NP89-19601-G4-BF

NP89-19601-G4-BF

  • 厂商:

    YAMAICHI

  • 封装:

  • 描述:

    NP89-19601-G4-BF - Pin Grid Array / Zero Insertion Force (PGA / ZIF) - Yamaichi Electronics Co., Ltd...

  • 详情介绍
  • 数据手册
  • 价格&库存
NP89-19601-G4-BF 数据手册
NP89 Series Specifications Pin Grid Array / Zero Insertion Force (PGA / ZIF) Part Number (Details) 1,000MW min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage:700V AC for 1 minute 30m W max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –40°C to +170°C NP89 Series No. - 121 10 MF - G 4 - BF No. of Contact Pins Materials and Finish Housing: Polyetherimide (PEI), glass-filled, UL94V-0 Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Design Number MF =Flanged Unmarked = Not Flanged Contact Plating (Gold) Features í Wiping action system: Cleans up IC lead surface during handling action í Reliable 3 point contact system í Cost performance: Different contact thickness for contact area and terminal area í Depopulated versions available í Also available with lever on the right hand side, standard type is lever on the left hand side Contact Terminal Style Plating Specification Standard lever left side Outline Socket Dimensions Recommended PC Board Layout Top View from Socket A C B 2.54 9.5 9.0 2-Æ3.2 Æ0.8 2.54 7.5 7.5 D 2- Æ3.2 B G 0.55 B F E Part Number NP89-12110**-G4-BF NP89-14409**-G4-BF NP89-13302**-G4-BF NP89-19601**-G4-BF NP89-22508**-G4-BF NP89-21004**-G4-BF NP89-28906**-G4-BF NP89-36105**-G4-BF NP89-44111**-G4-BF NP89-62522**-G4-BF Grid Size 11 x 11 12 x 12 14 x 14 14 x 14 15 x 15 17 x 17 17 x 17 19 x 19 21 x 21 25 x 25 Pin Count 121 144 133 196 225 210 289 361 441 625 A 42.5 43.1 51.0 51.0 52.7 59.0 59.0 63.7 69.0 85.7 Socket and PC Board Dimensions E F D B C 25.4 27.94 32.02 32.02 35.56 40.64 40.64 45.72 50.8 60.96 14.0 12.0 14.65 14.65 14.0 14.65 14.65 14.65 14.95 17.95 42.5 42.7 51.0 49.0 50.3 57.0 57.0 61.7 68.0 82.0 52.0 52.6 60.5 60.5 65.4 71.7 71.7 73.2 81.7 95.2 50.1 50.7 58.6 58.6 60.3 66.6 66.6 71.3 76.4 92.8 G 17.55 15.55 18.2 18.2 17.55 18.2 18.2 18.2 18.5 21.5 Test Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER NP89 Series 11 x 11 Grid NP89-12110-G4 Pin Layouts 15 x 15 Grid NP89-22508-G4 21 x 21 Grid NP89-44111-G4 12 x 12 Grid NP89-14409-G4 17 x 17 Grid NP89-21004-G4 25 x 25 Grid NP89-6252 -G4 14 x 14 Grid NP89-13302-G4 17 x 17 Grid NP89-28906-G4 14 x 14 Grid NP89-19601-G4 19 x 19 Grid NP89-36105-G4 Test & Burn-In Test SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
NP89-19601-G4-BF
### 物料型号 - NP89系列插座有多个型号,包括NP89-12110、NP89-14409、NP89-13302、NP89-19601、NP89-22508、NP89-21004、NP89-28906、NP89-36105、NP89-44111和NP89-62522等。

### 器件简介 - NP89系列是Pin Grid Array(PGA)/Zero Insertion Force(ZIF)插座,用于集成电路的测试和烧录。

### 引脚分配 - 引脚数量从121到625不等,具体型号的引脚数量和排列方式在表格中有详细说明。

### 参数特性 - 绝缘电阻:最小1,000MΩ,测试条件为500V DC。 - 介质耐电压:700V AC,持续1分钟。 - 接触电阻:30mΩ最大,测试条件为10mA/20mV。 - 工作温度范围:-40°C至+170°C。

### 功能详解 - 接触终端样式:具有擦拭动作系统,可以在操作过程中清洁IC引脚表面。 - 可靠的3点接触系统:提供稳定的连接。 - 成本性能:接触区域和终端区域采用不同厚度的接触材料。 - 去人口版本可用:可以根据需要提供不同配置的版本。

### 应用信息 - 适用于集成电路的测试和烧录,特别是在需要稳定连接和高可靠性的应用中。

### 封装信息 - 外壳材料:聚醚酰亚胺(PEI),玻璃填充,符合UL94V-0标准。 - 接触材料:铍铜(BeCu)。 - 镀层:镍上镀金。
NP89-19601-G4-BF 价格&库存

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