OB2004Ax
High Performance Synchronous Rectifier
GENERAL DESCRIPTION
FEATURES
OB2004Ax is a high performance and tightly
integrated secondary side synchronous rectifier for
switch mode power supply system. It combines a
much lower voltage drop N-channel MOSFET to
emulate the traditional diode rectifier at the
secondary side of Flyback converter, which can
reduce heat dissipation, increases output current
capability and efficiency and simplify thermal
design. It can support wide range of system output
voltage 3V~12V.
It is suitable for multiple mode applications
including discontinuous conduction mode (DCM),
quasi-resonant mode (QR) and continuous
conduction mode (CCM). Specially for CCM, to
guarantee system reliability, innovative property
prediction algorithm is used in SR turn-off control.
In addition, to balance reliability and efficiency,
OB2004Ax generates a driving signal with
optimized dead time with respect to the primary
side PWM signal from the information on the
secondary side of the isolation transformer with
the help of innovative property dead time control
algorithm.
The innovative property off time control effectively
avoid the ring impact induced by parasitic
elements so that a reliable and noise free
operation of the SR system is insured.
OB2004Ax is offered in SOP8 package.
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Secondary-side synchronous rectifier for
3V~12V output system
Suitable for DCM, QR and CCM operation
Prediction algorithm for CCM
Internal Power MOSFET
Accurate secondary side MOSFET Vds
sensing
SR turn on/off dead-time control for high
efficiency and low thermal with immunity of
interference
Adaptive off time control effectively avoid the
ring impact induced by parasitic elements
VDD UVLO protection
APPLICATIONS
to
AC/DC 3V~12V chargers/adaptors
Low voltage rectification circuits
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TYPICAL APPLICATION
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Preliminary Datasheet
OB_DOC_DS_2004Ax03
OB2004Ax
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High Performance Synchronous Rectifier
GENERAL INFORMATION
Absolute Maximum Ratings
Parameter
Value
Vin pin
-0.6V to 24V
VDD pin
-0.6V to 8V
Drain pin
-2.5V to 60V
Min/Max
Operating
-40 to 150 ℃
Junction Temperature TJ
Operating
Ambient
-20 to 85 ℃
Temperature TA
Min/Max
Storage
-55 to 150 ℃
Temperature Tstg
Lead
Temperature
260 ℃
(Soldering, 10secs)
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Pin Configuration
The OB2004Ax is offered in SOP8 package,
shown as below.
Note1: Stresses beyond those listed under “absolute
maximum ratings” may cause permanent damage to the device.
These are stress ratings only, functional operation of the device
at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure
to absolute maximum-rated conditions for extended periods
may affect device reliability.
Note2: -2.5V applies to minimum duty cycle during normal
operation only.
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Output Power Table
Part Number
OB2004AWCP
OB2004AZCP
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Recommended Operating Range
Symbol Parameter
Min/Max
VDD
VDD Supply Voltage
4.2V to 5V
OB2004Ax
Output
X
Package
C:SOP8
X
X
Green Package
P: Green
(Halogen-free)
Packing
Blank:Tube
A: Tape/Reel
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High Performance Synchronous Rectifier
Maximum
Current
2A
3A
Note: Maximum practical continuous power in a charger
designed with sufficient drain pattern as a heat sink, at 40℃
ambient.
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Package Dissipation Rating
Package
RJA(℃/W)
SOP8
85
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Ordering Information
Part Number
Description
OB2004AZCP
SOP8, Halogen-free in Tube
OB2004AZCPA
SOP8, Halogen-free in T&R
OB2004AWCP
SOP8, Halogen-free in Tube
OB2004AWCPA SOP8, Halogen-free in T&R
©On-Bright Electronics
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2
Preliminary Datasheet
OB_DOC_DS_2004Ax03
OB2004Ax
W
High Performance Synchronous Rectifier
YWWZZZ
OB2004WCP
A
S
Y:Year Code
WW:Week Code(01-52)
ZZZ:Lot Code
C:SOP8 Package
P:Halogen-free Package
A:Character Code
S:Internal Code(Optional)
Y:Year Code
WW:Week Code(01-52)
ZZZ:Lot Code
C:SOP8 Package
P:Halogen-free Package
A:Character Code
S:Internal Code(Optional)
to
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YWWZZZ
OB2004ZCP
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TERMINAL ASSIGNMENTS
I
Description
Ground
Power Supply
System output voltage detection
SR Mosfet drain pin. This pin is connected to secondary-side winding of
transformer
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Pin Name
GND-(1,2pin)
VDD-(3pin)
Vin-(4pin)
Drain(5,6,7,8pin)
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Marking Information
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-3-
Preliminary Datasheet
OB_DOC_DS_2004Ax03
OB2004Ax
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High Performance Synchronous Rectifier
BLOCK DIAGRAM
VDD
Vin
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Drain
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Regulator1
Bias
System
Output
Detection
PG
AVDD
UVLO
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Regulator2
to
AVDD
200mV
Drain
Min on
time
R
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HV
Switch
Logic
Control
Driver
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VS
Ring
Detection
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Demag_Det
Prdiction
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GND
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Preliminary Datasheet
OB_DOC_DS_2004Ax03
OB2004Ax
W
High Performance Synchronous Rectifier
ELECTRICAL CHARACTERISTICS
(TA = 25℃, VDD=5V, unless otherwise noted)
Symbol
Parameter
Test Conditions
Min Typ. Max Unit
Supply Voltage (VDD)
VDD_regulation_min VDD regulation voltage
VDD_regulation_max VDD regulation voltage
VDD Under Voltage Lockout
Entry
VDD Under Voltage Lockout
UVLO(ON)
Exit (Recovery)
VDrain Detection Section
SR MOSFET turn on threshold
Vth_SR_act
voltage detection at VDrain
Adjustable SR MOSFET turn
Vth_SR_deact
off threshold voltage detection
at VDrain
SR MOSFET fast path turn-on
propagation delay
Tdelay_on
SR MOSFET slow path turn-on
propagation delay
SR
MOSFET
turn-off
Tdelay_off
propagation delay
Voltage level at Vin when SR is
Vin_sr_disable
disable
CCM Prediction Section
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mA
0.8 mA
4.2
V
5
V
3.0
V
2.4
V
-150 -200 -250 mV
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Tsr_on_max
1.6
-1
mV
70
ns
200
ns
75
ns
1.9 2.1
2.3
V
No sub-harmonic condition
63
66
69
%
With sub-harmonic condition
12
15
18
%
35
40
45
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Prediction ratio
0.6
to
UVLO(OFF)
Rpre
1.2
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Operation current
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I_VDD_operation
Frequency@VDrain=65KHz,V
DD=5V, 1nF Cap load at
GATE.
Frequency@VDrain=2KHz,
VDD=5V, No load at GATE.
Frequency@VDrain=50KHz,
Duty=25%,
High
level
@VDrain=20V Vin5.5V
Maximum SR turn-on time
nB
Dead-time Control Section
Maximum SR turn-off dead time
0.8
us
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Tdt_off_max
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Preliminary Datasheet
OB_DOC_DS_2004Ax03
OB2004Ax
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High Performance Synchronous Rectifier
Product
BVdss(V)
MOSFET Drain-Source Breakdown Voltage
Min
Typ.
Max
Rds,on(mΩ)
On resistance
Min
Typ.
Max
OB2004AZCP
60
8
OB2004AWCP
60
16
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CHARACTERIZATION PLOTS
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Note1:Suggesting primary side controller operating at 65kHz frequency
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Parameter
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Preliminary Datasheet
OB_DOC_DS_2004Ax03
OB2004Ax
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High Performance Synchronous Rectifier
Operation Description
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OB2004Ax is a high performance and versatile
synchronous rectifier. It can emulate the behavior
of Schottky diode rectifier which directly reduces
power dissipation of the traditional rectifiers and
indirectly reduces primary-side loss due to
compounding of efficiency gains.
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Startup and under voltage lockout (UVLO)
Whether OB2004Ax can operate normally or not
depends on UVLO function implemented on chip
and system output voltage. When power system is
plugged in, VDD cap is charged from transformer
secondary winding. When VDD rises above
UVLO(off), the IC wakes up from under voltage
lock out state and monitors the system output
voltage through Vin pin. OB2004Ax will output SR
gate based on correct timing after VDD rises
above 3.0V(typical). Refer to the following timing
diagram.
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Fig.3 System output SCP timing diagram
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Additionally, there is a pull down on-chip 15Kohm
resistor to avoid the misconducting by VDrain
pulse coupling. Besides, a hysteresis window
between UVLO(off) and UVLO(on) makes system
work reliably.
Synchronization rectifier
OB2004Ax controls the turn-on and turn-off of
synchronization rectifier MOSFET (SR MOSFET)
by detection of drain-source voltage and
prediction control. When demagnetization of
transformer starts, the secondary-side current will
flow through the body diode of SR MOSFET and
the voltage at the drain will drop to below -200mV
(typical). As soon as OB2004Ax detects this
negative voltage, the driver voltage is pulled high
to turn on the SR MOSFET after variable delay
time depending on input line voltage and loading
condition, refer to Fig.4.This variable delay time
can improve system immunity to noise.
After the SR MOSFET is turned on, the drain
voltage of SR MOSFET begins to rise based on its
Rdson and secondary-side current. The drain
voltage becomes higher with demagnetization
going on. When the drain voltage rises above 1mV, the driver voltage will be pulled down to
ground very quickly, refer to Fig.4
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Fig.1 System start up timing diagram
With enough high Vin, OB2004Ax would be
powered from VDD and system output (Vin),
which can lead to better system efficiency. When
VDD drops below UVLO(on),SR would be disable.
Refer to the following timing diagram. For system
reliability, the SR gate would be pulled low when
VDD is lower than 2.4V (typical). Refer to the
following timing diagram.
Fig.2 System shut down timing diagram
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Preliminary Datasheet
OB_DOC_DS_2004Ax03
OB2004Ax
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High Performance Synchronous Rectifier
primary side to be 0.8uS in stable CCM operation
to further improve the efficiency while ensure the
safe operation.
Primary-side
PWM
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VDrain
Tdemag(n)
Tdemag(n+1)
Demag
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Prediction
Tsr_on(n)
SR
Tsr_on(n+1)
Tsr_on(n+1) = Tdemag(n) * 66%
Fig.5 Prediction in stable CCM
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Fig.4 SR MOSFET turn-on and turn-off timing
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Prediction control in CCM
When system works in CCM mode, drain voltage
can not rise above -1mV when primary side turns
on. In this case the property prediction algorithm
implemented in OB2004Ax turns off the SR.
OB2004Ax would detect the demagnetization time
of current cycle and use this information to turn off
SR in next cycle. For stable CCM, there is little
variation between consecutive demagnetization
phase, so the next cycle SR can be turn off
predictively with pre-set prediction ratio, such as
66%. This means the next SR turn-on would last
66% of current demagnetization time before turn
off. However when sub-harmonic switching
happens, there is risk of short-circuit of
transformer if both primary side and secondary
side switch controllers are in turn-on phase. To
avoid this risk, OB2004Ax would detect the
primary side turn on time. If the primary side turn
on time of current cycle is 500ns (typical) longer
than the previous cycle, the pre-set prediction
ratio would be changed from 66% to 15% so that
the SR turn-on time is significantly reduced to
avoid the risk of short-circuit of transformer. Fig.5
and Fig.6 illustrates the control scheme. In the
next consecutive cycles, the SR on-time will be
gradually increased that improve the efficiency.
Fig.6 Prediction in CCM with sub-harmonic
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Dead time control
For
efficiency
and
thermal
issue,
the
demagnetization current flowing through SR
MOSFET body diode after SR turn off should be
as small as possible, i.e the dead time between
SR turn off and demagnetization ending is as
short as possible. But when SR MOSFET Rdson
is too small or interference riding on Vds, SR
maybe turn off prematurely. In this case, an
adaptive dead time control algorithm used in
OB2004Ax can correct the dead time to 0.8uS
(typical) for good efficiency and thermal
performance.
In addition, a adaptive dead time control is
implemented (described in next section). It
regulates the time period (dead time) between the
SR tune off instance and turn on instance of the
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Preliminary Datasheet
OB_DOC_DS_2004Ax03
OB2004Ax
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High Performance Synchronous Rectifier
PACKAGE MECHANICAL DATA
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SOP8 PACKAGE OUTLINE DIMENSIONS
Symbol
Dimensions In Inches
Min
Max
Min
Max
1.350
1.750
0.053
0.069
A1
0.050
0.250
0.002
0.010
A2
1.250
1.650
0.049
0.065
b
0.310
0.510
0.012
0.020
c
0.100
0.250
0.004
0.010
D
4.700
5.150
0.185
0.203
E
3.800
4.000
0.150
0.157
E1
5.800
6.200
0.228
0.244
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Dimensions In Millimeters
e
1.270 (BSC)
0.050 (BSC)
L
0.400
1.270
0.016
0.050
θ
0º
8º
0º
8º
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Preliminary Datasheet
OB_DOC_DS_2004Ax03
OB2004Ax
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High Performance Synchronous Rectifier
IMPORTANT NOTICE
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RIGHT TO MAKE CHANGES
On-Bright Electronics Corp. reserves the right to make corrections, modifications, enhancements,
improvements and other changes to its products and services at any time and to discontinue any product
or service without notice. Customers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete.
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WARRANTY INFORMATION
On-Bright Electronics Corp. warrants performance of its hardware products to the specifications
applicable at the time of sale in accordance with its standard warranty. Testing and other quality control
techniques are used to the extent it deems necessary to support this warranty. Except where mandated
by government requirements, testing of all parameters of each product is not necessarily performed.
On-Bright Electronics Corp. assumes no liability for application assistance or customer product design.
Customers are responsible for their products and applications using On-Bright’s components, data sheet
and application notes. To minimize the risks associated with customer products and applications,
customers should provide adequate design and operating safeguards.
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LIFE SUPPORT
On-Bright Electronics Corp.’s products are not designed to be used as components in devices intended to
support or sustain human life. On-bright Electronics Corp. will not be held liable for any damages or
claims resulting from the use of its products in medical applications.
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MILITARY
On-Bright Electronics Corp.’s products are not designed for use in military applications. On-Bright
Electronics Corp. will not be held liable for any damages or claims resulting from the use of its products in
military applications.
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Preliminary Datasheet
OB_DOC_DS_2004Ax03