TDA8510J

INTEGRATED CIRCUITS DATA SHEET TDA8510J 26 W BTL and 2 × 13 W SE power amplifiers Preliminary specification Supersedes data of 1999 Jun 14 File under Integrated Circuits, IC01 1999 Dec 14 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE power amplifiers TDA8510J FEATURES • Electrostatic discharge protection • Requires very few external components • No switch-on/switch-off plop • High output power • Flexible leads • Low output offset voltage (BTL channel) • Low thermal resistance • Fixed gain • Identical inputs (inverting and non-inverting). • Diagnostic facility (distortion, short-circuit and temperature detection) GENERAL DESCRIPTION • Good ripple rejection The TDA8510J is an integrated class-B output amplifier in a 17-lead single-in-line (SIL) power package. It contains a 26 W Bridge-Tied Load (BTL) amplifier and 2 × 13 W Single-Ended (SE) amplifiers. • Mode select switch (operating, mute and standby) • AC and DC short-circuit safe to ground and to VP • Low power dissipation in any short-circuit condition The device is primarily developed for multi-media applications and active speaker systems (stereo with subwoofer). • Thermally protected • Reverse polarity safe QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT General VP supply voltage 6 15 18 V IORM repetitive peak output current − − 4 A Iq(tot) total quiescent current − 80 − mA Istb standby current − 0.1 100 µA − 26 − W 46 − − dB BTL channel Po output power SVRR RL = 4 Ω; THD = 10% supply voltage ripple rejection Vn(o) noise output voltage − 70 − µV Zi input impedance Rs = 0 Ω 25 − − kΩ ∆VOO DC output offset voltage − − 150 mV RL = 4 Ω − 7 − W RL = 2 Ω − 13 − W 46 − − dB − 50 − µV 50 − − kΩ Single-ended channels Po output power SVRR supply voltage ripple rejection Vn(o) noise output voltage Zi THD = 10% input impedance Rs = 0 Ω ORDERING INFORMATION TYPE NUMBER TDA8510J 1999 Dec 14 PACKAGE NAME DESCRIPTION DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) 2 VERSION SOT243-1 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE power amplifiers TDA8510J BLOCK DIAGRAM VP1 5 non-inverting input 1 1 mute switch VP2 13 Cm 60 kΩ TDA8510J 6 VA output 1 2 kΩ power stage 18 kΩ non-inverting input 2 3 mute switch Cm 60 kΩ 8 VA output 2 2 kΩ power stage 18 kΩ VP 14 diagnostic output standby reference voltage VA 15 kΩ PROTECTIONS thermal short-circuit mute switch x1 supply voltage ripple rejection mode select switch 16 standby switch 4 15 kΩ mute reference voltage mute switch Cm 60 kΩ inverting input 3 15 10 VA output 3 2 kΩ power stage 18 kΩ non-inverting input 4 17 mute switch Cm 60 kΩ 12 VA 2 kΩ input reference voltage 2 power stage 18 kΩ 7 11 GND1 ground (signal) 9 GND2 not connected power ground (substrate) Fig.1 Block diagram. 1999 Dec 14 3 MGL428 output 4 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE power amplifiers TDA8510J PINNING SYMBOL PIN DESCRIPTION −INV1 1 non-inverting input 1 SGND 2 signal ground −INV1 1 −INV2 3 non-inverting input 2 SGND 2 −INV2 3 RR 4 VP1 5 OUT1 6 GND1 7 OUT2 8 n.c. 9 RR 4 supply voltage ripple rejection VP1 5 supply voltage 1 OUT1 6 output 1 GND1 7 power ground 1 OUT2 8 output 2 n.c. 9 not connected OUT3 10 output 3 GND2 11 power ground 2 OUT4 12 output 4 VP2 13 supply voltage 2 MODE 14 mode select switch input INV3 15 inverting input 3 VDIAG 16 diagnostic output −INV4 17 non-inverting input 4 TDA8510J OUT3 10 GND2 11 OUT4 12 VP2 13 MODE 14 INV3 15 VDIAG 16 −INV4 17 MGL427 Fig.2 Pin configuration. 1999 Dec 14 4 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE power amplifiers TDA8510J During this short-circuit condition, pin 16 is LOW for 20 ms and HIGH for 50 µs (see Fig.5). FUNCTIONAL DESCRIPTION The TDA8510J contains four identical amplifiers and can be used for two Single-Ended (SE) channels (fixed gain 20 dB) and one Bridge-Tied Load (BTL) channel (fixed gain 26 dB). Special features of the device are: The power dissipation in any short-circuit condition is very low. Mode select switch (pin 14) • Low standby current (100 ms (charging of the input capacitors at pins 1, 3, 15 and 17. The circuit in Fig.8 slowly ramps up the voltage at the mode select switch pin when switching on and results in fast muting when switching off. handbook, halfpage VP 10 kΩ 47 µF 100 Ω mode select switch 100 kΩ MGA708 Fig.8 Mode select switch circuitry. 1999 Dec 14 12 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE power amplifiers TDA8510J PACKAGE OUTLINE DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 17 e1 Z bp e e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 e1 e2 1.27 5.08 Eh j L L3 m Q v w x Z (1) 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.4 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-03-11 97-12-16 SOT243-1 1999 Dec 14 EUROPEAN PROJECTION 13 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE power amplifiers TDA8510J The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction to soldering through-hole mount packages The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by solder wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL WAVE suitable(1) suitable Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Dec 14 14 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE power amplifiers TDA8510J NOTES 1999 Dec 14 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545002/03/pp16 Date of release: 1999 Dec 14 Document order number: 9397 750 06653