SSOP28

Package information - SSOP28 Surface mounted, 28 pin package Package outline D E1 E L c A2 A e A1 b Dim. A A1 A2 D E E1 Millimeters Min. 1.70 0.05 1.65 9.90 7.40 5.00 Max. 2.00 0.15 1.85 10.50 8.20 5.60 Inches Min. 0.067 0.002 0.065 0.390 0.291 0.197 Max. 0.079 0.006 0.073 0.413 0.323 0.220 Dim. L e b c - Millimeters Min. 0.55 0.22 0.09 0° Max. 0.95 0.38 0.25 8° - Inches Max. 0.022 0.009 0.004 0° Max. 0.037 0.015 0.010 8° - 0.65 BSC 0.026 BSC Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Soldering footprint 2.261 0.089 9.017 0.355 4.597 0.181 0.432 0.017 0.650 0.0256 mm inches Issue 1 - September 2005 © Zetex Semiconductors plc 2005 1 www.zetex.com Package information - SSOP28 Embossed carrier tape configuration P0 K t Top cover tape 10 pitches culmulative tolerance on tape ±0.2mm (±0.008”) D P2 E See Note 1 A0 See Note 1 F W B1 K0 See Note 1 B0 P Embossment Center lines of cavity D1 User direction of feed Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P Tape size (mm) 8 See note* 4.55 (0.179) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.75 ± 0.10 3.50 ± 0.10 (0.138 ± 0.004) 4.00 ±0.10 (0.157 ± 0.004) 12 See note* 8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 5.50 ± 0.05 (0.217 ± 0.002) 4.00 ±0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004) 16 See note* 12.10 (0.476) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 7.50 ± 0.10 (0.295 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004) 12.00 ± 0.10 (0.472 ± 0.004) 4.00 ± 0.10 2.00 ± 0.05 0.40 16.30 (0.642) 24 See note* 20.10 (0.791) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 11.50 ± 0.10 (0.453 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) to 20.00 ± 0.10 (0.787 ± 0.004) in 4.00 (0.157) increments 4.00 ± 0.10 2.00 ± 0.05 0.40 24.30 (0.957) P0 P2 t (max.) W 4.00 ± 0.10 2.00 ± 0.05 0.40 8.00 (0.315) 4.00 ± 0.10 2.00 ± 0.05 0.40 12.00 ± 0.30 (0.472 ± 0.012) NOTES: * A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements (see fig. 1). 0.5mm maximum 20° maximum Component cavity center line 0.5mm maximum B0 20° maximum Component center line A0 Component rotation - side view Component lateral movement Component rotation - top view Issue 1 - September 2005 © Zetex Semiconductors plc 2005 2 www.zetex.com Package information - SSOP28 Figure 1 - rotational and lateral movement Reel configuration Tape slot in core for tape start. 2.5mm min. width, 10mm min. depth T B A D N C Full radius G Tape size 8mm 12mm 16mm 24mm A (max.) 179 (7.047) 330 (12.992) 330 (12.992) 330 (12.992) B (min.) 1.5 (0.06) 1.5 (0.06) 1.5 (0.06) 1.5 (0.06) C 13.00 ±0.02 (0.512 ±0.008) 13.00 ±0.02 (0.512 ±0.008) 13.00 ±0.02 (0.512 ±0.008) 13.00 ±0.02 (0.512 ±0.008) D (min.) 25.0 (0.984) 20.2 (0.795) 20.2 (0.795) 20.2 (0.795) N (min.) 50 (1.969) 50 (1.969) 50 (1.969) 60 (2.362) G 8.4 +1.5 –0.0 (0.33 +0.06 – 0.00) 12.4 +2.0 –0.0 (0.49 +0.079 – 0.00) 16.4 +2.0 –0.0 (0.65 +0.079 – 0.00) 24.4 +2.0 –0.0 (0.96 +0.079 –0.00) T (max.) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 30.4 (1.197) This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. Issue 1 - September 2005 © Zetex Semiconductors plc 2005 3 www.zetex.com