BV-FA05UCD

BV-FA05UCD Order Code: BV-FA05UCD Version: A0 2020-04-22 Transient Voltage Suppressor Features Exterior  IEC 61000-4-2 (ESD) ±15KV (air), ±15KV (contact)  IEC61000-4-5(surge): 7A (8/20μs)  77Watts peak pulse power (tp=8/20μs)  Low capacitance: 0.8pF (Typical)  Low clamping voltage  Small package: DFN1006-2L DFN1006-2L  MSL 1 Application Information rmation Package (top view)  USB 2.0 and USB 3.0  HDMI 1.3, HDMI 1.4 and HDMI 2.0  SATA and eSATA interface 5T 1  DVI 2  IEEE 1394  Portable Electronics and Notebooks Agency Approvals rmation Schematic(top view) rmation Icon Description Compliance with 2011/65/EU Compliance with IEC61249-2-21:2003 Mean lead free Part Number and Electrical Parameter VBR①@IR IDRM@VDRM Part Number μA V MAX BV-FA05UCD 0.05 5 V V MIN TYP 6 8 mA Vc@Ipp ② Vc@Ipp ② V V A MAX 1 9 A MAX 1 11 C O③ 7 pF TYP MAX 0.8 1.0 Absolute maximum ratings measured at T= 25°C RH = 45%-75% (unless otherwise noted). ① IDRM is measured at VDRM=5V; VBR is measured at IR=1mA ② Surge Waveform: 8/20μs,pin 1 to pin2 and pin2 to pin1 ③ Off-state capacitance is measured in VDC=0V, f=1MHz 1/4 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BV-FA05UCD Order Code: BV-FA05UCD Version: A0 2020-04-22 Transient Voltage Suppressor Part Numbering System BV FA (1) (2) Mark 05 U C D (3) (4) (5) (6) (1) Bencent Transient Voltage Suppressor (2) Package:DFN1006-2L (3) Off-state Voltage: 5V (4) Low Capacitance (5) Bi-directional (6) Bencent internal code V-I Curve Parameters Definition VC Clamping voltage Ipp Surge waveform 8/20μ s VDRM Stand-off Voltage VBR Breakdown Voltage VSB Snapback Voltage IDRM Reverse Leakage Current IR Test current ISB Test current PPP Peak Pulse Power Dissipation Typical Characteristics Thermal Considerations symbol Parameter Value Unit TJ Operating Junction Temperature Range -55 to +125 ℃ TS Storage Temperature Range -55 to +150 ℃ 2/4 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BV-FA05UCD Order Code: BV-FA05UCD Version: A0 2020-04-22 Transient Voltage Suppressor Environmental Characteristics Technical standards Testing items High temperature Reverse Bias Test High Temperature Life Test High-low Temperature Cycle test High Temperature &High Humidity Test Pressure cooker Test Resistance of soldering heat Temperature: 150±3℃ Bias=80%VDRM Time: 168H Temperature: 150℃ Time: 168H Temperature: From -55℃ to150℃ Dwell time: 30min, 100cycles Temperature: 85℃Humidity: 85% Time: 168H Temperature: 121℃, 2atm. Humidity: 100% Time: 24H Temperature: 260±5℃ Time of dip soldering: 10s, 3times Note: The above testing items can be specified by customer’s special request Product Dimensions Pin 1 REF mm inch A 0.30~0.55 0.012~0.022 A1 0~0.05 0.000~0.002 A3 0.125 REF 0.020REF D 0.95~1.10 0.037~0.043 E 0.55~0.70 0.022~0.028 b 0.20~0.30 0.008~0.012 e 0.65BSC 0.026BSC L 0.45~0.55 0.018~0.022 Recommended Soldering Pad REF mm inch A 0.35 0.014 B 0.60 0.024 C 0.35 0.014 Notes: This recommended land pattern is for reference purposes only. Please consult your manufacturing group to ensure your PCB design guidelines are met 3/4 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BV-FA05UCD Order Code: BV-FA05UCD Version: A0 2020-04-22 Transient Voltage Suppressor Reflow Profile Pb-Free assembly Pre Heat Temperature Min 150°C Temperature Max 200°C Time (min to max) 60 – 180 secs Average ramp up rate (Liquid) Tamp (TL) to peal 3°C/s max TS (max) to TL - Ramp-up Rate 3°C/s max Reflow TP TP - Temperature (TL) (Liquid) 217°C - Temperature (TL) 60 – 150 secs Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (TP) 30secs Ramp-down Rate 6°C/s max Time 25°C to peak Temperature (TP) 8 mins max. Do not exceed 260°C Critical Zone TL to TP Ramp-up TL Temperature Reflow Condition TL TS(max) Ramp-down Preheat TS(min) TS 25 Time time to peak temperature Package Reel Information 4/4 REF mm inch A 0.65+/-0.10 0.026+/-0.004 B 1.20+/-0.1 0.047+/-0.004 d 1.50+/-0.1 0.059+/-0.004 D 178.00+/-2.00 7.008+/-0.079 D1 55.00+/-3.00 2.165+/-0.118 D2 13.00+/-0.50 0.512+/-0.020 E 1.75+/-0.10 0.069+/-0.004 F 3.50+/-0.20 0.138+/-0.008 P 2.00+/-0.20 0.079+/-0.008 P0 4.00+/-0.20 0.157+/-0.008 P1 2.00+/-0.20 0.079+/-0.008 W 8.00+/-0.30 0.315+/-0.012 W1 9.50+/-1.00 0.374+/-0.039 OUTLINE REEL (PCS) PER CARTON (PCS) REEL DIAMETERS (mm) L W H TAPING 10,000 300,000 178 390 370 220 www.bencent.com.cn CARTON SIZE(mm) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications