TSSOP20

Package information - TSSOP20 Surface mounted, 20 pin package Package outline D E1 E L c A2 A b DIM A A1 A2 D E L e b c e A1 Millimeters Min Max 1.20 0.05 0.15 0.80 1.05 6.40 6.60 6.40 BSC 0.45 0.75 0.65 BSC 0.19 0.30 0.09 0.20 Inches Min Max 0.047 0.002 0.006 0.031 0.041 0.252 0.260 0.252 BSC 0.018 0.030 0.026 BSC 0.007 0.012 0.004 0.008 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Nominal weight Nominal weight per device 69mg. Issue 1 - September 2005 © Zetex Semiconductors plc 2005 1 www.zetex.com Package information - TSSOP20 Embossed carrier tape configuration P0 K t Top cover tape D P2 10 pitches culmulative tolerance on tape ±0.2mm (±0.008”) E See Note 1 A0 See Note 1 F W B1 K0 See Note 1 B0 P Embossment Center lines of cavity D1 User direction of feed Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P Tape size (mm) 8 See note* 4.55 (0.179) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.75 ± 0.10 3.50 ± 0.10 (0.138 ± 0.004) 4.00 ±0.10 (0.157 ± 0.004) 12 See note* 8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 5.50 ± 0.05 (0.217 ± 0.002) 4.00 ±0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004) 16 See note* 12.10 (0.476) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 7.50 ± 0.10 (0.295 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004) 12.00 ± 0.10 (0.472 ± 0.004) 4.00 ± 0.10 2.00 ± 0.05 0.40 16.30 (0.642) 24 See note* 20.10 (0.791) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 11.50 ± 0.10 (0.453 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) to 20.00 ± 0.10 (0.787 ± 0.004) in 4.00 (0.157) increments 4.00 ± 0.10 2.00 ± 0.05 0.40 24.30 (0.957) P0 P2 t (max.) W 4.00 ± 0.10 2.00 ± 0.05 0.40 8.00 (0.315) 4.00 ± 0.10 2.00 ± 0.05 0.40 12.00 ± 0.30 (0.472 ± 0.012) NOTES: * A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements (see fig. 1). 0.5mm maximum 20° maximum Component cavity center line 0.5mm maximum B0 20° maximum Component center line A0 Component rotation - side view Component lateral movement Component rotation - top view Figure 1 - rotational and lateral movement Issue 1 - September 2005 © Zetex Semiconductors plc 2005 2 www.zetex.com Package information - TSSOP20 Reel configuration Tape slot in core for tape start. 2.5mm min. width, 10mm min. depth T B A D N C Full radius G Tape size 8mm 12mm 16mm 24mm A (max.) 179 (7.047) 330 (12.992) 330 (12.992) 330 (12.992) B (min.) 1.5 (0.06) 1.5 (0.06) 1.5 (0.06) 1.5 (0.06) C 13.00 ±0.02 (0.512 ±0.008) 13.00 ±0.02 (0.512 ±0.008) 13.00 ±0.02 (0.512 ±0.008) 13.00 ±0.02 (0.512 ±0.008) D (min.) 25.0 (0.984) 20.2 (0.795) 20.2 (0.795) 20.2 (0.795) N (min.) 50 (1.969) 50 (1.969) 50 (1.969) 60 (2.362) G 8.4 +1.5 –0.0 (0.33 +0.06 – 0.00) 12.4 +2.0 –0.0 (0.49 +0.079 – 0.00) 16.4 +2.0 –0.0 (0.65 +0.079 – 0.00) 24.4 +2.0 –0.0 (0.96 +0.079 –0.00) T (max.) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 30.4 (1.197) This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. Issue 1 - September 2005 © Zetex Semiconductors plc 2005 3 www.zetex.com