深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
规 格 承 认 书
SPECIFICATION FOR APPROVAL
客户名称 Customer
客户料号 Customer P/N
型号规格 Product Type
PB1608-151/2A0(f)
拟
制 Prepared By
王 楠
审
核 Checked By
明剑华
批
准 Approved By
王裕凡
签发日期 Issued Date
2024-05-27
我们已确认承认书中的产品特性和要求
We have confirmed the product features and requirements in this specification.
客户确认
Customer Approved Signature
请认真阅读承认书的相关内容,将确认签名后承认书回传给我们。
Please read the relevant contents of this specification carefully and return one duplicate of this product
specification to us with your signature to acknowledge your receipt.
如果在收到承认书后 1 个月内没有回传承认书,则视为贵公司已默认接受。
If the duplicate of this specification is not returned within 1 month of receipt, the product specification will be
deemed to have been received by your company.
最终解决权归深圳振华富电子有限公司所有。
The final interpretation right belongs to Shenzhen Zhenhuafu Electronics Co., Ltd.
总部地址:深圳市龙华区龙华街道和平路振华工业园
HQ ADD: ZhenHua Prodction Center, RD Heping, Longhua District, ShenZhen
电话(TEL):(+86 0755) 28159282 28159885 传真(FAX):(+86 0755) 28159885 邮编(ZIP):518109
生产基地:东莞市虎门镇赤岗社区中国电子东莞产业基地
Manufacturing Base: CEC Dongguan Industrial Base, Chigang Community, Humen Town, DG
电话(TEL):(+86 0769) 85226668 传真(FAX):(+86 0755) 85225678 邮编(ZIP):523899
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
PB1608 Series Specification
1
Scope: This specification applies to the PB series of multilayer chip beads
2
Shape And Dimensioncs
3
L
W
T
a
PB1608
1.6±0.15
0.8±0.15
0.8±0.15
0.3±0.2
Part Numbering
①
②
③
④
⑤
4
TYPE
PB
1608 - 151 / 2A0 (f)
①
②
③
④
⑤
Product symbol 系列代号
Dimensions 尺寸: Length 长(L)×Width 宽(W)
Impedance 阻抗: 151:150Ω
Rated Current 额定电流:2A0:2000mA
Hazardous Substance Free Products 无有害物质产品
Electrical Characteristics
Part Numbering
PB1608-151/2A0(f)
5
Z(Ω)
100MHz
DCR(mΩ) Max.
Rated Current
(mA)
75
2000
150±25%
Operating Temperature
Operating Temperature(工作温度):–55℃~+125℃
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
PB1608 Series Specification
6
Electrical Characteristics
7
Test Conditions and Test Equipment
7.1Test Conditions
Unless otherwise specified, the standard atmospheric conditions for measurement/test
as:
a. Ambient Temperature: 20±15℃
b. Relative Humidity: 65±20%
c. Air Pressure: 86kPa to 106kPa
7.2Test Equipment
HP4287A PACKED RF LCR METER □ HP4338B MILLIOHM METER
□ B2911A PRECISION SOURCE
8
□ E4991A RF IMPEDANCE ANALYZER
Recommended land pattern and Recommended soldering condition
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
Specification
9
Reliability and Conditions
ITEM
项 目
Resistance
to solder
heat
耐焊性
REOUIREMIENTS
要 求
TEST CONDITIOS
测试条件
1. No visible mechanical damage.
无可见机械损伤
2.More than 75% of the terminal shall be covered with new solder.
至少有 75%的端电极被焊锡覆盖.
3.Impedance change:within±30%;Inductance change: within ±10%;
Quality factor change :within ±30%.
阻抗变化应在±30%以内;电感变化在±10%以内;Q 值变化在±
30%以内。
①Solder temperature(焊接温度):
260±3℃
②Dip time (浸焊时间):10±1s
③Solder(焊料):Sn93.5/Ag3.0/Cu0.5
④ Flux( 助焊剂 ): 25% Rosin and 75%
ethanol in weight.
⑤The chip shall be stabilized at
normal condition for 1~2 hours
before measuring.
①Solder temperature (焊接温度):
245±2℃
②Dip time (浸焊时间):4±1s
③Solder(焊料):Sn93.5/Ag3.0/Cu0.5
④Flux(助焊剂): 25% Rosin and 75%
ethanol in weight.
1. No visible mechanical damage
无可见机械损伤
Solderability
2.More than 95% of the terminal shall be covered with new solder.
可焊性
至少有 95%的端电极被焊锡覆盖.
Terminal
Strength
端电极强度
No visible mechanical damage.
无可见机械损伤
1005
1608
2012
3216
3225
4516
4532
w(N)
5
5
10
10
10
10
10
A(mm)
0.50
0.60
0.8
1.1
1.1
1.3
1.3
B(mm)
0.35
0.80
1.0
2.2
2.2
3.0
3.0
C(mm)
0.80
1.2
1.5
2.0
3.0
2.0
3.5
1 Solder the inductor to the test
jig(glass epoxy board).
Bending
strength
抗弯强度
Drop
跌落
Vibration
振动
The body shall not be damaged by forces applied on the right
以右图测试方式过程中器件无损伤
1. No visible mechanical damage.
无可见机械损伤。
2. Impedance change: within ±20% of initial value;Inductance
change: within ±10% of initial value; Q : within ±30% of initial
value.
阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化在±
30%以内。
1. No visible mechanical damage.
无可见机械损伤
2. Impedance change: within ±20% of initial value; Inductance
change: within ±10% of initial value; Q : within ±30% of initial
value.
阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化在±
30%以内。
2 Flexure:2mm.
3 Pressurizing speed:0.5mm/sec.
4 Keep time:30sec.
Drop 10 times on a concrets floor from
a height of 100cm.
从 100cm 高度跌落到混凝土地面上
10 次
①Frequency (频率):10Hz-55Hz.
②Amplitude (振幅):1.5mm
③ Direction and time: X,Y and Z
directions for 2 hours.
方向和时间:XYZ 三个方向各振动 2
小时
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
Specification
9
Reliability and Conditions
Thermal
shock
热冲击
1. No visible mechanical damage.
无可见机械损伤
2.Impedance change: within ±20% of initial value; Inductance
change: within ±10% of initial value; Q : within ±30% of initial
value.
阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化
在±30%以内。
Resistance
to
Low
Temperature
耐低温
1. No visible mechanical damage.
无可见机械损伤
2. Impedance change: within ±20% of initial value; Inductance
change: within ±10% of initial value; Q : within ±30% of initial
value.
阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化
在±30%以内。
Resistance
to High
Temperature
耐高温
1. No visible mechanical damage.
无可见机械损伤
2. Impedance change: within ±20% of initial value; Inductance
change: within ±10% of initial value; Q : within ±30% of initial
value.
阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化
在±30%以内。
Loading at
High
Temperature
高温寿命
1. No visible mechanical damage.
无可见机械损伤
2. Impedance change: within ±20% of initial value; Inductance
change: within ±10% of initial value; Q : within ±30% of initial
value.
阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化
在±30%以内。
Humidity
load
resistance
耐潮湿
1. No visible mechanical damage.
无可见机械损伤
2. Impedance change: within ±20% of initial value; Inductance
change: within ±10% of initial value; Q : within ±30% of initial
value.
阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化
在±30%以内。
Solevnt
resistance
耐溶剂性
1. No visible mechanical damage.
无可见机械损伤
2. Impedance change: within ±20% of initial value; Inductance
change: within ±10% of initial value; Q:within ±30% of initial
value.
阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化
在±30%以内。
Step 1 ( 循 环 1):-40±3 ℃ 30±3
min
Step 2(循环 2):85±3℃ 30±3 min
Number of cycle( 循环次数 ):100
times
Temperature:-55℃±2℃;
Duration: 1000+24 hours.
Measured at room temperature
after placing for (24±2) hours.
通过额定电流,-55℃±2℃下保
持 1000+24 小时,试验结束后在
室 温 条 件 下 (24 ± 2) 小 时 后 测
量。
①Temperature:125℃±2℃;
②Duration: 1000+24 hours.
③ Measured at room temperature
after placing for (24±2) hours.
125 ℃± 2 ℃下保持 1000+24 小
时,试验结束后在室温条件下
(24±2)小时后测量。
①Temperature:85℃±2℃;
②Applied current :Rated current;
③Duration: 1000+24 hours.
④ Measured at room temperature
after placing for (24±2) hours.
85℃±2℃下施加额定电流,保
持 1000+24 小时,试验结束后在
室 温 条 件 下 (24 ± 2) 小 时 后 测
量。
Temperature:40
℃
±
2℃,Time:90~90%RH;
Applied current; Rated current
time:500 hours.
Measured at room temperature
after placing for (24±2) hours.
40℃±2℃,90~95%RH 条件下施
加额定电流,保持 500 小时,试
验结束后在室温条件下 (24 ± 2)
小时后测量。
Solvent:Trichlorethylene
溶剂:三氯乙烯
Washer:Ultrasonic washer(100w)
Washing time:3 mintues
清洗:100W 超声波清洗 3 分钟
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
Specification
10
Packaging Style
10.1 Taping Material 包装材料
10.2 Reel Dimensions 卷轴尺寸 (mm)
Tape Width
A
B
C
D
E
W
T
R
8mm
178±2
60±1
13±0.5
21±0.8
2±0.5
10±1
1.5±0.5
1
12mm
178±2
60±1
13±0.5
21±0.8
2±0.5
14±1
1.5±0.5
1
载带宽度
10.3 Carrier Dimensions 载带尺寸(mm)
Paper Tape 纸带
Paper Tape 纸带
Type
A
B
P
T
1005
0.62±0.03
1.12±0.03
2.0±0.05
0.61±0.02
1608
1.0±0.1
1.8±0.1
4.0±0.1
0.95±0.10
2012
1.5±0.1
2.3±0.1
4.0±0.1
0.95±0.10
3216
1.9±0.1
3.6±0.1
4.0±0.1
0.95±0.10
Embossed Tape 胶带
Embossed Tape 胶带
Type
A
B
C
D
P
K
1608
1.08±0.1
1.88±0.1
8±0.3
3.5±0.05
4.0±0.1
1.05±0.1
2012
1.50±0.1
2.32±0.1
8±0.3
3.5±0.05
4.0±0.1
1.20±0.1
3216
1.88±0.1
3.5±0.1
8±0.3
3.5±0.05
4.0±0.1
1.27±0.1
3225
3.1±0.1
3.8±0.1
12±0.3
5.5±0.05
4.0±0.1
1.63±0.1
4516
2.2±0.1
4.95±0.1
12±0.3
5.5±0.05
4.0±0.1
1.95±0.1
4532
3.8±0.1
4.95±0.1
12±0.3
5.5±0.05
8.0±0.1
1.90±0.1
10.4 Stripping methods and criteria 剥离方法及条件
Peeling angle
剥离角度
Speed of Peeling off
剥离速率
Peeling off force
剥离力
160°~180°
300 mm/min
20 g to 70 g
深圳振华富电子有限公司
Shenzhen Zhenhuafu Electronics Co., Ltd.
Specification
11
Storage
11.1 Quantilty 标准数量
PCS/REEL(只/
PCS/INNERBOX(只/小
PCS/OUTNERBOX(只/大
卷)
盒)
盒)
1005
10000
50000
250000
1608
4000
20000
100000
2012
4000
20000
100000
3216
4000
20000
100000
Type
11.2 Packaging Dimensions 包装尺寸(mm)
L
W
H
THICK 厚度
L
W
H
THICK 厚度
180±3
70±3
190±3
2±0.8
180±3
70±3
190±3
2±0.8
11.3 Indication on the box 包装标识
a. CUSORMER 客户名
b. QUANTITY 数量
c. PART NUMBER 料号
d. LOT NUMBER 批号
11.4 Storage 储存
Please be sure to the parts at -10℃~+40℃,70%RH or less,and isolate the parts from sulphic and choric atmosphere.
产品应存放于环境温度-10℃~+40℃,相对湿度不高于 70%,且不含硫和氯的空气气氛中。
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