NP291-03617

NP291 Series (Open Top) Fine Ball Grid Array (FBGA, 0.75mm Pitch) Specifications 1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m W max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +170°C 15g /pin (approx.) Contact Force: 10,000 insertions Mating Cycles: Part Number (Details) NP291 - 048 05 - 3 -(G4-BF) - * Series No. No. of Contact Pins Design Number G = Contact Plating (Gold) 4 = Contact Style (180° TH) Contact Area - Au (0.3µm min. over Ni) Terminal Area - Au (0.05µm min. over Ni) Positioning Pin Identification: No Mark = Without Positioning Pins 'A' and 'B' With Mark = For various Positioning Pin Options (Please contact Yamaichi) Materials and Finish Housing: Polyethersulphone (PES), glass-filled and Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features í Open top type sockets for FBGA packages í Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls Outline Socket Dimensions C Outline IC Dimensions A 0.75 D 0.75 E Part Number NP291-03617-* NP291-04805-3* AC-16001 NP291-04002-2 AC-11318 NP291-04002-2-G4-BF-* NP291-04009-2-G4-BF-* NP291-04013-* NP291-04019 NP291-04414-* NP291-04808-*AC-13177 NP291-04812 AC-15741 NP291-04812-2-* AC-14680 NP291-04805-1* NP291-04805-3* NP291-04805-4* NP291-04805-5* NP291-04805-8*-* NP291-04808-2-G4-BF-* NP291-04812-2-G4-BF-* NP291-04842-* NP291-04843-* NP291-04848-* NP291-04851-*-* NP291-04852-*-* NP291-04878 NP291-07210-2 AC-08904 NP291-05658-*-* NP291-07210-2 AC-08338 NP291-05670 NP291-07210-2-G4-BF-* NP291-07428-* NP291-07773-*-* NP291-28807-* Pin Count 36 36 40 40 40 40 40 44 45 46 46 48 48 48 48 48 48 48 48 48 48 48 48 48 54 56 56 56 72 74 77 288 Pitch 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 Grid Size 6x6 6x8 5x8 5x8 5x8 6x11 6x11 6x11 6x8 6x8 6x8 6x8 6x8 6x8 6x8 6x8 6x8 6x8 6x8 6x8 6x8 6x8 6x8 6x8 8x9 7x8 8x9 7x8 8x9 7x16 7x11 22x22 IC Dimensions AxB 6.5x10.50 6x8 7.628x9.228 5.74x7.48 5.857x7.508 5.55x9.10 6.15x10.65 7.75x14.35 7.45x7.55 6.50x7.91 6.50x7.91 9x15 6x8 7.20x11.65 6.20x13.15 6.94x14.40 7.58x9.81 6.50x7.91 7x7 6x8 8x10 7x11 9x12 7x8.50 7.67x16.37 7.25x12 7.67x16.37 10x6.5 7.67x16.37 6.80x12.40 7x10 18x18 Socket Dimensions CxD 28.5x27.3 64x64 27.5x22.5 27.5x22.5 27.5x22.5 18x24 16x19 18x24 28.3x27.3 28.3x27.3 28.3x27.3 32x32 32x32 32x32 32x32 32x32 28.3x27.3 28.3x27.3 20x20 20x20 20x20 20x20 20x20 20x20 28.4x33.9 20x20 28.4x33.9 20x26 28.4x33.9 16.8x22.0 20x26 40x40 Test & Burn-In B SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER D-63 Arrays