/
–0.01
3.29/
–0.01
3.29/
–0.01
3.29/
–0.01
4.31/
–0.07
ns
TDSPDCK_{A, D}_ADREG/
TDSPCKD_{A, D}_ADREG
{A, D} input to AD register CLK
1.29/
–0.02
1.48/
–0.02
1.76/
–0.02
1.76/
–0.02
1.76/
–0.02
2.29/
–0.27
ns
Setup and Hold Times of Data/Control Pins to the Output Register Clock
TDSPDCK_{A, B}_PREG_MULT/
TDSPCKD_{A, B} _PREG_MULT
{A, B} input to P register CLK
using multiplier
4.02/
–0.28
4.60/
–0.28
5.48/
–0.28
5.48/
–0.28
5.48/
–0.28
6.95/
–0.48
ns
TDSPDCK_D_PREG_MULT/
TDSPCKD_D_PREG_MULT
D input to P register CLK using
multiplier
3.93/
–0.73
4.50/
–0.73
5.35/
–0.73
5.35/
–0.73
5.35/
–0.73
6.73/
–1.68
ns
TDSPDCK_{A, B} _PREG/
TDSPCKD_{A, B} _PREG
A or B input to P register CLK
not using multiplier
1.73/
–0.28
1.98/
–0.28
2.35/
–0.28
2.35/
–0.28
2.35/
–0.28
2.80/
–0.48
ns
TDSPDCK_C_PREG/
TDSPCKD_C_PREG
C input to P register CLK not
using multiplier
1.54/
–0.26
1.76/
–0.26
2.10/
–0.26
2.10/
–0.26
2.10/
–0.26
2.54/
–0.45
ns
TDSPDCK_PCIN_PREG/
TDSPCKD_PCIN_PREG
PCIN input to P register CLK
1.32/
–0.15
1.51/
–0.15
1.80/
–0.15
1.80/
–0.15
1.80/
–0.15
2.13/
–0.25
ns
Setup and Hold Times of the CE Pins
TDSPDCK_{CEA;CEB}_{AREG;BREG}/
TDSPCKD_{CEA;CEB}_{AREG;BREG}
{CEA; CEB} input to {A; B}
register CLK
0.35/
0.06
0.42/
0.08
0.52/
0.11
0.52/
0.11
0.52/
0.11
0.64/
0.11
ns
TDSPDCK_CEC_CREG/
TDSPCKD_CEC_CREG
CEC input to C register CLK
0.28/
0.10
0.34/
0.11
0.42/
0.13
0.42/
0.13
0.42/
0.13
0.49/
0.16
ns
TDSPDCK_CED_DREG/
TDSPCKD_CED_DREG
CED input to D register CLK
0.36/
–0.03
0.43/
–0.03
0.52/
–0.03
0.52/
–0.03
0.52/
–0.03
0.68/
0.14
ns
TDSPDCK_CEM_MREG/
TDSPCKD_CEM_MREG
CEM input to M register CLK
0.17/
0.18
0.21/
0.20
0.27/
0.23
0.27/
0.23
0.27/
0.23
0.45/
0.29
ns
TDSPDCK_CEP_PREG/
TDSPCKD_CEP_PREG
CEP input to P register CLK
0.36/
0.01
0.43/
0.01
0.53/
0.01
0.53/
0.01
0.53/
0.01
0.63/
0.00
ns
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 31: DSP48E1 Switching Characteristics (Cont’d)
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
Setup and Hold Times of the RST Pins
TDSPDCK_{RSTA; RSTB}_{AREG; BREG}/
TDSPCKD_{RSTA; RSTB}_{AREG; BREG}
{RSTA, RSTB} input to {A, B}
register CLK
0.41/
0.11
0.46/
0.13
0.55/
0.15
0.55/
0.24
0.55/
0.15
0.63/
0.40
ns
TDSPDCK_RSTC_CREG/
TDSPCKD_RSTC_CREG
RSTC input to C register CLK
0.07/
0.10
0.08/
0.11
0.09/
0.12
0.09/
0.25
0.09/
0.12
0.13/
0.11
ns
TDSPDCK_RSTD_DREG/
TDSPCKD_RSTD_DREG
RSTD input to D register CLK
0.44/
0.07
0.50/
0.08
0.59/
0.09
0.59/
0.09
0.59/
0.09
0.67/
0.08
ns
TDSPDCK_RSTM_MREG/
TDSPCKD_RSTM_MREG
RSTM input to M register CLK
0.21/
0.22
0.23/
0.24
0.27/
0.28
0.27/
0.28
0.27/
0.28
0.28/
0.35
ns
TDSPDCK_RSTP_PREG/
TDSPCKD_RSTP_PREG
RSTP input to P register CLK
0.27/
0.01
0.30/
0.01
0.35/
0.01
0.35/
0.03
0.35/
0.01
0.43/
0.00
ns
Combinatorial Delays from Input Pins to Output Pins
TDSPDO_A_CARRYOUT_MULT
A input to CARRYOUT output
using multiplier
3.79
4.35
5.18
5.18
5.18
6.61
ns
TDSPDO_D_P_MULT
D input to P output using
multiplier
3.72
4.26
5.07
5.07
5.07
6.41
ns
TDSPDO_B_P
B input to P output not using
multiplier
1.53
1.75
2.08
2.08
2.08
2.48
ns
TDSPDO_C_P
C input to P output
1.33
1.53
1.82
1.82
1.82
2.22
ns
Combinatorial Delays from Input Pins to Cascading Output Pins
TDSPDO_{A; B}_{ACOUT; BCOUT}
{A, B} input to {ACOUT, BCOUT}
output
0.55
0.63
0.74
0.74
0.74
0.87
ns
TDSPDO_{A, B}_CARRYCASCOUT_MULT
{A, B} input to
CARRYCASCOUT output using
multiplier
4.06
4.65
5.54
5.54
5.54
7.03
ns
TDSPDO_D_CARRYCASCOUT_MULT
D input to CARRYCASCOUT
output using multiplier
3.97
4.54
5.40
5.40
5.40
6.81
ns
TDSPDO_{A, B}_CARRYCASCOUT
{A, B} input to
CARRYCASCOUT output not
using multiplier
1.77
2.03
2.41
2.41
2.41
2.88
ns
TDSPDO_C_CARRYCASCOUT
C input to CARRYCASCOUT
output
1.58
1.81
2.15
2.15
2.15
2.62
ns
Combinatorial Delays from Cascading Input Pins to All Output Pins
TDSPDO_ACIN_P_MULT
ACIN input to P output using
multiplier
3.65
4.19
5.00
5.00
5.00
6.40
ns
TDSPDO_ACIN_P
ACIN input to P output not using
multiplier
1.37
1.57
1.88
1.88
1.88
2.44
ns
TDSPDO_ACIN_ACOUT
ACIN input to ACOUT output
0.38
0.44
0.53
0.53
0.53
0.63
ns
TDSPDO_ACIN_CARRYCASCOUT_MULT
ACIN input to
CARRYCASCOUT output using
multiplier
3.90
4.47
5.33
5.33
5.33
6.79
ns
TDSPDO_ACIN_CARRYCASCOUT
ACIN input to
CARRYCASCOUT output not
using multiplier
1.61
1.85
2.21
2.21
2.21
2.84
ns
TDSPDO_PCIN_P
PCIN input to P output
1.11
1.28
1.52
1.52
1.52
1.82
ns
TDSPDO_PCIN_CARRYCASCOUT
PCIN input to
CARRYCASCOUT output
1.36
1.56
1.85
1.85
1.85
2.21
ns
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 31: DSP48E1 Switching Characteristics (Cont’d)
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
Clock to Outs from Output Register Clock to Output Pins
TDSPCKO_P_PREG
CLK PREG to P output
0.33
0.37
0.44
0.44
0.44
0.54
ns
TDSPCKO_CARRYCASCOUT_PREG
CLK PREG to
CARRYCASCOUT output
0.52
0.59
0.69
0.69
0.69
0.84
ns
Clock to Outs from Pipeline Register Clock to Output Pins
TDSPCKO_P_MREG
CLK MREG to P output
1.68
1.93
2.31
2.31
2.31
2.73
ns
TDSPCKO_CARRYCASCOUT_MREG
CLK MREG to
CARRYCASCOUT output
1.92
2.21
2.64
2.64
2.64
3.12
ns
TDSPCKO_P_ADREG_MULT
CLK ADREG to P output using
multiplier
2.72
3.10
3.69
3.69
3.69
4.60
ns
TDSPCKO_CARRYCASCOUT_ADREG_
CLK ADREG to
CARRYCASCOUT output using
multiplier
2.96
3.38
4.02
4.02
4.02
4.99
ns
MULT
Clock to Outs from Input Register Clock to Output Pins
TDSPCKO_P_AREG_MULT
CLK AREG to P output using
multiplier
3.94
4.51
5.37
5.37
5.37
6.84
ns
TDSPCKO_P_BREG
CLK BREG to P output not using
multiplier
1.64
1.87
2.22
2.22
2.22
2.65
ns
TDSPCKO_P_CREG
CLK CREG to P output not
using multiplier
1.69
1.93
2.30
2.30
2.30
2.81
ns
TDSPCKO_P_DREG_MULT
CLK DREG to P output using
multiplier
3.91
4.48
5.32
5.32
5.32
6.77
ns
CLK (ACOUT, BCOUT) to {A,B}
register output
0.64
0.73
0.87
0.87
0.87
1.02
ns
CLK (AREG, BREG) to
CARRYCASCOUT output using
multiplier
4.19
4.79
5.70
5.70
5.70
7.24
ns
TDSPCKO_CARRYCASCOUT_ BREG
CLK BREG to
CARRYCASCOUT output not
using multiplier
1.88
2.15
2.55
2.55
2.55
3.04
ns
TDSPCKO_CARRYCASCOUT_
CLK DREG to
CARRYCASCOUT output using
multiplier
4.16
4.76
5.65
5.65
5.65
7.17
ns
CLK CREG to
CARRYCASCOUT output
1.94
2.21
2.63
2.63
2.63
3.20
ns
Clock to Outs from Input Register Clock to Cascading Output Pins
TDSPCKO_{ACOUT; BCOUT}_{AREG;
BREG}
TDSPCKO_CARRYCASCOUT_{AREG,
BREG}_MULT
DREG_MULT
TDSPCKO_CARRYCASCOUT_ CREG
Maximum Frequency
FMAX
With all registers used
628.93 550.66 464.25
464.25
464.25 363.77
MHz
FMAX_PATDET
With pattern detector
531.63 465.77 392.93
392.93
392.93 310.08
MHz
FMAX_MULT_NOMREG
Two register multiply without
MREG
349.28 305.62 257.47
257.47
257.47 210.44
MHz
FMAX_MULT_NOMREG_PATDET
Two register multiply without
MREG with pattern detect
317.26 277.62 233.92
233.92
233.92 191.28
MHz
FMAX_PREADD_MULT_NOADREG
Without ADREG
397.30 346.26 290.44
290.44
290.44 223.26
MHz
FMAX_PREADD_MULT_NOADREG_
PATDET
Without ADREG with pattern
detect
397.30 346.26 290.44
290.44
290.44 223.26
MHz
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 31: DSP48E1 Switching Characteristics (Cont’d)
Speed Grade
Symbol
Description
1.0V
-3
-2/-2LE
-1
0.95V
0.9V
-1LI
-2LE
-1Q/-1M
Units
FMAX_NOPIPELINEREG
Without pipeline registers
(MREG, ADREG)
260.01 227.01 190.69
190.69
190.69 150.13
MHz
FMAX_NOPIPELINEREG_PATDET
Without pipeline registers
(MREG, ADREG) with pattern
detect
241.72 211.15 177.43
177.43
177.43 140.10
MHz
Clock Buffers and Networks
Table 32: Global Clock Switching Characteristics (Including BUFGCTRL)
Speed Grade
Symbol
Description
1.0V
-3
-2/-2LE
-1
-1Q/-1M
0.95V
0.9V
-1LI
-2LE
Units
TBCCCK_CE/
TBCCKC_CE(1)
CE pins setup/hold
0.12/0.39
0.13/0.40
0.16/0.41 0.16/0.83 0.16/0.41 0.31/0.67
ns
TBCCCK_S/
TBCCKC_S(1)
S pins setup/hold
0.12/0.39
0.13/0.40
0.16/0.41 0.16/0.83 0.16/0.41 0.31/0.67
ns
TBCCKO_O(2)
BUFGCTRL delay from I0/I1 to O
0.08
0.09
0.10
0.10
0.10
0.14
ns
628.00
628.00
464.00
464.00
464.00
394.00
MHz
Maximum Frequency
FMAX_BUFG
Global clock tree (BUFG)
Notes:
1.
2.
TBCCCK_CE and TBCCKC_CE must be satisfied to assure glitch-free operation of the global clock when switching between clocks. These
parameters do not apply to the BUFGMUX primitive that assures glitch-free operation. The other global clock setup and hold times are
optional; only needing to be satisfied if device operation requires simulation matches on a cycle-for-cycle basis when switching between
clocks.
TBGCKO_O (BUFG delay from I0 to O) values are the same as TBCCKO_O values.
Table 33: Input/Output Clock Switching Characteristics (BUFIO)
Speed Grade
Symbol
TBIOCKO_O
Description
Clock to out delay from I to O
1.0V
0.95V
0.9V
Units
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
1.11
1.26
1.54
1.54
1.54
1.56
ns
680.00
680.00
600.00
600.00
600.00
600.00
MHz
0.95V
0.9V
Units
Maximum Frequency
FMAX_BUFIO
I/O clock tree (BUFIO)
Table 34: Regional Clock Buffer Switching Characteristics (BUFR)
Speed Grade
Symbol
Description
1.0V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
TBRCKO_O
Clock to out delay from I to O
0.64
0.76
0.99
0.99
0.99
1.24
ns
TBRCKO_O_BYP
Clock to out delay from I to O with
Divide Bypass attribute set
0.34
0.39
0.52
0.52
0.52
0.72
ns
TBRDO_O
Propagation delay from CLR to O
0.81
0.85
1.09
1.09
1.09
0.96
ns
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 34: Regional Clock Buffer Switching Characteristics (BUFR) (Cont’d)
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
Units
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
420.00
375.00
315.00
315.00
315.00
315.00
MHz
0.95V
0.9V
Units
Maximum Frequency
FMAX_BUFR(1)
Regional clock tree (BUFR)
Notes:
1.
The maximum input frequency to the BUFR and BUFMR is the BUFIO FMAX frequency.
Table 35: Horizontal Clock Buffer Switching Characteristics (BUFH)
Speed Grade
Symbol
Description
TBHCKO_O
BUFH delay from I to O
TBHCCK_CE/
TBHCKC_CE
CE pin setup and hold
1.0V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
0.10
0.11
0.13
0.13
0.13
0.16
0.19/0.13 0.22/0.15 0.28/0.21 0.28/0.42 0.28/0.21 0.35/0.25
ns
ns
Maximum Frequency
FMAX_BUFH
Horizontal clock buffer (BUFH)
628.00
628.00
464.00
464.00
464.00
394.00
MHz
Table 36: Duty Cycle Distortion and Clock-Tree Skew
Speed Grade
Symbol
Description
Device
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
TDCD_CLK
Global clock tree duty-cycle
distortion(1)
All
0.20
0.20
0.20
N/A
0.20
0.25
ns
TCKSKEW
Global clock tree skew(2)
XC7A12T
0.26
0.26
0.26
N/A
0.26
0.33
ns
XC7A15T
0.26
0.26
0.26
N/A
0.26
0.33
ns
XC7A25T
0.26
0.26
0.26
N/A
0.26
0.33
ns
XC7A35T
0.26
0.26
0.26
N/A
0.26
0.33
ns
XC7A50T
0.26
0.26
0.26
N/A
0.26
0.33
ns
XC7A75T
0.27
0.33
0.36
N/A
0.36
0.48
ns
XC7A100T
0.27
0.33
0.36
N/A
0.36
0.48
ns
XC7A200T
0.40
0.48
0.54
N/A
0.54
0.69
ns
XA7A12T
N/A
0.26
0.26
0.26
N/A
N/A
ns
XA7A15T
N/A
0.26
0.26
0.26
N/A
N/A
ns
XA7A25T
N/A
0.26
0.26
0.26
N/A
N/A
ns
XA7A35T
N/A
0.26
0.26
0.26
N/A
N/A
ns
XA7A50T
N/A
0.26
0.26
0.26
N/A
N/A
ns
XA7A75T
N/A
0.33
0.36
0.36
N/A
N/A
ns
XA7A100T
N/A
0.33
0.36
0.36
N/A
N/A
ns
XQ7A50T
N/A
0.26
0.26
0.26
0.26
N/A
ns
XQ7A100T
N/A
0.33
0.36
0.36
0.36
N/A
ns
XQ7A200T
N/A
0.48
0.54
0.54
0.54
N/A
ns
0.14
0.14
0.14
0.14
0.14
0.14
ns
TDCD_BUFIO
I/O clock tree duty cycle distortion All
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 36: Duty Cycle Distortion and Clock-Tree Skew (Cont’d)
Speed Grade
Symbol
Description
Device
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1Q/-1M
-1LI
-2LE
Units
TBUFIOSKEW
I/O clock tree skew across one
clock region
All
0.03
0.03
0.03
0.03
0.03
0.03
ns
TDCD_BUFR
Regional clock tree duty cycle
distortion
All
0.18
0.18
0.18
0.18
0.18
0.18
ns
Notes:
1.
2.
These parameters represent the worst-case duty cycle distortion observable at the I/O flip flops. For all I/O standards, IBIS can be used to
calculate any additional duty cycle distortion that might be caused by asymmetrical rise/fall times.
The TCKSKEW value represents the worst-case clock-tree skew observable between sequential I/O elements. Significantly less clock-tree
skew exists for I/O registers that are close to each other and fed by the same or adjacent clock-tree branches. Use the Xilinx Timing Analyzer
tools to evaluate clock skew specific to your application.
MMCM Switching Characteristics
Table 37: MMCM Specification
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1LI
-2LE
Units
MMCM_FINMAX
Maximum input clock frequency
800.00
800.00
800.00
800.00
800.00
MHz
MMCM_FINMIN
Minimum input clock frequency
10.00
10.00
10.00
10.00
10.00
MHz
MMCM_FINJITTER
Maximum input clock period jitter
MMCM_FINDUTY
Allowable input duty cycle:
10—49 MHz
25
25
25
25
25
%
Allowable input duty cycle:
50—199 MHz
30
30
30
30
30
%
Allowable input duty cycle:
200—399 MHz
35
35
35
35
35
%
Allowable input duty cycle:
400—499 MHz
40
40
40
40
40
%
Allowable input duty cycle: > 500 MHz
45
45
45
45
45
%
< 20% of clock input period or 1 ns Max
MMCM_FMIN_PSCLK
Minimum dynamic phase-shift clock
frequency
0.01
0.01
0.01
0.01
0.01
MHz
MMCM_FMAX_PSCLK
Maximum dynamic phase-shift clock
frequency
550.00
500.00
450.00
450.00
450.00
MHz
MMCM_FVCOMIN
Minimum MMCM VCO frequency
600.00
600.00
600.00
600.00
600.00
MHz
MMCM_FVCOMAX
Maximum MMCM VCO frequency
1600.00
1440.00
1200.00
1200.00
1200.00
MHz
MMCM_FBANDWIDTH
Low MMCM bandwidth at typical(1)
1.00
1.00
1.00
1.00
1.00
MHz
High MMCM bandwidth at typical(1)
4.00
4.00
4.00
4.00
4.00
MHz
0.12
0.12
0.12
0.12
0.12
ns
MMCM_TSTATPHAOFFSET Static phase offset of the MMCM
outputs(2)
MMCM_TOUTJITTER
MMCM output jitter
MMCM_TOUTDUTY
MMCM output clock duty-cycle
precision(4)
MMCM_TLOCKMAX
Note 3
0.20
0.20
0.20
0.20
0.25
ns
MMCM maximum lock time
100.00
100.00
100.00
100.00
100.00
µs
MMCM_FOUTMAX
MMCM maximum output frequency
800.00
800.00
800.00
800.00
800.00
MHz
MMCM_FOUTMIN
MMCM minimum output frequency(5)(6)
4.69
4.69
4.69
4.69
4.69
MHz
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 37: MMCM Specification (Cont’d)
Speed Grade
Symbol
Description
1.0V
-3
MMCM_TEXTFDVAR
External clock feedback variation
MMCM_RSTMINPULSE
Minimum reset pulse width
MMCM_FPFDMAX
-2/-2LE
-1
0.95V
0.9V
-1LI
-2LE
Units
< 20% of clock input period or 1 ns Max
5.00
5.00
5.00
5.00
5.00
ns
Maximum frequency at the phase
frequency detector
550.00
500.00
450.00
450.00
450.00
MHz
MMCM_FPFDMIN
Minimum frequency at the phase
frequency detector
10.00
10.00
10.00
10.00
10.00
MHz
MMCM_TFBDELAY
Maximum delay in the feedback path
3 ns Max or one CLKIN cycle
MMCM Switching Characteristics Setup and Hold
TMMCMDCK_PSEN/
TMMCMCKD_PSEN
Setup and hold of phase-shift enable
1.04/0.00 1.04/0.00 1.04/0.00 1.04/0.00 1.04/0.00
ns
TMMCMDCK_PSINCDEC/
TMMCMCKD_PSINCDEC
Setup and hold of phase-shift
increment/decrement
1.04/0.00 1.04/0.00 1.04/0.00 1.04/0.00 1.04/0.00
ns
TMMCMCKO_PSDONE
Phase shift clock-to-out of PSDONE
0.59
0.68
0.81
0.81
0.78
ns
Dynamic Reconfiguration Port (DRP) for MMCM Before and After DCLK
TMMCMDCK_DADDR/
TMMCMCKD_DADDR
DADDR setup/hold
1.25/0.15 1.40/0.15 1.63/0.15 1.63/0.15 1.43/0.00
ns, Min
TMMCMDCK_DI/
TMMCMCKD_DI
DI setup/hold
1.25/0.15 1.40/0.15 1.63/0.15 1.63/0.15 1.43/0.00
ns, Min
TMMCMDCK_DEN/
TMMCMCKD_DEN
DEN setup/hold
1.76/0.00 1.97/0.00 2.29/0.00 2.29/0.00 2.40/0.00
ns, Min
TMMCMDCK_DWE/
TMMCMCKD_DWE
DWE setup/hold
1.25/0.15 1.40/0.15 1.63/0.15 1.63/0.15 1.43/0.00
ns, Min
TMMCMCKO_DRDY
CLK to out of DRDY
FDCK
DCLK frequency
0.65
0.72
0.99
0.99
0.99
ns, Max
200.00
200.00
200.00
200.00
100.00
MHz, Max
Notes:
1.
2.
3.
4.
5.
6.
The MMCM does not filter typical spread-spectrum input clocks because they are usually far below the bandwidth filter frequencies.
The static offset is measured between any MMCM outputs with identical phase.
Values for this parameter are available in the Clocking Wizard.
See http://www.xilinx.com/products/intellectual-property/clocking_wizard.htm.
Includes global clock buffer.
Calculated as FVCO/128 assuming output duty cycle is 50%.
When CLKOUT4_CASCADE = TRUE, MMCM_FOUTMIN is 0.036 MHz.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
PLL Switching Characteristics
Table 38: PLL Specification
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1LI
-2LE
Units
PLL_FINMAX
Maximum input clock frequency
800.00
800.00
800.00
800.00
800.00
MHz
PLL_FINMIN
Minimum input clock frequency
19.00
19.00
19.00
19.00
19.00
MHz
PLL_FINJITTER
Maximum input clock period jitter
PLL_FINDUTY
Allowable input duty cycle: 19—49 MHz
25
25
25
25
25
%
Allowable input duty cycle: 50—199 MHz
30
30
30
30
30
%
Allowable input duty cycle: 200—399 MHz
35
35
35
35
35
%
Allowable input duty cycle: 400—499 MHz
40
40
40
40
40
%
Allowable input duty cycle: >500 MHz
45
45
45
45
45
%
< 20% of clock input period or 1 ns Max
PLL_FVCOMIN
Minimum PLL VCO frequency
800.00
800.00
800.00
800.00
800.00
MHz
PLL_FVCOMAX
Maximum PLL VCO frequency
PLL_FBANDWIDTH
2133.00
1866.00
1600.00
1600.00
1600.00
MHz
Low PLL bandwidth at
typical(1)
1.00
1.00
1.00
1.00
1.00
MHz
High PLL bandwidth at
typical(1)
4.00
4.00
4.00
4.00
4.00
MHz
0.12
0.12
0.12
0.12
0.12
ns
PLL_TSTATPHAOFFSET
Static phase offset of the PLL
PLL_TOUTJITTER
PLL output jitter
outputs(2)
Note 3
PLL_TOUTDUTY
PLL output clock duty-cycle
PLL_TLOCKMAX
PLL_FOUTMAX
precision(4)
0.20
0.20
0.20
0.20
0.25
ns
PLL maximum lock time
100.00
100.00
100.00
100.00
100.00
µs
PLL maximum output frequency
800.00
800.00
800.00
800.00
800.00
MHz
6.25
6.25
6.25
6.25
6.25
MHz
frequency(5)
PLL_FOUTMIN
PLL minimum output
PLL_TEXTFDVAR
External clock feedback variation
PLL_RSTMINPULSE
Minimum reset pulse width
PLL_FPFDMAX
< 20% of clock input period or 1 ns Max
5.00
5.00
5.00
5.00
5.00
ns
Maximum frequency at the phase
frequency detector
550.00
500.00
450.00
450.00
450.00
MHz
PLL_FPFDMIN
Minimum frequency at the phase
frequency detector
19.00
19.00
19.00
19.00
19.00
MHz
PLL_TFBDELAY
Maximum delay in the feedback path
3 ns Max or one CLKIN cycle
Dynamic Reconfiguration Port (DRP) for PLL Before and After DCLK
TPLLDCK_DADDR/
TPLLCKD_DADDR
Setup and hold of D address
1.25/0.15 1.40/0.15 1.63/0.15 1.63/0.15 1.43/0.00
ns, Min
TPLLDCK_DI/
TPLLCKD_DI
Setup and hold of D input
1.25/0.15 1.40/0.15 1.63/0.15 1.63/0.15 1.43/0.00
ns, Min
TPLLDCK_DEN/
TPLLCKD_DEN
Setup and hold of D enable
1.76/0.00 1.97/0.00 2.29/0.00 2.29/0.00 2.40/0.00
ns, Min
TPLLDCK_DWE/
TPLLCKD_DWE
Setup and hold of D write enable
1.25/0.15 1.40/0.15 1.63/0.15 1.63/0.15 1.43/0.00
ns, Min
TPLLCKO_DRDY
CLK to out of DRDY
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0.72
0.99
0.99
0.99
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40
Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 38: PLL Specification (Cont’d)
Speed Grade
Symbol
FDCK
Description
1.0V
DCLK frequency
0.95V
0.9V
-3
-2/-2LE
-1
-1LI
-2LE
200.00
200.00
200.00
200.00
100.00
Units
MHz, Max
Notes:
1.
2.
3.
4.
5.
The PLL does not filter typical spread-spectrum input clocks because they are usually far below the bandwidth filter frequencies.
The static offset is measured between any PLL outputs with identical phase.
Values for this parameter are available in the Clocking Wizard.
See http://www.xilinx.com/products/intellectual-property/clocking_wizard.htm.
Includes global clock buffer.
Calculated as FVCO/128 assuming output duty cycle is 50%.
Device Pin‐to‐Pin Output Parameter Guidelines
Table 39: Clock-Capable Clock Input to Output Delay Without MMCM/PLL (Near Clock Region)(1)
Speed Grade
Symbol
Description
Device
1.0V
-3
-2/-2LE
-1
-1M/-1Q
0.95V
0.9V
-1LI
-2LE
Units
SSTL15 Clock-Capable Clock Input to Output Delay using Output Flip-Flop, Fast Slew Rate, without MMCM/PLL.
TICKOF
Clock-capable clock input and OUTFF at XC7A12T
pins/banks closest to the BUFGs without
XC7A15T
MMCM/PLL (near clock region)(2)
XC7A25T
4.97
5.55
6.44
N/A
6.44
7.38
ns
5.10
5.70
6.61
N/A
6.61
7.56
ns
4.97
5.55
6.44
N/A
6.44
7.38
ns
XC7A35T
5.10
5.70
6.61
N/A
6.61
7.56
ns
XC7A50T
5.10
5.70
6.61
N/A
6.61
7.56
ns
XC7A75T
5.14
5.74
6.72
N/A
6.72
7.62
ns
XC7A100T
5.14
5.74
6.72
N/A
6.72
7.62
ns
XC7A200T
5.47
6.11
7.16
N/A
7.16
8.08
ns
XA7A12T
N/A
5.55
6.44
6.44
N/A
N/A
ns
XA7A15T
N/A
5.70
6.61
6.61
N/A
N/A
ns
XA7A25T
N/A
5.55
6.44
6.44
N/A
N/A
ns
XA7A35T
N/A
5.70
6.61
6.61
N/A
N/A
ns
XA7A50T
N/A
5.70
6.61
6.61
N/A
N/A
ns
XA7A75T
N/A
5.74
6.72
6.72
N/A
N/A
ns
XA7A100T
N/A
5.74
6.72
6.72
N/A
N/A
ns
XQ7A50T
N/A
5.70
6.61
6.61
6.61
N/A
ns
XQ7A100T
N/A
5.74
6.72
6.72
6.72
N/A
ns
XQ7A200T
N/A
6.11
7.16
7.16
7.16
N/A
ns
Notes:
1.
2.
Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and where all
accessible IOB and CLB flip-flops are clocked by the global clock net.
Refer to the Die Level Bank Numbering Overview section of 7 Series FPGA Packaging and Pinout Specification (UG475).
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 40: Clock-Capable Clock Input to Output Delay Without MMCM/PLL (Far Clock Region)(1)
Speed Grade
Symbol
Description
Device
1.0V
-3
-2/-2LE
-1
-1M/-1Q
0.95V
0.9V
-1LI
-2LE
Units
SSTL15 Clock-Capable Clock Input to Output Delay using Output Flip-Flop, Fast Slew Rate, without MMCM/PLL.
TICKOFFAR
Clock-capable clock input and OUTFF XC7A12T
at pins/banks farthest from the BUFGs
without MMCM/PLL (far clock region)(2) XC7A15T
XC7A25T
4.97
5.55
6.44
N/A
6.44
7.38
ns
5.10
5.70
6.61
N/A
6.61
7.57
ns
4.97
5.55
6.44
N/A
6.44
7.38
ns
XC7A35T
5.10
5.70
6.61
N/A
6.61
7.57
ns
XC7A50T
5.10
5.70
6.61
N/A
6.61
7.57
ns
XC7A75T
5.38
6.01
7.02
N/A
7.02
7.94
ns
XC7A100T
5.38
6.01
7.02
N/A
7.02
7.94
ns
XC7A200T
6.17
6.89
8.05
N/A
8.05
9.03
ns
XA7A12T
N/A
5.55
6.44
6.44
N/A
N/A
ns
XA7A15T
N/A
5.70
6.61
6.61
N/A
N/A
ns
XA7A25T
N/A
5.55
6.44
6.44
N/A
N/A
ns
XA7A35T
N/A
5.70
6.61
6.61
N/A
N/A
ns
XA7A50T
N/A
5.70
6.61
6.61
N/A
N/A
ns
XA7A75T
N/A
6.01
7.02
7.02
N/A
N/A
ns
XA7A100T
N/A
6.01
7.02
7.02
N/A
N/A
ns
XQ7A50T
N/A
5.70
6.61
6.61
6.61
N/A
ns
XQ7A100T
N/A
6.01
7.02
7.02
7.02
N/A
ns
XQ7A200T
N/A
6.89
8.05
8.05
8.05
N/A
ns
Notes:
1.
2.
Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and where all
accessible IOB and CLB flip-flops are clocked by the global clock net.
Refer to the Die Level Bank Numbering Overview section of 7 Series FPGA Packaging and Pinout Specification (UG475).
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 41: Clock-Capable Clock Input to Output Delay With MMCM
Speed Grade
Symbol
Description
Device
1.0V
-3
-2/-2LE
-1
-1M/-1Q
0.95V
0.9V
-1LI
-2LE
Units
SSTL15 Clock-Capable Clock Input to Output Delay using Output Flip-Flop, Fast Slew Rate, with MMCM.
TICKOFMMCMCC
Clock-capable clock input and
OUTFF with MMCM
XC7A12T
1.00
1.00
1.00
N/A
1.00
1.78
ns
XC7A15T
1.00
1.00
1.00
N/A
1.00
1.78
ns
XC7A25T
1.00
1.00
1.00
N/A
1.00
1.78
ns
XC7A35T
1.00
1.00
1.00
N/A
1.00
1.78
ns
XC7A50T
1.00
1.00
1.00
N/A
1.00
1.78
ns
XC7A75T
1.00
1.00
1.00
N/A
1.00
1.79
ns
XC7A100T
1.00
1.00
1.00
N/A
1.00
1.79
ns
XC7A200T
1.01
1.02
1.04
N/A
1.04
1.84
ns
XA7A12T
N/A
1.00
1.00
1.00
N/A
N/A
ns
XA7A15T
N/A
1.00
1.00
1.00
N/A
N/A
ns
XA7A25T
N/A
1.00
1.00
1.00
N/A
N/A
ns
XA7A35T
N/A
1.00
1.00
1.00
N/A
N/A
ns
XA7A50T
N/A
1.00
1.00
1.00
N/A
N/A
ns
XA7A75T
N/A
1.00
1.00
1.00
N/A
N/A
ns
XA7A100T
N/A
1.00
1.00
1.00
N/A
N/A
ns
XQ7A50T
N/A
1.00
1.00
1.00
1.00
N/A
ns
XQ7A100T
N/A
1.00
1.00
1.00
1.00
N/A
ns
XQ7A200T
N/A
1.02
1.04
1.04
1.04
N/A
ns
Notes:
1.
2.
Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and where all
accessible IOB and CLB flip-flops are clocked by the global clock net.
MMCM output jitter is already included in the timing calculation.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 42: Clock-Capable Clock Input to Output Delay With PLL
Speed Grade
Symbol
Description
Device
1.0V
-3
-2/-2LE
-1
-1M/-1Q
0.95V
0.9V
-1LI
-2LE
Units
SSTL15 Clock-Capable Clock Input to Output Delay using Output Flip-Flop, Fast Slew Rate, with PLL.
TICKOFPLLCC
Clock-capable clock input and
OUTFF with PLL
XC7A12T
0.83
0.83
0.83
N/A
0.83
1.38
ns
XC7A15T
0.82
0.82
0.82
N/A
0.82
1.39
ns
XC7A25T
0.83
0.83
0.83
N/A
0.83
1.38
ns
XC7A35T
0.82
0.82
0.82
N/A
0.82
1.39
ns
XC7A50T
0.82
0.82
0.82
N/A
0.82
1.39
ns
XC7A75T
0.82
0.82
0.82
N/A
0.82
1.40
ns
XC7A100T
0.82
0.82
0.82
N/A
0.82
1.40
ns
XC7A200T
0.81
0.81
0.81
N/A
0.81
1.45
ns
XA7A12T
N/A
0.83
0.83
0.83
N/A
N/A
ns
XA7A15T
N/A
0.82
0.82
0.82
N/A
N/A
ns
XA7A25T
N/A
0.83
0.83
0.83
N/A
N/A
ns
XA7A35T
N/A
0.82
0.82
0.82
N/A
N/A
ns
XA7A50T
N/A
0.82
0.82
0.82
N/A
N/A
ns
XA7A75T
N/A
0.82
0.82
0.82
N/A
N/A
ns
XA7A100T
N/A
0.82
0.82
0.82
N/A
N/A
ns
XQ7A50T
N/A
0.82
0.82
0.82
0.82
N/A
ns
XQ7A100T
N/A
0.82
0.82
0.82
0.82
N/A
ns
XQ7A200T
N/A
0.81
0.81
0.81
0.81
N/A
ns
Notes:
1.
2.
Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and where all
accessible IOB and CLB flip-flops are clocked by the global clock net.
PLL output jitter is already included in the timing calculation.
Table 43: Pin-to-Pin, Clock-to-Out using BUFIO
Speed Grade
Symbol
Description
1.0V
-3
-2/-2LE
-1
-1M/-1Q
0.95V
0.9V
-1LI
-2LE
6.64
7.32
Units
SSTL15 Clock-Capable Clock Input to Output Delay using Output Flip-Flop, Fast Slew Rate, with BUFIO.
TICKOFCS
Clock to out of I/O clock
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6.64
6.64
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44
Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Device Pin‐to‐Pin Input Parameter Guidelines
All devices are 100% functionally tested. Values are expressed in nanoseconds unless otherwise noted.
Table 44: Global Clock Input Setup and Hold Without MMCM/PLL with ZHOLD_DELAY on HR I/O Banks
Speed Grade
Symbol
Description
Device
1.0V
-3
-2/-2LE
Input Setup and Hold Time Relative to Global Clock Input Signal for SSTL15
TPSFD/
TPHFD
Full delay (legacy delay
or default delay)
global clock input and
IFF(2) without
MMCM/PLL with
ZHOLD_DELAY on HR
I/O banks
-1
-1M/-1Q
0.95V
0.9V
-1LI
-2LE
Units
Standard.(1)
XC7A12T
2.49/–0.37 2.67/–0.37 3.12/–0.37
N/A
3.12/–0.37 5.13/–0.54
ns
XC7A15T
2.47/–0.29 2.65/–0.29 3.10/–0.29
N/A
3.10/–0.29 5.10/–0.44
ns
XC7A25T
2.49/–0.37 2.67/–0.37 3.12/–0.37
N/A
3.12/–0.37 5.13/–0.54
ns
XC7A35T
2.47/–0.29 2.65/–0.29 3.10/–0.29
N/A
3.10/–0.29 5.10/–0.44
ns
XC7A50T
2.47/–0.29 2.65/–0.29 3.10/–0.29
N/A
3.10/–0.29 5.10/–0.44
ns
XC7A75T
2.69/–0.34 2.89/–0.34 3.34/–0.34
N/A
3.34/–0.34 5.66/–0.51
ns
XC7A100T
2.69/–0.34 2.89/–0.34 3.34/–0.34
N/A
3.34/–0.34 5.66/–0.51
ns
XC7A200T
3.03/–0.36 3.27/–0.36 3.79/–0.36
N/A
3.79/–0.36 6.66/–0.55
ns
XA7A12T
N/A
2.67/–0.37 3.12/–0.37 3.12/–0.37
N/A
N/A
ns
XA7A15T
N/A
2.65/–0.29 3.10/–0.29 3.10/–0.29
N/A
N/A
ns
XA7A25T
N/A
2.67/–0.37 3.12/–0.37 3.12/–0.37
N/A
N/A
ns
XA7A35T
N/A
2.65/–0.29 3.10/–0.29 3.10/–0.29
N/A
N/A
ns
XA7A50T
N/A
2.65/–0.29 3.10/–0.29 3.10/–0.29
N/A
N/A
ns
XA7A75T
N/A
2.89/–0.34 3.34/–0.34 3.34/–0.34
N/A
N/A
ns
XA7A100T
N/A
2.89/–0.34 3.34/–0.34 3.34/–0.34
N/A
N/A
ns
XQ7A50T
N/A
2.65/–0.29 3.10/–0.29 3.10/–0.29 3.10/–0.29
N/A
ns
XQ7A100T
N/A
2.89/–0.34 3.34/–0.34 3.34/–0.34 3.34/–0.34
N/A
ns
XQ7A200T
N/A
3.27/–0.36 3.79/–0.36 3.79/–0.36 3.79/–0.36
N/A
ns
Notes:
1.
2.
Setup and hold times are measured over worst case conditions (process, voltage, temperature). Setup time is measured relative to the global
clock input signal using the slowest process, highest temperature, and lowest voltage. Hold time is measured relative to the global clock input
signal using the fastest process, lowest temperature, and highest voltage.
IFF = Input flip-flop or latch.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 45: Clock-Capable Clock Input Setup and Hold With MMCM
Speed Grade
Symbol
Description
Device
1.0V
-3
-2/-2LE
Input Setup and Hold Time Relative to Global Clock Input Signal for SSTL15
TPSMMCMCC/
TPHMMCMCC
No delay clockcapable clock input
and IFF(2) with
MMCM
-1
-1M/-1Q
0.95V
0.9V
-1LI
-2LE
Units
Standard.(1)
XC7A12T
2.37/–0.61 2.69/–0.61 3.21/–0.61
N/A
3.21/–0.61 2.00/–0.47
ns
XC7A15T
2.46/–0.62 2.80/–0.62 3.35/–0.62
N/A
3.35/–0.62 2.14/–0.48
ns
XC7A25T
2.37/–0.61 2.69/–0.61 3.21/–0.61
N/A
3.21/–0.61 2.00/–0.47
ns
XC7A35T
2.46/–0.62 2.80/–0.62 3.35/–0.62
N/A
3.35/–0.62 2.14/–0.48
ns
XC7A50T
2.46/–0.62 2.80/–0.62 3.35/–0.62
N/A
3.35/–0.62 2.14/–0.48
ns
XC7A75T
2.47/–0.62 2.81/–0.62 3.36/–0.62
N/A
3.36/–0.62 2.15/–0.48
ns
XC7A100T
2.47/–0.62 2.81/–0.62 3.36/–0.62
N/A
3.36/–0.62 2.15/–0.48
ns
XC7A200T
2.59/–0.63 2.95/–0.63 3.52/–0.63
N/A
3.52/–0.63 2.32/–0.51
ns
XA7A12T
N/A
2.69/–0.61 3.21/–0.61 3.21/–0.61
N/A
N/A
ns
XA7A15T
N/A
2.80/–0.62 3.35/–0.62 3.35/–0.62
N/A
N/A
ns
XA7A25T
N/A
2.69/–0.61 3.21/–0.61 3.21/–0.61
N/A
N/A
ns
XA7A35T
N/A
2.80/–0.62 3.35/–0.62 3.35/–0.62
N/A
N/A
ns
XA7A50T
N/A
2.80/–0.62 3.35/–0.62 3.35/–0.62
N/A
N/A
ns
XA7A75T
N/A
2.81/–0.62 3.36/–0.62 3.36/–0.62
N/A
N/A
ns
XA7A100T
N/A
2.81/–0.62 3.36/–0.62 3.36/–0.62
N/A
N/A
ns
XQ7A50T
N/A
2.80/–0.62 3.35/–0.62 3.35/–0.62 3.35/–0.62
N/A
ns
XQ7A100T
N/A
2.81/–0.62 3.36/–0.62 3.36/–0.62 3.36/–0.62
N/A
ns
XQ7A200T
N/A
2.95/–0.63 3.52/–0.63 3.52/–0.63 3.52/–0.63
N/A
ns
Notes:
1.
2.
3.
Setup and hold times are measured over worst case conditions (process, voltage, temperature). Setup time is measured relative to the
global clock input signal using the slowest process, highest temperature, and lowest voltage. Hold time is measured relative to the global
clock input signal using the fastest process, lowest temperature, and highest voltage.
IFF = Input flip-flop or latch
Use IBIS to determine any duty-cycle distortion incurred using various standards.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 46: Clock-Capable Clock Input Setup and Hold With PLL
Speed Grade
Symbol
Description
Device
1.0V
-3
-2/-2LE
-1
Input Setup and Hold Time Relative to Clock-Capable Clock Input Signal for SSTL15
TPSPLLCC/
TPHPLLCC
-1M/-1Q
0.95V
0.9V
-1LI
-2LE
Units
Standard.(1)
No delay clock-capable XC7A12T
clock input and IFF(2)
XC7A15T
with PLL
XC7A25T
2.68/–0.19 3.04/–0.19 3.64/–0.19
N/A
3.64/–0.19 2.32/–0.57
ns
2.77/–0.20 3.15/–0.20 3.77/–0.20
N/A
3.77/–0.20 2.46/–0.59
ns
2.68/–0.19 3.04/–0.19 3.64/–0.19
N/A
3.64/–0.19 2.32/–0.57
ns
XC7A35T
2.77/–0.20 3.15/–0.20 3.77/–0.20
N/A
3.77/–0.20 2.46/–0.59
ns
XC7A50T
2.77/–0.20 3.15/–0.20 3.77/–0.20
N/A
3.77/–0.20 2.46/–0.59
ns
XC7A75T
2.78/–0.20 3.15/–0.20 3.78/–0.20
N/A
3.78/–0.20 2.47/–0.59
ns
XC7A100T
2.78/–0.20 3.15/–0.20 3.78/–0.20
N/A
3.78/–0.20 2.47/–0.59
ns
XC7A200T
2.91/–0.21 3.29/–0.21 3.94/–0.21
N/A
3.94/–0.21 2.64/–0.62
ns
XA7A12T
N/A
3.04/–0.19 3.64/–0.19 3.64/–0.19
N/A
N/A
ns
XA7A15T
N/A
3.15/–0.20 3.77/–0.20 3.77/–0.20
N/A
N/A
ns
XA7A25T
N/A
3.04/–0.19 3.64/–0.19 3.64/–0.19
N/A
N/A
ns
XA7A35T
N/A
3.15/–0.20 3.77/–0.20 3.77/–0.20
N/A
N/A
ns
XA7A50T
N/A
3.15/–0.20 3.77/–0.20 3.77/–0.20
N/A
N/A
ns
XA7A75T
N/A
3.15/–0.20 3.78/–0.20 3.78/–0.20
N/A
N/A
ns
XA7A100T
N/A
3.15/–0.20 3.78/–0.20 3.78/–0.20
N/A
N/A
ns
XQ7A50T
N/A
3.15/–0.20 3.77/–0.20 3.77/–0.20 3.77/–0.20
N/A
ns
XQ7A100T
N/A
3.15/–0.20 3.78/–0.20 3.78/–0.20 3.78/–0.20
N/A
ns
XQ7A200T
N/A
3.29/–0.21 3.94/–0.21 3.94/–0.21 3.94/–0.21
N/A
ns
Notes:
1.
2.
3.
Setup and hold times are measured over worst case conditions (process, voltage, temperature). Setup time is measured relative to the
global clock input signal using the slowest process, highest temperature, and lowest voltage. Hold time is measured relative to the global
clock input signal using the fastest process, lowest temperature, and highest voltage.
IFF = Input flip-flop or latch
Use IBIS to determine any duty-cycle distortion incurred using various standards.
Table 47: Data Input Setup and Hold Times Relative to a Forwarded Clock Input Pin Using BUFIO
Speed Grade
Symbol
Description
1.0V
-3
-2/-2LE
-1
-1M/-1Q
0.95V
0.9V
-1LI
-2LE
Units
Input Setup and Hold Time Relative to a Forwarded Clock Input Pin Using BUFIO for SSTL15 Standard.
TPSCS/TPHCS
Setup and hold of I/O clock
–0.38/1.31 –0.38/1.46 –0.38/1.76 –0.38/1.76 –0.38/1.76 –0.16/1.89
ns
Table 48: Sample Window
Speed Grade
Symbol
TSAMP
Description
Sampling error at receiver pins(1)
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1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1M/-1Q
-1LI
-2LE
0.59
0.64
0.70
0.70
0.70
0.70
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47
Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 48: Sample Window (Cont’d)
Speed Grade
Symbol
TSAMP_BUFIO
Description
1.0V
Sampling error at receiver pins using
BUFIO(2)
0.95V
0.9V
-3
-2/-2LE
-1
-1M/-1Q
-1LI
-2LE
0.35
0.40
0.46
0.46
0.46
0.46
Units
ns
Notes:
1.
2.
This parameter indicates the total sampling error of the Artix-7 FPGAs DDR input registers, measured across voltage, temperature, and
process. The characterization methodology uses the MMCM to capture the DDR input registers’ edges of operation. These measurements
include:
- CLK0 MMCM jitter
- MMCM accuracy (phase offset)
- MMCM phase shift resolution
These measurements do not include package or clock tree skew.
This parameter indicates the total sampling error of the Artix-7 FPGAs DDR input registers, measured across voltage, temperature, and
process. The characterization methodology uses the BUFIO clock network and IDELAY to capture the DDR input registers’ edges of
operation. These measurements do not include package or clock tree skew.
Additional Package Parameter Guidelines
The parameters in this section provide the necessary values for calculating timing budgets for Artix-7 FPGA clock transmitter
and receiver data-valid windows.
Table 49: Package Skew
Symbol
TPKGSKEW
Description
Package
skew(1)
Device
XC7A12T
XC7A15T
XC7A25T
XC7A35T
XC7A50T
XC7A75T
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Package
Value
Units
CPG238
55
ps
CSG325
76
ps
CPG236
48
ps
CSG324
104
ps
CSG325
142
ps
FTG256
98
ps
FGG484
97
ps
CPG238
55
ps
CSG325
76
ps
CPG236
48
ps
CSG324
104
ps
CSG325
142
ps
FTG256
98
ps
FGG484
97
ps
CPG236
48
ps
CSG324
104
ps
CSG325
142
ps
FTG256
98
ps
FGG484
97
ps
CSG324
113
ps
FTG256
120
ps
FGG484
144
ps
FGG676
153
ps
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 49: Package Skew (Cont’d)
Symbol
TPKGSKEW
Description
Package skew(1)
Device
XC7A100T
XC7A200T
XA7A12T
XA7A15T
XA7A25T
XA7A35T
XA7A50T
XA7A75T
XA7A100T
XQ7A50T
XQ7A100T
XQ7A200T
Package
Value
Units
CSG324
113
ps
FTG256
120
ps
FGG484
144
ps
FGG676
153
ps
SBG484
111
ps
FBG484
109
ps
FBG676
121
ps
FFG1156
151
ps
CSG325
76
ps
CPG238
55
ps
CPG236
48
ps
CSG324
104
ps
CSG325
142
ps
CSG325
76
ps
CPG238
55
ps
CPG236
48
ps
CSG324
104
ps
CSG325
142
ps
CPG236
48
ps
CSG324
104
ps
CSG325
142
ps
CSG324
113
ps
FGG484
144
ps
CSG324
113
ps
FGG484
144
ps
CS325
142
ps
FG484
97
ps
CS324
113
ps
FG484
144
ps
RS484
111
ps
RB484
109
ps
RB676
121
ps
Notes:
1.
2.
These values represent the worst-case skew between any two SelectIO resources in the package: shortest delay to longest delay from die
pad to ball.
Package delay information is available for these device/package combinations. This information can be used to deskew the package.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
GTP Transceiver Specifications
GTP Transceiver DC Input and Output Levels
Table 50 summarizes the DC output specifications of the GTP transceivers in Artix-7 FPGAs. Consult 7 Series FPGAs GTP
Transceiver User Guide (UG482) for further details.
Table 50: GTP Transceiver DC Specifications
Symbol
DC Parameter
Conditions
DVPPOUT
Differential peak-to-peak output Transmitter output swing is set to
voltage (1)
maximum setting
VCMOUTDC
DC common mode output
voltage
ROUT
Differential output resistance
VCMOUTAC
Common mode output voltage: AC coupled
TOSKEW
Min
Typ
Max
Units
1000
–
–
mV
Equation based
VMGTAVTT – DVPPOUT/4
–
mV
100
–
1/2 VMGTAVTT
mV
Transmitter output pair (TXP and TXN) intra-pair skew
(FF, FB, SB packages)
–
–
10
ps
Transmitter output pair (TXP and TXN) intra-pair skew
(FG, FT, CS, CP packages)
–
–
12
ps
DVPPIN
Differential peak-to-peak input
voltage
External AC coupled
150
–
2000
mV
VIN
Single-ended input voltage(2)
DC coupled VMGTAVTT = 1.2V
–200
–
VMGTAVTT
mV
VCMIN
Common mode input voltage
DC coupled VMGTAVTT = 1.2V
–
2/3 VMGTAVTT
–
mV
RIN
Differential input resistance
–
100
–
CEXT
Recommended external AC coupling capacitor(3)
–
100
–
nF
Notes:
1.
2.
3.
The output swing and preemphasis levels are programmable using the attributes discussed in 7 Series FPGAs GTP Transceiver User Guide
(UG482) and can result in values lower than reported in this table.
Voltage measured at the pin referenced to ground.
Other values can be used as appropriate to conform to specific protocols and standards.
X-Ref Target - Figure 3
+V
P
Single-Ended
Peak-to-Peak
Voltage
N
0
ds181_01_062014
Figure 3: Single-Ended Peak-to-Peak Voltage
X-Ref Target - Figure 4
+V
Differential
Peak-to-Peak
Voltage
0
–V
P–N
ds181_02_062014
Figure 4: Differential Peak-to-Peak Voltage
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50
Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Note: In Figure 4, differential peak-to-peak voltage = single-ended peak-to-peak voltage x 2.
Table 51 summarizes the DC specifications of the clock input of the GTP transceiver. Consult 7 Series FPGAs GTP Transceiver
User Guide (UG482) for further details.
Table 51: GTP Transceiver Clock DC Input Level Specification
Symbol
DC Parameter
Min
Typ
Max
Units
350
–
2000
mV
VIDIFF
Differential peak-to-peak input voltage
RIN
Differential input resistance
–
100
–
CEXT
Required external AC coupling capacitor
–
100
–
nF
GTP Transceiver Switching Characteristics
Consult 7 Series FPGAs GTP Transceiver User Guide (UG482) for further information.
Table 52: GTP Transceiver Performance
Speed Grade
-2 (1.0V)
-2LE (1.0V)
-3 (1.0V)
Symbol
Description
Output
Divider
-1 (1.0V)
-1LI (0.95V)
-1Q (1.0V)
-1M (1.0V)
-2LE (0.9V)
Units
Package Type
FF
FB
SB
FG
FT
CS
CP
FF
FB
SB
RB
RS
FG
FT
CS
CP
FF
FB
SB
RB
RS
FG
FT
CS
CP
FF
FB
SB
FG
FT
CS
CP
FGTPMAX
Maximum GTP transceiver data rate
6.6
6.25
6.6
6.25
3.75
3.75
3.75
3.75
Gb/s
FGTPMIN
Minimum GTP transceiver data rate
0.500
0.500
0.500
0.500
0.500
0.500
0.500
0.500
Gb/s
FGTPRANGE
PLL line rate range
1
3.2–6.6
3.2–6.6
3.2–3.75
3.2–3.75
Gb/s
2
1.6–3.3
1.6–3.3
1.6–3.2
1.6–3.2
Gb/s
4
0.8–1.65
0.8–1.65
0.8–1.6
0.8–1.6
Gb/s
8
0.5–0.825
0.5–0.825
0.5–0.8
0.5–0.8
Gb/s
1.6–3.3
1.6–3.3
1.6–3.3
1.6–3.3
GHz
0.95V
0.9V
Units
FGTPPLLRANGE GTP transceiver PLL frequency
range
Table 53: GTP Transceiver Dynamic Reconfiguration Port (DRP) Switching Characteristics
Speed Grade
Symbol
FGTPDRPCLK
Description
1.0V
GTPDRPCLK maximum frequency
-3
-2/-2LE
-1
-1LI
-2LE
175
175
156
156
125
MHz
Table 54: GTP Transceiver Reference Clock Switching Characteristics
Symbol
Description
Conditions
All Speed Grades
Units
Min
Typ
Max
60
–
660
MHz
FGCLK
Reference clock frequency range
TRCLK
Reference clock rise time
20% – 80%
–
200
–
ps
TFCLK
Reference clock fall time
80% – 20%
–
200
–
ps
TDCREF
Reference clock duty cycle
Transceiver PLL only
40
–
60
%
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
X-Ref Target - Figure 5
TRCLK
80%
20%
TFCLK
ds181_03_062811
Figure 5: Reference Clock Timing Parameters
Table 55: GTP Transceiver PLL/Lock Time Adaptation
Symbol
TLOCK
TDLOCK
Description
All Speed Grades
Conditions
Initial PLL lock
Clock recovery phase acquisition and
adaptation time.
After the PLL is locked to the
reference clock, this is the time it
takes to lock the clock data
recovery (CDR) to the data
present at the input.
Units
Min
Typ
Max
–
–
1
ms
–
50,000
2.3 x106
UI
Table 56: GTP Transceiver User Clock Switching Characteristics(1)
Speed Grade
Symbol
Description
Conditions
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1LI
-2LE
Units
FTXOUT
TXOUTCLK maximum frequency
412.500
412.500
234.375
234.375
234.375
MHz
FRXOUT
RXOUTCLK maximum frequency
412.500
412.500
234.375
234.375
234.375
MHz
FTXIN
TXUSRCLK maximum frequency
16-bit data path
412.500
412.500
234.375
234.375
234.375
MHz
FRXIN
RXUSRCLK maximum frequency
16-bit data path
412.500
412.500
234.375
234.375
234.375
MHz
FTXIN2
TXUSRCLK2 maximum frequency
16-bit data path
412.500
412.500
234.375
234.375
234.375
MHz
FRXIN2
RXUSRCLK2 maximum frequency
16-bit data path
412.500
412.500
234.375
234.375
234.375
MHz
Notes:
1.
Clocking must be implemented as described in 7 Series FPGAs GTP Transceiver User Guide (UG482).
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 57: GTP Transceiver Transmitter Switching Characteristics
Symbol
Description
FGTPTX
Serial data rate range
TRTX
TX rise time
TFTX
TX fall time
Condition
Min
Typ
Max
Units
0.500
–
FGTPMAX
Gb/s
20%–80%
–
50
–
ps
80%–20%
ps
–
50
–
TLLSKEW
TX lane-to-lane
skew(1)
–
–
500
ps
VTXOOBVDPP
Electrical idle amplitude
–
–
20
mV
TTXOOBTRANSITION
Electrical idle transition time
–
–
140
ns
–
–
0.30
UI
–
–
0.15
UI
–
–
0.30
UI
–
–
0.15
UI
–
–
0.30
UI
–
–
0.15
UI
–
–
0.30
UI
–
–
0.15
UI
–
–
0.2
UI
–
–
0.1
UI
–
–
0.32
UI
–
–
0.16
UI
–
–
0.20
UI
–
–
0.08
UI
–
–
0.15
UI
–
–
0.06
UI
–
–
0.1
UI
–
–
0.03
UI
TJ6.6
Total
Jitter(2)(3)
Jitter(2)(3)
DJ6.6
Deterministic
TJ5.0
Total Jitter(2)(3)
DJ5.0
Deterministic Jitter(2)(3)
TJ4.25
Total
Jitter(2)(3)
Jitter(2)(3)
DJ4.25
Deterministic
TJ3.75
Total Jitter(2)(3)
DJ3.75
Deterministic Jitter(2)(3)
TJ3.2
Total
Jitter(2)(3)
Jitter(2)(3)
DJ3.2
Deterministic
TJ3.2L
Total Jitter(2)(3)
DJ3.2L
Deterministic Jitter(2)(3)
TJ2.5
Total
Jitter(2)(3)
Jitter(2)(3)
DJ2.5
Deterministic
TJ1.25
Total Jitter(2)(3)
DJ1.25
Deterministic Jitter(2)(3)
TJ500
DJ500
Total
Jitter(2)(3)
Deterministic
Jitter(2)(3)
6.6 Gb/s
5.0 Gb/s
4.25 Gb/s
3.75 Gb/s
3.20 Gb/s(4)
3.20 Gb/s(5)
2.5 Gb/s(6)
1.25 Gb/s(7)
500 Mb/s
Notes:
1.
2.
3.
4.
5.
6.
7.
Using same REFCLK input with TX phase alignment enabled for up to four consecutive transmitters (one fully populated GTP Quad).
Using PLL[0/1]_FBDIV = 2, 20-bit internal data width. These values are NOT intended for protocol specific compliance determinations.
All jitter values are based on a bit-error ratio of 1e-12.
PLL frequency at 3.2 GHz and TXOUT_DIV = 2.
PLL frequency at 1.6 GHz and TXOUT_DIV = 1.
PLL frequency at 2.5 GHz and TXOUT_DIV = 2.
PLL frequency at 2.5 GHz and TXOUT_DIV = 4.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 58: GTP Transceiver Receiver Switching Characteristics
Symbol
Description
RX oversampler not enabled
Min
Typ
Max
Units
0.500
–
FGTPMAX
Gb/s
FGTPRX
Serial data rate
TRXELECIDLE
Time for RXELECIDLE to respond to loss or restoration of data
–
10
–
ns
RXOOBVDPP
OOB detect threshold peak-to-peak
60
–
150
mV
RXSST
Receiver spread-spectrum
tracking(1)
–5000
–
5000
ppm
RXRL
Run length (CID)
–
–
512
UI
RXPPMTOL
Data/REFCLK PPM offset tolerance
–1250
–
1250
ppm
Modulated @ 33 kHz
SJ Jitter Tolerance(2)
JT_SJ6.6
Sinusoidal Jitter(3)
6.6 Gb/s
0.44
–
–
UI
JT_SJ5.0
Sinusoidal Jitter(3)
5.0 Gb/s
0.44
–
–
UI
JT_SJ4.25
Sinusoidal Jitter(3)
4.25 Gb/s
0.44
–
–
UI
JT_SJ3.75
Sinusoidal Jitter(3)
3.75 Gb/s
0.44
–
–
UI
JT_SJ3.2
Sinusoidal Jitter(3)
3.2 Gb/s(4)
0.45
–
–
UI
JT_SJ3.2L
Sinusoidal Jitter(3)
3.2 Gb/s(5)
0.45
–
–
UI
JT_SJ2.5
Sinusoidal Jitter(3)
2.5 Gb/s(6)
0.5
–
–
UI
JT_SJ1.25
Sinusoidal Jitter(3)
1.25 Gb/s(7)
0.5
–
–
UI
JT_SJ500
Sinusoidal Jitter(3)
500 Mb/s
0.4
–
–
UI
3.2 Gb/s
0.70
–
–
UI
6.6 Gb/s
0.70
–
–
UI
3.2 Gb/s
0.1
–
–
UI
6.6 Gb/s
0.1
–
–
UI
SJ Jitter Tolerance with Stressed Eye(2)
JT_TJSE3.2
JT_TJSE6.6
JT_SJSE3.2
JT_SJSE6.6
Total Jitter with Stressed Eye(8)
Sinusoidal Jitter with Stressed
Eye(8)
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
Using RXOUT_DIV = 1, 2, and 4.
All jitter values are based on a bit error ratio of 1e–12.
The frequency of the injected sinusoidal jitter is 10 MHz.
PLL frequency at 3.2 GHz and RXOUT_DIV = 2.
PLL frequency at 1.6 GHz and RXOUT_DIV = 1.
PLL frequency at 2.5 GHz and RXOUT_DIV = 2.
PLL frequency at 2.5 GHz and RXOUT_DIV = 4.
Composite jitter.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
GTP Transceiver Protocol Jitter Characteristics
For Table 59 through Table 63, the 7 Series FPGAs GTP Transceiver User Guide (UG482) contains recommended settings for
optimal usage of protocol specific characteristics.
Table 59: Gigabit Ethernet Protocol Characteristics
Description
Line Rate (Mb/s)
Min
Max
Units
1250
–
0.24
UI
1250
0.749
–
UI
Line Rate (Mb/s)
Min
Max
Units
3125
–
0.35
UI
3125
0.65
–
UI
Gigabit Ethernet Transmitter Jitter Generation
Total transmitter jitter (T_TJ)
Gigabit Ethernet Receiver High Frequency Jitter Tolerance
Total receiver jitter tolerance
Table 60: XAUI Protocol Characteristics
Description
XAUI Transmitter Jitter Generation
Total transmitter jitter (T_TJ)
XAUI Receiver High Frequency Jitter Tolerance
Total receiver jitter tolerance
Table 61: PCI Express Protocol Characteristics(1)
Standard
Description
Line Rate (Mb/s)
Min
Max
Units
PCI Express Transmitter Jitter Generation
PCI Express Gen 1
Total transmitter jitter
2500
–
0.25
UI
PCI Express Gen 2
Total transmitter jitter
5000
–
0.25
UI
2500
0.65
–
UI
0.40
–
UI
0.30
–
UI
PCI Express Receiver High Frequency Jitter Tolerance
PCI Express Gen 1
PCI Express Gen 2(2)
Total receiver jitter tolerance
Receiver inherent timing error
5000
Receiver inherent deterministic timing error
Notes:
1.
2.
Tested per card electromechanical (CEM) methodology.
Using common REFCLK.
Table 62: CEI-6G Protocol Characteristics
Description
Line Rate (Mb/s)
Interface
Min
Max
Units
CEI-6G-SR
–
0.3
UI
CEI-6G-SR
0.6
–
UI
CEI-6G Transmitter Jitter Generation
Total transmitter jitter(1)
4976–6375
CEI-6G Receiver High Frequency Jitter Tolerance
Total receiver jitter tolerance(1)
4976–6375
Notes:
1.
Tested at most commonly used line rate of 6250 Mb/s using 390.625 MHz reference clock.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 63: CPRI Protocol Characteristics
Description
Line Rate (Mb/s)
Min
Max
Units
614.4
–
0.35
UI
1228.8
–
0.35
UI
2457.6
–
0.35
UI
3072.0
–
0.35
UI
4915.2
–
0.3
UI
6144.0
–
0.3
UI
614.4
0.65
–
UI
1228.8
0.65
–
UI
2457.6
0.65
–
UI
3072.0
0.65
–
UI
4915.2(1)
0.60
–
UI
6144.0(1)
0.60
–
UI
CPRI Transmitter Jitter Generation
Total transmitter jitter
CPRI Receiver Frequency Jitter Tolerance
Total receiver jitter tolerance
Notes:
1.
Tested to CEI-6G-SR.
Integrated Interface Block for PCI Express Designs Switching Characteristics
More information and documentation on solutions for PCI Express designs can be found at:
www.xilinx.com/products/technology/pci-express.html
Table 64: Maximum Performance for PCI Express Designs
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1LI
-2LE
Units
FPIPECLK
Pipe clock maximum frequency
250.00
250.00
250.00
250.00
250.00
MHz
FUSERCLK
User clock maximum frequency
250.00
250.00
250.00
250.00
250.00
MHz
FUSERCLK2
User clock 2 maximum frequency
250.00
250.00
250.00
250.00
250.00
MHz
FDRPCLK
DRP clock maximum frequency
250.00
250.00
250.00
250.00
250.00
MHz
Notes:
1.
Refer to PG054, 7 Series FPGAs Integrated Block for PCI Express Product Guide for specific supported core configurations.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
XADC Specifications
Table 65: XADC Specifications
Parameter
Symbol
Comments/Conditions
Min
Typ
Max
Units
VCCADC = 1.8V ± 5%, VREFP = 1.25V, VREFN = 0V, ADCCLK = 26 MHz, –55°C Tj 125°C, Typical values at Tj=+40°C
ADC Accuracy(1)
Resolution
Integral
Nonlinearity(2)
INL
12
–
–
Bits
–40°C Tj 100°C
–
–
±2
LSBs
–55°C Tj < –40°C; 100°C < Tj 125°C
–
–
±3
LSBs
Differential Nonlinearity
DNL
No missing codes, guaranteed monotonic
–
–
±1
LSBs
Offset Error
Unipolar
–40°C Tj 100°C
–
–
±8
LSBs
–55°C Tj < –40°C; 100°C < Tj 125°C
–
–
±12
LSBs
–55°C Tj 125°C
–
–
±4
LSBs
Gain Error
–
–
±0.5
%
Offset Matching
–
–
4
LSBs
Gain Matching
–
–
0.3
%
–
–
1
MS/s
FSAMPLE = 500KS/s, FIN = 20 kHz
60
–
–
dB
External 1.25V reference
–
–
2
LSBs
On-chip reference
–
3
–
LSBs
FSAMPLE = 500KS/s, FIN = 20 kHz
70
–
–
dB
Unipolar operation
0
–
1
V
Bipolar operation
–0.5
–
+0.5
V
Unipolar common mode range (FS input)
0
–
+0.5
V
Bipolar common mode range (FS input)
+0.5
–
+0.6
V
Adjacent analog channels set within these
ranges should not corrupt measurements on
adjacent channels
–0.1
–
VCCADC
V
250
–
–
kHz
–40°C Tj 100°C
–
–
±4
°C
–55°C Tj < –40°C; 100°C < Tj 125°C
–
–
±6
°C
–40°C Tj 100°C
–
–
±1
%
–55°C Tj < –40°C; 100°C < Tj 125°C
–
–
±2
%
Bipolar
Sample Rate
Signal to Noise
Ratio(2)
SNR
RMS Code Noise
Total Harmonic
Analog
Distortion(2)
THD
Inputs(3)
ADC Input Ranges
Maximum External Channel Input Ranges
Auxiliary Channel Full
Resolution Bandwidth
FRBW
On-Chip Sensors
Temperature Sensor Error
Supply Sensor Error
Conversion Rate(4)
Conversion Time - Continuous
tCONV
Number of ADCCLK cycles
26
–
32
Cycles
Conversion Time - Event
tCONV
Number of CLK cycles
–
–
21
Cycles
DRP Clock Frequency
DCLK
DRP clock frequency
8
–
250
MHz
ADC Clock Frequency
ADCCLK
Derived from DCLK
1
–
26
MHz
40
–
60
%
DCLK Duty Cycle
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 65: XADC Specifications (Cont’d)
Parameter
Symbol
Comments/Conditions
Min
Typ
Max
Units
1.20
1.25
1.30
V
Ground VREFP pin to AGND,
–40°C Tj 100°C
1.2375
1.25
1.2625
V
Ground VREFP pin to AGND,
–55°C Tj < –40°C; 100°C < Tj 125°C
1.225
1.25
1.275
V
XADC Reference(5)
External Reference
VREFP
On-Chip Reference
Externally supplied reference voltage
Notes:
1.
2.
3.
4.
5.
Offset and gain errors are removed by enabling the XADC automatic gain calibration feature. The values are specified for when this feature
is enabled.
Only specified for bitstream option XADCEnhancedLinearity = ON.
See the ADC chapter in the 7 Series FPGAs and Zynq-7000 SoC XADC Dual 12-Bit 1 MSPS Analog-to-Digital Converter (UG480) for a
detailed description.
See the Timing chapter in the 7 Series FPGAs and Zynq-7000 SoC XADC Dual 12-Bit 1 MSPS Analog-to-Digital Converter (UG480) for a
detailed description.
Any variation in the reference voltage from the nominal VREFP = 1.25V and VREFN = 0V will result in a deviation from the ideal transfer
function. This also impacts the accuracy of the internal sensor measurements (i.e., temperature and power supply). However, for external
ratiometric type applications allowing reference to vary by ±4% is permitted.
Configuration Switching Characteristics
Table 66: Configuration Switching Characteristics
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1LI
-2LE
Units
Power-up Timing Characteristics
TPL(1)
Program latency
5.00
5.00
5.00
5.00
5.00
ms, Max
TPOR(1)
Power-on reset (50 ms ramp rate time)
10/50
10/50
10/50
10/50
10/50
ms, Min/Max
Power-on reset (1 ms ramp rate time)
10/35
10/35
10/35
10/35
10/35
ms, Min/Max
Program pulse width
250.00
250.00
250.00
250.00
250.00
ns, Min
TPROGRAM
CCLK Output (Master Mode)
TICCK
Master CCLK output delay
150.00
150.00
150.00
150.00
150.00
ns, Min
TMCCKL
Master CCLK clock Low time duty cycle
40/60
40/60
40/60
40/60
40/60
%, Min/Max
TMCCKH
Master CCLK clock High time duty cycle
40/60
40/60
40/60
40/60
40/60
%, Min/Max
FMCCK
Master CCLK frequency
100.00
100.00
100.00
100.00
70.00
MHz, Max
Master CCLK frequency for AES encrypted x16
50.00
50.00
50.00
50.00
35.00
MHz, Max
FMCCK_START Master CCLK frequency at start of configuration
3.00
3.00
3.00
3.00
3.00
MHz, Typ
FMCCKTOL
±50
±50
±50
±50
±50
%, Max
Frequency tolerance, master mode with respect
to nominal CCLK
CCLK Input (Slave Modes)
TSCCKL
Slave CCLK clock minimum Low time
2.50
2.50
2.50
2.50
2.50
ns, Min
TSCCKH
Slave CCLK clock minimum High time
2.50
2.50
2.50
2.50
2.50
ns, Min
FSCCK
Slave CCLK frequency
100.00
100.00
100.00
100.00
70.00
MHz, Max
EMCCLK Input (Master Mode)
TEMCCKL
External master CCLK Low time
2.50
2.50
2.50
2.50
2.50
ns, Min
TEMCCKH
External master CCLK High time
2.50
2.50
2.50
2.50
2.50
ns, Min
FEMCCK
External master CCLK frequency
100.00
100.00
100.00
100.00
70.00
MHz, Max
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 66: Configuration Switching Characteristics (Cont’d)
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1LI
-2LE
100.00
100.00
100.00
100.00
70.00
Units
Internal Configuration Access Port
FICAPCK
Internal configuration access port (ICAPE2)
clock frequency
MHz, Max
Master/Slave Serial Mode Programming Switching
TDCCK/
TCCKD
DIN setup/hold
TCCO
DOUT clock to out
4.00/0.00 4.00/0.00 4.00/0.00 4.00/0.00 5.00/0.00
8.00
8.00
8.00
8.00
9.00
ns, Min
ns, Max
SelectMAP Mode Programming Switching
TSMDCCK/
TSMCCKD
D[31:00] setup/hold
4.00/0.00 4.00/0.00 4.00/0.00 4.00/0.00 4.50/0.00
ns, Min
TSMCSCCK/
TSMCCKCS
CSI_B setup/hold
4.00/0.00 4.00/0.00 4.00/0.00 4.00/0.00 5.00/0.00
ns, Min
TSMWCCK/
TSMCCKW
RDWR_B setup/hold
10.00/0.00 10.00/0.00 10.00/0.00 10.00/0.00 12.00/0.00
ns, Min
TSMCKCSO
CSO_B clock to out (330 pull-up resistor
required)
7.00
7.00
7.00
7.00
8.00
ns, Max
TSMCO
D[31:00] clock to out in readback
8.00
8.00
8.00
8.00
10.00
ns, Max
FRBCCK
Readback frequency
100.00
100.00
100.00
100.00
70.00
MHz, Max
Boundary-Scan Port Timing Specifications
TTAPTCK/
TTCKTAP
TMS and TDI setup/hold
3.00/2.00 3.00/2.00 3.00/2.00 3.00/2.00 3.00/2.00
ns, Min
TTCKTDO
TCK falling edge to TDO output
7.00
7.00
7.00
7.00
8.50
ns, Max
FTCK
TCK frequency
66.00
66.00
66.00
66.00
50.00
MHz, Max
8.50
8.50
8.50
8.50
10.00
ns, Max
BPI Flash Master Mode Programming Switching
TBPICCO(2)
A[28:00], RS[1:0], FCS_B, FOE_B, FWE_B,
ADV_B clock to out
TBPIDCC/
TBPICCD
D[15:00] setup/hold
4.00/0.00 4.00/0.00 4.00/0.00 4.00/0.00 4.50/0.00
ns, Min
3.00/0.00 3.00/0.00 3.00/0.00 3.00/0.00 3.00/0.00
ns, Min
SPI Flash Master Mode Programming Switching
TSPIDCC/
TSPICCD
D[03:00] setup/hold
TSPICCM
MOSI clock to out
8.00
8.00
8.00
8.00
9.00
ns, Max
TSPICCFC
FCS_B clock to out
8.00
8.00
8.00
8.00
9.00
ns, Max
STARTUPE2 Ports
TUSRCCLKO
STARTUPE2 USRCCLKO input to CCLK output 0.50/6.00 0.50/6.70 0.50/7.50 0.50/7.50 0.50/7.50
ns,
Min/Max
FCFGMCLK
STARTUPE2 CFGMCLK output frequency
FCFGMCLKTOL STARTUPE2 CFGMCLK output frequency
tolerance
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65.00
65.00
65.00
65.00
MHz, Typ
±50
±50
±50
±50
±50
%, Max
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Table 66: Configuration Switching Characteristics (Cont’d)
Speed Grade
Symbol
Description
1.0V
0.95V
0.9V
-3
-2/-2LE
-1
-1LI
-2LE
100.00
100.00
100.00
100.00
70.00
Units
Device DNA Access Port
FDNACK
DNA access port (DNA_PORT)
MHz, Max
Notes:
1.
2.
To support longer delays in configuration, use the design solutions described in 7 Series FPGA Configuration User Guide (UG470).
Only during configuration, the last edge is determined by a weak pull-up/pull-down resistor in the I/O.
eFUSE Programming Conditions
Table 67 lists the programming conditions specifically for eFUSE. For more information, see 7 Series FPGA Configuration User
Guide (UG470).
Table 67: eFUSE Programming Conditions(1)
Symbol
Description
Min
Typ
Max
Units
IFS
VCCAUX supply current
–
–
115
mA
Tj
Temperature range
15
–
125
°C
Notes:
1.
The FPGA must not be configured during eFUSE programming.
Revision History
The following table shows the revision history for this document:
Date
Version
09/26/2011
1.0
Initial Xilinx release.
11/07/2011
1.1
Revised the VOCM specification in Table 11. Updated the AC Switching Characteristics based upon the
ISE 13.3 software v1.02 speed specification throughout document including Table 13 and Table 14.
Added MMCM_TFBDELAY while adding MMCM_ to the symbol names of a few specifications in
Table 37 and PLL to the symbol names in Table 38. In Table 39 through Table 46, updated the pin-topin description with the SSTL15 standard. Updated units in Table 46.
02/13/2012
1.2
Updated the Artix-7 family of devices listed throughout the entire data sheet. Updated the AC Switching
Characteristics based upon the ISE 13.4 software v1.03 for the -3, -2, and -1 speed grades and v1.00
for the -2L speed grade.
Updated summary description on page 1. In Table 2, revised VCCO for the 3.3V HR I/O banks and
updated Tj. Updated the notes in Table 5. Added MGTAVCC and MGTAVTT power supply ramp times
to Table 7. Rearranged Table 8, added Mobile_DDR, HSTL_I_18, HSTL_II_18, HSUL_12,
SSTL135_R, SSTL15_R, and SSTL12 and removed DIFF_SSTL135, DIFF_SSTL18_I,
DIFF_SSTL18_II, DIFF_HSTL_I, and DIFF_HSTL_II. Added Table 9 and Table 10. Revised the
specifications in Table 11. Revised VIN in Table 50. Updated the eFUSE Programming Conditions
section and removed the endurance table. Added the table. Revised FTXIN and FRXIN in Table 56.
Revised ICCADC and updated Note 1 in Table 65. Revised DDR LVDS transmitter data width in
Table 15. Removed notes from Table 27 as they are no longer applicable. Updated specifications in
Table 66. Updated Note 1 in Table 36.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Date
Version
Description
06/01/2012
1.3
Reorganized entire data sheet including adding Table 43 and Table 47.
Updated TSOL in Table 1. Updated IBATT and added RIN_TERM to Table 3. Updated Power-On/Off Power
Supply Sequencing section with regards to GTP transceivers. In Table 8, updated many parameters
including SSTL135 and SSTL135_R. Removed VOX column and added DIFF_HSUL_12 to Table 10.
Updated VOL in Table 11. Updated Table 15 and removed notes 2 and 3. Updated Table 16.
Updated the AC Switching Characteristics based upon the ISE 14.1 software v1.03 for the -3, -2, -2L
(1.0V), -1, and v1.01 for the -2L (0.9V) speed specifications throughout the document.
In Table 30, updated Reset Delays section including Note 10 and Note 11. In Table 56, replaced
FTXOUT with FGLK. Updated many of the XADC specifications in Table 65 and added Note 2. Updated
and moved Dynamic Reconfiguration Port (DRP) for MMCM Before and After DCLK section from
Table 66 to Table 37 and Table 38.
09/20/2012
1.4
In Table 1, updated the descriptions, changed VIN and Note 2, and added Note 4. In Table 2, changed
descriptions and notes. Updated parameters in Table 3. Added Table 4. Revised the Power-On/Off
Power Supply Sequencing section. Updated standards and specifications in Table 8, Table 9, and
Table 10. Removed the XC7A350T device from data sheet.
Updated the AC Switching Characteristics section to the ISE 14.2 speed specifications throughout the
document. Updated the IOB Pad Input/Output/3-State discussion and changed Table 18 by adding
TIOIBUFDISABLE. Removed many of the combinatorial delay specifications and TCINCK/TCKCIN from
Table 27.Changed FPFDMAX conditions in Table 37 and Table 38. Updated the GTP Transceiver
Specifications section, moved the GTP Transceiver DC characteristics section to the overall DC
Characteristics section, and added the GTP Transceiver Protocol Jitter Characteristics section. In
Table 65, updated Note 1. In Table 66, updated TPOR.
02/01/2013
1.5
Updated the AC Switching Characteristics based upon the 14.4/2012.4 device pack for ISE 14.4 and
Vivado 2012.4, both at v1.07 for the -3, -2, -2L (1.0V), -1 speed specifications, and v1.05 for the -2L
(0.9V) speed specifications throughout the document. Production changes to Table 13 and Table 14
for -3, -2, -2L (1.0V), -1 speed specifications.
Revised IDCIN and IDCOUT and added Note 5 in Table 1. Added Note 2 to Table 2. Updated Table 5.
Added minimum current specifications to Table 6. Removed SSTL12 and HSTL_I_12 from Table 8.
Removed DIFF_SSTL12 from Table 10. Updated Table 13. Added a 2:1 memory controller section to
Table 16. Updated Note 1 in Table 34. Revised Table 36. Updated Note 1 and Note 2 in Table 49.
Updated DVPPIN in Table 50. Updated VIDIFF in Table 51. Removed TLOCK and TPHASE and revised
FGCLK in Table 54. Updated TDLOCK in Table 55. Updated Table 56. In Table 57, updated TRTX, TFTX,
VTXOOBVDPP , and revised Note 1 through Note 7. In Table 58, updated RXSST and RXPPMTOL and
revised Note 4 through Note 7. In Table 63, revised and added Note 1.
Revised the maximum external channel input ranges in Table 65. In Table 66, revised FMCCK and
added the Internal Configuration Access Port section.
04/17/2013
1.6
Updated the AC Switching Characteristics based upon v1.07 of the ISE 14.5 and Vivado 2013.1 for the
-3, -2, -2L (1.0V), and -1 speed specifications, and v1.05 for the -2L (0.9V) speed specifications.
Production changes to Table 13 and Table 14 for -2L (0.9V) speed specifications.
In Table 1, revised VIN (I/O input voltage) to match values in Table 4 and combined Note 4 with old Note
5 and then added new Note 5. Revised VIN description, removed Note 10, and added Note 7 in Table 2.
Updated first 3 rows in Table 4. Also revised PCI33_3 voltage minimum in Table 8 to match values in
Table 1 and Table 4. Added Note 1 to Table 11. Removed Note 1 from Table 14. Updated Table 16 title.
Throughout the data sheet (Table 28, Table 29, and Table 44) removed the obvious note “A Zero “0”
Hold Time listing indicates no hold time or a negative hold time.”
09/04/2013
1.7
Added new Artix-7 devices (XC7A35T, XC7A50T, and XC7A75T) throughout. In Table 1, updated IDCIN
and IDCOUT for cases when floating, at VMGTAVTT, or GND. Added back Note 1 to Table 14. Added CPG
package to Table 50 and Table 52.
11/27/2013
1.8
Added automotive and expanded temperature range Artix-7 devices throughout. Added -1M and -1Q
speed grades throughout. Added reference to 7 Series FPGAs Overview, Defense-Grade 7 Series
FPGAs Overview, and XA Artix-7 FPGAs Overview in Introduction. In Table 2, added junction
temperature operating ranges for expanded (Q) and military (M) devices, and added Note 3. In Table 3,
removed commercial (C), industrial (I), and extended (E) from descriptions of RIN_TERM. Updated
temperature ranges in Table 4. Removed notes from Table 6. Added TJ = 125°C to Conditions column
for TVCCO2VCCAUX in Table 7. In AC Switching Characteristics, updated first paragraph, added
Table 12, and added -1Q/-1M speed grades to other tables in this section. In Table 52, added RB and
RS packages, and updated FGTPMAX. In Table 65, updated ADC Accuracy, On-Chip Sensors, XADC
Reference sections and notes. Added TUSRCCLKO and FDNACK to Table 66.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Date
Version
Description
01/07/2014
1.9
In Table 13, promoted all XC7A75T speed grades from Advance to Production and all XQ7A50T speed
grades from Preliminary to Advance. In Table 14, inserted “Vivado tools 2013.3” for the production
XC7A75T speed grades.
01/23/2014
1.10
Updated the AC Switching Characteristics based upon ISE 14.7 and Vivado 2013.4. Updated Note 5
in Table 2. Removed pad pull-down @ VIN = 1.8V for IRPD in Table 3. Added Note 2 to Table 4.
Removed XQ7A50T fromTable 12, Table 13, and Table 14. In Table 13, changed speed grades for XA
Artix-7 FPGAs and defense-grade Artix-7Q family from -2 to -2I and -1 to -1I, and moved all speed
grades of XA7A100T, and -1I and -2I speed grades of XQ7A100T from Preliminary to Production. In
Table 14, updated production software for XA7A100T and XQ7A100T. Added HSUL_12_F,
DIFF_HSUL_12_F, MOBILE_DDR_S, MOBILE_DDR_F, DIFF_MOBILE_DDR_S, and
DIFF_MOBILE_DDR_F to Table 17. Removed introductory text in Device Pin-to-Pin Output Parameter
Guidelines.
03/04/2014
1.11
Updated Note 2 in Table 4. In Table 13, moved XQ7A100T -1M speed grade from Preliminary to
Production. In Table 14, added production software for XQ7A100T -1M speed grade.
03/28/2014
1.12
In Table 5, added ICCINTQ, ICCOQ, ICCAUXQ, and ICCBRAMQ values for XC7A35T, XC7A50T, XA7A35T,
XA7A50T, and XQ7A50T devices. In Table 6, added power-on current values for XC7A35T, XC7A50T,
XA7A35T, XA7A50T, and XQ7A50T devices. In Table 12, added row for XC7A35T, XC7A50T, and
XC7A75T devices. In Table 13, moved all speed grades of XC7A35T and XC7A50T devices from
Advance to Production, and added XQ7A50T. In Table 14, added XQ7A50T and production software
for XC7A35T and XC7A50T -3, -2, -2L (1.0V), -1, and -2L (0.9V) speed grades. For FIDELAYCTRL_REF
in Table 25, updated REFCLK frequency of 300 MHz, added REFCLK frequency of 400 MHz, and
updated Note 1. In Table 36, added TCKSKEW data for XC7A35T and XC7A50T devices. In Table 39,
updated TICKOF data for -1 and -2L (0.9V) speed grades of XC7A35T and XC7A50T devices. In
Table 40, updated TICKOFFAR data for -1 and -2L (0.9V) speed grades of XC7A35T and XC7A50T
devices. In Table 41, added TICKOFMMCMCC data for -2L (0.9V) speed grade of XC7A35T and
XC7A50T devices. In Table 42, added TICKOFPLLCC data for -2L (0.9V) speed grade of XC7A35T and
XC7A50T devices. In Table 44, updated TPSFD/TPHFD data for -2/-2L, -1, and -2L (0.9V) speed grades
of XC7A35T and XC7A50T devices. In Table 45, updated TPSMMCMCC/TPHMMCMCC data for -1 and -2L
(0.9V) speed grades of XC7A35T and XC7A50T devices. In Table 46, updated TPSPLLCC/TPHPLLCC
data for -1 and -2L (0.9V) speed grades of XC7A35T and XC7A50T devices. In Table 49, added
package skew values for XC7A35T, XC7A50T, XA7A35T, XA7A50T, and XQ7A50T devices.
05/13/2014
1.13
In AC Switching Characteristics, updated to Vivado 2014.1. In Table 12, updated Vivado 2014.1
version numbers and consolidated rows. In Table 13, moved all XA7A75T speed grades from Advance
to Preliminary and all XQ7A200T speed grades from Preliminary to Production. In Table 14, added
production software for XQ7A200T -2, -1, and -1M speed grades. Added timing data for XA7A35T,
XA7A50T, XA7A75T, and XQ7A50T devices to Table 39, Table 40, Table 41, Table 42, Table 44,
Table 45, and Table 46.
07/01/2014
1.14
Updated Note 2 in Table 4 per the customer notice XCN14014: 7 Series FPGA and Zynq-7000 AP SoC
I/O Undershoot Voltage Data Sheet Update. In Power-On/Off Power Supply Sequencing, added
sentence about there being no recommended sequence for supplies not shown. In AC Switching
Characteristics, updated to Vivado 2014.2. In Table 12, added row for XQ7A50T. In Table 13, moved
all XQ7A50T speed grades from Advance to Production. In Table 14, added production software for
XQ7A50T -2, -1, and -1M speed grades. In Table 36, added TCKSKEW values for XA7A35T, XA7A50T,
and XQ7A50T. Updated description of TICKOF in Table 39 and added Note 2. Updated description of
TICKOFFAR in Table 40 and added Note 2. In Table 50, moved DVPPOUT value of 1000 mV from Max to
Min column, updated VIN DC parameter description, and added Note 2. Added “peak-to-peak” to labels
in Figure 3 and Figure 4. Added note after Figure 4. Added Note 1 to Table 64. In Table 66, replaced
USRCCLK Output with STARTUPE2 Ports and added FCFGMCLK and FCFGMCLKTOL.
09/23/2014
1.15
Removed 3.3V as descriptor of HR I/O banks throughout. Updated Note 3 in Table 5. In Table 13,
moved all XA7A35T and XA7A50T speed grades from Advance to Production, and all XA7A75T speed
grades from Preliminary to Production. In Table 14, added production software for XA7A35T, XA7A50T,
and XA7A75T -2, -1, and -1Q speed grades, and removed Note 2. Added I/O Standard Adjustment
Measurement Methodology.
10/09/2014
1.16
Added XC7A15T and XA7A15T devices. Added -1LI speed grade throughout. Updated Introduction.
Added -1LI (0.95V) to description of VCCINT and VCCBRAM in Table 2. Updated Note 1 and added
Note 2 to Table 14.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
Date
Version
Description
11/19/2014
1.17
Replaced -2L speed grade with -2LE throughout. Updated descriptions of VCCINT and VCCBRAM in
Table 2. Updated the AC Switching Characteristics based upon Vivado 2014.4. In Table 12, updated
Vivado software version and added a row for VCCINT = 0.95V. In Table 13, moved all speed grades for
all devices from Advance to Production. In Table 14, added Vivado 2014.4 software version to -1LI
(0.95V) speed grade column for commercial devices and applicable speed grades for XC7A15T and
XA7A15T devices, and removed table notes. Added Selecting the Correct Speed Grade and Voltage
in the Vivado Tools. In Table 16, moved LPDDR2 row to end of 2:1 Memory Controllers section.
Updated speed grade heading row in Table 52.
03/18/2015
1.18
In Table 11, changed maximum VICM value from 1.425V to 1.500V. Removed LVDS 1.8V standard from
Table 19 and Table 20. Removed minimum sample rate specification from Table 65.
09/24/2015
1.19
Updated first paragraph in Introduction. Assigned quiescent supply currents to -1LI speed grade
Artix-7Q devices in Table 5. In Table 14, changed -1LI speed grade Artix-7Q device cells from N/A to
blank and added Note 1. Removed DIFF_SSTL12 standard from Table 19 and Table 20. Changed -1LI
speed grade Artix-7Q device cells from N/A to blank in Table 36, Table 39, Table 40, Table 41, Table 42,
Table 44, Table 45, and Table 46. Added SBV484, FBV484, FBV676, and FFV1156 packages to
Table 49. Removed Pb-free G suffix from packages in Table 50 and Table 52.
11/24/2015
1.20
In AC Switching Characteristics, updated to Vivado 2015.4. In Table 13, added -1LI (0.95V) speed
grade to Production column for XQ7A50T, XQ7A100T, and XQ7A200T. In Table 14, removed table note
and added Vivado 2015.4 software version to -1LI (0.95V) speed grade column for XQ7A50T,
XQ7A100T, and XQ7A200T. In Table 36, added TCKSKEW for XQ7A50T, XQ7A100T, and XQ7A200T
at -1LI (0.95V) speed grade. Updated device pin-to-pin output parameter tables (Table 39 to Table 42)
and input parameter tables (Table 44 to Table 46) for XQ7A50T, XQ7A100T, and XQ7A200T at -1LI
(0.95V) speed grade.
09/27/2016
1.21
Added XC7A12T and XC7A25T devices. Updated the AC Switching Characteristics based upon
Vivado 2016.3. In Table 19, updated VMEAS values for LVCMOS 3.3V, LVTTL 3.3V, and PCI33 3.3V,
and removed note 1. Removed LVDCI_15, HSLVDCI_15, LVDCI_15, and HSLVDCI_18 I/O standards
from Table 20.
04/13/2017
1.22
Added 1.35V to Note 5 in Table 2. Updated the AC Switching Characteristics based upon Vivado
2016.4. In Table 13, added -2LE (0.9V) speed grade to Advance column for XC7A12T and XC7A25T.
In Table 25, changed TIDELAYRESOLUTION units from ps to µs. In Table 36, updated TCKSKEW for
XC7A12T and XC7A25T devices at -2LE (0.9V) speed grade. Updated device pin-to-pin output
parameter tables (Table 39 to Table 42) and input parameter tables (Table 44 to Table 46) for XC7A12T
and XC7A25T devices at -2LE (0.9V) speed grade. Removed SBV484, FBV484, FBV676, and
FFV1156 packages from Table 49 per the customer notice XCN16022: Cross-ship of Lead-free Bump
and Substrates in Lead-free (FFG/FBG/SBG) Packages.
12/21/2017
1.23
Updated the AC Switching Characteristics based upon Vivado 2017.4. For XC7A12T and XC7A25T in
Table 13, moved -3 and -2LE (0.9V) speed grades to Preliminary column and -2, -1, and -1LI (0.95V)
speed grades to Production column. In Table 14, added Vivado 2017.4 software version to -2, -2LE, -1,
and -1LI (0.95V) speed grade columns for XC7A12T and XC7A25T. In Table 44, updated TPSFD/ TPHFD
for XC7A12T and XC7A25T at -3, -2/-2LE, -1 and -1LI (0.95V) speed grades. In Table 46, updated
TPSPLLCC for XC7A12T and XC7A25T at -1 and -1LI (0.95V) speed grades. In Table 49, added
package skew values for XC7A12T and XC7A25T.
04/04/2018
1.24
Added XA7A12T and XA7A25T devices. Updated the AC Switching Characteristics based upon
Vivado 2018.1. In Table 13, for XC7A12T and XC7A25T moved -2LE (0.9V) speed grade to Production
column and added XA7A12T and XA7A25T with -2I, -1I, and -1Q speed grades in Production column.
Added Note 3 to Table 16.
06/18/2018
1.25
Updated the AC Switching Characteristics based upon Vivado 2018.2. In Table 13, for XC7A12T and
XC7A25T moved -3 speed grade to Production. In Table 14, added Vivado 2018.2 software version to
-3 speed grade for XC7A12T and XC7A25T and removed note.
03/23/2021
1.26
Replaced D with DDLY in description of TISDCK_DDLY_DDR/TISCKD_DDLY_DDR in Table 23.
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Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
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