P6SMB62CA(MS)

P6SMBXXXA(CA)(MS) Product specification P6SMBXXXA(CA)(MS) Features Mechanical Data   For surface mounted applications in order to optimize board Case : JEDEC DO-214AA/SMB molded plastic body space Low profile package Terminals : Solderable per MIL-STD-750,Method  Built-in strain relief Glass passivated junction 2026 Low inductance Excellent clamping capability Mounting Position : Any    Polarity : Polarity symbol marking on body Weight : 0.003 ounce, 0.095 grams   600W peak pulse power capability at 10/1000μswaveform,   Fast response time Typical IR less than 1μA above 12V  High Temperature soldering: 260℃/ 40 seconds at terminals Plastic package has underwriters laboratory flammability  repetition rate (duty cycle): 0.01% Applications    I/O interface AC/DC power supply Industrial and Consumer electronic applications. 94V-0 Reference News PACKAGE OUTLINE PIN CONFIGURATION Marking Information ***A S Unipolar J ***C Bipolar Copyright© Msksemi Incorporated www.msksemi.com P6SMBXXXA(CA)(MS) Maximum Ratings And Electrical Characteristics Ratings at 25℃ ambient temperature unless otherwise specified. Peak Pulse Power Dissipation at TA=25℃ by 10x1000μs waveform (Fig.1) (Note 1), (Note 2) Power Dissipation on infinite heat sink at TA=50℃ P PP M 600 Watt s P M( AV ) 5.0 Watt s Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) I FSM 100 Amps Maximum Instantaneous Forward Voltage at 50A for Unidirectionalonly (Note 4) VF 3.5V/5.0 V Operating Junction and Storage Temperature Range T J ,T ST G -6 5 to +1 5 0 Typical Thermal Resistance Junction to Lead R θ JL 20 ℃ /W Typical Thermal Resistance Junction to Ambient R θ JA 100 ℃ /W ℃ NOTES: 1.Non-repetitive current pulse , per Fig. 3 and derated above TA = 25℃per Fig. 2. 2.Mounted on copper pad area of 0.2x0.2” (5.0 x 5.0mm) to each terminal. 3.Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only,duty cycle=4 per minute maximum. 4.VF