SMBJ58CA

Date: 03/22/2017 Page: 1/2 DOC. No: Title: SMBJ58CA-BD Version: A1 Version EFF.Date A1 03/22/2017 TITAN MICRO Electronics, Co., Ltd. Bonding Diagram for SMBJ58CA IN SMB (DO-214AA) Author Cao Lixin Description Created www.jy-electronics.com.cn Date: DOC. No: 03/22/2017 Title: SMBJ58CA-BD Version: A1 Page: 2/2 Bonding Diagram for SMBJ58CA IN SMB (DO-214AA) 1. Bonding Information 1. 2. 3. 4. 5. Chip name: SMBJ58CA Die Size:1.8mmx1.8mm Scribe:60um Pad Size:1.58mmx1.58mm(Ag) Die Thickness:200-210um 6. Package: SMB(DO-214AA) 2. Finish Test Specification 1. Test Circuit Pin2 Pin1 Vin/I 2. Test Conditions Table.1 SMBJ58CA Test Conditions Symbol Parameter V1 Breakdown Voltage V2 Breakdown Voltage I1 Leakage Current I2 Leakage Current TITAN MICRO Electronics, Co., Ltd. Test Condition Max Units 64.4 71.2 V 64.4 71.2 V Vin =58V Pin1 to Pin2 T = 25℃ 1 μA Pin2 to Pin1 Vin =58V T = 25℃ 1 μA Pin1 to Pin2 I(Pin1 to Pin2) = 1.0mA T = 25℃ Pin2 to Pin1 I(Pin2 to Pin1) = 1.0mA T = 25℃ Min Typ www.jy-electronics.com.cn