G1GF-F1-0000HF

RoHS G1AF THRU G1MF  COMPLIANT   Surface Mount General Purpose Rectifier Features ● Low profile package ● Ideal for automated placement ● Glass passivated chip junction ● High forward surge capability ● Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Typical Applications For use in general purpose rectification of power supplies, inverters, converters, and freewheeling diodes for consumer, and telecommunication. Mechanical Data ● Package: SMAF Molding compound meets UL 94 V-0 flammability rating, RoHS-compliant, halogen-free ● Terminals: Tin plated leads, solderable per J-STD-002 and JESD22-B102 ● Polarity: Cathode line denotes the cathode end ■Maximum Ratings (Ta=25℃ Unless otherwise specified） PARAMETER SYMBOL UNIT Device marking code G1AF G1BF G1DF G1GF G1JF G1KF G1MF G1AF G1BF G1DF G1GF G1JF G1KF G1MF Maximum Repetitive Peak Reverse Voltage VRRM V 50 100 200 400 600 800 1000 Maximum RMS Voltage VRMS V 35 70 140 280 420 560 700 VDC V 50 100 200 400 600 800 1000 IO A IFSM A G1JF G1KF G1MF Maximum DC blocking Voltage Average rectified output current @60Hz sine wave, resistance load, TL (Fig.1) Forward Surge Current (Non-repetitive) @60Hz Half-sine wave,1 cycle, Tj=25℃ Forward Surge Current (Non-repetitive) @1ms, square wave, 1 cycle, Tj=25℃ 1.0 30 60 Current squared time @1ms≤t8.3≤ms Tj=25℃，Rating of per diode Typical junction capacitance @Measured at 1MHz and Applied Reverse Voltage of 4.0 V.D.C I2t A2s 3.735 Cj pF 8 Storage temperature Tstg ℃ -55 ~ +150 Junction temperature Tj ℃ -55 ~ +150 ■Electrical Characteristics（Ta=25℃ Unless otherwise specified） SYMBOL UNIT TEST CONDITIONS Maximum instantaneous forward voltage drop per diode VF V IFM=1.0A 1.1 Maximum DC reverse current at rated DC blocking voltage per diode Tj =25℃ 5.0 IR μA Tj =125℃ 100 PARAMETER G1AF G1BF G1DF G1GF 1/4 S-S035 Rev. 2.4, 07-Jan-21 Yangzhou Yangjie Electronic Technology Co., Ltd. www.21yangjie.com G1AF THRU G1MF    ■Thermal Characteristics （Ta=25℃ Unless otherwise specified） PARAMETER SYMBOL G1AF UNIT G1BF G1DF G1GF RθJ-A(1) G1KF G1MF 65 ℃/W RθJ-L(1) Typical Thermal resistance G1JF 20 RθJ-C(1) 15 Note: (1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas ■ Characteristics (Typical) FIG.2: Forward Surge Current Capability FIG.1: Io-TL Curve 30 Peak Forward Surge Current (A) Average Forward Output Current (A) 1.0 0.8 0.6 0.4 0.2 0 24 8.3ms Single Half Sine Wave JEDEC Method 18 12 6 0 0 50 100 1 150 2 6 8 10 20 40 60 80 100 Number of Cycles Lead Temperature (℃) FIG.3: Typical Forward Voltage FIG.4: Typical Reverse Characteristics 1000 Instantaneous Reverse Current (uA) 100 Instantaneous Forward Current (A) 4 10 1.0 0.1 100 Tj=125℃ 10 1.0 Tj=25℃ 0.1   0.01 0.2 0.01 0.4 0.6 0.8 1.0 1.2 1.4 0 1.6 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Instantaneous Forward Voltage (V) 2/4 S-S035 Rev. 2.4, 07-Jan-21 Yangzhou Yangjie Electronic Technology Co., Ltd. www.21yangjie.com G1AF THRU G1MF    ■Ordering Information (Example) PREFERED P/N PACKING CODE UNIT WEIGHT(g) MINIMUM PACKAGE(pcs) INNER BOX QUANTITY(pcs) OUTER CARTON QUANTITY(pcs) DELIVERY MODE G1AF-G1MF F1 Approximate 0.034 3000 24000 96000 7” reel G1AF-G1MF F2 Approximate 0.034 10000 20000 160000 13” reel G1AF-G1MF F3 Approximate 0.034 10000 20000 120000 13” reel G1AF-G1MF F4 Approximate 0.034 7500 15000 120000 13” reel ■ Outline Dimensions SMAF SMAF A E B D F C Dim Min Max A 2.40 2.80 B 1.35 1.45 C 3.40 3.60 D 4.40 4.80 E 1.05 1.25 F 0.50 1.00 G 0.15 0.22 G Dimensions in millimeters ■ Suggested pad layout SMAF P2 Q2 P3 Dim Millimeters P1 6.50 P2 4.00 P3 1.50 Q1  2.50 Q2  1.70 Q1 P1 Dimensions in millimeters 3/4 S-S035 Rev. 2.4, 07-Jan-21 Yangzhou Yangjie Electronic Technology Co., Ltd. www.21yangjie.com G1AF THRU G1MF    Disclaimer The information presented in this document is for reference only. Yangzhou Yangjie Electronic Technology Co., Ltd. reserves the right to make changes without notice for the specification of the products displayed herein to improve reliability, function or design or otherwise. The product listed herein is designed to be used with ordinary electronic equipment or devices, and not designed to be used with equipment or devices which require high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Yangjie or anyone on its behalf, assumes no responsibility or liability for any damages resulting from such improper use of sale. This publication supersedes & replaces all information previously supplied. For additional information, please visit our website http:// www.21yangjie.com , or consult your nearest Yangjie’s sales office for further assistance. 4/4 S-S035 Rev. 2.4, 07-Jan-21 Yangzhou Yangjie Electronic Technology Co., Ltd. www.21yangjie.com