Cross-ship of Lead-free Bump
and Substrates in Lead-free
(FFG/FBG/SBG) Packages
XCN16022 (v1.0) October 31, 2016
Product Change Notice
Overview
The purpose of this notification is to announce that selected Xilinx lead-free flip chip products denoted by the
package code “FFG”, “FBG”, or “SBG” will be shipped with either the current eutectic C4 bump and associated
substrate or the new lead-free C4 bump and associated lead-free substrate. The external packaging and the
current lead-free balls will not be changed. Form, fit, function and reliability will remain the same.
Description
Xilinx offers lead free components that comply with the European Union’s RoHS 2 directive (2011/95/EU). RoHS
compliant devices are specified by adding the character “G” to the package designator portion of the part
number. Under the current RoHS directive, Xilinx flip-chip packages are exempt from the full lead-free
requirements under Exemption 15. Exemption 15 specifies that lead is allowed in solder bumps to complete a
viable electrical connection between semiconductor die and substrate within integrated circuit flip chip packages.
In 2015, the RoHS committee planned to remove Exemption 15 in July 2016. Thus, Xilinx qualified and
introduced versions of these parts with lead-free solder bump material between the semiconductor die and the
substrate. In early 2016, however, removal of RoHS Exemption 15 was delayed. We do know that the RoHS
directive will eventually eliminate Exemption 15 for newer device technologies and smaller die sizes, in 2018 at
the earliest. In order to ease the transition for Xilinx and customers well ahead of the transition date, Xilinx will
begin the gradual transition to lead-free material for the solder bumps between the semiconductor die and the
substrate. Eligible devices are in the Virtex®-5, Virtex®-6, Artix®-7, Kintex®-7, Virtex®-7 FPGAs and Zynq®7000 families. Defense-grade “XQ” and Automotive “XA” device-packages are not affected by this PCN.
The specific material that will change includes the C4 Bump on the wafer, the substrate, and the underfill used in
assembly. The current RoHS parts in “G” packages use bumps, substrate, and underfill appropriate for eutectic
solder (eutectic material set). The new bumps, substrate, and underfill (lead-free material set) enables the use of
fully lead-free solder bumps.
There are no differences in package reliability, form, fit or function using the lead-free material set. There are no
external package changes (BGA balls will be remain lead-free). There are no changes to the package outline
drawing. All packages meet the 8 mil (0.2 mm) package coplanarity specifications and should provide seamless
board mount results.
Until the cross ship date of July 1 2017, the products with “G” packages will only be shipped with the eutectic
material set. After the cross ship date, the products with “G” packages will be shipped with either eutectic or leadfree material sets. When the RoHS Directive changes to remove Exemption 15, all product should be shifted to
the lead-free material set already. Note that all affected product shipped will meet the RoHS Directive.
© Copyright 2016 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Vivado, Zynq, and other designated brands included herein are
trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.
XCN16022 (v1.0) October 31, 2016
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1
Cross-ship of Lead-free Bump & Substrates in Lead-free (FFG/FBG/SBG) Packages
Products Affected
This change affects all speed, package, and temperature variations of “XC” commercial (C), industrial (I) and
extended (E) device-package combinations listed in the tables below. Any associated Specification Control
Documents (SCDs) are also affected.
Table 1: Virtex-5 Products Affected
Device
Package
Device
Package
XC5VFX30T
FFG665
XC5VSX35T
FFG665
XC5VFX70T
FFG1136
XC5VSX50T
FFG1136
XC5VFX70T
FFG665
XC5VSX50T
FFG665
XC5VFX100T
FFG1136
XC5VSX95T
FFG1136
XC5VFX100T
FFG1738
XC5VLX110
FFG1153
XC5VLX20T
FFG323
XC5VLX110
FFG1760
XC5VLX30
FFG324
XC5VLX110
FFG676
XC5VLX30
FFG676
XC5VLX110T
FFG1136
XC5VLX30T
FFG323
XC5VLX110T
FFG1738
XC5VLX30T
FFG665
XC5VLX155
FFG1153
XC5VLX50
FFG1153
XC5VLX155
FFG1760
XC5VLX50
FFG324
XC5VLX155T
FFG1136
XC5VLX50
FFG676
FFG1738
XC5VLX50T
FFG1136
XC5VLX155T
XCE05L11
XC5VLX50T
FFG665
XCE05L11T
FFG1136
XC5VLX85
FFG1153
XCE05L15
FFG1153
XC5VLX85
FFG676
XCE05S05T
FFG1136
XC5VLX85T
FFG1136
FFG1153
Table 2: Virtex-6 Products Affected
2
Device
Package
Device
Package
XC6VCX75T
FFG484
XC6VLX130T
FFG1156
XC6VCX75T
FFG784
XC6VLX130T
FFG484
XC6VCX130T
FFG1156
XC6VLX130T
FFG784
XC6VCX130T
FFG484
XC6VLX195T
FFG1156
XC6VCX130T
FFG784
XC6VLX195T
FFG784
XC6VCX195T
FFG1156
XC6VLX240T
FFG784
XC6VCX195T
FFG784
XC6VLX240T
FFG1156
XC6VCX240T
FFG784
XC6VLX240T
FFG1759
XC6VCX240T
FFG1156
XC6VHX250T
FFG1154
XC6VCX240T
FFG1759
XC6VHX255T
FFG1155
XC6VLX75T
FFG484
XC6VHX255T
FFG1923
XC6VLX75T
FFG784
XCE06L19T
FFG1156
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XCN16022 (v1.0) October 31, 2016
Cross-ship of Lead-free Bump & Substrates in Lead-free (FFG/FBG/SBG) Packages
Table 3: 7 Series and Zynq-7000 Products Affected
Device
Package
Device
Package
XC7A200T
FBG676
XC7K70T
FBG484
XC7A200T
FFG1156
XC7K70T
FFG484
XC7A200T
FBG484
XC7V585T
FFG1157
XC7A200T
FFG676
XC7V585T
FFG1761
XC7A200T
SBG484
XC7VX330T
FFG1761
XC7K160T
FFG676
XC7VX330T
FFG1157
XC7K160T
FBG484
XC7VX415T
FFG1158
XC7K160T
FBG676
XC7VX415T
FFG1157
XC7K325T
FBG676
XC7VX415T
FFG1927
XC7K325T
FBG900
XC7Z030
FBG484
XC7K325T
FFG900
XC7Z030
FBG676
XC7K325T
FFG676
XC7Z030
FFG676
XC7K355T
FFG901
XC7Z030
SBG485
XC7K410T
FBG900
XC7Z035
FFG900
XC7K410T
FFG900
XC7Z035
FFG676
XC7K410T
FBG676
XC7Z035
FBG676
XC7K410T
FFG676
XC7Z045
FFG900
XC7K420T
FFG1156
XC7Z045
FFG676
XC7K420T
FFG901
XC7Z045
FBG676
XC7K480T
FFG1156
XC7Z100
FFG1156
XC7K480T
FFG901
XC7Z100
FFG900
XC7K70T
FBG676
Key Dates and Ordering Information
Xilinx will begin cross-shipping the new material set for bumps, substrate, and underfill on July 1, 2017.
Traceability
To enable traceability, any products with “G” packages shipped that use the new lead-free material set will be
marked with a special Pb-Free character in the upper right corner of the part as shown in Figure 1 below. There
will be no mark for the eutectic material set. Marking changes are reflected in the product documents UG475,
UG865, UG365 and UG195, available on www.xilinx.com.
XCN16022 (v1.0) October 31, 2016
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Cross-ship of Lead-free Bump & Substrates in Lead-free (FFG/FBG/SBG) Packages
XILINX®
KINTEX-7
XC7K325T™
FFG676ABC1519
CF1234567A
2E
Indicates Full Lead Free Compliant
(RoHS 6/6) Material Set
Taiwan
KKN2W1.00 CF1234567A 1519
Figure 1: Package Topmark
Note: Refer to XCN16014 for 2D barcode additional marking.
Qualification Data
Qualification data will be available and provided upon request.
Response
No response is required. For additional information or questions, please contact Xilinx Technical Support.
Important Notice: Xilinx Customer Notifications (XCNs, XDNs, and Quality Alerts) can be delivered via e-mail
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Revision History
The following table shows the revision history for this document.
Date
Version
Revision
10/31/16
4
1.0
Initial release.
www.xilinx.com
XCN16022 (v1.0) October 31, 2016
Cross-ship of Lead-free Bump & Substrates in Lead-free (FFG/FBG/SBG) Packages
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XCN16022 (v1.0) October 31, 2016
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