NP396-500

NP396 Series (Open Top) Specifications Shrink Ball Grid Array (1.27mm Pitch) Part Number (Details) 1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m W max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C –40°C to +170°C 13g per pin approx. Contact Force: 3.2 Kg Operationg Force: 10,000 insetions Mating Cycles: NP396 Series No. - 500 * No. of Contact Pins Design Number Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features í Open top type sockets for BGA packages íCoverless shrink version í2-point Tweezer Contact System Outline Dimensions Recommended PC Board Layout Top View from Socket Recommended PC Board Layout SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test Test & Burn-In Arrays