SS12F-AT THRU SS120F-AT
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
Forward Current-1A
Reverse Voltage-20V to 200V
FEATURES
PINNING
For surface mount applications
PIN
DESCRIPTION
1
Cathode
2
Anode
High forward surge current capability
Low power loss,high efficiency
Metal silicon junction,majority carriers conduction
MECHANICAL DATA
1
Case: SMAF molded plastic body
Terminals: Solderable per MIL-STD-750, Method 2026
Weight: Approximated 0.027 grams
2
Top View
Simplified outline SMAF and symbol
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load current derating by 20 %.
SS12F SS14F SS16F SS18F SS110F SS112F SS115F SS120F
PARAMETER
SYMBOL
UNIT
-AT
-AT
-AT
-AT
-AT
-AT
-AT
-AT
Maximum Repetitive Peak Reverse
Voltage
VRRM
20
40
60
80
100
120
150
200
V
Maximum RMS Voltage
VRMS
14
28
42
56
70
84
105
140
V
Maximum DC Blocking Voltage
Maximum Average Forward
Rectified Current at TC=125℃
VDC
20
40
60
80
100
120
150
200
V
IF(AV)
1.0
A
Peak Forward Surge Current
(Note1)
IFSM
30
A
Maximum Forward Voltage at 1.0 A
VF
Maximum DC Reverse Current at
Rated DC Blocking Voltage at
TA=25℃
IR
0.55
0.70
0.85
0.90
V
0.2
5
0.1
2
mA
0.3
10
TA=100℃
Typical Junction Capacitance
(Note2)
CJ
110
80
95
pF
Typical Thermal Resistance(Note3)
RθJA
Storage Temperature Range
TSTG
-55 to +150
℃
TJ
-55 to +125
℃
Operating Junction Temperature
Range
℃/W
Notes: 1. Measured at 8.3 ms single half sine wave superimposed on rated load (JEDEC Method).
2. Measured at 1MHz and applied reverse voltage of 4 V D.C.
3. P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas.
AGERTECH MICROELECTRONICS
Subsidiary of Sino-Talent International Holdings Ltd.
1/3
Dated: 04/2017
Rev:2.0
SS12F-AT THRU SS120F-AT
RATINGS AND CHARACTERISTIC CURVES
Fig.2 Typical Reverse Characteristics
Fig.1 Forward Current Derating Curve
10 4
Instaneous Reverse Current (μA )
Average Forward Current (A)
1.2
1.0
0.8
0.6
0.4
0.2
Single phase half-wave 60 Hz
resistive or inductive load
0.0
25
125
100
75
50
150
10 3
TJ=100°C
10 2
TJ=75°C
101
TJ=25°C
10
0
0
40
20
60
80
100
Percent of Rated Peak Reverse Voltage(%)
Case Temperature (°C)
Fig.3 Typical Forward Characteristic
Fig.4 Typical Junction Capacitance
TJ=25°C
10
1.0
Junction Capacitance (pF)
Instaneous Forward Current (A)
500
20
SS12F-AT/SS14F-AT
SS16F-AT/SS18F-AT
SS110F-AT/SS112F-AT
SS115F-AT/SS120F-AT
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
200
100
50
SS12F-AT/SS14F-AT
20
10
SS16F-AT~SS120F-AT
Transient Thermal Impedance(°C/W)
Peak Forward Surge Current (A)
40
30
20
10
8.3 ms Single Half Sine Wave
(JEDEC Method)
10
100
Fig.6- Typical Transient Thermal Impedance
50
1
10
Reverse Voltage (V)
Fig.5 Maximum Non-Repetitive Peak
Forward Surge Current
00
1
0.1
Instaneous Forward Voltage (V)
100
Number of Cycles at 60Hz
1000
100
10
1
0.01
0.1
1
10
100
t, Pulse Duration(sec)
AGERTECH MICROELECTRONICS
Subsidiary of Sino-Talent International Holdings Ltd.
2/3
Dated: 04/2017
Rev:2.0
SS12F-AT THRU SS120F-AT
PACKAGE OUTLINE
SMAF
4.40
4.90
3.30
3.70
1.30
1.60
2.40
2.80
0.90
1.10
0.18
0.30
Dimensions in milimeters
ORDERING INFORMATION
Device
Package
SS12F-AT thru SS120F-AT
SMAF
Shipping
3,000/Tape & Reel (7 inches)
10,000/ Tape & Reel (13 inches)
AGERTECH MICROELECTRONICS
Subsidiary of Sino-Talent International Holdings Ltd.
3/3
Dated: 04/2017
Rev:2.0
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