MM9Z2V0~MM9Z75-HAF
Silicon Planar Zener Diodes
Features
• Total power dissipation: max. 250 mW
• Small plastic package suitable for
surface mounted design
• High reliability
PINNING
PIN
1
DESCRIPTION
Cathode
2
Anode
1
2
Transparent top view
Simplified outline DFN1006-2H and symbol
Absolute Maximum Ratings (Ta = 25℃)
Parameter
Total Device Dissipaton
Junction and Storage Temperature Range
Symbol
Value
Unit
Ptot
250
mW
Tj , Tstg
- 65 to + 150
℃
Symbol
Max.
Unit
VF
0.9
V
Characteristics at Ta = 25℃
Parameter
Forward Voltage
at IF = 10 mA
TOP DYNAMIC
Dated:16/03/2015 Rev:02
MM9Z2V0~MM9Z75-HAF
Zener Voltage
Type
Marking
Code
VZT
1)
Zener Impedance
Leakage Current
at lZT
ZZT
at lZT
ZZK
at IZK
IR
Max. (µA)
at VR
Min. (V)
Max. (V)
(mA)
Max. (Ω)
(mA)
Max. (Ω)
(mA)
MM9Z2V0
9H
1.8
2.15
5
100
5
-
-
120
0.5
(V)
MM9Z2V2
9J
2.08
2.33
5
100
5
-
-
120
0.7
MM9Z2V4
9K
2.2
2.6
5
100
5
1000
1
120
1
MM9Z2V7
9L
2.5
2.9
5
100
5
1000
1
120
1
MM9Z3V0
9M
2.8
3.2
5
100
5
1000
1
50
1
MM9Z3V3
9N
3.1
3.5
5
95
5
1000
1
20
1
MM9Z3V6
9P
3.4
3.8
5
90
5
1000
1
10
1
MM9Z3V9
9Q
3.7
4.1
5
90
5
1000
1
5
1
MM9Z4V3
9R
4
4.6
5
90
5
1000
1
5
1
MM9Z4V7
9S
4.4
5
5
80
5
800
1
2
1
MM9Z5V1
9T
4.8
5.4
5
60
5
500
1
2
1.5
MM9Z5V6
9U
5.2
6
5
40
5
200
1
1
2.5
MM9Z6V2
9V
5.8
6.6
5
10
5
100
1
1
3
MM9Z6V8
9W
6.4
7.2
5
15
5
160
1
0.5
3.5
MM9Z7V5
9X
7
7.9
5
15
5
160
1
0.5
4
MM9Z8V2
9Y
7.7
8.7
5
15
5
160
1
0.5
5
MM9Z9V1
9Z
8.5
9.6
5
15
5
160
1
0.5
6
MM9Z10
0A
9.4
10.6
5
20
5
160
1
0.1
7
MM9Z11
0B
10.4
11.6
5
20
5
160
1
0.1
8
MM9Z12
0C
11.4
12.7
5
25
5
80
1
0.1
9
MM9Z13
0D
12.4
14.1
5
30
5
80
1
0.1
10
MM9Z15
0E
13.8
15.6
5
30
5
80
1
0.1
11
MM9Z16
0F
15.3
17.1
2
40
2
80
1
0.1
12
MM9Z18
0G
16.8
19.1
2
45
2
80
1
0.1
13
MM9Z20
0H
18.8
21.2
2
55
2
100
1
0.1
15
MM9Z22
0J
20.8
23.3
2
55
2
100
1
0.1
17
MM9Z24
0K
22.8
25.6
2
70
2
120
1
0.1
19
MM9Z27
0L
25.1
28.9
2
80
2
300
1
0.1
21
MM9Z30
0M
28
32
2
80
2
300
1
0.1
23
MM9Z33
0N
31
35
2
80
2
300
1
0.1
25
MM9Z36
0P
34
38
2
90
2
500
1
0.1
27
MM9Z39
0Q
37
41
2
130
2
500
1
2
30
MM9Z43
0R
40
46
1
150
1
500
1
2
33
MM9Z47
0S
44
50
1
170
1
500
1
2
36
MM9Z51
0T
48
54
1
180
1
500
1
1
39
MM9Z56
0U
52
60
1
200
1
500
1
1
43
MM9Z62
0V
58
66
1
215
1
500
1
0.2
47
MM9Z68
0W
64
72
1
240
1
500
1
0.2
52
MM9Z75
0X
70
79
1
255
1
500
1
0.2
57
1)
Tested with pulses tp = 20 ms.
TOP DYNAMIC
Dated:16/03/2015 Rev:02
MM9Z2V0~MM9Z75-HAF
Power Dissipation: Ptot (mW)
300
200
100
0
0
25
150
100
Ambient Temperature: Ta ( C)
O
Derating Curve
TOP DYNAMIC
Dated:16/03/2015 Rev:02
MM9Z2V0~MM9Z75-HAF
PACKAGE OUTLINE
Plastic surface mounted package
DFN1006-2H
UNIT
A
A1
b
D
E
e
L
R
mm
0.51
0.46
0.05
0
0.55
0.45
1.05
0.95
0.65
0.55
0.4
0.3
0.2
0.15
0.05
Recommended Soldering Footprint
0.3
0.7
0.4
0.7
Packing information
Package
DFN1006-2H
Pitch
Reel Size
Tape Width
(mm)
mm
inch
mm
inch
8
4 ± 0.1
0.157 ± 0.004
178
7
Per Reel Packing Quantity
5,000
TOP DYNAMIC
Dated:16/03/2015 Rev:02
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