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PxxxxSB-MS
Semiconductor
Compiance
Features
Low capatcitance
Cannot be damaged by voltage
Will not fatigue
Eliminate voltage overshoot
Glass passivated junction
Halogen free and RoHS compliant
Mechanical Data
CASE: SMB(DO-214AA) Molded Plastic
UL Flammability Classification Rating 94V0
Mounting Position:Any
SMB
Maximum Ratings & Thermal Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified.)
Parameter
Peak Pulse Voltage
Peak Pulse Current
Peak Pulse Current
Peak One-cycle Surge Current
Rate of Rise of Current
Typical Thermal Resistance Junction to Lead
Typical Thermal Resistance Junction to Ambient
Operating Temperature Range
Storage Temperature Range
Symbol
Value
Units
Remarks
VPP
4000
V
10/700us
IPP
80
A
10/1000us
IPK
250
A
8/20us
ITSM
25
A
60Hz
di/dt
500
A/us
RθJL
20
℃/W
RθJA
100
℃/W
TJ
-40 to 150
℃
TSTG
-55 to 150
℃
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PxxxxSB-MS
Semiconductor
Compiance
Electrical Characteristics
( Ratings at 25 ℃ ambient temperature unless otherwise specified).
IS_LMT
VT @ IT
IT
ID @ VD
VD
CO@1MHz,2VDC
IH
V
MAX
mA
V
MAX
A
uA
MAX
V
pF
TYP
mA
TYP
VS @100KV/S
P/N
Mark
P0080SB-MS
P008B
XXXX
25
500
4
2.2
5
6
84
40
P0220SB-MS
P02B
XXXX
30
500
4
2.2
5
15
84
40
P0300SB-MS
P03B
XXXX
40
500
4
2.2
5
25
80
40
P0640SB-MS
P06B
XXXX
77
800
4
2.2
5
58
76
120
P0720SB-MS
P07B
XXXX
88
800
4
2.2
5
65
76
120
P0900SB-MS
P09B
XXXX
98
800
4
2.2
5
75
76
120
P1100SB-MS
P11B
XXXX
130
800
4
2.2
5
90
72
120
P1300SB-MS
P13B
XXXX
160
800
4
2.2
5
120
72
120
P1500SB-MS
P15B
XXXX
180
800
4
2.2
5
140
68
120
P1800SB-MS
P18B
XXXX
220
800
4
2.2
5
170
64
120
P2300SB-MS
P23B
XXXX
260
800
4
2.2
5
190
60
120
P2600SB-MS
P26B
XXXX
300
800
4
2.2
5
220
56
120
P3100SB-MS
P31B
XXX
350
800
4
2.2
5
275
52
120
P3500SB-MS
P35B
XXXX
400
800
4
2.2
5
320
48
120
P4500SB-MS
P45B
XXXX
530
800
4
2.2
5
400
36
120
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PxxxxSB-MS
Semiconductor
Compiance
Ratings and Characteristic Curves
( Ratings at 25℃ ambient temperature unless otherwise specified).
16
2
14
1.8
10
Ratio of IH / IH (TC=25℃)
Percent of VS Change (%)
12
8
6
4
2
0
25, 0
-2
-4
-40
-20
0
1
25, 1
0.8
-40
-20
0
20 40 60 80 100 120 140 160
TC - Case Temperature (℃)
Fig.1 - Peak Pulse Current Rating
Fig.2 - Normalized DC Holding Current vs. Case Temperature
100
Current (A)
VT,IT
50
IH
VS,IS
VD,ID
0
tr
td
t - Time (us)
10000
100
10
1
1
10
100
td - Pulse Width (us)
Fig.5 - Peak Pulse Current Rating
Fig.4 - VI Curve
100
1000
0.1
VB
Voltage (V)
Fig.3 - tr/td us Pulse Waveform
1000
CO - Typical Off-state Capacitance (pF)
IPP - Peak Pulse Current, % IPK
1.2
0.4
20 40 60 80 100 120 140 160
TJ - Junction Temperature (℃)
IPP - Peak Pulse Current (A)
1.4
0.6
-6
-8
1.6
80
60
40
20
0
0
100
200
300
VB - Breakdown Voltage (V)
400
500
Fig.6 - Typical Off-state Capacitance
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PxxxxSB-MS
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
A
Dimensions
B
C
Ref.
H
F
G
D
E
L
J
K
Millimeters
Min.
Max.
Min.
Max.
A
4.25
4.75
0.167
0.187
B
3.30
3.94
0.130
0.155
C
1.85
2.21
0.073
0.087
D
0.76
1.52
0.030
0.060
E
5.08
5.59
0.200
0.220
F
0.051
0.203
0.002
0.008
G
0.15
0.31
0.006
0.012
H
2.11
2.44
0.083
0.096
J
6.80
L
0.270
2.60
K
DO-214AA (SMB)
Inches
2.40
0.100
0.090
REEL SPECIFICATION
P/N
PKG
QTY
PxxxxSB-MS
SMB
3000
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PxxxxSB-MS
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from theauthorities concerned in
accordance with the above law.
■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and
reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property
rights or other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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