深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
规 格 承 认 书
SPECIFICATION FOR APPROVAL
客户名称 Customer
客户料号 Customer P/N
型号规格 Product Type
SMRH3D28-220M(f)
拟
制 Prepared By
王
审
核 Checked By
钟景高
批
准 Approved By
王上衡
签发日期 Issued Date
楠
2024-05-27
我们已确认承认书中的产品特性和要求
We have confirmed the product features and requirements in this specification.
客户确认
Customer Approved Signature
请认真阅读承认书的相关内容,将确认签名后承认书回传给我们。
Please read the relevant contents of this specification carefully and return one duplicate of this product
specification to us with your signature to acknowledge your receipt.
如果在收到承认书后 1 个月内没有回传承认书,则视为贵公司已默认接受。
If the duplicate of this specification is not returned within 1 month of receipt, the product specification will be
deemed to have been received by your company.
最终解决权归深圳振华富电子有限公司所有。
The final interpretation right belongs to Shenzhen Zhenhuafu Electronics Co., Ltd.
总部地址:深圳市龙华区龙华街道和平路振华工业园
HQ ADD: ZhenHua Prodction Center, RD Heping, Longhua District, ShenZhen
电话(TEL):(+86 0755) 28159282 28159885 传真(FAX):(+86 0755) 28159885 邮编(ZIP):518109
生产基地:东莞市虎门镇赤岗社区中国电子东莞产业基地
Manufacturing Base: CEC Dongguan Industrial Base, Chigang Community, Humen Town, DG
电话(TEL):(+86 0769) 85226668 传真(FAX):(+86 0755) 85225678 邮编(ZIP):523899
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
更改记录
REVISED RECORD
日期
更改内容
备注
Date
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Remarks
i
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
1 产品命名 PRODUCT INDENFICATION
SMRH
3D28 –
①
220
M (f)
③
④ ⑤
②
①系列代号 Series Code
SMRH
②外形尺寸(mm) External Dimensions(mm)
长度×宽度×高度
③标称电感量 Nominal Inductance
220:22μH
④电感量偏差 Inductance Tolerance
M:±20%
⑤无有害物质产品 Hazardous Substance Free Products
(f)
2 外形结构及尺寸APPEARANCE AND DIMENSIONS
外形结构 APPEARANCE
单位(UNIT): mm 电气特性图 SCHEMATICS OF ELECTRICAL
CHARACTERISTICS
推荐焊盘 RECOMMENDED PAD
系列 Series
A
B
C
H
I
J
SMRH3D28
3.8±0.3
3.8±0.3
3.2±0.3
1.5
1.5
4.5
主要材料
Main Materials
铁氧体磁芯 Ferrite Core、漆包铜线 Copper Wire、锡合金 Tin Alloys
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深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
3 电气特性 ELECTRICAL CHARACTERISTICS
电感量 L
型号规格
Inductance
Product Type
直流电阻 RDC
测试条件
DC Resistance
Test Conditions
±20%
Max
额定电流 IDC
Rated Current
SMRH3D28-220M(f)
22
100 kHz/0.25V
335
0.68
单位 Units
μH
——
mΩ
A
TH2828
——
TH2516
WK3260B
工作温度
储存温度
储存相对湿度
Operating temp.: -40℃~ 125℃
Storage temp.: -40℃ ~ 85℃
Storage R.H.: 30% ~ 70%
测试仪器
Test Equipments
通用要求
General Requirements
额定电流:产品电感量相对于零电流时下降 20%时的直流电流值。
IDC : The DC current value when the inductance of the product drops by 20% relative to the zero current.
4 包装 Packaging
4.1 包装方式 Packaging Method
4.2 剥离强度要求 Peeling off Force of Cover Tape
剥离力 Peeling off Force:20~100g
剥离速度 Speed of Peeling off:300mm/min
剥离角度 Angle of Peeling off:165°~180°
4.3 盘装数量 Reel Quantity
系列
卷盘 Reel
Series
(PCS)
SMRH3D28
2000
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深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
5 可靠性 Reliability
项目
要求
试验方法及备注
Items
Requirements
Test Methods and Remarks
无端电极剥离、断线或其它失效现象发生。
No removal or split of the termination or other defects
shall occur.
按左图将电感器焊接于试验板上
Soldering the inductor on the testing Substrate (glass
epoxy board shown as the left figure) by using eutectic
solder.
引出端强度
Terminal Strength
按左图施加作用力
Apply a force as the left figure.
作用力 Force: 2.5N
持续时间 Duration: 10s
外观无可见机械损伤。
按左图将电感器焊接于试验板上
No visible mechanical damage.
Soldering the inductor on the testing Substrate (glass
epoxy board shown as the left figure) by using eutectic
弯曲
solder.
Bending Test
施加作用力速度 Speed of Applying Force: 0.5mm/s
形变量 Deflection: 2mm
持续时间 Duration: 30s
振动频率 Oscillation Frequency:
10Hz to 2000Hz to 10Hz, 20 min;
振动
Vibration
外观无可见机械损伤。
振幅或加速度 Total amplitude or Acceleration:
No visible mechanical damage.
3.0 mm , 245m/s2;
方向 Direction: X、Y、Z;
每个方向试验时间 Each Direction Testing Time: 4h
方法:采用浸焊试验
Method: The test samples shall be dipped in flux, and
then immersed in molten solder.
可焊性
Solderability
预热 Pre-Heating: 150℃±10℃ / 60s~90s
端电极表面至少覆盖 90%新焊料。
The surface of the terminal electrode shall be covered
with at least 90% new solder.
焊接温度 Soldering temp.: 245±5℃
浸锡时间 Immersion Time: 3±1s
焊料 Solder: 96.5Sn/3.0Ag/0.5Cu
助焊剂 Flux: 25%松香 rosin, 75%乙醇 ethanol
浸锡深度 Immersion depth: 焊锡应浸没端电极 All
sides of the terminal electrode shall be immersed.
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深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
项目
要求
试验方法及备注
Items
Requirements
Test Methods and Remarks
方法:采用浸焊试验
Method: The test samples shall be dipped in flux, and
then immersed in molten solder
耐焊接热
Resistance to
Soldering Heat
外观无可见机械损伤;
焊接温度 Soldering temp.: 260±5℃
No visible mechanical damage;
浸锡时间 Duration: 10±1s
电感量变化率 Inductance change rate:±30%.
焊料 Solder: 96.5Sn/3.0Ag/0.5Cu
助焊剂 Flux: 25%松香 rosin, 75%乙醇 ethanol
浸锡深度 Immersion depth: 焊锡应浸没端电极 All
sides of the terminal electrode shall be immersed.
温度及时间 Temperature and time: -40±3℃, 30min;
温度冲击
Thermal Shock
外观无可见机械损伤;
125±3℃, 30min
No visible mechanical damage;
转换时间 Transforming interval: ≤20s
电感量变化率 Inductance change Rate:±20%.
循环次数 Cycle Times: 100
测量恢复时间 Test Recovery Time: 24h±2h
耐湿
Humidity Resistance
高温贮存
High Temperature
Storage
低温贮存
Low Temperature
Storage
寿命
Life
温度 Temperature: 40±2℃
外观无可见机械损伤;
湿度 Humidity: 90~95%RH
No visible mechanical damage;
电感量变化率 Inductance change Rate:±30%.
时间 Duration: 100±4h
测量恢复时间 Test Recovery Time: 24h±2h
外观无可见机械损伤;
试验温度 Temperature: 125±2℃
No visible mechanical damage;
时间 Duration: 100±4h
电感量变化率 Inductance change Rate:±30%.
测量恢复时间 Test Recovery Time: 24h±2h
外观无可见机械损伤;
温度 Temperature: -40±3℃
No visible mechanical damage;
时间 Duration: 100±4h
电感量变化率 Inductance change Rate:±30%.
测量恢复时间 Test Recovery Time:24h±2h
温度 Temperature: 85±3℃
外观无可见机械损伤;
施加电流 Applied current: Irms/IDC
No visible mechanical damage;
电感量变化率 Inductance change Rate:±30%.
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时间 Duration: 1000±24h
测量恢复时间 Test Recovery Time: 24h±2h
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
附件 1:电感器焊接及安装注意事项
Annex 1: Inductors Soldering and Mounting Precautions
1-1 焊接方式 Soldering Methods
(a)贴片电感器推荐使用回流焊。
Reflow soldering is recommended for Chip Inductors.
(b)插件电感器推荐使用波峰焊或者烙铁焊。
Flow soldering or soldering iron is recommended for through-hole Inductors.
(c)条件限制时除外。
Except for limited conditions.
1-2 焊接原材料 Soldering Materials
(a)焊料:推荐使用 96.5Sn/3.0Ag/0.5Cu 焊料,或者采用 Sn 含量不超过 97%的锡合金焊料。
Solder: It is recommended to use 96.5Sn/3.0Ag/0.5Cu solder, or use Tin alloy solder with a Tin
content not exceeding 97%.
(b)助焊剂:推荐使用松香类助焊剂,请勿使用强酸性助焊剂(含氯量超过 0.2wt %),并且请勿
使用水溶性助焊剂。
Flux: It is recommended to use rosin-based flux. Acidic flux (with chlorine content exceeding
0.2wt %) and water-soluble flux are forbidden.
1-3 焊接温度及要求 Soldering Temperature & Requirements
(a)回流焊 Reflow Soldering
回流焊温度曲线 Reflow Soldering Temperature Profile
回流焊要求 Reflow Soldering Requirements
标准温度曲线 Standard Profile
加热 Heating
加热
时间
Temp.
Time
(T1)
(t1)
220℃
30~60s
极限温度曲线 Limit Profile
加热 Heating
峰值温度
回流焊次数
Peak Temp.
Cycle Of
温度 Temp.
时间 Time
Peak Temp.
(T2)
Reflow
(T3)
(t2)
(T4)
245±3℃
≤2
230℃
≤60s
260℃/10s
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峰值温度
回流焊次数
Cycle Of Reflow
1
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
(b)波峰焊 Flow Soldering
波峰焊温度曲线 Flow Soldering Temperature Profile
波峰焊要求 Flow Soldering Requirements
预热 Pre-heating
标准温度曲线 Standard Profile
极限温度曲线 Limit Profile
加热
加热 Heating
温度
时间
温度
时间
波峰次数
温度
时间
波峰次数
Temp.
Time
Temp.
Time
Cycle Of Flow
Temp.
Time
Cycle Of Flow
(T1)
(t1)
(T2)
(t2)
(T3)
(t2)
150℃
≥60s
250℃
4s~6s
265±3℃
≤5s
≤2
1
(c)烙铁焊 Soldering Iron
推荐使用恒温电烙铁进行焊接,焊头工作部分最大直径不宜超过 5 毫米。
It’s recommended to use a constant temperature soldering iron, the maximum diameter of the
soldering iron end tip should not exceed 5 mm.
焊接温度根据焊料和实际情况确定,最高温度不宜超过 380℃。
The temperature of soldering iron is determined according to the solder and the actual situation, and
the maximum temperature should not exceed 380 °C.
单次焊接时间应控制在 3 秒以内。
The single soldering time should be controlled within 3 seconds.
重焊或者重复焊接时,需先在 150℃条件下预热 1-2 分钟。
When resoldering or repeating the soldering, it is necessary to preheat for 1-2 minutes at 150 °C.
烙铁头不能直接接触元件焊盘以外的部分。
Do not directly touch parts other than soldering pads with soldering iron tip.
1-4 安装说明 Mounting instructions
(a)焊盘布局尺寸 Pad Dimensions
过大焊盘会降低安装后的电感器 Q 值。同时,过大焊盘面积(图中线划分部分“c”和“d”
)
还会造成电极浮悬和电极浸出。请采用推荐焊盘,否则电感器性能可能发生变化或者在焊接
过程中出现位置偏移。
Too large a pad can degrade the inductor Q value after installation. At the same time, too large a pad
area (the line division sections "c" and "d" in the figure) will also cause electrode floating and
electrode leaching. Use the recommended pads, otherwise inductor performance may change or
position shifts may occur during the soldering process.
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深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
焊盘布局图
Pad Sketch
(b)磁耦合 Magnetic Coupling
由于一些电感器的结构如同开放磁路,电感器之间的间距过窄可能会导致磁耦合,如下图所
示,因此建议使用耦合系数小的电感器。
Since some inductors are structured like open magnetic circuits, too narrow a spacing between
inductors may cause magnetic coupling, as shown in the figure below, so it is recommended to use
inductors with small coupling coefficients.
磁耦合示意图
Magnetic Coupling Sketch
(c)PCB 设计 PCB Design
PCB 板需合理设计,使产品不会因板的翘曲而承受机械应力。
PCB needs to be reasonably designed so that the product will not be subjected to the mechanical
stress due to warpage of the board, as shown in the figure below.
PCB 设计示意图
PCB Design Sketch
(d)绑定胶量 Amount of Adhesive
电感器安装后有振动等特殊使用条件时,需对电感器进行粘接绑定。如果绑定胶使用过多,
可能会溢出流入到焊盘或电极处,造成可焊性降低。反之,如果绑定胶用量不足,或者绑定
胶没有充分固化,电感器可能就会在后续试验中脱落,绑定如下图所示。
When the inductor needs to be used in special conditions such as vibration after it is installed, it is
necessary to bond the inductor with adhesive. If too much adhesive is applied, then it may overflow
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深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
into the pad or electrode areas and cause poor solder ability. In contrast, if insufficient adhesive is
applied, or if the adhesive is not sufficiently hardened, then the inductors may become detached
during flow test. The application method of adhesive is shown in the figure below.
绑定示意图
Adhesive Sketch
1-5 清洗 Cleaning
清洗时应遵循以下条件:
The following conditions should be observed when cleaning:
电装后建议采用喷淋清洗方式,请勿使用超声清洗。
It is recommended to use spray cleaning method after soldered. Do not use Ultrasonic cleaning.
清洗温度应不高于 60°C(使用醇类有机溶剂时应在 40°C 以下)
。
Cleaning temperature shall be limited to 60°C max. (40°C max for alcohol cleaning agents).
确保彻底清除残留助焊剂,用去离子水清除水溶性清洗液后,应使电感器完全干燥。
To ensure that flux residue is completely removed. Inductors should be thoroughly dried after it has
been removed with deionized water.
8/9
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
附件 2:最小起定量和其他要求
Annex 2: Minimum Order Quantity and Other Requirements
系列
包装
最小起定量
外箱
Series
Packing
Minimum Order Quantity
Outer Case
SMRH3D28
卷盘 Reel
2000 PCS
纸箱 Carton
△
警告 Caution
限制使用 Limitation of Applications
若将本目录中的产品用于需要极高可
飞机设备 Aircraft equipment
靠性以防直接危及第三方生命、身体
运输设备(汽车、火车、船舶等)Transportation equipment (vehicles, trains, ships, etc.)
或财产的下列用途时,或当其中产品
宇航设备 Aerospace equipment
用于本目录规定以外的用途时,请提
交通信号设备 Traffic signal equipment
前与我公司联系。
海底设备 Undersea equipment
Please contact us before using our
防灾、预防犯罪设备 Disaster prevention / crime prevention equipment
products for the applications listed
电厂设备 Power plant control equipment
below which require especially high
数据处理设备 Data-processing equipment
reliability for the prevention of defects
医疗设备 Medical equipment
which might directly cause damage to
与上述用途具有类似复杂性或有可靠性要求的其它用途。
the third party's life, body or property.
Other applications of similar complexity or reliability requirements to the above use.
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