NP284-26409N

NP284 Series (Open Top) Chip Scale Package (CSP, 0.50mm Pitch) Specifications 1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 30m W max. at 10mA/20mV max. Operating Temperature Range: –40°C to +150°C 11gf per pin approx. Contact Force: 35 x 35 Grid Size: 264 pins Pin Count: Part Number (Details) NP284 - 264 Series No. No. of Contact Pins Design Number 09 * Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyetherssulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Positioning Pin: N = Without P = With Features í Open top type socket for CSP packages with 0.50mm pitch í Self contacting structure without upper pressing force (ZIF) í Fan-out Terminal type, designed to reduce ball damage Outline Socket Dimensions Contact Details (Section C - C) 0.30 4 - 0.5x32=16.00±0.15 8.50±0.1 0.50±0.1 50.00 46.00 22.00 +0.1 18.15 0 8.50±0.1 0.15 0.50 0 +0.1 0 0.15 'B' 8.50 Pos. pin Detail 'B' 22.00 +0.1 18.15 0 41.00±0.1 50.00 46.00 20.15 0.5x34=17.00±0.15 0.50±0.1 28.60 Æ2.60 20.15 0.5x34=17.00±0.15 0.50±0.1 8.50±0.1 C C 15.65 -0.1 17.35 Æ3.20 Thru hole 8.50±0.1 Æ6.00 1.50 Matching IC Dimensions 0.25 0.64 Recommended PC Board Layout 42.25±0.05 38.25±0.05 34.25±0.05 27.25±0.05 23.25±0.05 19.25±0.05 Top View from Socket 4 - 0.5x32=16.00±0.1 0.50x34=17.00 0.50 8.50±0.05 +0.1 4 - Æ2.70 0 Thru hole for pos. pin 8.50±0.05 0.50±0.05 18.00 8.50±0.05 0.50 0.50x34=17.00 264 - Æ0.30 Æ3.20 0 Thru hole +0.1 264 - Æ0.45 +0.1 0 Test & Burn-In Test SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER 40.00±0.05 0.85