UltraScale Architecture and
Product Data Sheet: Overview
DS890 (v4.1.1) February 7, 2022
Product Specification
General Description
Xilinx® UltraScale™ architecture comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of
system requirements with a focus on lowering total power consumption through numerous innovative technological
advancements.
Artix® UltraScale+ FPGAs: Highest serial bandwidth and signal compute density in a cost-optimized device for critical
networking applications, vision and video processing, and secured connectivity.
Kintex® UltraScale FPGAs: High-performance FPGAs with a focus on price/performance, using both monolithic and
next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation
transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.
Kintex UltraScale+™ FPGAs: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of
high-performance peripherals and cost-effective system implementation. Kintex UltraScale+ FPGAs have numerous power
options that deliver the optimal balance between the required system performance and the smallest power envelope.
Virtex® UltraScale FPGAs: High-capacity, high-performance FPGAs enabled using both monolithic and next-generation SSI
technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance to address key market and
application requirements through integration of various system-level functions.
Virtex UltraScale+ FPGAs: The highest transceiver bandwidth, highest DSP count, and highest on-chip and in-package memory
available in the UltraScale architecture. Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal
balance between the required system performance and the smallest power envelope.
Zynq® UltraScale+ MPSoCs: Combine the Arm® v8-based Cortex®-A53 high-performance energy-efficient 64-bit application
processor with the Arm Cortex-R5F real-time processor and the UltraScale architecture to create the industry's first
programmable MPSoCs. Provide unprecedented power savings, heterogeneous processing, and programmable acceleration.
Zynq® UltraScale+ RFSoCs: Combine RF data converter subsystem and forward error correction with industry-leading
programmable logic and heterogeneous processing capability. Integrated RF-ADCs, RF-DACs, and soft decision FECs (SD-FEC)
provide the key subsystems for multiband, multi-mode cellular radios and cable infrastructure.
Family Comparisons
Table 1: Device Resources
Artix
UltraScale+
FPGA
Kintex
UltraScale
FPGA
Kintex
UltraScale+
FPGA
Virtex
UltraScale
FPGA
Virtex
UltraScale+
FPGA
MPSoC Processing System
Zynq
UltraScale+
MPSoC
Zynq
UltraScale+
RFSoC
✓
✓
RF-ADC/DAC
✓
SD-FEC
System Logic Cells (K)
Block Memory (Mb)
✓
96–308
318–1,451
356–1,843
783–5,541
862–8,938
81–1,143
489–930
3.5–10.5
12.7–75.9
12.7–60.8
44.3–132.9
23.6–94.5
3.8–34.6
22.8–38.0
90–360
0–36
13.5–45.0
0–81
UltraRAM (Mb)
0–16
HBM DRAM (GB)
DSP (Slices)
400–1,200
768–5,520
1,368–3,528
600–2,880
1,320–12,288
216–3,528
1,872–4,272
DSP Performance (GMAC/s)
1,860
8,180
6,287
4,268
21,897
6,287
7,613
Transceivers
8–12
12–64
16–76
36–120
32–128
0–72
8–16
Max. Transceiver Speed (Gb/s)
16.3
16.3
32.75
30.5
58.0
32.75
32.75
Max. Serial BW (bidir) (Gb/s)
393
2,086
3,268
5,616
8,384
3,268
1,048
Memory Interface Perf (Mb/s)
2,400
2,400
2,666
2,400
2,666
2,666
2,666
128–304
312–832
280–668
338–1,456
208–2,072
82–668
152–408
I/O Pins
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UltraScale Architecture and Product Data Sheet: Overview
Summary of Features
RF Data Converter Subsystem Overview
Most Zynq UltraScale+ RFSoCs include an RF data converter subsystem, which contains multiple radio
frequency analog to digital converters (RF-ADCs) and multiple radio frequency digital to analog
converters (RF-DACs). The high-precision, high-speed, power efficient RF-ADCs and RF-DACs can be
individually configured for real data or in most cases can be configured in pairs for real and imaginary I/Q
data. See RF-ADCs and RF-DACs sections.
Soft Decision Forward Error Correction (SD-FEC) Overview
Some Zynq UltraScale+ RFSoCs include highly flexible soft decision FEC blocks for decoding and encoding
data as a means to control errors in data transmission over unreliable or noisy communication channels.
The SD-FEC blocks support low-density parity check (LDPC) decode/encode and Turbo decode for use in
5G wireless, backhaul, DOCSIS, and LTE applications.
Processing System Overview
Zynq UltraScale+ MPSoCs and RFSoCs feature dual and quad core variants of the Arm Cortex-A53 (APU)
with dual-core Arm Cortex-R5F (RPU) processing system (PS). Some devices also include a dedicated Arm
Mali™-400 MP2 graphics processing unit (GPU). See Table 2.
Table 2: Zynq UltraScale+ MPSoC and RFSoC Device Features
MPSoC
RFSoC
CG Devices
EG Devices
EV Devices
DR Devices
APU
Dual-core Arm Cortex-A53
Quad-core Arm Cortex-A53
Quad-core Arm Cortex-A53
Quad-core Arm Cortex-A53
RPU
Dual-core Arm Cortex-R5F
Dual-core Arm Cortex-R5F
Dual-core Arm Cortex-R5F
Dual-core Arm Cortex-R5F
GPU
–
Mali-400MP2
Mali-400MP2
–
VCU
–
–
H.264/H.265
–
To support the processors' functionality, a number of peripherals with dedicated functions are included in
the PS. For interfacing to external memories for data or configuration storage, the PS includes a
multi-protocol dynamic memory controller, a DMA controller, a NAND controller, an SD/eMMC controller
and a Quad SPI controller. In addition to interfacing to external memories, the APU also includes a Level-1
(L1) and Level-2 (L2) cache hierarchy; the RPU includes an L1 cache and Tightly Coupled memory
subsystem. Each has access to a 256KB on-chip memory.
For high-speed interfacing, the PS includes 4 channels of transmit (TX) and receive (RX) pairs of
transceivers, called PS-GTR transceivers, supporting data rates of up to 6.0Gb/s. These transceivers can
interface to the high-speed peripheral blocks that support PCIe at 5.0GT/s (Gen 2) as a root complex or
Endpoint in x1, x2, or x4 configurations; Serial-ATA (SATA) at 1.5Gb/s, 3.0Gb/s, or 6.0Gb/s data rates; and
up to two lanes of Display Port at 1.62Gb/s, 2.7Gb/s, or 5.4Gb/s data rates. The PS-GTR transceivers can
also interface to components over USB 3.0 and Serial Gigabit Media Independent Interface (SGMII).
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UltraScale Architecture and Product Data Sheet: Overview
For general connectivity, the PS includes: a pair of USB 2.0 controllers, which can be configured as host,
device, or On-The-Go (OTG); an I2C controller; a UART; and a CAN2.0B controller that conforms to
ISO11898-1. There are also four triple speed Ethernet MACs and 128 bits of GPIO, of which 78 bits are
available through the MIO and 96 through the EMIO.
High-bandwidth connectivity based on the Arm AMBA® AXI4 protocol connects the processing units with
the peripherals and provides interface between the PS and the programmable logic (PL).
For additional information, go to: DS891, Zynq UltraScale+ MPSoC Overview.
I/O, Transceiver, PCIe, 100G Ethernet, and 150G Interlaken
Data is transported on and off chip through a combination of the high-performance parallel SelectIO™
interface and high-speed serial transceiver connectivity. I/O blocks provide support for cutting-edge
memory interface and network protocols through flexible I/O standard and voltage support. The serial
transceivers in the UltraScale architecture-based devices transfer data up to 58.0Gb/s, enabling 25G+
backplane designs with dramatically lower power per bit than previous generation transceivers. All
transceivers, except the PS-GTR, support the required data rates for 8.0GT/s (Gen3), and 16.0GT/s (Gen4)
for PCIe. The integrated blocks for PCIe can be configured for Endpoint or Root Port, supporting a variety
of link widths and speeds depending on the targeted device speed grade and package. Integrated blocks
for 150Gb/s Interlaken and 100Gb/s Ethernet (100G MAC/PCS) extend the capabilities of UltraScale
devices, enabling simple, reliable support for Nx100G switch and bridge applications. Virtex UltraScale+
HBM devices include Cache Coherent Interconnect for Accelerators (CCIX) ports for coherently sharing data
with different processors.
Clocks and Memory Interfaces
UltraScale devices contain powerful clock management circuitry, including clock synthesis, buffering, and
routing components that together provide a highly capable framework to meet design requirements. The
clock network allows for extremely flexible distribution of clocks to minimize the skew, power
consumption, and delay associated with clock signals. The clock management technology is tightly
integrated with dedicated memory interface circuitry to enable support for high-performance external
memories, including DDR4. In addition to parallel memory interfaces, UltraScale devices support serial
memories, such as hybrid memory cube (HMC).
Routing, SSI, Logic, Storage, and Signal Processing
Configurable Logic Blocks (CLBs) containing 6-input look-up tables (LUTs) and flip-flops, DSP slices with
27x18 multipliers, 36Kb block RAMs with built-in FIFO and ECC support, and 4Kx72 UltraRAM blocks (in
UltraScale+ devices) are all connected with an abundance of high-performance, low-latency interconnect.
In addition to logical functions, the CLB provides shift register, multiplexer, and carry logic functionality as
well as the ability to configure the LUTs as distributed memory to complement the highly capable and
configurable block RAMs. The DSP slice, with its 96-bit-wide XOR functionality, 27-bit pre-adder, and
30-bit A input, performs numerous independent functions including multiply accumulate, multiply add,
and pattern detect. In addition to the device interconnect, in devices using SSI technology, signals can
cross between super-logic regions (SLRs) using dedicated, low-latency interface tiles. These combined
routing resources enable easy support for next-generation bus data widths. Virtex UltraScale+ HBM
devices include up to 16GB of high bandwidth memory.
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UltraScale Architecture and Product Data Sheet: Overview
Configuration, Encryption, and System Monitoring
The configuration and encryption block performs numerous device-level functions critical to the
successful operation of the FPGA, MPSoC, or RFSoC. This high-performance configuration block enables
device configuration from external media through various protocols, including PCIe, often with no
requirement to use multi-function I/O pins during configuration. The configuration block also provides
256-bit AES-GCM decryption capability at the same performance as unencrypted configuration.
Additional features include SEU detection and correction, partial reconfiguration support, and
battery-backed RAM or eFUSE technology for AES key storage to provide additional security. The System
Monitor enables the monitoring of the physical environment via on-chip temperature and supply sensors
and can also monitor up to 17 external analog inputs. With Zynq UltraScale+ MPSoCs and RFSoCs, the
device is booted via the Configuration and Security Unit (CSU), which supports secure boot via the 256-bit
AES-GCM and SHA/384 blocks. The cryptographic engines in the CSU can be used after boot for user
encryption.
Migrating Devices
UltraScale and UltraScale+ families provide footprint compatibility to enable users to migrate designs
from one device or family to another. Any two packages with the same footprint identifier code are
footprint compatible. For example, Kintex UltraScale devices in the A1156 packages are footprint
compatible with Kintex UltraScale+ devices in the A1156 packages. Likewise, Virtex UltraScale devices in
the B2104 packages are compatible with Virtex UltraScale+ devices and Kintex UltraScale devices in the
B2104 packages. All valid device/package combinations are provided in the Device-Package Combinations
and Maximum I/Os tables in this document. Refer to UG583, UltraScale Architecture PCB Design User Guide
for more detail on migrating between UltraScale and UltraScale+ devices and packages.
DS890 (v4.1.1) February 7, 2022
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4
UltraScale Architecture and Product Data Sheet: Overview
Artix UltraScale+ FPGA Feature Summary
Table 3: Artix UltraScale+ FPGA Feature Summary
AU10P
AU15P
AU20P
AU25P
System Logic Cells
96,250
170,100
238,437
308,437
CLB Flip-Flops
88,000
155,520
218,000
282,000
CLB LUTs
44,000
77,760
109,000
141,000
Max. Distributed RAM (Mb)
1.0
2.5
3.2
4.7
Block RAM Blocks
100
144
200
300
Block RAM (Mb)
3.5
5.1
7.0
10.5
UltraRAM Blocks
–
–
–
–
UltraRAM (Mb)
–
–
–
–
CMTs (1 MMCM and 2 PLLs)
3
3
3
4
Max. HP
I/O(1)
156
156
156
208
Max. HD
I/O(2)
72
72
72
96
400
576
900
1,200
1
1
1
1
GTH Transceiver 16.375Gb/s(3)
12
12
–
–
GTY Transceivers 16.375Gb/s(3)
–
–
12
12
Transceiver Fractional PLLs
6
6
6
6
PCIE4
–
–
1
1
PCIE4C(4)
1
1
–
–
DSP Slices
System Monitor
Notes:
1.
2.
3.
4.
HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.
GTH and GTY transceiver line rates are package limited: SFVB784, SBVB484, and UBVA368 to 12.5Gb/s. See Table 8. 12.5Gb/s
operation in UBVA368 package is pending characterization.
This block operates in compatibility mode for 16.0GT/s (Gen4) operation. Go to PG213, UltraScale+ Devices Integrated
Block for PCI Express Product Guide, for details on compatibility mode.
Artix UltraScale+ Device-Package Combinations and Maximum I/Os
Table 4: Artix UltraScale+ Device-Package Combinations and Maximum I/Os
Package Dimensions
(mm)
AU10P
UBVA368
11.5x9.5
24, 104, 8, 0
24, 104, 8, 0
SBVB484
19x19
48, 156, 12, 0
48, 156, 12, 0
72, 156, 12, 0
72, 156, 12, 0
Package
(1)(2)(3)
SFVB784
23x23
FFVB676
27x27
AU15P
AU20P
AU25P
HD I/O, HP I/O, GTH, GTY
72, 156, 0, 12
96, 208, 0, 12
72, 156, 0, 12
72, 208, 0, 12
Notes:
1. Go to Ordering Information for package designation details.
2. FF packages have 1.0mm ball pitch. SB/SF packages have 0.8mm ball pitch. UB packages have 0.5mm ball pitch.
3. Packages with the same last letter and number sequence, e.g., B676, are footprint compatible with all other UltraScale
architecture-based devices with the same sequence. The footprint compatible devices within this family are outlined. See the
UltraScale Architecture Product Selection Guide for details on inter-family migration.
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5
UltraScale Architecture and Product Data Sheet: Overview
Kintex UltraScale FPGA Feature Summary
Table 5: Kintex UltraScale FPGA Feature Summary
KU025(1)
KU035
KU040
KU060
KU085
KU095
KU115
System Logic Cells
318,150
444,343
530,250
725,550
1,088,325
1,176,000
1,451,100
CLB Flip-Flops
290,880
406,256
484,800
663,360
995,040
1,075,200
1,326,720
CLB LUTs
145,440
203,128
242,400
331,680
497,520
537,600
663,360
Maximum Distributed RAM (Mb)
4.1
5.9
7.0
9.1
13.4
4.7
18.3
Block RAM Blocks
360
540
600
1,080
1,620
1,680
2,160
Block RAM (Mb)
12.7
19.0
21.1
38.0
56.9
59.1
75.9
6
10
10
12
22
16
24
24
40
40
48
56
64
64
208
416
416
520
572
650
676
CMTs (1 MMCM, 2 PLLs)
I/O DLLs
Maximum HP
I/Os(2)
Maximum HR
I/Os(3)
104
104
104
104
104
52
156
1,152
1,700
1,920
2,760
4,100
768
5,520
System Monitor
1
1
1
1
2
1
2
PCIe Gen3 x8
1
2
3
3
4
4
6
DSP Slices
150G Interlaken
0
0
0
0
0
2
0
100G Ethernet
0
0
0
0
0
2
0
12
16
20
32
56
32
64
0
0
0
0
0
32
0
0
0
0
0
0
16
0
GTH 16.3Gb/s Transceivers(4)
GTY 16.3Gb/s
Transceivers(5)
Transceiver Fractional PLLs
Notes:
1.
2.
3.
4.
5.
Certain advanced configuration features are not supported in the KU025. Refer to the Configuring FPGAs section for details.
HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
HR = High-range I/O with support for I/O voltage from 1.2V to 3.3V.
GTH transceivers in SF/FB packages support data rates up to 12.5Gb/s. See Table 6.
GTY transceivers in Kintex UltraScale devices support data rates up to 16.3Gb/s. See Table 6.
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UltraScale Architecture and Product Data Sheet: Overview
Kintex UltraScale Device-Package Combinations and Maximum I/Os
Table 6: Kintex UltraScale Device-Package Combinations and Maximum I/Os
KU025
KU035
KU040
KU060
KU085
KU095
KU115
HR, HP
GTH
HR, HP
GTH
HR, HP
GTH
HR, HP
GTH
HR, HP
GTH
HR, HP
GTH, GTY(4)
HR, HP
GTH
23x23
104, 364
8
104, 364
8
FBVA676(5)
27x27
104, 208
16
104, 208
16
FBVA900(5)
31x31
104, 364
16
104, 364
16
FFVA1156
35x35
104, 416
16
104, 416
20
FFVA1517
40x40
FLVA1517
40x40
FFVC1517
40x40
FLVD1517
40x40
FFVB1760
42.5x42.5
FLVB1760
42.5x42.5
FLVD1924
45x45
FLVF1924
45x45
FLVA2104
47.5x47.5
FFVB2104
47.5x47.5
FLVB2104
47.5x47.5
Package
(1)(2)(3)
Package
Dimensions
(mm)
SFVA784(5)
104, 208
12
104, 416
28
52, 468
20, 8
104, 520
32
104, 520
48
104, 520
48
52, 468
20, 20
104, 234
64
52, 650
32, 16
104, 572
44
104, 598
52
156, 676
52
104, 520
56
104, 624
64
156, 676
52
52, 650
32, 32
104, 598
64
Notes:
1. Go to Ordering Information for package designation details.
2. FB/FF/FL packages have 1.0mm ball pitch. SF packages have 0.8mm ball pitch.
3. Packages with the same last letter and number sequence, e.g., A2104, are footprint compatible with all other UltraScale
architecture-based devices with the same sequence. The footprint compatible devices within this family are outlined. See the
UltraScale Architecture Product Selection Guide for details on inter-family migration.
4. GTY transceivers in Kintex UltraScale devices support data rates up to 16.3Gb/s.
5. GTH transceivers in SF/FB packages support data rates up to 12.5Gb/s.
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UltraScale Architecture and Product Data Sheet: Overview
Kintex UltraScale+ FPGA Feature Summary
Table 7: Kintex UltraScale+ FPGA Feature Summary
KU3P
KU5P
KU9P
KU11P
KU13P
KU15P
KU19P
System Logic Cells
355,950
474,600
599,550
653,100
746,550
1,143,450
1,842,750
CLB Flip-Flops
325,440
433,920
548,160
597,120
682,560
1,045,440
1,684,800
CLB LUTs
162,720
216,960
274,080
298,560
341,280
522,720
842,400
Max. Distributed RAM (Mb)
4.7
6.1
8.8
9.1
11.3
9.8
11.6
Block RAM Blocks
360
480
912
600
744
984
1,728
Block RAM (Mb)
12.7
16.9
32.1
21.1
26.2
34.6
60.8
UltraRAM Blocks
48
64
0
80
112
128
288
13.5
18.0
0
22.5
31.5
36.0
81.0
UltraRAM (Mb)
CMTs (1 MMCM and 2 PLLs)
4
4
4
8
4
11
9
Max. HP
I/O(1)
208
208
208
416
208
572
468
Max. HD
I/O(2)
96
96
96
96
96
96
72
DSP Slices
1,368
1,824
2,520
2,928
3,528
1,968
1,080
System Monitor
1
1
1
1
1
1
1
GTH Transceiver 16.3Gb/s
0
0
28
32
28
44
0
16
16
0
20
0
32
32
Transceiver Fractional PLLs
8
8
14
26
14
38
16
PCIE4 (PCIe Gen3 x16)
1
1
0
4
0
5
0
PCIE4C (PCIe Gen3 x16 / Gen4
x8 / CCIX)(4)
0
0
0
0
0
0
3
150G Interlaken
0
0
0
1
0
4
0
100G Ethernet w/RS-FEC
0
1
0
2
0
4
1
GTY Transceivers 32.75Gb/s(3)
Notes:
1.
2.
3.
4.
HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.
GTY transceiver line rates are package limited: SFVB784 to 12.5Gb/s; FFVA676, FFVD900, and FFVA1156 to 16.3Gb/s. See
Table 8.
This block operates in compatibility mode for 16.0GT/s (Gen4) operation. Go to PG213, UltraScale+ Devices Integrated
Block for PCI Express Product Guide, for details on compatibility mode.
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UltraScale Architecture and Product Data Sheet: Overview
Kintex UltraScale+ Device-Package Combinations and Maximum I/Os
Table 8: Kintex UltraScale+ Device-Package Combinations and Maximum I/Os
Package
(1)(2)(4)
Package
Dimensions
(mm)
KU3P
KU5P
KU9P
KU11P
KU13P
KU15P
KU19P
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
SFVB784(3)
23x23
96, 208
0, 16
96, 208
0, 16
FFVA676(3)
27x27
48, 208
0, 16
48, 208
0, 16
FFVB676
27x27
72, 208
0, 16
72, 208
0, 16
FFVD900(3)
31x31
96, 208
0, 16
96, 208
0, 16
FFVE900
31x31
FFVA1156(3)
35x35
48, 416
20, 8
48, 468
20, 8
FFVE1517
40x40
96, 416
32, 20
96, 416
32, 24
FFVA1760
42.5x42.5
96, 416
44, 32
FFVE1760
42.5x42.5
96, 572
32, 24
FFVJ1760
42.5x42.5
72, 468
0, 32
FFVB2104
47.5x47.5
72, 468
0, 32
96, 312
16, 0
96, 208
28, 0
96, 208
28, 0
Notes:
1.
2.
3.
4.
Go to Ordering Information for package designation details.
FF packages have 1.0mm ball pitch. SF packages have 0.8mm ball pitch.
GTY transceiver line rates are package limited: SFVB784 to 12.5Gb/s; FFVA676, FFVD900, and FFVA1156 to 16.3Gb/s.
Packages with the same last letter and number sequence, e.g., A676, are footprint compatible with all other UltraScale
architecture-based devices with the same sequence. The footprint compatible devices within this family are outlined. See
the UltraScale Architecture Product Selection Guide for details on inter-family migration.
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Product Specification
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9
UltraScale Architecture and Product Data Sheet: Overview
Virtex UltraScale FPGA Feature Summary
Table 9: Virtex UltraScale FPGA Feature Summary
VU065
VU080
VU095
VU125
VU160
VU190
VU440
System Logic Cells
783,300
975,000
1,176,000
1,566,600
2,026,500
2,349,900
5,540,850
CLB Flip-Flops
716,160
891,424
1,075,200
1,432,320
1,852,800
2,148,480
5,065,920
CLB LUTs
358,080
445,712
537,600
716,160
926,400
1,074,240
2,532,960
4.8
3.9
4.8
9.7
12.7
14.5
28.7
1,260
1,421
1,728
2,520
3,276
3,780
2,520
44.3
50.0
60.8
88.6
115.2
132.9
88.6
Maximum Distributed RAM (Mb)
Block RAM Blocks
Block RAM (Mb)
CMT (1 MMCM, 2 PLLs)
10
16
16
20
28
30
30
I/O DLLs
40
64
64
80
120
120
120
Maximum HP I/Os(1)
468
780
780
780
650
650
1,404
Maximum HR I/Os(2)
52
52
52
104
52
52
52
DSP Slices
600
672
768
1,200
1,560
1,800
2,880
System Monitor
1
1
1
2
3
3
3
PCIe Gen3 x8
2
4
4
4
4
6
6
150G Interlaken
3
6
6
6
8
9
0
100G Ethernet
3
4
4
6
9
9
3
GTH 16.3Gb/s Transceivers
20
32
32
40
52
60
48
GTY 30.5Gb/s Transceivers
20
32
32
40
52
60
0
Transceiver Fractional PLLs
10
16
16
20
26
30
0
Notes:
1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
2. HR = High-range I/O with support for I/O voltage from 1.2V to 3.3V.
DS890 (v4.1.1) February 7, 2022
Product Specification
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10
UltraScale Architecture and Product Data Sheet: Overview
Virtex UltraScale Device-Package Combinations and Maximum I/Os
Table 10: Virtex UltraScale Device-Package Combinations and Maximum I/Os
Package
Dimensions
(mm)
VU065
VU080
VU095
VU125
VU160
VU190
VU440
Package(1)(2)(3)
HR, HP
GTH, GTY
HR, HP
GTH, GTY
HR, HP
GTH, GTY
HR, HP
GTH, GTY
HR, HP
GTH, GTY
HR, HP
GTH, GTY
HR, HP
GTH, GTY
FFVC1517
40x40
52, 468
20, 20
52, 468
20, 20
52, 468
20, 20
FFVD1517
40x40
52, 286
32, 32
52, 286
32, 32
FLVD1517
40x40
FFVB1760
42.5x42.5
FLVB1760
42.5x42.5
FFVA2104
47.5x47.5
FLVA2104
47.5x47.5
FFVB2104
47.5x47.5
FLVB2104
47.5x47.5
FLGB2104
47.5x47.5
52, 650
40, 36
52, 650
40, 36
FFVC2104
47.5x47.5
FLVC2104
47.5x47.5
FLGC2104
47.5x47.5
52, 364
52, 52
52, 364
52, 52
FLGB2377
50x50
FLGA2577
52.5x52.5
FLGA2892
55x55
52, 286
40, 32
52, 650
32, 16
52, 650
32, 16
52, 650
36, 16
52, 780
28, 24
52, 780
28, 24
52, 780
28, 24
52, 650
32, 32
52, 650
32, 32
52, 650
40, 36
52, 364
32, 32
52, 364
40, 40
52, 1248
36, 0
0, 448
60, 60
52, 1404
48, 0
Notes:
1.
2.
3.
Go to Ordering Information for package designation details.
All packages have 1.0mm ball pitch.
Packages with the same last letter and number sequence, e.g., A2104, are footprint compatible with all other UltraScale
architecture-based devices with the same sequence. The footprint compatible devices within this family are outlined. See the
UltraScale Architecture Product Selection Guide for details on inter-family migration.
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Product Specification
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11
UltraScale Architecture and Product Data Sheet: Overview
Virtex UltraScale+ FPGA Feature Summary
Table 11: Virtex UltraScale+ FPGA Feature Summary
VU3P
VU5P
VU7P
VU9P
VU11P
VU13P
VU19P
VU23P
VU27P
VU29P
862,050
1,313,763
1,724,100
2,586,150
2,835,000
3,780,000
8,937,600
2,252,250
2,835,000
3,780,000
CLB Flip-Flops
788,160
1,201,154
1,576,320
2,364,480
2,592,000
3,456,000
8,171,520
2,059,200
2,592,000
3,456,000
CLB LUTs
394,080
600,577
788,160
1,182,240
1,296,000
1,728,000
4,085,760
1,029,600
1,296,000
1,728,000
Max. Distributed RAM (Mb)
12.0
18.3
24.1
36.1
36.2
48.3
58.4
14.2
36.2
48.3
Block RAM Blocks
720
1,024
1,440
2,160
2,016
2,688
2,160
2,112
2,016
2,688
Block RAM (Mb)
25.3
36.0
50.6
75.9
70.9
94.5
75.9
74.3
70.9
94.5
UltraRAM Blocks
320
470
640
960
960
1,280
320
352
960
1,280
UltraRAM (Mb)
90.0
132.2
180.0
270.0
270.0
360.0
90.0
99.0
270.0
360.0
–
–
–
–
–
–
–
–
–
–
System Logic Cells
HBM DRAM (GB)
CMTs (1 MMCM and 2 PLLs)
10
20
20
30
12
16
40
11
16
16
Max. HP I/O(1)
520
832
832
832
624
832
1,976
572
676
676
Max. HD I/O(2)
0
0
0
0
0
0
96
72
0
0
2,280
3,474
4,560
6,840
9,216
12,288
3,840
1,320
9,216
12,288
DSP Slices
System Monitor
1
2
2
3
3
4
4
1
4
4
40
80
80
120
96
128
80
34
32
32
GTM Transceivers 58.0Gb/s
0
0
0
0
0
0
0
4
48
48
100G / 50G KP4 FEC
0
0
0
0
0
0
0
2/4
24/48
24/48
GTY Transceivers 32.75Gb/s(3)
Transceiver Fractional PLLs
20
40
40
60
48
64
40
20
40
40
PCIE4 (PCIe Gen3 x16)
2
4
4
6
3
4
0
0
1
1
PCIE4C (PCIe Gen3 x16 / Gen4 x8 /
CCIX)(4)
0
0
0
0
0
0
8
4
0
0
150G Interlaken
3
4
6
9
6
8
0
0
8
8
100G Ethernet w/RS-FEC
3
4
6
9
9
12
0
2
15
15
Notes:
1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
2. HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.
3. GTY transceivers in the FLGF1924 package support data rates up to 16.3Gb/s. See Table 12.
4.
This block operates in compatibility mode for 16.0GT/s (Gen4) operation. Go to PG213, UltraScale+ Devices Integrated Block for PCI Express Product Guide, for
details on compatibility mode.
DS890 (v4.1.1) February 7, 2022
Product Specification
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12
UltraScale Architecture and Product Data Sheet: Overview
Virtex UltraScale+ Device-Package Combinations and Maximum I/Os
Table 12: Virtex UltraScale+ Device-Package Combinations and Maximum I/Os
Package
(1)(2)(3)(4)(5)
Package
Dimensions
(mm)
VSVA1365
35x35
FFVC1517
40x40
FSVJ1760
42.5x42.5
FLGF1924(5)
VU3P
VU5P
VU7P
VU9P
VU11P
VU13P
VU19P
VU23P
VU27P
VU29P
HP, GTY
HP, GTY
HP, GTY
HP, GTY
HP, GTY
HP, GTY
HP, HD, GTY
HP, HD, GTY, GTM
HP, GTY, GTM
HP, GTY, GTM
676, 16, 30
676, 16, 30
448, 32, 48
448, 32, 48
364, 0, 34(7), 4
520, 40
572, 72, 34, 4
45x45
624, 64
FLVA2104
47.5x47.5
832, 52
832, 52
FLGA2104
47.5x47.5
FHGA2104
52.5x52.5(6)
FLVB2104
47.5x47.5
FLGB2104
47.5x47.5
FHGB2104
52.5x52.5(6)
FLVC2104
47.5x47.5
FLGC2104
47.5x47.5
FHGC2104
52.5x52.5(6)
FSGD2104
47.5x47.5
FIGD2104
52.5x52.5(6)
FLGA2577
52.5x52.5
FSGA2577
52.5x52.5
FSVA3824
65x65
1976, 96, 48
FSVB3824
65x65
1664, 96, 80
832, 52
832, 52
702, 76
702, 76
702, 76
572, 76
702, 76
416, 80
416, 80
416, 104
416, 96
416, 104
676, 76
572, 76
448, 120
448, 96
676, 76
448, 128
448, 128
Notes:
1. Go to Ordering Information for package designation details.
2. All packages have 1.0mm ball pitch.
3. Packages with the same last letter and number sequence, e.g., A2104, are footprint compatible with all other UltraScale architecture-based devices with the same sequence.
The footprint compatible devices within this family are outlined. See the UltraScale Architecture Product Selection Guide for details on inter-family migration.
4. Consult UG583, UltraScale Architecture PCB Design User Guide for specific migration details.
5. GTY transceivers in the FLGF1924 package support data rates up to 16.3Gb/s.
6. These 52.5x52.5mm overhang packages have the same PCB ball footprint as the corresponding 47.5x47.5mm packages (i.e., the same last letter and number sequence) and
are footprint compatible.
7. GTYs in quads 224-230 and 232 are limited to 16Gb/s.
DS890 (v4.1.1) February 7, 2022
Product Specification
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13
UltraScale Architecture and Product Data Sheet: Overview
Table 13: Virtex UltraScale+ HBM FPGA Feature Summary
VU31P
VU33P
VU35P
VU37P
VU45P
VU47P
VU57P
System Logic Cells
961,800
961,800
1,906,800
2,851,800
1,906,800
2,851,800
2,851,800
CLB Flip-Flops
879,360
879,360
1,743,360
2,607,360
1,743,360
2,607,360
2,607,360
CLB LUTs
439,680
439,680
871,680
1,303,680
871,680
1,303,680
1,303,680
Max. Distributed RAM (Mb)
12.5
12.5
24.6
36.7
24.6
36.7
36.7
Block RAM Blocks
672
672
1,344
2,016
1,344
2,016
2,016
Block RAM (Mb)
23.6
23.6
47.3
70.9
47.3
70.9
70.9
UltraRAM Blocks
320
320
640
960
640
960
960
UltraRAM (Mb)
90.0
90.0
180.0
270.0
180.0
270.0
270.0
HBM DRAM (GB)
4
8
8
8
16
16
16
CMTs (1 MMCM and 2 PLLs)
4
4
8
12
8
12
12
208
208
416
624
416
624
624
2,880
2,880
5,952
9,024
5,952
9,024
9,024
1
1
2
3
2
3
3
32
32
64
96
64
96
32
0
0
0
0
0
0
32
Max. HP
I/O(1)
DSP Slices
System Monitor
GTY Transceivers 32.75Gb/s(2)
GTM Transceivers 58.0Gb/s
100G / 50G KP4 FEC
0
0
0
0
0
0
16/32
16
16
32
48
32
48
32
PCIE4 (PCIe Gen3 x16)
0
0
1
2
1
2
0
PCIE4C (PCIe Gen3 x16 /
Gen4 x8 / CCIX)(3)
4
4
4
4
4
4
4
Transceiver Fractional PLLs
150G Interlaken
–
–
2
4
2
4
4
100G Ethernet w/RS-FEC
2
2
5
8
5
8
10
Notes:
1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
2. GTY transceivers in the FLGF1924 package support data rates up to 16.3Gb/s. See Table 14.
3.
This block operates in compatibility mode for 16.0GT/s (Gen4) operation. Go to PG213, UltraScale+ Devices Integrated
Block for PCI Express Product Guide, for details on compatibility mode.
Virtex UltraScale+ HBM Device-Package Combinations and Maximum I/Os
Table 14: Virtex UltraScale+ HBM Device-Package Combinations and Maximum I/Os
Package
Dimensions
(mm)
VU31P
VU33P
VU35P
VU37P
VU45P
VU47P
VU57P
HP, GTY
HP, GTY
HP, GTY
HP, GTY
HP, GTY
HP, GTY
HP, GTY, GTM
FSVH1924
45x45
208, 32
FSVH2104
47.5x47.5
208, 32
416, 64
FSVH2892
55x55
FSVK2892
55x55
Package
(1)(2)(3)(4)
416, 64
416, 64
624, 96
416, 64
624, 96
624, 32, 32
Notes:
1. Go to Ordering Information for package designation details.
2. All packages have 1.0mm ball pitch.
3. Packages with the same last letter and number sequence, e.g., A2104, are footprint compatible with all other UltraScale
architecture-based devices with the same sequence. The footprint compatible devices within this family are outlined. See the
UltraScale Architecture Product Selection Guide for details on inter-family migration.
4. Consult UG583, UltraScale Architecture PCB Design User Guide for specific migration details.
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14
UltraScale Architecture and Product Data Sheet: Overview
Zynq UltraScale+ MPSoC: CG Device Feature Summary
Table 15: Zynq UltraScale+ MPSoC: CG Device Feature Summary
(3)
ZU1CG
ZU2CG
ZU3CG
ZU4CG
ZU5CG
ZU6CG
ZU7CG
ZU9CG
Application Processing Unit
Dual-core Arm Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point; 32KB/32KB L1 Cache, 1MB L2 Cache
Real-Time Processing Unit
Dual-core Arm Cortex-R5F with CoreSight; Single/Double Precision Floating Point;
32KB/32KB L1 Cache, and TCM
Embedded and External
Memory
256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3;
External Quad-SPI; NAND; eMMC
General Connectivity
214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple Timer Counters
High-Speed Connectivity
4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII
System Logic Cells
81,900
103,320
154,350
192,150
256,200
469,446
504,000
599,550
CLB Flip-Flops
74,880
94,464
141,120
175,680
234,240
429,208
460,800
548,160
CLB LUTs
37,440
47,232
70,560
87,840
117,120
214,604
230,400
274,080
Distributed RAM (Mb)
1.0
1.2
1.8
2.6
3.5
6.9
6.2
8.8
Block RAM Blocks
108
150
216
128
144
714
312
912
Block RAM (Mb)
3.8
5.3
7.6
4.5
5.1
25.1
11.0
32.1
UltraRAM Blocks
0
0
0
48
64
0
96
0
UltraRAM (Mb)
DSP Slices
CMTs
0
0
0
13.5
18.0
0
27.0
0
216
240
360
728
1,248
1,973
1,728
2,520
3
3
3
4
4
4
8
4
Max. HP
I/O(1)
156
156
156
156
156
208
416
208
Max. HD
I/O(2)
24
96
96
96
96
120
48
120
System Monitor
1
2
2
2
2
2
2
2
GTH Transceiver 16.3Gb/s(3)
0
0
0
16
16
24
24
24
GTY Transceivers 32.75Gb/s
0
0
0
0
0
0
0
0
Transceiver Fractional PLLs
0
0
0
8
8
12
12
12
PCIE4 (PCIe Gen3 x16)
0
0
0
2
2
0
2
0
150G Interlaken
0
0
0
0
0
0
0
0
100G Ethernet w/ RS-FEC
0
0
0
0
0
0
0
0
Notes:
1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
2. HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.
3. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s. See Table 16.
DS890 (v4.1.1) February 7, 2022
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15
UltraScale Architecture and Product Data Sheet: Overview
Zynq UltraScale+: CG Device-Package Combinations and Maximum I/Os
Table 16: Zynq UltraScale+ MPSoC: CG Device-Package Combinations and Maximum I/Os
Package
(1)(2)(3)(4)(5)
Package
Dimensions
(mm)
ZU1CG
ZU2CG
ZU3CG
ZU4CG
ZU5CG
ZU6CG
ZU7CG
ZU9CG
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
24, 58
0, 0
24, 58
0, 0
96, 156
4, 0
96, 156
4, 0
48, 156
16, 0
48, 156
16, 0
24, 58
0, 0
UBVA494(6)
9.5x15
UBVA530(6)
9.5x16
SBVA484(6)
19x19
24, 58
0, 0
24, 58
0, 0
24, 58
0, 0
SFVA625
21x21
24, 156
0, 0
24, 156
0, 0
24, 156
0, 0
SFVC784(7)
23x23
24, 156
0, 0
96, 156
0, 0
96, 156
0, 0
FBVB900
31x31
FFVC900
31x31
48, 156
16, 0
48, 156
16, 0
FFVB1156
35x35
120, 208
24, 0
120, 208
24, 0
FFVC1156
35x35
48, 312
20, 0
FFVF1517
40x40
48, 416
24, 0
48, 156
16, 0
Notes:
1.
2.
3.
4.
5.
6.
7.
Go to Ordering Information for package designation details.
FB/FF packages have 1.0mm ball pitch. SB/SF packages have 0.8mm ball pitch. UB packages have 0.5mm ball pitch.
All device package combinations bond out 4 PS-GTR transceivers.
All device package combinations bond out 214 PS I/O except ZU1CG, ZU2CG, and ZU3CG in the UBVA494, UBVA530, SBVA484 and
SFVA625 packages, which bond out 170 PS I/Os. Packages that bond out 170 PS I/O support DDR 32-bit only.
Packages with the same last letter and number sequence, e.g., A484, are footprint compatible with all other UltraScale
architecture-based devices with the same sequence. The footprint compatible devices within this family are outlined.
All 58 HP I/O pins are powered by the same VCCO supply.
GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s.
DS890 (v4.1.1) February 7, 2022
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16
UltraScale Architecture and Product Data Sheet: Overview
Zynq UltraScale+ MPSoC: EG Device Feature Summary
Table 17: Zynq UltraScale+ MPSoC: EG Device Feature Summary
ZU1EG
ZU2EG
ZU3EG
ZU4EG
ZU5EG
ZU6EG
ZU7EG
ZU9EG
ZU11EG
ZU15EG
ZU17EG
ZU19EG
Application Processing Unit
Quad-core Arm Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point; 32KB/32KB L1 Cache, 1MB L2 Cache
Real-Time Processing Unit
Dual-core Arm Cortex-R5F with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1 Cache, and TCM
Embedded and External
Memory
256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3;
External Quad-SPI; NAND; eMMC
General Connectivity
214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple Timer Counters
High-Speed Connectivity
4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII
Graphic Processing Unit
Arm Mali-400 MP2; 64KB L2 Cache
System Logic Cells
81,900
103,320
154,350
192,150
256,200
469,446
504,000
599,550
653,100
746,550
926,194
1,143,450
CLB Flip-Flops
74,880
94,464
141,120
175,680
234,240
429,208
460,800
548,160
597,120
682,560
846,806
1,045,440
CLB LUTs
37,440
47,232
70,560
87,840
117,120
214,604
230,400
274,080
298,560
341,280
423,403
522,720
Distributed RAM (Mb)
1.0
1.2
1.8
2.6
3.5
6.9
6.2
8.8
9.1
11.3
8.0
9.8
Block RAM Blocks
108
150
216
128
144
714
312
912
600
744
796
984
Block RAM (Mb)
3.8
5.3
7.6
4.5
5.1
25.1
11.0
32.1
21.1
26.2
28.0
34.6
UltraRAM Blocks
0
0
0
48
64
0
96
0
80
112
102
128
UltraRAM (Mb)
0
0
0
13.5
18.0
0
27.0
0
22.5
31.5
28.7
36.0
216
240
360
728
1,248
1,973
1,728
2,520
2,928
3,528
1,590
1,968
DSP Slices
CMTs
3
3
3
4
4
4
8
4
8
4
11
11
Max. HP I/O(1)
156
156
156
156
156
208
416
208
416
208
572
572
Max. HD I/O(2)
24
96
96
96
96
120
48
120
96
120
96
96
System Monitor
1
2
2
2
2
2
2
2
2
2
2
2
16.3Gb/s(3)
0
0
0
16
16
24
24
24
32
24
44
44
GTY Transceivers 32.75Gb/s
0
0
0
0
0
0
0
0
16
0
28
28
Transceiver Fractional PLLs
0
0
0
8
8
12
12
12
24
12
36
36
PCIE4 (PCIe Gen3 x16)
0
0
0
2
2
0
2
0
4
0
4
5
GTH Transceiver
150G Interlaken
0
0
0
0
0
0
0
0
1
0
2
4
100G Ethernet w/ RS-FEC
0
0
0
0
0
0
0
0
2
0
2
4
Notes:
1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
2. HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.
3. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s. See Table 18.
DS890 (v4.1.1) February 7, 2022
Product Specification
www.xilinx.com
17
UltraScale Architecture and Product Data Sheet: Overview
Zynq UltraScale+ MPSoC: EG Device-Package Combinations and Maximum I/Os
Table 18: Zynq UltraScale+ MPSoC: EG Device-Package Combinations and Maximum I/Os
Package
(1)(2)(3)(4)(5)
Package
Dimensions
(mm)
ZU1EG
ZU2EG
ZU3EG
ZU4EG
ZU5EG
ZU6EG
ZU7EG
ZU9EG
ZU11EG
ZU15EG
ZU17EG
ZU19EG
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
24, 58
0, 0
24, 58
0, 0
96, 156
4, 0
96, 156
4, 0
48, 156
16, 0
48, 156
16, 0
72, 572
16, 0
72, 572
16, 0
96, 416
32, 16
96, 416
32, 16
24, 58
0, 0
UBVA494(6)
9.5x15
UVBA530(6)
9.5x16
SBVA484(6)
19x19
24, 58
0, 0
24, 58
0, 0
24, 58
0, 0
SFVA625
21x21
24, 156
0, 0
24, 156
0, 0
24, 156
0, 0
SFVC784(7)
23x23
24, 156
0, 0
96, 156
0, 0
96, 156
0, 0
FBVB900
31x31
FFVC900
31x31
48, 156
16, 0
48, 156
16, 0
48, 156
16, 0
FFVB1156
35x35
120, 208
24, 0
120, 208
24, 0
120, 208
24, 0
FFVC1156
35x35
FFVB1517
40x40
FFVF1517
40x40
FFVC1760
42.5x42.5
FFVD1760
42.5x42.5
48, 260
44, 28
48, 260
44, 28
FFVE1924
45x45
96, 572
44, 0
96, 572
44, 0
48, 156
16, 0
48, 312
20, 0
48, 312
20, 0
72, 416
16, 0
48, 416
24, 0
48, 416
32, 0
96, 416
32, 16
Notes:
1.
2.
3.
4.
5.
6.
7.
Go to Ordering Information for package designation details.
FB/FF packages have 1.0mm ball pitch. SB/SF packages have 0.8mm ball pitch. UB packages have 0.5mm ball pitch.
All device package combinations bond out 4 PS-GTR transceivers.
All device package combinations bond out 214 PS I/O except ZU1EG, ZU2EG, and ZU3EG in the UBVA494, UBVA530, SBVA484 and SFVA625 packages, which bond out 170 PS I/Os. Packages that bond
out 170 PS I/O support DDR 32-bit only.
Packages with the same last letter and number sequence, e.g., A484, are footprint compatible with all other UltraScale architecture-based devices with the same sequence. The footprint compatible
devices within this family are outlined.
All 58 HP I/O pins are powered by the same VCCO supply.
GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s.
DS890 (v4.1.1) February 7, 2022
Product Specification
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18
UltraScale Architecture and Product Data Sheet: Overview
Zynq UltraScale+ MPSoC: EV Device Feature Summary
Table 19: Zynq UltraScale+ MPSoC: EV Device Feature Summary
ZU4EV
ZU5EV
ZU7EV
Application Processing Unit
Quad-core Arm Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point;
32KB/32KB L1 Cache, 1MB L2 Cache
Real-Time Processing Unit
Dual-core Arm Cortex-R5F with CoreSight; Single/Double Precision Floating Point;
32KB/32KB L1 Cache, and TCM
Embedded and External
Memory
General Connectivity
256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3;
External Quad-SPI; NAND; eMMC
214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple
Timer Counters
High-Speed Connectivity
4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII
Graphic Processing Unit
Video Codec
Arm Mali-400 MP2; 64KB L2 Cache
1
1
1
System Logic Cells
192,150
256,200
504,000
CLB Flip-Flops
175,680
234,240
460,800
CLB LUTs
87,840
117,120
230,400
Distributed RAM (Mb)
2.6
3.5
6.2
Block RAM Blocks
128
144
312
Block RAM (Mb)
4.5
5.1
11.0
UltraRAM Blocks
48
64
96
UltraRAM (Mb)
13.5
18.0
27.0
DSP Slices
728
1,248
1,728
4
4
8
156
156
416
96
96
48
2
2
2
16
16
24
CMTs
Max. HP
I/O(1)
Max. HD I/O(2)
System Monitor
GTH Transceiver
16.3Gb/s(3)
GTY Transceivers 32.75Gb/s
0
0
0
Transceiver Fractional PLLs
8
8
12
PCIE4 (PCIe Gen3 x16)
2
2
2
150G Interlaken
0
0
0
100G Ethernet w/ RS-FEC
0
0
0
Notes:
1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
2. HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.
3. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s. See Table 20.
DS890 (v4.1.1) February 7, 2022
Product Specification
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19
UltraScale Architecture and Product Data Sheet: Overview
Zynq UltraScale+: EV Device-Package Combinations and Maximum I/Os
Table 20: Zynq UltraScale+ MPSoC: EV Device-Package Combinations and Maximum I/Os
Package
(1)(2)(3)(5)
Package
Dimensions
(mm)
ZU4EV
ZU5EV
ZU7EV
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
SFVC784(4)
23x23
96, 156
4, 0
96, 156
4, 0
FBVB900
31x31
48, 156
16, 0
48, 156
16, 0
FFVC1156
35x35
48, 312
20, 0
FFVF1517
40x40
48, 416
24, 0
48, 156
16, 0
Notes:
1.
2.
3.
4.
5.
Go to Ordering Information for package designation details.
FB/FF packages have 1.0mm ball pitch. SF packages have 0.8mm ball pitch.
All device package combinations bond out 4 PS-GTR transceivers.
Packages with the same last letter and number sequence, e.g., B900, are footprint compatible with all other UltraScale
architecture-based devices with the same sequence. The footprint compatible devices within this family are outlined.
GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s.
DS890 (v4.1.1) February 7, 2022
Product Specification
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20
UltraScale Architecture and Product Data Sheet: Overview
Zynq UltraScale+ RFSoC: Device Feature Summary
Table 21: Zynq UltraScale+ RFSoC Feature Summary
XCZU21DR XCZU25DR XCZU27DR XCZU28DR XCZU29DR XCZU39DR XCZU42DR XCZU43DR XCZU46DR XCZU47DR XCZU48DR XCZU49DR XCZU65DR XCZU67DR
12-bit
RF-ADC
w/ DDC
# of ADCs
0
8
8
8
16
16
–
–
–
–
–
–
–
–
Max Rate
(GSPS)
0
4.096
4.096
4.096
2.058
2.220
–
–
–
–
–
–
–
–
14-bit
RF-ADC
w/ DDC
# of ADCs
–
–
–
–
–
–
8
4
8
8
16
6
8
Max Rate
(GSPS)
–
–
–
–
–
–
2.5
5.0
5.0
5.0
2.5
5.9
2.95
14-bit
RF-DAC
w/ DUC
# of DACs
0
8
8
8
16
16
8
4
12
8
8
16
6
8
Max Rate
(GSPS)
0
6.554
6.554
6.554
6.554
6.554
9.85
9.85
9.85
9.85
9.85
9.85
10.0
10.0
SD-FEC
8
0
0
8
0
0
0
0
8
0
8
0
0
0
Digital Front End
–
–
–
–
–
–
–
–
–
–
–
–
Application
Processing Unit
2
4
8
5.0
5.0
2.5
2
5.9
Quad-core Arm Cortex-A53 MPCore with CoreSight™; NEON and Single/Double Precision Floating Point; 32KB/32KB L1 Cache, 1MB L2 Cache
Real-Time Processing Dual-core Arm Cortex-R5F with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1 Cache, and TCM
Unit
Embedded and
External Memory
256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3; External Quad-SPI; NAND; eMMC
General Connectivity
214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; Watchdog Timers; Triple Timer Counters
High-Speed
Connectivity
4 PS-GTR; PCIe® Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII
System Logic Cells
930,300
678,318
930,300
930,300
930,300
930,300
489,300
930,300
930,300
930,300
930,300
930,300
489,300
489,300
CLB Flip-Flops
850,560
620,176
850,560
850,560
850,560
850,560
447,360
850,560
850,560
850,560
850,560
850,560
447,360
447,360
CLB LUTs
425,280
310,088
425,280
425,280
425,280
425,280
223,680
425,280
425,280
425,280
425,280
425,280
223,680
223,680
13.0
9.6
13.0
13.0
13.0
13.0
6.8
13.0
13.0
13.0
13.0
13.0
6.9
6.9
1,080
792
1,080
1,080
1,080
1,080
648
1,080
1,080
1,080
1,080
1,080
648
648
Block RAM (Mb)
38.0
27.8
38.0
38.0
38.0
38.0
22.8
38.0
38.0
38.0
38.0
38.0
22.8
22.8
UltraRAM Blocks
80
48
80
80
80
80
160
80
80
80
80
80
160
160
22.5
13.5
22.5
22.5
22.5
22.5
45.0
22.5
22.5
22.5
22.5
22.5
45.0
45.0
4,272
3,145
4,272
4,272
4,272
4,272
1,872
4,272
4,272
4,272
4,272
4,272
1,872
1,872
8
6
8
8
8
8
5
8
8
8
8
8
5
5
Maximum HP I/O
208
299
299
299
312
312
130
299
312
299
299
312
130
130
Maximum HD I/O
72
48
48
48
96
96
24
48
48
48
48
96
24
24
2
2
2
2
2
2
2
2
2
2
2
2
2
2
16
8
16
16
16
16
8
16
16
16
16
16
8
8
Fractional PLLs
8
4
8
8
8
8
4
8
8
8
8
8
4
4
PCIe Gen3 x16
2
1
2
2
2
2
–
–
–
–
–
–
–
–
PCIe Gen3 x16 /
Gen4 x8 /CCIX
–
–
–
–
–
–
0
2
2
2
2
2
–
–
150G Interlaken
1
1
1
1
1
1
0
1
1
1
1
1
0
0
100G Ethernet w/
RS-FEC
2
1
2
2
2
2
1
2
2
2
2
2
1
1
Distributed RAM (Mb)
Block RAM Blocks
UltraRAM (Mb)
DSP Slices
CMTs
System Monitor
GTY Transceivers
DS890 (v4.1.1) February 7, 2022
Product Specification
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21
UltraScale Architecture and Product Data Sheet: Overview
Table 22: Zynq UltraScale+ RFSoC Device-Package Combinations and Maximum I/Os
ZU21DR
ZU25DR
ZU27DR
ZU28DR
ZU29DR
ZU39DR
ZU42DR
ZU47DR
ZU48DR
214
48, 104
4, 8
4, 4
214
48, 104
4, 8
8, 8
214
48, 104
4, 8
4, 4
214
48, 299
4, 16
8, 8
214
48, 299
4, 16
8, 8
Package
(1)
Dim.
(mm)
FFVD1156
35x35
FFVE1156
35x35
214
48, 104
4, 8
8, 8
214
48, 104
4, 8
8, 8
214
48, 104
4, 8
8, 8
214
24, 130
4, 8
10, 8
FSVE1156
35x35
214
48, 104
4, 8
8, 8
214
48, 104
4, 8
8, 8
214
48, 104
4, 8
8, 8
214
24, 130
4, 8
10, 8
FFVG1517
40x40
214
48, 299
4, 8
8, 8
214
48, 299
4, 16
8, 8
FSVG1517
40x40
214
48, 299
4, 8
8, 8
214
48, 299
4, 16
8, 8
ZU43DR
ZU46DR
ZU49DR
ZU65DR
ZU67DR
214
48, 104
4, 8
8, 8
214
24, 130
4, 8
6, 6
214
24, 130
4, 8
10, 8
214
48, 104
4, 8
8, 8
214
48, 104
4, 8
8, 8
214
24, 130
4, 8
6, 6
214
24, 130
4, 8
10, 8
214
48, 299
4, 16
4, 4
214
48, 299
4, 16
8, 8
214
48, 299
4, 16
8, 8
214
48, 299
4, 16
4, 4
214
48, 299
4, 16
8, 8
214
48, 299
4, 16
8, 8
PSIO
HDIO, HPIO
PS-GTR, GTY
RF-ADC, RF-DAC
214
72, 208
4, 16
0, 0
FFVF1760 42.5x42.5
214
96, 312
4, 16
16, 16
214
96, 312
4, 16
16, 16
214
96, 312
4, 16
16, 16
FSVF1760 42.5x42.5
214
96, 312
4, 16
16, 16
214
96, 312
4, 16
16, 16
214
96, 312
4, 16
16, 16
FFVH1760 42.5x42.5
214
48, 312
4, 16
12(2), 12
FSVH1760 42.5x42.5
214
48, 312
4, 16
12(2), 12
Notes:
1.
Packages with the same last letter and number sequence, e.g., B900, are footprint compatible with all other UltraScale architecture-based devices with the same sequence. The footprint compatible
devices within this family are outlined.
2.
Of these 12 RF-ADCs, 8 can operate up to 2.5 GSPS and 4 can operate up to 5.0 GSPS.
DS890 (v4.1.1) February 7, 2022
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22
UltraScale Architecture and Product Data Sheet: Overview
Device Layout
UltraScale devices are arranged in a column-and-grid layout. Columns of resources are combined in
different ratios to provide the optimum capability for the device density, target market or application, and
device cost. At the core of Zynq UltraScale+ MPSoCs and RFSoCs is the processing system that displaces
some of the full or partial columns of programmable logic resources. Figure 1 shows a device-level view
with resources grouped together. For simplicity, certain resources such as the processing system,
integrated blocks for PCIe, configuration logic, and System Monitor are not shown.
Transceivers
CLB, DSP, Block RAM
I/O, Clocking, Memory Interface Logic
CLB, DSP, Block RAM
I/O, Clocking, Memory Interface Logic
CLB, DSP, Block RAM
Transceivers
X-Ref Target - Figure 1
DS890_01_101712
Figure 1: FPGA with Columnar Resources
Resources within the device are divided into segmented clock regions. The height of a clock region is
60 CLBs. A bank of 52 I/Os, 24 DSP slices, 12 block RAMs, or 4 transceiver channels also matches the height
of a clock region. The width of a clock region is essentially the same in all cases, regardless of device size
or the mix of resources in the region, enabling repeatable timing results. Each segmented clock region
contains vertical and horizontal clock routing that span its full height and width. These horizontal and
vertical clock routes can be segmented at the clock region boundary to provide a flexible,
high-performance, low-power clock distribution architecture. Figure 2 is a representation of an FPGA
divided into regions.
X-Ref Target - Figure 2
Clock Region Width
Clock
Region
Height
For graphical representation only, does not represent a real device.
DS890_02_121014
Figure 2: Column-Based FPGA Divided into Clock Regions
DS890 (v4.1.1) February 7, 2022
Product Specification
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23
UltraScale Architecture and Product Data Sheet: Overview
RF Data Converter Subsystem
Zynq UltraScale+ RFSoCs contain an RF data converter subsystem consisting of multiple RF-ADCs and
RF-DACs.
RF-ADCs
The RF-ADCs can be configured individually for real input signals. RF-ADCs in all devices other than the
XCZU43DR can also be configured as a pair for I/Q input signals. The RF-ADC tile has one PLL and a
clocking instance. Decimation filters in the RF-ADCs can operate in varying decimation modes at 80% of
Nyquist bandwidth with 89dB stop-band attenuation. Each RF-ADC contains a 48-bit numerically
controlled oscillator (NCO) and a dedicated high-speed, high-performance, differential input buffer with
on-chip calibrated 100 termination.
RF-DACs
The RF-DACs can be configured individually for real outputs. RF-DACs in all devices other than the
XCZU43DR can also be configured as a pair for I/Q output signal generation. The RF-DAC tile has one PLL
and a clocking instance. Interpolation filters in the RF-DACs can operate in varying interpolation modes at
80% of Nyquist bandwidth with 89dB stop-band attenuation. Each RF-DAC contains a 48-bit NCO.
Soft Decision Forward Error Correction (SD-FEC)
Some members of the Zynq UltraScale+ RFSoC family contain integrated SD-FEC blocks capable of
encoding and decoding using LDPC codes and decoding using Turbo codes.
LDPC Decoding/Encoding
A range of quasi-cyclic codes can be configured over an AXI4-Lite interface. Code parameter memory can
be shared across up to 128 codes. Codes can be selected on a block-by-block basis with the encoder able
to reuse suitable decoder codes. The SD-FEC uses a normalized min-sum decoding algorithm with a
normalization factor programmable from 0.0625 to 1 in increments of 0.0625. There can be between 1 and
63 iterations for each codeword. Early termination is specified for each codeword to be none, one, or both
of the following:
Parity check passes
No change in hard information or parity bits since last operation
Soft or hard outputs are specified for each codeword to include information and optional parity with 6-bit
soft log-likelihood ratio (LLR) on inputs and 8-bit LLR on outputs.
DS890 (v4.1.1) February 7, 2022
Product Specification
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24
UltraScale Architecture and Product Data Sheet: Overview
Turbo Decoding
In Turbo mode, the SD-FEC can use the Max, Max Scale, or Max Star algorithms. When using the Max Scale
algorithm, the scale factor is programmable from 0.0625 to 1 in increments of 0.0625. There can be
between 1 and 63 iterations for each codeword, specified using the AXI4-Stream control interface. Early
termination is specified for each codeword to be none, one, or both of the following:
CRC passes
No change in hard decision since last iteration
Soft or hard outputs are specified for each codeword to include systematic and optionally parity 0 and
parity 1 with 8-bit soft LLR on inputs and outputs.
DS890 (v4.1.1) February 7, 2022
Product Specification
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25
UltraScale Architecture and Product Data Sheet: Overview
Processing System (PS)
Zynq UltraScale+ MPSoCs and RFSoCs consist of a PS coupled with programmable logic. The contents of
the PS varies between the different Zynq UltraScale+ devices. All devices contain an APU, an RPU, and
many peripherals for connecting the multiple processing engines to external components. The EG and EV
devices contain a GPU and the EV devices contain a video codec unit (VCU). The components of the PS are
connected together and to the PL through a multi-layered Arm AMBA AXI non-blocking interconnect that
supports multiple simultaneous master-slave transactions. Traffic through the interconnect can be
regulated by the quality of service (QoS) block in the interconnect. Twelve dedicated AXI 32-bit, 64-bit, or
128-bit ports connect the PL to high-speed interconnect and DDR in the PS via a FIFO interface.
There are four independently controllable power domains: the PL plus three within the PS (full power,
lower power, and battery power domains). Additionally, many peripherals support clock gating and power
gating to further reduce dynamic and static power consumption.
Application Processing Unit (APU)
The APU has a feature-rich dual-core or quad-core Arm Cortex-A53 processor. Cortex-A53 cores are
32-bit/64-bit application processors based on Arm-v8A architecture, offering the best
performance-to-power ratio. The Armv8 architecture supports hardware virtualization. Each of the
Cortex-A53 cores has: 32KB of instruction and data L1 caches, with parity and ECC protection respectively;
a NEON SIMD engine; and a single and double precision floating point unit. In addition to these blocks,
the APU consists of a snoop control unit and a 1MB L2 cache with ECC protection to enhance system-level
performance. The snoop control unit keeps the L1 caches coherent thus eliminating the need of spending
software bandwidth for coherency. The APU also has a built-in interrupt controller supporting virtual
interrupts. The APU communicates to the rest of the PS through 128-bit AXI coherent extension (ACE) port
via Cache Coherent Interconnect (CCI) block, using the System Memory Management Unit (SMMU). The
APU is also connected to the Programmable Logic (PL), through the 128-bit accelerator coherency port
(ACP), providing a low latency coherent port for accelerators in the PL. To support real-time debug and
trace, each core also has an Embedded Trace Macrocell (ETM) that communicates with the Arm
CoreSight™ Debug System.
Real-Time Processing Unit (RPU)
The RPU in the PS contains a dual-core Arm Cortex-R5F PS. Cortex-R5F cores are 32-bit real-time
processor cores based on Arm-v7R architecture. Each of the Cortex-R5F cores has 32KB of level-1 (L1)
instruction and data cache with ECC protection. In addition to the L1 caches, each of the Cortex-R5F cores
also has a 128KB tightly coupled memory (TCM) interface for real-time single cycle access. The RPU also
has a dedicated interrupt controller. The RPU can operate in either split or lock-step mode. In split mode,
both processors run independently of each other. In lock-step mode, they run in parallel with each other,
with integrated comparator logic, and the TCMs are used as 256KB unified memory. The RPU
communicates with the rest of the PS via the 128-bit AXI-4 ports connected to the low power domain
switch. It also communicates directly with the PL through 128-bit low latency AXI-4 ports. To support
real-time debug and trace each core also has an embedded trace macrocell (ETM) that communicates with
the Arm CoreSight Debug System.
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UltraScale Architecture and Product Data Sheet: Overview
External Memory
The PS can interface to many types of external memories through dedicated memory controllers. The
dynamic memory controller supports DDR3, DDR3L, DDR4, LPDDR3, and LPDDR4 memories. The
multi-protocol DDR memory controller can be configured to access a 2GB address space in 32-bit
addressing mode and up to 32GB in 64-bit addressing mode using a single or dual rank configuration of
8-bit, 16-bit, or 32-bit DRAM memories. Both 32-bit and 64-bit bus access modes are protected by ECC
using extra bits.
The SD/eMMC controller supports 1 and 4 bit data interfaces at low, default, high-speed, and
ultra-high-speed (UHS) clock rates. This controller also supports 1-, 4-, or 8-bit-wide eMMC interfaces that
are compliant to the eMMC 4.51 specification. eMMC is one of the primary boot and configuration modes
for Zynq UltraScale+ MPSoCs and RFSoCs and supports boot from managed NAND devices. The controller
has a built-in DMA for enhanced performance.
The Quad-SPI controller is one of the primary boot and configuration devices. It supports 4-byte and
3-byte addressing modes. In both addressing modes, single, dual-stacked, and dual-parallel
configurations are supported. Single mode supports a quad serial NOR flash memory, while in double
stacked and double parallel modes, it supports two quad serial NOR flash memories.
The NAND controller is based on ONFI3.1 specification. It has an 8-pin interface and provides 200Mb/s of
bandwidth in synchronous mode. It supports 24 bits of ECC thus enabling support for SLC NAND
memories. It has two chip-selects to support deeper memory and a built-in DMA for enhanced
performance.
General Connectivity
There are many peripherals in the PS for connecting to external devices over industry standard protocols,
including CAN2.0B, USB, Ethernet, I2C, and UART. Many of the peripherals support clock gating and power
gating modes to reduce dynamic and static power consumption.
USB 3.0/2.0
The pair of USB controllers can be configured as host, device, or On-The-Go (OTG). The core is compliant
to USB 3.0 specification and supports super, high, full, and low speed modes in all configurations. In host
mode, the USB controller is compliant with the Intel XHCI specification. In device mode, it supports up to
12 end points. While operating in USB 3.0 mode, the controller uses the serial transceiver and operates up
to 5.0Gb/s. In USB 2.0 mode, the Universal Low Peripheral Interface (ULPI) is used to connect the controller
to an external PHY operating up to 480Mb/s. The ULPI is also connected in USB 3.0 mode to support
high-speed operations.
Ethernet MAC
The four tri-speed ethernet MACs support 10Mb/s, 100Mb/s, and 1Gb/s operations. The MACs support
jumbo frames and time stamping through the interfaces based on IEEE Std 1588v2. The ethernet MACs can
be connected through the serial transceivers (SGMII), the MIO (RGMII), or through EMIO (GMII). The GMII
interface can be converted to a different interface within the PL.
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UltraScale Architecture and Product Data Sheet: Overview
High-Speed Connectivity
The PS includes four PS-GTR transceivers (transmit and receive), supporting data rates up to 6.0Gb/s and
can interface to the peripherals for communication over PCIe, SATA, USB 3.0, SGMII, and DisplayPort.
PCIe
The integrated block for PCIe is compliant with PCI Express base specification 2.1 and supports x1, x2, and
x4 configurations as root complex or end point, compliant to transaction ordering rules in both
configurations. It has built-in DMA, supports one virtual channel and provides fully configurable base
address registers.
SATA
Users can connect up to two external devices using the two SATA host port interfaces compliant to the
SATA 3.1 specification. The SATA interfaces can operate at 1.5Gb/s, 3.0Gb/s, or 6.0Gb/s data rates and are
compliant with advanced host controller interface (AHCI) version 1.3 supporting partial and slumber
power modes.
DisplayPort
The DisplayPort controller supports up to two lanes of source-only DisplayPort compliant with VESA
DisplayPort v1.2a specification (source only) at 1.62Gb/s, 2.7Gb/s, and 5.4Gb/s data rates. The controller
supports single stream transport (SST); video resolution up to 4Kx2K at a 30Hz frame rate; video formats
Y-only, YCbCr444, YCbCr422, YCbCr420, RGB, YUV444, YUV422, xvYCC, and pixel color depth of 6, 8, 10,
and 12 bits per color component.
Graphics Processing Unit (GPU)
The dedicated Arm Mali-400 MP2 GPU in the PS supports 2D and 3D graphics acceleration up to 1080p
resolution. The Mali-400 supports OpenGL ES 1.1 and 2.0 for 3D graphics and Open VG 1.1 standards for
2D vector graphics. It has a geometry processor (GP) and 2 pixel processors to perform tile rendering
operations in parallel. It has dedicated Memory management units for GP and pixel processors, which
supports 4 KB page size. The GPU also has 64KB level-2 (L2) read-only cache. It supports 4X and 16X Full
scene Anti-Aliasing (FSAA). It is fully autonomous, enabling maximum parallelization between APU and
GPU. It has built-in hardware texture decompression, allowing the texture to remain compressed (in ETC
format) in graphics hardware and decompress the required samples on the fly. It also supports efficient
alpha blending of multiple layers in hardware without additional bandwidth consumption. It has a pixel fill
rate of 2Mpixel/sec/MHz and a triangle rate of 0.1Mvertex/sec/MHz. The GPU supports extensive texture
format for RGBA 8888, 565, and 1556 in Mono 8, 16, and YUV formats. For power sensitive applications,
the GPU supports clock and power gating for each GP, pixel processors, and L2 cache. During power
gating, GPU does not consume any static or dynamic power; during clock gating, it only consumes static
power.
Video Codec Unit (VCU)
The video codec unit (VCU) provides multi-standard video encoding and decoding capabilities, including:
High Efficiency Video Coding (HEVC), i.e., H.265; and Advanced Video Coding (AVC), i.e., H.264 standards.
The VCU is capable of simultaneous encode and decode at rates up to 4Kx2K at 60 frames per second (fps)
(approx. 600Mpixel/sec) or 8Kx4K at a reduced frame rate (~15fps).
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UltraScale Architecture and Product Data Sheet: Overview
Input/Output
All UltraScale devices, whether FPGA, MPSoC, or RFSoCs, have I/O pins for communicating to external
components. In addition, in the PS, there are another 78 I/Os that the I/O peripherals use to communicate
to external components, referred to as multiplexed I/O (MIO). If more than 78 pins are required by the I/O
peripherals, the I/O pins in the PL can be used to extend the MPSoC or RFSoC interfacing capability,
referred to as extended MIO (EMIO).
The number of I/O pins in UltraScale FPGAs and in the programmable logic of Zynq UltraScale+ MPSoCs
and RFSoCs varies depending on device and package. Each I/O is configurable and can comply with a large
number of I/O standards. The I/Os are classed as high-range (HR), high-performance (HP), or high-density
(HD). The HR I/Os offer the widest range of voltage support, from 1.2V to 3.3V. The HP I/Os are optimized
for highest performance operation, from 1.0V to 1.8V. The HD I/Os are reduced-feature I/Os organized in
banks of 24, providing voltage support from 1.2V to 3.3V.
All I/O pins are organized in banks, with 52 HP or HR pins per bank or 24 HD pins per bank. Each bank has
one common V CCO output buffer power supply, which also powers certain input buffers. In addition, HR
banks can be split into two half-banks, each with their own V CCO supply. Some single-ended input buffers
require an internally generated or an externally applied reference voltage (VREF). VREF pins can be driven
directly from the PCB or internally generated using the internal V REF generator circuitry present in each
bank.
I/O Electrical Characteristics
Single-ended outputs use a conventional CMOS push/pull output structure driving High towards V CCO or
Low towards ground, and can be put into a high-Z state. The system designer can specify the slew rate and
the output strength. The input is always active but is usually ignored while the output is active. Each pin
can optionally have a weak pull-up or a weak pull-down resistor.
Most signal pin pairs can be configured as differential input pairs or output pairs. Differential input pin
pairs can optionally be terminated with a 100 internal resistor. All UltraScale devices support differential
standards beyond LVDS, including RSDS, BLVDS, differential SSTL, and differential HSTL. Each of the I/Os
supports memory I/O standards, such as single-ended and differential HSTL as well as single-ended and
differential SSTL. UltraScale+ families add support for MIPI with a dedicated D-PHY in the I/O bank.
3-State Digitally Controlled Impedance and Low Power I/O Features
The 3-state Digitally Controlled Impedance (T_DCI) can control the output drive impedance (series
termination) or can provide parallel termination of an input signal to VCCO or split (Thevenin) termination
to VCCO/2. This allows users to eliminate off-chip termination for signals using T_DCI. In addition to board
space savings, the termination automatically turns off when in output mode or when 3-stated, saving
considerable power compared to off-chip termination. The I/Os also have low power modes for IBUF and
IDELAY to provide further power savings, especially when used to implement memory interfaces.
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UltraScale Architecture and Product Data Sheet: Overview
I/O Logic
Input and Output Delay
All inputs and outputs can be configured as either combinatorial or registered. Double data rate (DDR) is
supported by all inputs and outputs. Any input or output can be individually delayed by up to 1,250ps of
delay with a resolution of 5–15ps. Such delays are implemented as IDELAY and ODELAY. The number of
delay steps can be set by configuration and can also be incremented or decremented while in use. The
IDELAY and ODELAY can be cascaded together to double the amount of delay in a single direction.
ISERDES and OSERDES
Many applications combine high-speed, bit-serial I/O with slower parallel operation inside the device. This
requires a serializer and deserializer (SerDes) inside the I/O logic. Each I/O pin possesses an IOSERDES
(ISERDES and OSERDES) capable of performing serial-to-parallel or parallel-to-serial conversions with
programmable widths of 2, 4, or 8 bits. These I/O logic features enable high-performance interfaces, such
as Gigabit Ethernet/1000BaseX/SGMII, to be moved from the transceivers to the SelectIO interface.
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UltraScale Architecture and Product Data Sheet: Overview
High-Speed Serial Transceivers
Serial data transmission between devices on the same PCB, over backplanes, and across even longer distances is becoming increasingly
important for scaling to 100Gb/s and 400Gb/s line cards. Specialized dedicated on-chip circuitry and differential I/O capable of coping with
the signal integrity issues are required at these high data rates.
Four types of transceivers are used in the UltraScale architecture: GTH, GTY, and GTM in FPGAs, GTH and GTY in the PL in MPSoCs and RFSoCs,
and PS-GTR in the PS of MPSoCs and RFSoCs. All transceivers are arranged in groups of four, known as a transceiver Quad. Each serial
transceiver is a combined transmitter and receiver. Table 23 compares the available transceivers.
Table 23: Transceiver Information
Artix
UltraScale+
Kintex UltraScale
Kintex
UltraScale+
Virtex UltraScale
Virtex
UltraScale+
Zynq UltraScale+
MPSoCs and RFSoCs
Type
GTH
GTY
GTH
GTY
GTH
GTY
GTH
GTY
GTY
GTM
PS-GTR
GTH
GTY
Qty
0–12
0–12
16–64
0–32
0–44
0–32
20–60
0–60
34–128
0–48
4
0–44
0–28
Max. Data
Rate
16.3Gb/s
16.3Gb/s
16.3Gb/s
16.3Gb/s
16.3Gb/s
32.75Gb/s
16.3Gb/s
30.5Gb/s
32.75Gb/s
58.0Gb/s
6.0Gb/s
16.3Gb/s
32.75Gb/s
Min. Data
Rate
0.5Gb/s
0.5Gb/s
0.5Gb/s
0.5Gb/s
0.5Gb/s
0.5Gb/s
0.5Gb/s
0.5Gb/s
0.5Gb/s
9.8Gb/s
1.25Gb/s
0.5Gb/s
0.5Gb/s
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UltraScale Architecture and Product Data Sheet: Overview
GTH/GTY Transceivers
The serial transmitter and receiver are independent circuits that use an advanced phase-locked loop (PLL)
architecture to multiply the reference frequency input by certain programmable numbers between 4 and
25 to become the bit-serial data clock. Each transceiver has a large number of user-definable features and
parameters. All of these can be defined during device configuration, and many can also be modified
during operation.
Transmitter (GTH/GTY)
The transmitter is fundamentally a parallel-to-serial converter with a conversion ratio of 16, 20, 32, 40, 64,
or 80 for the GTH and 16, 20, 32, 40, 64, 80, 128, or 160 for the GTY. This allows the designer to trade off
datapath width against timing margin in high-performance designs. These transmitter outputs drive the
PC board with a single-channel differential output signal. TXOUTCLK is the appropriately divided serial
data clock and can be used directly to register the parallel data coming from the internal logic. The
incoming parallel data is fed through an optional FIFO and has additional hardware support for the
8B/10B, 64B/66B, or 64B/67B encoding schemes to provide a sufficient number of transitions. The
bit-serial output signal drives two package pins with differential signals. This output signal pair has
programmable signal swing as well as programmable pre- and post-emphasis to compensate for PC board
losses and other interconnect characteristics. For shorter channels, the swing can be reduced to reduce
power consumption.
Receiver (GTH/GTY)
The receiver is fundamentally a serial-to-parallel converter, changing the incoming bit-serial differential
signal into a parallel stream of words, each 16, 20, 32, 40, 64, or 80 bits in the GTH or 16, 20, 32, 40, 64, 80,
128, or 160 for the GTY. This allows the designer to trade off internal datapath width against logic timing
margin. The receiver takes the incoming differential data stream, feeds it through programmable DC
automatic gain control, linear and decision feedback equalizers (to compensate for PC board, cable,
optical and other interconnect characteristics), and uses the reference clock input to initiate clock
recognition. There is no need for a separate clock line. The data pattern uses non-return-to-zero (NRZ)
encoding and optionally ensures sufficient data transitions by using the selected encoding scheme.
Parallel data is then transferred into the device logic using the RXUSRCLK clock. For short channels, the
transceivers offer a special low-power mode (LPM) to reduce power consumption by approximately 30%.
The receiver DC automatic gain control and linear and decision feedback equalizers can optionally
“auto-adapt” to automatically learn and compensate for different interconnect characteristics. This
enables even more margin for 10G+ and 25G+ backplanes.
Out-of-Band Signaling
The transceivers provide out-of-band (OOB) signaling, often used to send low-speed signals from the
transmitter to the receiver while high-speed serial data transmission is not active. This is typically done
when the link is in a powered-down state or has not yet been initialized. This benefits PCIe and SATA/SAS
and QPI applications.
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UltraScale Architecture and Product Data Sheet: Overview
GTM Transceivers
The serial transmitter and receiver are independent circuits that use an advanced phase-locked loop (PLL)
architecture to multiply the reference frequency input by certain programmable numbers between 16 and
160 to become the bit-serial data clock. Each transceiver has a large number of user-definable features
and parameters. All of these can be defined during device configuration, and many can also be modified
during operation.
Transmitter (GTM)
The transmitter is fundamentally a parallel-to-serial converter. These transmitter outputs drive pulse
amplitude modulated signals with either 4 levels (PAM4) or 2 levels (NRZ) to the PC board with a
single-channel differential output signal. TXOUTCLK is the appropriately divided serial data clock and can
be used directly to register the parallel data coming from the internal logic. The incoming parallel data can
optionally leverage a Reed-Solomon, RS(544,514) Forward Error Correction encoder and/or 64b66b data
encoder. The bit-serial output signal drives two package pins with PAM4 differential signals. This output
signal pair has programmable signal swing as well as programmable pre- and post-emphasis to
compensate for PC board losses and other interconnect characteristics. For shorter channels, the swing
can be reduced to reduce power consumption.
Receiver (GTM)
The receiver is fundamentally a serial-to-parallel converter, changing the incoming PAM4 differential
signal into a parallel stream of words. The receiver takes the incoming differential data stream, feeds it
through automatic gain compensation (AGC) and a continuous time linear equalizer (CTLE), after which it
is sampled with a high-speed analog to digital converter. Further equalization is completed digitally via a
decision feedback equalizer (DFE) and feed forward equalizer (FFE) implemented in DSP logic before the
recovered bits are parallelized and provided to the PCS. This equalization provides the flexibility to receive
data over channels ranging from very short chip-to-chip to high loss backplane applications across all
supported rates. Clock recovery circuitry generates a clock derived from the high-speed PLL to clock in
serial data and provides an appropriately divided and phase-aligned clock, RXOUTCLK, to internal logic.
Parallel data can optionally be transferred into an RS-FEC and/or 64b/66b decoder before being presented
to the FPGA interface.
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UltraScale Architecture and Product Data Sheet: Overview
Integrated Interface Blocks for PCI Express Designs
The UltraScale architecture uses three different integrated blocks for PCIe. The integrated block on
UltraScale devices is compliant with the PCI Express Base Specification v3.1 and can operate with a lane
width of up to x8 and a speed up to 8.0GT/s (Gen3).
UltraScale+ devices use two types of integrated blocks: PCIE4 and PCIE4C, with most using the PCIE4
blocks. PCIE4 blocks are compliant to PCI Express Base Specification v3.1 and support up to Gen3 x16, and
can also be configured for lower link width and speeds. The PCIE4 block does not support Gen4 operation.
Some devices, such as Virtex UltraScale+ HBM FPGAs, have only PCIE4C blocks or a combination of both
PCIE4 and PCIE4C blocks. The PCIE4C block can implement both PCI Express and CCIX while PCIE4 blocks
can implement only PCI Express.
PCIE4C blocks are compliant to the PCI Express Base Specification v3.1 supporting up to 8.0GT/s (Gen3)
and compatible with PCI Express Base Specification v4.0 supporting up to 16.0GT/s (Gen4). PCIE4C blocks
are also compliant with CCIX Base Specification v1.0 Version 0.9, supporting speeds up to 16.0GT/s.
PCIE4C blocks support up to 16 lanes at Gen3 or up to 8 lanes at Gen4 and can be configured for lower link
widths and speeds to conserve resources and power.
All integrated blocks for PCIe in the UltraScale architecture can be configured as Endpoint or Root Port.
The Root Port can be used to build the basis for a compatible Root Complex, to allow custom chip-to-chip
communication via the PCI Express protocol, and to attach ASSP Endpoint devices, such as Ethernet
Controllers or Fibre Channel HBAs, to the FPGA, MPSoC, or RFSoC.
The maximum lane widths and data rates per family are listed in Table 24.
Table 24: PCIe Maximum Configurations
Artix
UltraScale+
Kintex
UltraScale
Kintex
UltraScale+
Virtex
UltraScale
Virtex
UltraScale+
Zynq
UltraScale+
MPSoC
Zynq
UltraScale+
RFSoC
Gen1 (2.5GT/s)
x8
x8
x16
x8
x16
x16
x16
Gen2 (5GT/s)
x8
x8
x16
x8
x16
x16
x16
Gen3 (8GT/s)
x8
x8
x16
x8
x16
x16
x16
Gen4 (16GT/s)(1)
x2(2)
x8
x8
x8
Notes:
1.
2.
Transceivers in UltraScale+ devices support 16.0GT/s. Soft PCIe IP is available from Xilinx partners.
PCIe Gen4 is available in AU10P and AU15P in the FFVB676 package.
For high-performance applications, advanced buffering techniques of the block offer a flexible maximum
payload size of up to 1,024 bytes. The integrated block interfaces to the integrated high-speed
transceivers for serial connectivity and to block RAMs for data buffering. Combined, these elements
implement the Physical Layer, Data Link Layer, and Transaction Layer of the PCI Express protocol.
Xilinx provides LogiCORE™ IP options to configure the integrated blocks for PCIe in all UltraScale and
UltraScale+ devices. This includes AXI Streaming interfaces at the PCIe packet level and more advanced IP
such as AXI to PCIe Bridges and DMA engines. This IP gives the designer control over many configurable
parameters such as link width and speed, maximum payload size, and reference clock frequency. For a
complete list of features that can be configured for each of the IP, go to the specific Product Guide.
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UltraScale Architecture and Product Data Sheet: Overview
Cache Coherent Interconnect for Accelerators (CCIX)
CCIX is a chip-to-chip interconnect operating at data rates up to 25Gb/s that allows two or more devices
to share memory in a cache coherent manner. Using PCIe for the transport layer, CCIX can operate at
several standard data rates (2.5, 5, 8, and 16Gb/s) with an additional high-speed 25Gb/s option. The
specification employs a subset of full coherency protocols and ensures that FPGAs used as accelerators
can coherently share data with processors using different instruction set architectures.
PCIE4C blocks support CCIX data rates up to 16Gb/s and contain one CCIX port. Each CCIX port requires
the use of one integrated block for PCIe. If not used with a CCIX port, the integrated blocks for PCIe can
still be used for PCIe communication.
Integrated Block for Interlaken
Some UltraScale architecture-based devices include integrated blocks for Interlaken. Interlaken is a
scalable chip-to-chip interconnect protocol designed to enable transmission speeds from 10Gb/s to
150Gb/s. The Interlaken integrated block in the UltraScale architecture is compliant to revision 1.2 of the
Interlaken specification with data striping and de-striping across 1 to 12 lanes. Permitted configurations
are: 1 to 12 lanes at up to 12.5Gb/s and 1 to 6 lanes at up to 25.78125Gb/s, enabling flexible support for
up to 150Gb/s per integrated block. With multiple Interlaken blocks, certain UltraScale devices enable
easy, reliable Interlaken switches and bridges.
Integrated Block for 100G Ethernet
Compliant to the IEEE Std 802.3ba, the 100G Ethernet integrated blocks in the UltraScale architecture
provide low latency 100Gb/s Ethernet ports with a wide range of user customization and statistics
gathering. With support for 10 x 10.3125Gb/s (CAUI) and 4 x 25.78125Gb/s (CAUI-4) configurations, the
integrated block includes both the 100G MAC and PCS logic with support for IEEE Std 1588v2 1-step and
2-step hardware timestamping.
In UltraScale+ devices, the 100G Ethernet blocks contain a Reed Solomon Forward Error Correction
(RS-FEC) block, compliant to IEEE Std 802.3bj, that can be used with the Ethernet block or stand alone in
user applications. These families also support OTN mapping mode in which the PCS can be operated
without using the MAC.
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UltraScale Architecture and Product Data Sheet: Overview
Stacked Silicon Interconnect (SSI) Technology
Many challenges associated with creating high-capacity devices are addressed by Xilinx with the second generation of the pioneering 3D SSI
technology. SSI technology enables multiple super-logic regions (SLRs) to be combined on a passive interposer layer, using proven
manufacturing and assembly techniques from industry leaders, to create a single device with more than 20,000 low-power inter-SLR
connections. Dedicated interface tiles within the SLRs provide ultra-high bandwidth, low latency connectivity to other SLRs. Table 25 shows
the number of SLRs in devices that use SSI technology and their dimensions.
Table 25: UltraScale and UltraScale+ 3D IC SLR Count and Dimensions
Kintex
UltraScale
Device
KU085 KU115
Virtex
UltraScale
Virtex
UltraScale+
VU125
VU160
VU190
VU440
VU5P
VU7P
VU9P
# SLRs
2
2
2
3
3
3
2
2
3
3
4
4
4
4
1
1
2
3
2
3
3
SLR Width
(in regions)
6
6
6
6
6
9
6
6
6
8
8
9
8
8
8
8
8
8
8
8
8
SLR Height
(in regions)
5
5
5
5
5
5
5
5
5
4
4
5
4
4
4
4
4
4
4
4
4
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UltraScale Architecture and Product Data Sheet: Overview
Clock Management
The clock generation and distribution components in UltraScale devices are located adjacent to the
columns that contain the memory interface and input and output circuitry. This tight coupling of clocking
and I/O provides low-latency clocking to the I/O for memory interfaces and other I/O protocols. Within
every clock management tile (CMT) resides one mixed-mode clock manager (MMCM), two PLLs, clock
distribution buffers and routing, and dedicated circuitry for implementing external memory interfaces.
Mixed-Mode Clock Manager
The mixed-mode clock manager (MMCM) can serve as a frequency synthesizer for a wide range of
frequencies and as a jitter filter for incoming clocks. At the center of the MMCM is a voltage-controlled
oscillator (VCO), which speeds up and slows down depending on the input voltage it receives from the
phase frequency detector (PFD).
There are three sets of programmable frequency dividers (D, M, and O) that are programmable by
configuration and during normal operation via the Dynamic Reconfiguration Port (DRP). The pre-divider D
reduces the input frequency and feeds one input of the phase/frequency comparator. The feedback
divider M acts as a multiplier because it divides the VCO output frequency before feeding the other input
of the phase comparator. D and M must be chosen appropriately to keep the VCO within its specified
frequency range. The VCO has eight equally-spaced output phases (0°, 45°, 90°, 135°, 180°, 225°, 270°, and
315°). Each phase can be selected to drive one of the output dividers, and each divider is programmable
by configuration to divide by any integer from 1 to 128.
The MMCM has three input-jitter filter options: low bandwidth, high bandwidth, or optimized mode.
Low-Bandwidth mode has the best jitter attenuation. High-Bandwidth mode has the best phase offset.
Optimized mode allows the tools to find the best setting.
The MMCM can have a fractional counter in either the feedback path (acting as a multiplier) or in one
output path. Fractional counters allow non-integer increments of 1/8 and can thus increase frequency
synthesis capabilities by a factor of 8. The MMCM can also provide fixed or dynamic phase shift in small
increments that depend on the VCO frequency. At 1,600MHz, the phase-shift timing increment is 11.2ps.
PLL
With fewer features than the MMCM, the two PLLs in a clock management tile are primarily present to
provide the necessary clocks to the dedicated memory interface circuitry. The circuit at the center of the
PLLs is similar to the MMCM, with PFD feeding a VCO and programmable M, D, and O counters. There are
two divided outputs to the device fabric per PLL as well as one clock plus one enable signal to the memory
interface circuitry.
Zynq UltraScale+ MPSoCs and RFSoCs are equipped with five additional PLLs in the PS for independently
configuring the four primary clock domains with the PS: the APU, the RPU, the DDR controller, and the I/O
peripherals.
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UltraScale Architecture and Product Data Sheet: Overview
Clock Distribution
Clocks are distributed throughout UltraScale devices via buffers that drive a number of vertical and
horizontal tracks. There are 24 horizontal clock routes per clock region and 24 vertical clock routes per
clock region with 24 additional vertical clock routes adjacent to the MMCM and PLL. Within a clock region,
clock signals are routed to the device logic (CLBs, etc.) via 16 gateable leaf clocks.
Several types of clock buffers are available. The BUFGCE and BUFCE_LEAF buffers provide clock gating at
the global and leaf levels, respectively. BUFGCTRL provides glitchless clock muxing and gating capability.
BUFGCE_DIV has clock gating capability and can divide a clock by 1 to 8. BUFG_GT performs clock division
from 1 to 8 for the transceiver clocks. In MPSoCs and RFSoCs, clocks can be transferred from the PS to the
PL using dedicated buffers.
Memory Interfaces
Memory interface data rates continue to increase, driving the need for dedicated circuitry that enables
high performance, reliable interfacing to current and next-generation memory technologies. Every
UltraScale device includes dedicated physical interfaces (PHY) blocks located between the CMT and I/O
columns that support implementation of high-performance PHY blocks to external memories such as
DDR4, DDR3, QDRII+, and RLDRAM3. The PHY blocks in each I/O bank generate the address/control and
data bus signaling protocols as well as the precision clock/data alignment required to reliably
communicate with a variety of high-performance memory standards. Multiple I/O banks can be used to
create wider memory interfaces.
As well as external parallel memory interfaces, UltraScale architecture-based devices can communicate to
external serial memories, such as Hybrid Memory Cube (HMC), via the high-speed serial transceivers. All
transceivers in the UltraScale architecture support the HMC protocol, up to 15Gb/s line rates. UltraScale
devices support the highest bandwidth HMC configuration of 64 lanes with a single FPGA.
Block RAM
Every UltraScale architecture-based device contains a number of 36 Kb block RAMs, each with two
completely independent ports that share only the stored data. Each block RAM can be configured as one
36Kb RAM or two independent 18Kb RAMs. Each memory access, read or write, is controlled by the clock.
Connections in every block RAM column enable signals to be cascaded between vertically adjacent block
RAMs, providing an easy method to create large, fast memory arrays, and FIFOs with greatly reduced
power consumption.
All inputs, data, address, clock enables, and write enables are registered. The input address is always
clocked (unless address latching is turned off), retaining data until the next operation. An optional output
data pipeline register allows higher clock rates at the cost of an extra cycle of latency. During a write
operation, the data output can reflect either the previously stored data or the newly written data, or it can
remain unchanged. Block RAM sites that remain unused in the user design are automatically powered
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UltraScale Architecture and Product Data Sheet: Overview
down to reduce total power consumption. There is an additional pin on every block RAM to control the
dynamic power gating feature.
Programmable Data Width
Each port can be configured as 32K × 1; 16K × 2; 8K × 4; 4K × 9 (or 8); 2K × 18 (or 16); 1K × 36 (or 32); or
512 × 72 (or 64). Whether configured as block RAM or FIFO, the two ports can have different aspect ratios
without any constraints. Each block RAM can be divided into two completely independent 18Kb block
RAMs that can each be configured to any aspect ratio from 16K × 1 to 512 × 36. Everything described
previously for the full 36Kb block RAM also applies to each of the smaller 18Kb block RAMs. Only in simple
dual-port (SDP) mode can data widths of greater than 18bits (18Kb RAM) or 36 bits (36Kb RAM) be
accessed. In this mode, one port is dedicated to read operation, the other to write operation. In SDP mode,
one side (read or write) can be variable, while the other is fixed to 32/36 or 64/72. Both sides of the
dual-port 36Kb RAM can be of variable width.
Error Detection and Correction
Each 64-bit-wide block RAM can generate, store, and utilize eight additional Hamming code bits and
perform single-bit error correction and double-bit error detection (ECC) during the read process. The ECC
logic can also be used when writing to or reading from external 64- to 72-bit-wide memories.
FIFO Controller
Each block RAM can be configured as a 36Kb FIFO or an 18Kb FIFO. The built-in FIFO controller for
single-clock (synchronous) or dual-clock (asynchronous or multirate) operation increments the internal
addresses and provides four handshaking flags: full, empty, programmable full, and programmable empty.
The programmable flags allow the user to specify the FIFO counter values that make these flags go active.
The FIFO width and depth are programmable with support for different read port and write port widths on
a single FIFO. A dedicated cascade path allows for easy creation of deeper FIFOs.
UltraRAM
UltraRAM is a high-density, dual-port, synchronous memory block available in UltraScale+ devices. Both
of the ports share the same clock and can address all of the 4K x 72 bits. Each port can independently read
from or write to the memory array. UltraRAM supports two types of write enable schemes. The first mode
is consistent with the block RAM byte write enable mode. The second mode allows gating the data and
parity byte writes separately. UltraRAM blocks can be connected together to create larger memory arrays.
Dedicated routing in the UltraRAM column enables the entire column height to be connected together. If
additional density is required, all the UltraRAM columns in an SLR can be connected together with a few
fabric resources to create single instances of RAM approximately 100Mb in size. This makes UltraRAM an
ideal solution for replacing external memories such as SRAM. Cascadable anywhere from 288Kb to 100Mb,
UltraRAM provides the flexibility to fulfill many different memory requirements.
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UltraScale Architecture and Product Data Sheet: Overview
Error Detection and Correction
Each 64-bit-wide UltraRAM can generate, store and utilize eight additional Hamming code bits and
perform single-bit error correction and double-bit error detection (ECC) during the read process.
High Bandwidth Memory (HBM)
Virtex UltraScale+ HBM devices incorporate 4GB or 8GB HBM stacks adjacent to the FPGA die. Using
stacked silicon interconnect technology, the FPGA communicates to the HBM stacks through memory
controllers that connect to dedicated low-inductance interconnect in the silicon interposer. Each Virtex
UltraScale+ HBM FPGA contains one or two HBM stacks, resulting in up to 16GB of HBM per FPGA.
The FPGA has 32 HBM AXI interfaces used to communicate with the HBM. Through a built-in switch
mechanism, any of the 32 HBM AXI interfaces can access any memory address on either one or both of the
HBM stacks due to the flexible addressing feature. This flexible connection between the FPGA and the
HBM stacks results in easy floorplanning and timing closure. The memory controllers perform read and
write reordering to improve bus efficiency. Data integrity is ensured through error checking and correction
(ECC) circuitry.
Configurable Logic Block
Every Configurable Logic Block (CLB) in the UltraScale architecture contains 8 LUTs and 16 flip-flops. The
LUTs can be configured as either one 6-input LUT with one output, or as two 5-input LUTs with separate
outputs but common inputs. Each LUT can optionally be registered in a flip-flop. In addition to the LUTs
and flip-flops, the CLB contains arithmetic carry logic and multiplexers to create wider logic functions.
Each CLB contains one slice. There are two types of slices: SLICEL and SLICEM. LUTs in the SLICEM can be
configured as 64-bit RAM, as 32-bit shift registers (SRL32), or as two SRL16s. CLBs in the UltraScale
architecture have increased routing and connectivity compared to CLBs in previous-generation Xilinx
devices. They also have additional control signals to enable superior register packing, resulting in overall
higher device utilization.
Interconnect
Various length vertical and horizontal routing resources in the UltraScale architecture that span 1, 2, 4, 5,
12, or 16 CLBs ensure that all signals can be transported from source to destination with ease, providing
support for the next generation of wide data buses to be routed across even the highest capacity devices
while simultaneously improving quality of results and software run time.
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UltraScale Architecture and Product Data Sheet: Overview
Digital Signal Processing
DSP applications use many binary multipliers and accumulators, best implemented in dedicated DSP
slices. All UltraScale devices have many dedicated, low-power DSP slices, combining high speed with small
size while retaining system design flexibility.
Each DSP slice fundamentally consists of a dedicated 27 × 18 bit twos complement multiplier and a 48-bit
accumulator. The multiplier can be dynamically bypassed, and two 48-bit inputs can feed a
single-instruction-multiple-data (SIMD) arithmetic unit (dual 24-bit add/subtract/accumulate or quad
12-bit add/subtract/accumulate), or a logic unit that can generate any one of ten different logic functions
of the two operands.
The DSP includes an additional pre-adder, typically used in symmetrical filters. This pre-adder improves
performance in densely packed designs and reduces the DSP slice count by up to 50%. The 96-bit-wide
XOR function, programmable to 12, 24, 48, or 96-bit widths, enables performance improvements when
implementing forward error correction and cyclic redundancy checking algorithms.
The DSP also includes a 48-bit-wide pattern detector that can be used for convergent or symmetric
rounding. The pattern detector is also capable of implementing 96-bit-wide logic functions when used in
conjunction with the logic unit.
The DSP slice provides extensive pipelining and extension capabilities that enhance the speed and
efficiency of many applications beyond digital signal processing, such as wide dynamic bus shifters,
memory address generators, wide bus multiplexers, and memory-mapped I/O register files. The
accumulator can also be used as a synchronous up/down counter.
System Monitor
The System Monitor blocks in the UltraScale architecture are used to enhance the overall safety, security,
and reliability of the system by monitoring the physical environment via on-chip power supply and
temperature sensors and external channels to the ADC.
All UltraScale architecture-based devices contain at least one System Monitor. The System Monitor in
UltraScale+ FPGAs and the PL of Zynq UltraScale+ MPSoCs and RFSoCs is similar to the Kintex UltraScale
and Virtex UltraScale devices but with additional features including a PMBus interface.
Zynq UltraScale+ MPSoCs contain an additional System Monitor block in the PS. See Table 26.
Table 26: Key System Monitor Features
Kintex UltraScale
Virtex UltraScale
Artix UltraScale+
Kintex UltraScale+
Virtex UltraScale+
Zynq UltraScale+ PL
Zynq UltraScale+ PS
ADC
10-bit 200kSPS
10-bit 200kSPS
10-bit 1MSPS
Interfaces
JTAG, I2C, DRP
JTAG, I2C, DRP, PMBus
APB
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UltraScale Architecture and Product Data Sheet: Overview
In FPGAs and the PL of the MPSoCs and RFSoCs, sensor outputs and up to 17 user-allocated external
analog inputs are digitized using a 10-bit 200 kilo-sample-per-second (kSPS) ADC, and the measurements
are stored in registers that can be accessed via internal FPGA (DRP), JTAG, PMBus, or I2C interfaces. The
I2C interface and PMBus allow the on-chip monitoring to be easily accessed by the System Manager/Host
before and after device configuration.
The System Monitor in the PS MPSoC and RFSoC uses a 10-bit, 1 mega-sample-per-second (MSPS) ADC to
digitize the sensor outputs. The measurements are stored in registers and are accessed via the Advanced
Peripheral Bus (APB) interface by the processors and the platform management unit (PMU) in the PS.
Configuration
The UltraScale architecture-based devices store their customized configuration in SRAM-type internal
latches. The configuration storage is volatile and must be reloaded whenever the device is powered up.
This storage can also be reloaded at any time. Several methods and data formats for loading configuration
are available, determined by the mode pins, with more dedicated configuration datapath pins to simplify
the configuration process.
UltraScale architecture-based devices support secure and non-secure boot with optional Advanced
Encryption Standard - Galois/Counter Mode (AES-GCM) decryption and authentication logic. If only
authentication is required, the UltraScale architecture provides an alternative form of authentication in the
form of RSA algorithms. For RSA authentication support in the Kintex UltraScale and Virtex UltraScale
families, go to UG570, UltraScale Architecture Configuration User Guide.
UltraScale architecture-based devices also have the ability to select between multiple configurations, and
support robust field-update methodologies. This is especially useful for updates to a design after the end
product has been shipped. Designers can release their product with an early version of the design, thus
getting their product to market faster. This feature allows designers to keep their customers current with
the most up-to-date design while the product is already deployed in the field.
Booting MPSoCs and RFSoCs
Zynq UltraScale+ MPSoCs and RFSoCs use a multi-stage boot process that supports both a non-secure
and a secure boot. The PS is the master of the boot and configuration process. For a secure boot, the
AES-GCM, SHA-3/384 decryption/authentication, and 4096-bit RSA blocks decrypt and authenticate the
image.
Upon reset, the device mode pins are read to determine the primary boot device to be used: NAND,
Quad-SPI, SD, eMMC, or JTAG. JTAG can only be used as a non-secure boot source and is intended for
debugging purposes. One of the CPUs, Cortex-A53 or Cortex-R5F, executes code out of on-chip ROM and
copies the first stage boot loader (FSBL) from the boot device to the on-chip memory (OCM).
After copying the FSBL to OCM, the processor executes the FSBL. Xilinx supplies example FSBLs or users
can create their own. The FSBL initiates the boot of the PS and can load and configure the PL, or
configuration of the PL can be deferred to a later stage. The FSBL typically loads either a user application
or an optional second stage boot loader (SSBL) such as U-Boot. Users obtain example SSBL from Xilinx or
a third party, or they can create their own SSBL. The SSBL continues the boot process by loading code from
any of the primary boot devices or from other sources such as USB, Ethernet, etc. If the FSBL did not
configure the PL, the SSBL can do so, or again, the configuration can be deferred to a later stage.
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UltraScale Architecture and Product Data Sheet: Overview
The static memory interface controller (NAND, eMMC, or Quad-SPI) is configured using default settings.
To improve device configuration speed, these settings can be modified by information provided in the
boot image header. The ROM boot image is not user readable or executable after boot.
Configuring FPGAs
The SPI (serial NOR) interface (x1, x2, x4, and dual x4 modes) and the BPI (parallel NOR) interface (x8 and
x16 modes) are two common methods used for configuring the FPGA. Users can directly connect an SPI or
BPI flash to the FPGA, and the FPGA's internal configuration logic reads the bitstream out of the flash and
configures itself, eliminating the need for an external controller. The FPGA automatically detects the bus
width on the fly, eliminating the need for any external controls or switches. Bus widths supported are x1,
x2, x4, and dual x4 for SPI, and x8 and x16 for BPI. The larger bus widths increase configuration speed and
reduce the amount of time it takes for the FPGA to start up after power-on.
In master mode, the FPGA can drive the configuration clock from an internally generated clock, or for
higher speed configuration, the FPGA can use an external configuration clock source. This allows
high-speed configuration with the ease of use characteristic of master mode. Slave modes up to 32 bits
wide that are especially useful for processor-driven configuration are also supported by the FPGA. In
addition, the new media configuration access port (MCAP) provides a direct connection between the
integrated block for PCIe and the configuration logic to simplify configuration over PCIe.
SEU detection and mitigation (SEM) IP, RSA authentication, post-configuration CRC, and Security Monitor
(SecMon) IP are not supported in the KU025 FPGA.
Packaging
The UltraScale devices are available in a variety of organic flip-chip, lidless flip-chip, and integrated
fan-out (InFO) packages supporting different quantities of I/Os and transceivers. Maximum supported
performance can depend on the style of package and its material. Always refer to the specific device data
sheet for performance specifications by package type.
In flip-chip packages, the silicon device is attached to the package substrate using a high-performance
flip-chip process. Decoupling capacitors are mounted on the package substrate to optimize signal
integrity under simultaneous switching of outputs (SSO) conditions.
InFO packages are small form factor packages that require much less PCB area and are much thinner than
other packaging types. These packages enable the use of high compute density devices in small
applications. The elimination of the package substrate provides excellent thermal and power distribution
and shorter flight times with improved signal integrity.
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UltraScale Architecture and Product Data Sheet: Overview
Ordering Information
Table 27 shows the speed and temperature grades available in the different device families. V CCINT supply
voltage is listed in parentheses.
Table 27: Speed Grade and Temperature Grade
Speed Grade and Temperature Grade
Device
Family
XC
Devices
Commercial
(C)
0°C to +85°C
Artix
UltraScale+
All
Extended
(E)
0°C to +100°C(1)
Industrial
(I)
0°C to +110°C
–40°C to +100°C
-2E (0.85V)
-2I (0.85V)
-1E (0.85V)
-1I (0.85V)
-1LI (0.85 or 0.72V)
-3E(2) (1.0V)
Kintex
UltraScale
All
-2E (0.95V)
-2I (0.95V)
-1I (0.95V)
-1C (0.95V)
-1LI(2)
(0.95V or 0.90V)
-3E (0.90V)
Kintex
UltraScale+
-2E (0.85V)
-2I (0.85V)
-2LE(3)
All
(0.85V or 0.72V)
-1E (0.85V)
-1I (0.85V)
-1LI (0.85V or 0.72V)
Virtex
UltraScale
VU065
VU080
VU095
VU125
VU160
VU190
-3E (1.0V)
-2E (0.95V)
-2I (0.95V)
-1HE (0.95V or 1.0V)
-1I (0.95V)
-3E (1.0V)
VU440
-2E (0.95V)
-2I (0.95V)
-1I (0.95V)
-1C (0.95V)
Virtex
UltraScale+
VU3P
VU5P
VU7P
VU9P
VU11P
VU13P
VU23P
VU27P
VU29P
VU19P
VU31P
VU33P
VU35P
VU37P
VU45P
VU47P
VU57P
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Product Specification
-3E (0.90V)
-2E (0.85V)
-2I (0.85V)
-2LE(3)
(0.85V or 0.72V)
-1E (0.85V)
-1I (0.85V)
-2E (0.85V)
-1E (0.85V)
-3E (0.90V)
-2E (0.85V)
-2LE(3)(4) (0.85V or 0.72V)
-1E (0.85V)
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UltraScale Architecture and Product Data Sheet: Overview
Table 27: Speed Grade and Temperature Grade (Cont’d)
Speed Grade and Temperature Grade
Device
Family
XC
Devices
Commercial
(C)
0°C to +85°C
Extended
(E)
0°C to +100°C(1)
Industrial
(I)
0°C to +110°C
-2E (0.85V)
CG
Devices
–40°C to +100°C
-2I (0.85V)
-2LE(3)(5) (0.85V or 0.72V)
-1E (0.85V)
-1I (0.85V)
-1LI(5)
-2E (0.85V)
ZU1EG
ZU2EG
ZU3EG
(0.85V or 0.72V)
-2I (0.85V)
-2LE(3)(5)
(0.85V or 0.72V)
-1E (0.85V)
-1I (0.85V)
-1LI(5) (0.85V or 0.72V)
Zynq
UltraScale+
ZU4EG
ZU5EG
ZU6EG
ZU7EG
ZU9EG
ZU11EG
ZU15EG
ZU17EG
ZU19EG
-3E (0.90V)
-2E (0.85V)
-2I (0.85V)
-2LE(3)(5)
(0.85V or 0.72V)
-1E (0.85V)
-1I (0.85V)
-1LI(5) (0.85V or 0.72V)
-3E (0.90V)
-2E (0.85V)
EV
Devices
-2I (0.85V)
-2LE(3)(5)
(0.85V or 0.72V)
-1E (0.85V)
-1I (0.85V)
-1LI(5)
ZU21DR
ZU25DR
ZU27DR
ZU28DR
ZU29DR
-2E (0.85V)
-2I (0.85V)
-2LE(3)(5) (0.85V or 0.72V)
-1E (0.85V)
DS890 (v4.1.1) February 7, 2022
Product Specification
-2LI (0.72V)(6)
-1I (0.85V)
-1LI(5) (0.85V or 0.72V)
-2I (0.85V)
ZU39DR
ZU42DR
ZU43DR
ZU46DR
ZU47DR
ZU48DR
ZU49DR
(0.85V or 0.72V)
-2LI (0.72V)(6)
-2E (0.85V)
-2I (0.85V)
-2LI (0.72V)(6)
-1E (0.85V)
-1I (0.85V)
-1LI(5) (0.72V)
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UltraScale Architecture and Product Data Sheet: Overview
Table 27: Speed Grade and Temperature Grade (Cont’d)
Speed Grade and Temperature Grade
Device
Family
XC
Devices
Commercial
(C)
0°C to +85°C
Extended
(E)
0°C to +100°C(1)
Industrial
(I)
0°C to +110°C
–40°C to +100°C
-2I (0.85V)
Zynq
UltraScale+
RFSoC DFE
-2LI (0.72V)(6)
ZU65DR
ZU67DR
-1I (0.85V)
-1LI (0.72V)
Notes:
1.
2.
3.
4.
5.
6.
The recommended maximum operating temperature for high-bandwidth memory is 95°C.
KU025 and KU095 are not available in -3E or -1LI speed/temperature grades.
In -2LE speed/temperature grade, devices can operate for a limited time with junction temperature of 110°C. Timing parameters adhere
to the same speed file at 110°C as they do below 110°C, regardless of operating voltage (nominal at 0.85V or low voltage at 0.72V).
Operation at 110°C Tj is limited to 1% of the device lifetime and can occur sequentially or at regular intervals as long as the total time
does not exceed 1% of device lifetime.
Devices with HBM and labeled with the speed/temperature grade of -2LE can operate for a limited time at a junction temperature between
95°C and 105°C. HBM operation up to Tj = 105°C is limited to 4.1% of the device lifetime and can occur sequentially or at regular
intervals as long as the total time does not exceed 4.1% of the device lifetime, and for no longer than 96 hours at a time. While operating
the HBM above 95°C, the refresh rate must be at least 4x the refresh rate at 95°C.
In Zynq UltraScale+ MPSoCs and RFSoCs, when operating the PL at low voltage (0.72V), the PS operates at nominal voltage (0.85V).
In -2LI speed/temperature grade, devices can operate for a limited time with junction temperature of 110°C. Timing parameters adhere
to the same speed file at 110°C as they do below 110°C. Operation at 110°C Tj is limited to 5% of the device lifetime and can occur
sequentially or at regular intervals as long as the total time does not exceed 5% of device lifetime.
The ordering information shown in Figure 3 applies to all packages in the Kintex UltraScale and Virtex
UltraScale FPGAs. Refer to the Package Marking section of UG575, UltraScale and UltraScale+ FPGAs
Packaging and Pinouts User Guide for a more detailed explanation of the device markings.
X-Ref Target - Figure 3
Example: XC KU 040 -1 F F V A1156 C
Temperature Grade
C: Commercial
E: Extended
I: Industrial
Xilinx Commercial
KU: Kintex UltraScale
VU: Virtex UltraScale
Value Index
Speed Grade:
-1: Slowest
-L1: Low Power
-H1: Slowest or Mid
-2: Mid
-3: Fastest
Package Designator and Pin Count
(Footprint Identifier)
V: RoHS 6/6
G: RoHS 6/6 with Exemption 15
F: Lid
L: Lid SSI
B: Bare-die
F: Flip-chip with 1.0mm Ball Pitch
S: Flip-chip with 0.8mm Ball Pitch
1) -L1 and -H1 are the ordering codes for the -1L and -1H speed grades, respectively.
2) See UG575: UltraScale and UltraScale+ FPGAs Packaging and Pinouts User Guide for more information.
DS890_03_092917
Figure 3: Kintex UltraScale and Virtex UltraScale FPGA Ordering Information
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UltraScale Architecture and Product Data Sheet: Overview
The ordering information shown in Figure 4 applies to all packages in the Artix UltraScale+, Kintex
UltraScale+, and Virtex UltraScale+ FPGAs, and Figure 5 applies to Zynq UltraScale+MPSoCs and RFSoCs.
The -1L and -2L speed grades in the UltraScale+ families can run at one of two different VCCINT operating
voltages. At 0.72V, they operate at similar performance to the Kintex UltraScale and Virtex UltraScale
devices with up to 30% reduction in power consumption. At 0.85V, they consume similar power to the
Kintex UltraScale and Virtex UltraScale devices, but operate over 30% faster.
X-Ref Target - Figure 4
Example: XC VU 7 P -1 F L V A2104 E
Temperature Grade
E: Extended
I: Industrial
Xilinx Commercial
AU: Artix UltraScale
KU: Kintex UltraScale
VU: Virtex UltraScale
Package Designator and Pin Count
(Footprint Identifier)
Value Index
+ (Plus)
V: RoHS 6/6
G: RoHS 6/6 with Exemption 15
Speed Grade:
-1: Slowest
-L1: Low Power
-2: Mid
-L2: Low Power
-3: Fastest
F: Lid
L: Lid SSI
B: Bare-die
S: Lidless Stiffener
H: Overhang SSI
I: Overhang Lidless Stiffener
F: Flip-chip with 1.0mm Ball Pitch
S: Flip-chip with 0.8mm Ball Pitch
V: Flip-chip with 0.92mm Ball Pitch
U: InFO with 0.5mm Ball Pitch
1) -L1 and -L2 are the ordering codes for the low power -1L and -2L speed grades, respectively.
DS890_04_020921
Figure 4: UltraScale+ FPGA Ordering Information
X-Ref Target - Figure 5
Example: XC ZU 7 E V -1 F F V C1156 E
Temperature Grade
E: Extended
I: Industrial
Xilinx Commercial
ZU: Zynq UltraScale+
Value Index
Package Designator and Pin Count
(Footprint Identifier)
Processor System Identifier
C: Dual APU, Dual RPU
D: Quad APU; Dual RPU
E: Quad APU, Dual RPU, Single GPU
V: RoHS 6/6
Engine Type
G: General Purpose
R: RF Signal
V: Video
Speed Grade
-1: Slowest
-L1: Low Power
-2: Mid
-L2: Low Power
-3: Fastest
F: Lid
S: Lidless Stiffener
B: Bare-die
F: Flip-chip with 1.0mm Ball Pitch
S: Flip-chip with 0.8mm Ball Pitch
U: InFO with 0.5mm Ball Pitch
1) -L1 and -L2 are the ordering codes for the low power -1L and -2L speed grades, respectively.
DS890_05_030421
Figure 5: Zynq UltraScale+ MPSoC and RFSoC Ordering Information
DS890 (v4.1.1) February 7, 2022
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47
UltraScale Architecture and Product Data Sheet: Overview
Revision History
The following table shows the revision history for this document:
Date
Version
Description of Revisions
02/07/2022
4.1.1
01/07/2022
4.1
Added Zynq UltraScale+ RFSoC DFE devices throughout document. Updated Artix
UltraScale+ FPGA information in Table 24.
03/16/2021
4.0
Added Artix UltraScale+ and Zynq UltraScale+ ZU1CG/EG devices throughout document.
09/14/2020
3.14
Added ZU42DR throughout document.
07/21/2020
3.13
Added KU19P throughout the document. Updated Table 23 and Table 24.
06/25/2020
3.12
Added VU57P throughout the document. Updated RF Data Converter Subsystem
Overview, RF-ADCs, RF-DACs, Table 25 and Table 27.
05/20/2020
3.11
Added VU23P throughout document. Added Zynq UltraScale+ RFSoCs to Table 24.
Updated Table 1, Table 12, Table 23, Table 25, and Cache Coherent Interconnect for
Accelerators (CCIX).
08/21/2019
3.10
Added VU19P and ZU43DR throughout document.
06/27/2019
3.9
Added VU45P and VU47P throughout document. Updated Routing, SSI, Logic, Storage,
and Signal Processing, and High Bandwidth Memory (HBM). Added VU27P to Table 27.
05/13/2019
3.8
Updated VU27P in Table 11 and ZU39DR in Table 21.
02/20/2019
3.7
Added XCZU39DR, XCZU46DR, XCZU47DR, XCZU48DR, and XCZU49DR. Updated
Table 21, Table 22, RF-ADCs, RF-DACs, and Table 27.
11/12/2018
3.6
Updated PCIe information throughout document: Processing System Overview, I/O,
Transceiver, PCIe, 100G Ethernet, and 150G Interlaken, Table 7, Table 15, Table 17,
Table 19, Table 21, Table 23, Integrated Interface Blocks for PCI Express Designs, and
Table 24. Updated VU27P resource and package information in Table 11 and Table 14.
08/21/2018
3.5
Changed document classification to Product Specification from Preliminary Product
Specification. Updated RF Data Converter Subsystem Overview. Updated RF-ADCs and
RF-DACs.
05/17/2018
3.4
Updated RF Data Converter Subsystem Overview, Table 21, RF-ADCs, and Table 27
(removed -3E, added -2LI and note 4 for the DR devices). Added FSGA2577 to Table 14.
03/12/2018
3.3
Added VU27P and VU29P: Updated Table 1, I/O, Transceiver, PCIe, 100G Ethernet, and
150G Interlaken, Table 11, Table 14, High-Speed Serial Transceivers, and Table 23, and
added GTM Transceivers. Updated Note 4 in Table 16 and Table 18.
01/23/2018
3.2
Updated RFADC/DAC rates in RF Data Converter Subsystem Overview, Table 21,
RF-ADCs, and RF-DACs.
11/15/2017
3.1
Updated Table 22 with FSVE1156, FSVG1517, and FSVF176 0 packages. Updated
Figure 5.
10/03/2017
3.0
Added Zynq UltraScale+ RFSoC information throughout document. Updated General
Description, Table 1, RF Data Converter Subsystem Overview, Soft Decision Forward Error
Correction (SD-FEC) Overview, Processing System Overview (including Table 2),
Configuration, Encryption, and System Monitoring, Table 25, Table 27, and Figure 5.
Updated UltraRAM ZU4CG/ZU4EG/ZU4EV values in Table 15, Table 17, Table 19.
Added Table 21, Table 22, RF Data Converter Subsystem Overview, and Soft Decision
Forward Error Correction (SD-FEC) Overview.
Updated Figure 3, Figure 4, and Figure 5.
02/15/2017
2.11
Updated Table 1, Table 11: Converted HBM from Gb to GB. Updated Table 15, Table 17,
and Table 19: Updated DSP count for Zynq UltraScale+ MPSoCs. Updated Cache Coherent
Interconnect for Accelerators (CCIX). Updated High Bandwidth Memory (HBM). Updated
Table 27: Added-2E speed grade to all UltraScale+ devices. Removed -3E from XCZU2
and XCZU3.
Typographical edit: Updated fractional PLL counts in Table 3.
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UltraScale Architecture and Product Data Sheet: Overview
Date
Version
Description of Revisions
11/09/2016
2.10
Updated Table 1. Added HBM devices to Table 11, Table 14, Table 25 and new High
Bandwidth Memory (HBM) section. Added Cache Coherent Interconnect for Accelerators
(CCIX) section.
09/27/2016
2.9
Updated Table 7, Table 16, Table 17, and Table 18.
06/03/2016
2.8
Added Zynq UltraScale+ MPSoC CG devices: Added Table 2. Updated Table 15, Table 16,
Table 27, and Figure 5. Created separate tables for EG and EV devices: Table 17,
Table 18, Table 19, and Table 20.
Updated Table 1, Table 5, Table 7 and notes, Table 8 and notes, Table 9, Table 11,
Table 14, Processing System Overview, and Processing System (PS) details.
02/17/2016
2.7
Added Migrating Devices. Updated Table 6, Table 7, Table 8, Table 14, Table 15, Table 16,
and Figure 4.
12/15/2015
2.6
Updated Table 1, Table 7, Table 8, Table 11, Table 16, and Configuration.
11/24/2015
2.5
Updated Configuration, Encryption, and System Monitoring, Table 7, Table 11, Table 15,
and Table 27.
10/15/2015
2.4
Updated Table 1, Table 5, Table 7, Table 9, Table 11, and Table 15 with System Logic
Cells. Updated Figure 3. Updated Table 25.
09/29/2015
2.3
Added A1156 to KU095 in Table 6. Updated Table 7. Updated Max. Distributed RAM in
Table 11. Updated Distributed RAM in Table 15. Added Table 25. Updated Table 27.
Updated Figure 3.
08/14/2015
2.2
Updated Table 1. Added XCKU025 to Table 5, Table 6, and Table 27. Updated Table 9,
Table 11, Table 15, Table 16, Table 24. Updated System Monitor. Added voltage
information to Table 27.
04/27/2015
2.1
Updated Table 1, Table 5, Table 6, Table 7, Table 8, Table 9, Table 14, Table 15, Table 16,
Table 23, I/O, Transceiver, PCIe, 100G Ethernet, and 150G Interlaken, Integrated
Interface Blocks for PCI Express Designs, USB 3.0/2.0, Clock Management, System
Monitor, and Figure 3.
02/23/2015
2.0
UltraScale+ device information (Kintex UltraScale+ FPGA, Virtex UltraScale+ FPGA, and
Zynq UltraScale+ MPSoC) added throughout document.
12/16/2014
1.6
Updated Table 1; I/O, Transceiver, PCIe, 100G Ethernet, and 150G Interlaken; Table 5,
Table 9; Table 10; and Table 23.
11/17/2014
1.5
Updated I/O, Transceiver, PCIe, 100G Ethernet, and 150G Interlaken; Table 1; Table 6;
Table 9; Table 10; Table 23; Input/Output; and Figure 3.
09/16/2014
1.4
Updated Logic Cell information in Table 1. Updated Table 5; I/O, Transceiver, PCIe, 100G
Ethernet, and 150G Interlaken; Table 9; Table 10; Integrated Block for 100G Ethernet;
and Figure 3.
05/20/2014
1.3
Updated Table 10.
05/13/2014
1.2
Added Ordering Information. Updated Table 1, Clocks and Memory Interfaces, Table 5,
Table 9 (removed XCVU145; added XCVU190), Table 10 (removed XCVU145; removed
FLVD1924 from XCVU160; added XCVU190; updated Table Notes), Table 23, Integrated
Interface Blocks for PCI Express Designs, and Integrated Block for Interlaken, and
Memory Interfaces.
02/06/2014
1.1
Updated PCIe information in Table 1 and Table 5. Added FFVJ1924 package to Table 10.
12/10/2013
1.0
Initial Xilinx release.
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UltraScale Architecture and Product Data Sheet: Overview
Disclaimer
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maximum extent permitted by applicable law: (1) Materials are made available “AS IS” and with all faults, Xilinx hereby DISCLAIMS
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MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE; and (2) Xilinx shall not be liable (whether
in contract or tort, including negligence, or under any other theory of liability) for any loss or damage of any kind or nature related
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AUTOMOTIVE PRODUCTS (IDENTIFIED AS "XA" IN THE PART NUMBER) ARE NOT WARRANTED FOR USE IN THE DEPLOYMENT OF
AIRBAGS OR FOR USE IN APPLICATIONS THAT AFFECT CONTROL OF A VEHICLE ("SAFETY APPLICATION") UNLESS THERE IS A
SAFETY CONCEPT OR REDUNDANCY FEATURE CONSISTENT WITH THE ISO 26262 AUTOMOTIVE SAFETY STANDARD ("SAFETY
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© Copyright 2013–2022 Xilinx, Inc. Xilinx, the Xilinx logo, Alveo, Artix, Kintex, Spartan, UltraScale, Versal, Virtex, Vivado, Zynq, and other designated brands included herein
are trademarks of Xilinx in the United States and other countries. AMBA, AMBA Designer, Arm, Arm1176JZ-S, CoreSight, Cortex, and PrimeCell are trademarks of Arm in
the EU and other countries. PCI, PCIe, and PCI Express are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
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