NP276-11904

NP276-11904

  • 厂商:

    YAMAICHI

  • 封装:

  • 描述:

    NP276-11904 - Ball Grid Array (BGA, 1.27mm Pitch) - Yamaichi Electronics Co., Ltd.

  • 详情介绍
  • 数据手册
  • 价格&库存
NP276-11904 数据手册
NP276 Series (Open Top) Ball Grid Array (BGA, 1.27mm Pitch) Specifications 1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m W max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C –40°C to +170°C 30g per pin approx. Contact Force: 10,000 insetions Mating Cycles: Part Number (Details) NP276 Series No. - 1105 22 - * - (*) No. of Contact Pins (.AC-types are depopulated base sockets) Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyethersulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Design Number Positioning Pin Options (see PCB): Pos. pin 'A' Pos. pin 'B' 1= With With 2= With Without 3= Without With 4= Without Without Contact Terminal Length and Form Features í Open top type sockets for BGA packages í Self contacting structure without upper pressing force (ZIF) í Contacting structure to nip the sides of solder balls to lower damage to the coplanarity of the solder balls Yamaichi's 2-point Tweezer Contact IC Ball Socket Base A Contacts Socket Base B Since the solder balls are touched by two contacts on each side, the solder ball damage can be minimized; additional features are low actuation force and compact socket size We have depopulated versions from existing NP276 base sockets. As new versions are continually being tooled up we rcommend to contact Yamaichi for your specific pin count and matching IC Applicable Base Socket and IC Dimensions Part Number NP276-11904 NP276-11904-3 NP276-15316 NP276-16951 NP276-25626 NP276-37206 NP276-40009 NP276-59608 NP276-65227 NP276-87318 NP276-110522 Pin Count 119 119 153 169 256 372 400 596 652 873 1105 IC Dimensions Pitch 1.27 1.27 1.27 1.27 1.27 1.27 1.27 1.27 1.27 1.27 1.27 Base Sockets (see page) 2 2 3 4 5 6 7 8 9 10 11 Grid Size 7 x 17 7 x 17 9 x 17 13 x 13 16 x 16 20 x 20 20 x 20 26 x 26 28 x 28 31 x 31 35 x 35 Body Size 14 x 22 14 x 22 14 x 22 17 x 17 21 x 21 27 x 27 27 x 27 35 x 35 37.5 x 37.5 40 x 40 45 x 45 Test Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER NP276 Series (Open Top) Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Base Socket NP276-11904 Outline Socket Dimensions (27.00 x 38.00mm) Grid Size: 7 x 17 NP276-11904 Pin Count Body Size 119 14 x 22 Base Socket NP276-11094-3 Outline Socket Dimensions (26.40 x 32.20mm) Grid Size: 7 x 17 NP276-11094-3 3.80 Pin Count Body Size 119 14 x 22 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test Test & Burn-In NP276 Series (Open Top) Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Base Socket NP276-15316 Outline Socket Dimensions (28.40 x 33.20mm) 3.80 = NP276-15316 Grid Size: 9 x 17 NP276-15316 Pin Count Body Size 153 14 x 22 Test Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER NP276 Series (Open Top) Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Base Socket NP276-16951 Outline Socket Dimensions (27.00 x 38.00mm) Pin Count Body Size Grid Size 169 17.0 x 17.0 13 x 13 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test Test & Burn-In NP276 Series (Open Top) Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Base Socket NP276-25626 Outline Socket Dimensions (49.4 x 49.4mm) 49.40 Pin Count Body Size Grid Size 256 21.0 x 21.0 16 x 16 Recommended PC Board Layouts Top View from Socket Various Pin Counts Test Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER NP276 Series (Open Top) Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Base Socket NP276-37206 Outline Socket Dimensions (49.4 x 49.4mm) 49.40 Pin Count Body Size Grid Size 372 27.0 x 27.0 20 x 20 Recommended PC Board Layouts Top View from Socket Various Pin Counts SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test Test & Burn-In NP276 Series (Open Top) Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Base Socket NP276-40009 Outline Socket Dimensions (49.4 x 49.4mm) 49.40 Pin Count Body Size Grid Size 400 27.0 x 27.0 20 x 20 Recommended PC Board Layouts Top View from Socket Various Pin Counts Test Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER NP276 Series (Open Top) Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Base Socket NP276-59608 Outline Socket Dimensions (58.4 x 58.4mm) 58.40 Pin Count Body Size Grid Size 596 35.0 x 35.0 26 x 26 Recommended PC Board Layouts Top View from Socket Pin Counts Various Various Pins SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test Test & Burn-In NP276 Series (Open Top) Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Base Socket NP276-62525 Outline Socket Dimensions (58.4 x 58.4mm) 58.40 Pin Count Body Size Grid Size 625 35.0 x 35.0 25 x 25 Recommended PC Board Layouts Top View from Socket Various Pins Various Pin Counts Test Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER NP276 Series (Open Top) Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Base Socket NP276-87318 Outline Socket Dimensions (68.0 x 68.0mm) 68.00 Pin Count Body Size Grid Size 873 42.0 x 42.0 35 x 35 Recommended PC Board Layouts Top View from Socket Various Pin Counts SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test Test & Burn-In NP276 Series (Open Top) Base Socket NP276-110522 Ball Grid Array Base Socket (BGA, 1.27mm Pitch) Outline Socket Dimensions (74.0 x 74.0mm) 74.40 Pin Count Body Size Grid Size 1105 45.0 x 45.0 35 x 35 Recommended PC Board Layouts Top View from Socket Various Pin Counts Test Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
NP276-11904
### 物料型号 - NP276系列提供了多种型号,包括NP276-11904、NP276-11904-3、NP276-15316、NP276-16951、NP276-25626、NP276-37206、NP276-40009、NP276-59608、NP276-65227、NP276-87318、NP276-110522等。

### 器件简介 - NP276系列是开放式顶部的BGA封装底座,具有1.27mm的引脚间距。这些底座设计用于BGA封装,具有自接触结构,无需上部压力(ZIF),通过夹持焊球的侧面来降低对焊球共面性的损伤。

### 引脚分配 - 提供了不同引脚数量的型号,从119到1105不等,以适应不同的IC尺寸和网格大小。

### 参数特性 - 绝缘电阻:100V AC下1分钟 - 耐电压:接触电阻 - 工作温度范围:-40°C至+170°C - 接触力:30g每引脚,大约10000次插入

### 功能详解 - 开放式顶部插座用于BGA封装,无需上部压力即可自接触。 - 接触结构通过夹持焊球的侧面来降低对焊球共面性的损伤。 - 采用Yamaichi的2点镊子接触方式,每个焊球两侧由两个接触点接触,以最小化焊球损伤,同时具有低驱动力和紧凑的插座尺寸。

### 应用信息 - 适用于需要BGA封装测试和烧录测试的应用。

### 封装信息 - 提供了详细的底座尺寸和IC尺寸,例如NP276-11904的底座尺寸为27.00 x 38.00mm,IC尺寸为14x22。
NP276-11904 价格&库存

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