RoHS
YJD45G10AQ
COMPLIANT
N-Channel Enhancement Mode Field Effect Transistor
Product Summary
● VDS
● ID
● RDS(ON)( at VGS=10V)
● RDS(ON)( at VGS=4.5V)
● 100% UIS Tested
● 100% ▽VDS Tested
100V
45A
<17mΩ
<21.5mΩ
General Description
● Low RDS(on) & FOM
● Extremely low switching loss
● Excellent stability and uniformity
● Fast switching and soft recovery
● Part no. with suffix “Q” means AEC-Q101 qualified
Applications
● Power switching application
● Hard switched and high frequency circuits
● Uninterruptible power supply
● DC-DC convertor
■ Absolute Maximum Ratings (TA=25℃ unless otherwise noted)
Parameter
Symbol
Limit
Drain-source Voltage
VDS
100
V
Gate-source Voltage
VGS
±20
V
7
TA=25℃
4.5
TA=100℃
Drain Current
Avalanche energy
A
ID
Pulsed Drain Current
TC=25℃
45
TC =100℃
28
A
B
IDM
180
A
EAS
90
mJ
2.5
TA=25℃
1
TA=100℃
Total Power Dissipation
Unit
C
W
PD
TC=25℃
73
TC =100℃
29
Junction and Storage Temperature Range
TJ ,TSTG
-55~+150
℃
1/9
S-B2249
Rev.2.0,15-Feb-22
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com
YJD45G10AQ
■Thermal resistance
Parameter
Thermal Resistance Junction-to-Ambient
D
Symbol
Typ
Max
Steady-State
RθJA
40
50
Steady-State
RθJC
1.4
1.7
Units
℃/W
Thermal Resistance Junction-to-Case
■ Ordering Information (Example)
PREFERED P/N
PACKING
CODE
Marking
MINIMUM
PACKAGE(pcs)
INNER BOX
QUANTITY(pcs)
OUTER CARTON
QUANTITY(pcs)
DELIVERY
MODE
YJD45G10AQ
F1
YJD45G10A
2500
/
25000
13”Reel
2/9
S-B2249
Rev.2.0,15-Feb-22
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com
YJD45G10AQ
■ Electrical Characteristics (TJ=25℃ unless otherwise noted)
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Drain-Source Breakdown Voltage
BVDSS
VGS= 0V, ID=250μA
100
-
-
V
VDS=100V, VGS=0V
-
-
1
Zero Gate Voltage Drain Current
IDSS
VDS=100V, VGS=0V, Tj=150℃
-
-
100
IGSS
VGS= ±20V, VDS=0V
-
-
±100
nA
Gate Threshold Voltage
VGS(th)
VDS= VGS, ID=250μA
1.0
1.8
2.5
V
VGS=10V, ID=22.5A
-
14
17
Static Drain-Source On-Resistance
RDS(ON)
VGS=4.5V, ID=20A
-
17
21.5
IS=22.5A, VGS=0V
-
0.9
1.2
V
-
-
45
A
-
1.4
-
Ω
-
1165
-
-
265
-
Static Parameter
Gate-Body Leakage Current
Diode Forward Voltage
VSD
Maximum Body-Diode Continuous Current
IS
Gate resistance
RG
μA
mΩ
f=1MHz, Open drain
Dynamic Parameters
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
-
8
-
Total Gate Charge
Qg
-
19
-
Gate-Source Charge
Qgs
-
6
-
Gate-Drain Charge
Qgd
-
3
-
Reverse Recovery Charge
Qrr
-
45
-
nC
trr
-
40
-
ns
Turn-on Delay Time
tD(on)
-
40
-
Turn-on Rise Time
tr
-
12
-
Turn-off Delay Time
tD(off)
-
55
-
-
16
-
VDS=50V, VGS=0V, f=1MHz
pF
Switching Parameters
VGS=10V, VDS=50V, ID=22.5A
nC
IF=22.5A, di/dt=100A/us
Reverse Recovery Time
Turn-off fall Time
A.
B.
C.
D.
VGS=10V, VDD=50V, ID=22.5A
RGEN=2.2Ω
tf
ns
Repetitive rating; pulse width limited by max. junction temperature.
TJ=25℃, VDD=50V, VG=10V, RG=25Ω, L=0.5mH, IAS=19A.
Pd is based on max. junction temperature, using junction-case thermal resistance.
The value of RθJA is measured with the device mounted on the minimum recommend pad size, in the still air environment with TA =25℃.
The maximum allowed junction temperature of 150℃. The value in any given application depends on the user's specific board design.
3/9
S-B2249
Rev.2.0,15-Feb-22
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com
YJD45G10AQ
■Typical Electrical and Thermal Characteristics Diagrams
150
VGS= 10V
9V
8V
7V
6V
Tj=25℃
VDS=5V
-55℃
ID-Drain Current (A)
ID-Drain Current (A)
150
5V
100
4V
50
25℃
100
150℃
50
3V
0
0
0
1
2
3
4
1
5
2
VDS-Drain to Source Voltage (V)
Figure 1. Output Characteristics
C-Capacitance (pF)
VGS-Gate to Source Voltage (V)
10
Ciss
Coss
100
Crss
10
1
0
20
40
60
5
80
VDS=50V
ID=22.5A
Tj=25℃
8
6
4
2
0
100
0
5
VDS-Drain to Source Voltage (V)
10
15
20
Qg-Total Gate Charge (nC)
Figure 3. Capacitance Characteristics
Figure 4. Gate Charge
2.5
RDS(on)-Drain to Source Resistance
Normalized
100
RDS(on)-Drain to Source resistance (mΩ)
4
Figure 2. Transfer Characteristics
10000
1000
3
Vgs-Gate to Source Voltage (V)
80
60
40
20
ID=22.5A
Tj=25℃
3
2
1.5
1
0.5
0
2
Vgs=10V
4
5
6
7
8
9
-75
10
-25
25
75
125
175
Tj-Junction Temperature (℃)
VGS-Gate to Source Voltage (V)
Figure 5. On-Resistance vs Gate to Source Voltage
Figure 6. Normalized On-Resistance
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S-B2249
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Yangzhou Yangjie Electronic Technology Co., Ltd.
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100
25
20
Is-Reverse Drain Current (A)
RDS(on) -Drain to Source resistance (mΩ)
YJD45G10AQ
VGS=4.5V
15
VGS=10V
10
5
150℃
Tj=25℃
1
0
0
10
20
30
40
0.4
50
0.5
Figure 7. RDS(on) VS Drain Current
BVDSS-MAX Drain to Source Voltage
Normalized
1.1
0.6
0.7
0.8
0.9
1
Vsd- Source to Drain Voltage (V)
ID-Drain Current (A)
Figure 8. Forward characteristics of reverse diode
1.4
ID=250uA
ID=250uA
VGS(th)-Threshold Voltage
Normalized
1.2
1.05
1
0.95
0.9
-75
-25
25
75
125
1
0.8
0.6
0.4
0.2
175
-75
-25
25
75
125
175
Tj-Junction Temperature (℃)
Tj-Junction Temperature (℃)
Figure 9. Normalized breakdown voltage
Figure 10. Normalized Threshold voltage
50
100
40
80
Ptot-Power Dissipation (W)
ID-Drain Current (A)
25℃
10
30
20
10
60
40
20
0
0
-50
0
50
100
-50
150
0
50
100
150
Tc-Case Temperature (℃)
Tc-Case Temperature (℃)
Figure 11. Current dissipation
Figure 12. Power dissipation
5/9
S-B2249
Rev.2.0,15-Feb-22
Yangzhou Yangjie Electronic Technology Co., Ltd.
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YJD45G10AQ
1000
1
0.1
ID-Drain-Source Current (A)
Zth(J-C)-Thermal Resistance (℃/W)
10
D=0.5
D=0.3
D=0.1
D=0.05
D=0.02
0.01
D=0.01
Single Pulse
10uS
100
Operation in this area is
limited by RDS(ON)
100uS
300uS
10
1mS
10mS
DC
1
TJ(max)=150℃
TC=25℃
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
Single Pulse
0.1
1
0.1
Square Wave Pulse Durtion(S)
1
10
100
1000
VDS-Drain to Source Voltage (V)
Figure 13. Maximum Transient Thermal Impedance
Figure 14. Safe Operation Area
■ Test Circuits & Waveforms
EAS=1/2*L*IAS2
Tp
VGS
D
S
L
Tp
G
IAS
A
D
ID
VDD
DUT
25Ω
BVDSS
Vds
G
S
Tp
VDS
Figure A. Unclamped Inductive Switching (UIS) Test Circuit & Waveform
6/9
S-B2249
Rev.2.0,15-Feb-22
Yangzhou Yangjie Electronic Technology Co., Ltd.
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YJD45G10AQ
D
R1
VGS
VGS (V)
Qg
R2
G
10V
S
C1
VDD
D
R3
VGS(pl)
DUT
G
IG
Qgd
Qgs
S
Charge (C)
Figure B. Gate Charge Test Circuit & Waveform
VDS
90%
L
90%
90%
D
DUT
Rg
C1
C2
VDD
Vds
G
S
R shunt
Vgs
VR
10%
10%
10%
VGS
tD(on)
tf
tD(off)
tr
Id=VR/R shunt
t(off)
t(on)
Figure C. Resistive Switching Test Circuit & Waveform
D
Rg
ISD
G
S
D
C1
C2
VDD
trr
DUT
G
S
R shunt
VR
25%IRRM
Qrr
L
IRRM
Figure D. Diode Recovery Test Circuit & Waveform
7/9
S-B2249
Rev.2.0,15-Feb-22
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com
YJD45G10AQ
■ TO-252 Package information
■ Suggested Pad Layout
Dim
Millimeters
A
11.4
B
6.74
C
6.23
P
4.56
Q1
2.28
Q2
1.52
8/9
S-B2249
Rev.2.0,15-Feb-22
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com
YJD45G10AQ
Disclaimer
The information presented in this document is for reference only. Yangzhou Yangjie Electronic Technology Co., Ltd. reserves the
right to make changes without notice for the specification of the products displayed herein to improve reliability, function or design or
otherwise.
The product listed herein is designed to be used with automotive electronics,are not designed for use in medical, life-saving,
lifesustaining,or military,Yangjie or anyone on its behalf, assumes no responsibility or liability for any damages resulting from such im
proper use of sale.
This publication supersedes & replaces all information previously supplied. For additional information, please visit our website http://
www.21yangjie.com , or consult your nearest Yangjie’s sales office for further assistance.
9/9
S-B2249
Rev.2.0,15-Feb-22
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com