SMD18
812 SER
RIES
Posittive Temperature
e Coefficient (PTC
C) Data S
Sheet
Des
scription
The 1812 seriess provides surface
s
mou
unt resettab
ble overcurrrent protectiion with
holding current from
f
0.1A to
o 3.0A. This series offerss complete portfolio
p
in te
erms of
holding current and
a working
g voltage, an
nd is suitable
e for wide ra
ange of application.
Fea
atures
■ RoHS
R
complliant and lea
ad-free
■ Halogen-free
H
e
■ Compact
C
dessign saves board
b
space
e
■ Low
w profile
■ Fas
st response to
t fault curre
ent
■ Com
mpatible with
h high temperature sold
ders
App
plications
■ U
USB hubs, ports
p
and peripherals
■ Set-top-box
S
a HDMI
and
■ Game
G
conso
ole port prote
ection
■ Mottherboard USB & IEEE 1394 protec
ction
■ Opttical disk drivves
■ Gen
neral electro
onics
ency Apprroval and Environm
E
ental Com
mpliance
Age
Agency
File Numbe
er
Regulatio
on
Standard
UL/CUL
E482628
RoHS
2011/65/EU
TUV
B1606960480
001
Halogen Free
F
EN 145
582:2007
Elec
ctrical Cha
aracteristics
Part
Numbe
er
Ihold
(A)
Itrip
(
(A)
Vmax
(Vdcc)
Imax
(A)
Pd typ.
(W)
S
SMD1812B0
010TF
0.10
0.30
30
100
S
SMD1812B0
014TF
0.14
0.34
60
S
SMD1812B0
020TF
0.20
0.40
S
SMD1812B0
20TF-J
0.20
SM
MD1812B03
35TF/30
Maximu
um
Time To T
Trip
Resistance
e
Time
(Sec.)
C
Current
(A)
Rmin
(Ω)
(
R1m
max
(Ω
Ω)
0.8
1.50
0.50
1..600
15.0
000
10
0.8
0.15
1.50
1..500
6.0
000
30
100
0.8
0.02
8.00
0..800
5.0
000
0.40
60
40
0.8
2.00
1.00
0..700
5.0
000
0.35
0.75
30
40
0.8
0.15
8.00
0..400
1.7
700
S
SMD1812B0
050TF
0.50
1.00
15
100
0.8
0.15
8.00
0..150
1.0
000
SM
MD1812B05
50TF/30
0.50
1.00
30
100
0.8
0.15
8.00
0..150
1.0
000
S
SMD1812B0
075TF
0.75
1.50
13.2
2
100
0.8
0.20
8.00
0..100
0.4
450
SM
MD1812B07
75TF/24
0.75
1.50
24
100
0.8
0.20
8.00
0..100
0.2
290
Reviision:26-Se
ep-17
www
w.brightking.com
SMD1812 SERIES
Electrical Characteristics
Part
Number
Ihold
(A)
Itrip
(A)
Vmax
(Vdc)
Imax
(A)
Pd typ.
(W)
SMD1812B075TF/33
0.75
1.50
33
20
SMD1812B110TF
1.10
2.20
8
SMD1812B110TF/16
1.10
1.95
SMD1812B110TF/24
1.10
SMD1812B110TF/33
Maximum
Time To Trip
Resistance
Time
(Sec.)
Current
(A)
Rmin
(Ω)
R1max
(Ω)
0.8
0.20
8.00
0.100
0.400
100
0.8
0.30
8.00
0.040
0.210
16
100
0.8
0.30
8.00
0.060
0.180
1.95
24
20
0.8
0.50
8.00
0.060
0.200
1.10
1.95
33
20
0.8
0.50
8.00
0.060
0.200
SMD1812B125TF/16
1.25
2.50
16
100
0.8
0.40
8.00
0.050
0.140
SMD1812B125TF/6,4L
1.25
2.50
6
100
0.8
0.40
8.00
0.050
0.140
SMD1812B150TF/8
1.50
3.00
8
100
0.8
0.30
8.00
0.040
0.120
SMD1812B150TF/12
1.50
3.00
12
100
0.8
0.50
8.00
0.040
0.120
SMD1812B150TF/16
1.50
2.80
16
100
0.8
0.50
8.00
0.040
0.120
SMD1812B150TF/24
1.50
3.00
24
20
0.8
1.50
8.00
0.040
0.120
SMD1812B160TF/8(4L)
1.60
2.8
8
100
0.8
0.30
8.00
0.030
0.100
SMD1812B160TF/16
1.60
2.80
16
100
0.8
0.80
8.00
0.030
0.100
SMD1812B200TFT
2.00
3.50
8
100
0.8
2.00
8.00
0.020
0.070
SMD1812B200TF/12
2.00
3.50
12
100
1.0
2.00
8.00
0.020
0.075
SMD1812B200TF/16
2.00
3.50
16
100
1.0
2.00
8.00
0.020
0.075
SMD1812B260TFT
2.60
5.00
8
100
0.8
2.50
8.00
0.015
0.047
SMD1812B260TF/12
2.60
5.00
12
100
0.8
5.00
8.00
0.015
0.055
SMD1812B260TF/16
2.60
5.00
16
100
1.2
5.00
8.00
0.015
0.050
SMD1812B300TFT
3.00
5.00
6
100
0.8
4.00
8.00
0.012
0.040
Note on Electrical Characteristics
■ Vocabulary
·Ihold = Hold current: maximum current device will pass without tripping in 23℃ still air.
·Itrip = Trip current: minimum current at which the device will trip in 23℃ still air.
·Vmax = Maximum voltage device can withstand without damage at rated current (Imax)
·Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax)
·Pd typ. = Typical power dissipated from device when in the tripped state at 23℃ still air.
·Rmin = Minimum resistance of device in initial (un-soldered) state.
·R1max = Maximum resistance of device at 23℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec.
■ Value specified is determined by using the PWB with 0.030”*1.5oz copper traces.
■ Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
■ Specifications are subject to change without notice.
Revision:26-Sep-17
www.brightking.com
SMD1812 SERIES
Polymeric PTC Selecting Guide
■ Determine the following operating parameters for the circuits:
·Normal operating current (Ihold)
·Maximum interrupt current (Imax)
·Maximum circuit voltage (Vmax)
·Normal operating temperature surrounding device (min℃/max℃)
■ Select the device from factor and dimension suitable for the application
■ Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure
the circuit’s requirement does not exceed the device rating.
■ Check that PPTC device’s trip time (time-to-trip) will protect the circuit.
■ Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range.
■ Verify that performance and suitability of the chosen PPTC device in the application.
! WARNING
■ Mechanical Stress
·PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application
where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate
materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and
other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied.
■ Chemical Pollutants
·Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices,
and shall not be used or applied.
■ Electronic and Thermal Effect
·PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature
error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by,
among others, incorrect pin-connection of a connector) or over-extensive trip events may occur.
·PPTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open
circuit, in which case the voltage at such PPTC devices may reach a hazardous level.
·Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to
the PPTC devices.
·Conductive material contamination, such as metal particle, may induce shortage, flame or arcing.
·Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices,
which shall not be used under such circumstances.
■ General
·Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual
applications will be met.
·The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or
mechanical procedures and/or conditions non-conformant to those recommended by manufacturer.
·Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection
To avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices.
·Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with.
Revision:26-Sep-17
www.brightking.com
SMD1812 SERIES
Thermal Derating Curve
Thermal Derating Chart
Recommended Hold Current (A) at Ambient Temperature (℃)
Ambient Operation Temperature
Part
Number
-40℃
-20℃
0℃
23℃
40℃
50℃
60℃
70℃
85℃
SMD1812B010TF
0.16
0.14
0.12
0.10
0.08
0.07
0.06
0.05
0.03
SMD1812B014TF
0.23
0.19
0.17
0.14
0.12
0.10
0.09
0.08
0.06
SMD1812B020TF
0.29
0.26
0.23
0.20
0.17
0.15
0.14
0.12
0.10
SMD1812B020TF-J
0.29
0.26
0.23
0.20
0.17
0.15
0.14
0.12
0.10
SMD1812B035TF/30
0.50
0.45
0.40
0.35
0.30
0.26
0.24
0.20
0.16
SMD1812B050TF
0.77
0.68
0.59
0.50
0.44
0.40
0.37
0.33
0.29
SMD1812B050TF/30
0.77
0.68
0.59
0.50
0.44
0.40
0.37
0.33
0.29
SMD1812B075TF
1.15
1.01
0.88
0.75
0.65
0.60
0.55
0.49
0.43
SMD1812B075TF/24
1.06
0.95
0.84
0.75
0.60
0.55
0.50
0.45
0.37
SMD1812B075TF/33
1.10
1.00
0.88
0.75
0.66
0.60
0.56
0.47
0.36
SMD1812B110TF
1.59
1.43
1.26
1.10
0.95
0.87
0.80
0.71
0.60
SMD1812B110TF/16
1.58
1.43
1.27
1.10
0.95
0.85
0.77
0.71
0.58
SMD1812B110TF/24
1.55
1.40
1.25
1.10
0.93
0.83
0.73
0.63
0.50
SMD1812B110TF/33
1.55
1.40
1.25
1.10
0.93
0.83
0.73
0.63
0.50
SMD1812B125TF/16
2.00
1.75
1.52
1.25
1.00
0.95
0.90
0.75
0.53
SMD1812B125TF/6,4L
2.00
1.75
1.52
1.25
1.00
0.95
0.90
0.75
0.53
SMD1812B150TF/8
2.06
1.93
1.79
1.50
1.28
1.10
1.02
0.80
0.68
SMD1812B150TF/12
2.04
1.88
1.68
1.50
1.25
1.10
1.00
0.80
0.60
Revision:26-Sep-17
www.brightking.com
SMD1812 SERIES
Ambient Operation Temperature
Part
Number
-40℃
-20℃
0℃
23℃
40℃
50℃
60℃
70℃
85℃
SMD1812B150TF/16
2.04
1.88
1.68
1.50
1.25
1.10
1.00
0.80
0.60
SMD1812B150TF/24
2.05
1.87
1.67
1.50
1.25
1.08
0.95
0.77
0.60
SMD1812B160TF/8(4L)
2.20
2.06
1.91
1.60
1.36
1.17
1.09
0.85
0.72
SMD1812B160TF/16
2.20
2.06
1.91
1.60
1.36
1.17
1.09
0.85
0.72
SMD1812B200TFT
2.60
2.44
2.22
2.00
1.78
1.67
1.50
1.45
1.29
SMD1812B200TF/12
2.60
2.44
2.22
2.00
1.78
1.67
1.50
1.45
1.29
SMD1812B200TF/16
2.60
2.44
2.22
2.00
1.78
1.67
1.50
1.45
1.29
SMD1812B260TFT
3.40
3.16
3.00
2.60
2.30
2.15
2.00
1.85
1.63
SMD1812B260TF/12
3.40
3.16
3.00
2.60
2.30
2.15
2.00
1.85
1.63
SMD1812B260TF/16
3.40
3.16
3.00
2.60
2.30
2.15
2.00
1.85
1.63
SMD1812B300TFT
4.13
3.75
3.30
3.00
2.62
2.43
2.25
2.00
1.78
Average Time-Current Curve
Revision:26-Sep-17
www.brightking.com
SMD1812 SERIES
Average Time-Current Curve
Revision:26-Sep-17
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SMD1812 SERIES
Soldering Parameters
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TS max to TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (TS min to TS max)
150℃
200℃
60-180 seconds
Time maintained above:
-Temperature (TL)
-Time (tL)
217℃
60-150 seconds
Peak Temperature (TP)
260℃
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Storage Condition
20-40 seconds
6℃/second max.
8 minutes max.
0℃~35℃, ≤70%RH
·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
·Recommended maximum paste thickness is 0.25mm (0.010 inch)
·Device can be cleaned using standard industry methods and solvents.
Note 1: All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
Revision:26-Sep-17
www.brightking.com
SMD1812 SERIES
Physical Dimensions (mm)
C
A
BK Logo
Part identification
D
A
B
Marking
E
B
C
D
E
Part
Number
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
SMD1812B010TF
4.37
4.73
3.07
3.41
0.75
1.25
0.30
1.20
0.15
0.65
SMD1812B014TF
4.37
4.73
3.07
3.41
0.75
1.95
0.30
1.20
0.15
0.65
SMD1812B020TF
4.37
4.73
3.07
3.41
0.55
1.25
0.30
1.20
0.15
0.65
SMD1812B020TF-J
4.37
4.73
3.07
3.41
0.55
1.25
0.30
1.20
0.15
0.65
SMD1812B035TF/30
4.37
4.73
3.07
3.41
0.55
1.25
0.30
1.20
0.15
0.65
SMD1812B050TF
4.37
4.73
3.07
3.41
0.50
1.25
0.30
1.20
0.15
0.50
SMD1812B050TF/30
4.37
4.73
3.07
3.41
0.50
2.10
0.30
1.20
0.15
0.65
SMD1812B075TF
4.37
4.73
3.07
3.41
0.50
1.55
0.30
1.20
0.15
0.50
SMD1812B075TF/24
4.37
4.73
3.07
3.41
0.50
1.55
0.30
1.20
0.15
0.65
SMD1812B075TF/33
4.37
4.73
3.07
3.41
0.75
1.55
0.30
1.20
0.15
0.65
SMD1812B110TF
4.37
4.73
3.07
3.41
0.30
2.00
0.30
1.20
0.15
0.65
SMD1812B110TF/16
4.37
4.73
3.07
3.41
0.30
2.00
0.30
1.20
0.15
0.65
SMD1812B110TF/24
4.37
4.73
3.07
3.41
0.30
2.00
0.30
1.20
0.15
0.65
SMD1812B110TF/33
4.37
4.73
3.07
3.41
0.75
2.00
0.30
1.20
0.15
0.65
SMD1812B125TF/16
4.37
4.73
3.07
3.41
0.45
1.50
0.30
1.20
0.15
0.65
SMD1812B125TF/6,4L
4.37
4.73
3.07
3.41
0.45
1.50
0.30
1.20
0.15
0.65
SMD1812B150TF/8
4.37
4.73
3.07
3.41
0.40
0.90
0.30
1.20
0.15
0.65
SMD1812B150TF/12
4.37
4.73
3.07
3.41
0.40
1.80
0.30
1.20
0.15
0.65
SMD1812B150TF/16
4.37
4.73
3.07
3.41
0.40
1.80
0.30
1.20
0.15
0.65
SMD1812B150TF/24
4.37
4.73
3.07
3.41
0.80
2.10
0.30
1.20
0.15
0.65
SMD1812B160TF/8(4L)
4.37
4.73
3.07
3.41
0.40
1.80
0.30
1.20
0.15
0.65
SMD1812B160TF/16
4.37
4.73
3.07
3.41
0.75
1.80
0.30
1.20
0.15
0.65
SMD1812B200TFT
4.37
4.73
3.07
3.41
0.20
1.25
0.30
1.20
0.15
0.65
SMD1812B200TF/12
4.37
4.73
3.07
3.41
0.80
1.80
0.30
1.20
0.15
0.65
SMD1812B200TF/16
4.37
4.73
3.07
3.41
0.80
2.00
0.30
1.20
0.15
0.65
SMD1812B260TFT
4.37
4.73
3.07
3.41
0.20
1.80
0.30
1.20
0.15
0.65
SMD1812B260TF/12
4.37
4.73
3.07
3.41
0.80
1.80
0.30
1.20
0.15
0.65
SMD1812B260TF/16
4.37
4.73
3.07
3.41
0.80
2.10
0.30
1.20
0.15
0.65
SMD1812B300TFT
4.37
4.73
3.07
3.41
0.50
1.60
0.30
1.20
0.15
0.65
Revision:26-Sep-17
www.brightking.com
SMD1812 SERIES
Environmental Specifications
Operating / Storage temperature
-40℃ to +85℃
Maximum Device Surface Temperature in Tripped State
125℃
Passive Aging
+85℃, 1000 hours
±50% typical resistance change
Humidity Aging
+85℃, 85%R.H. 1000 hours
±50% typical resistance change
Thermal Shock
MIL-STD-202, Method 107G
+85℃/-40℃ 20 times
-50% typical resistance change
Solvent Resistance
MIL-STD-202, Method 215
No change
Vibration
MIL-STD-883C, Method 2007.1, Condition A
No change
Moisture Level Sensitivity
Level 1, J-STD-020C
Packaging Quantity and Marking
3.15typ.
Recommended Pad Layout (mm)
Part Number
Marking
Quantity
SMD1812B010TF
010
1500
SMD1812B014TF
014
1500
SMD1812B020TF
020
1500
SMD1812B020TF-J
020.J
1500
SMD1812B035TF/30
0330
2000
SMD1812B050TF
050
2000
SMD1812B050TF/30
0530
1000
SMD1812B075TF
075
2000
SMD1812B075TF/24
0724
1500
SMD1812B075TF/33
0733
1000
Revision:26-Sep-17
www.brightking.com
SMD1812 SERIES
Packaging Quantity and Marking
3.15typ.
Recommended Pad Layout (mm)
Part Number
Marking
Quantity
SMD1812B110TF
110
2000
SMD1812B110TF/16
1116
1500
SMD1812B110TF/24
1124
1000
SMD1812B110TF/33
1133
1000
SMD1812B125TF/16
125
1500
SMD1812B125TF/6,4L
125
2000
SMD1812B150TF/8
150
2000
SMD1812B150TF/12
1512
1500
SMD1812B150TF/16
1516
1000
SMD1812B150TF/24
1524
1000
SMD1812B160TF/8(4L)
160
2000
SMD1812B160TF/16
1616
1000
SMD1812B200TFT
20
2000
SMD1812B200TF/12
2012
1000
SMD1812B200TF/16
2016
1000
SMD1812B260TFT
260
2000
SMD1812B260TF/12
2612
1000
SMD1812B260TF/16
2616
1000
SMD1812B300TFT
30
1000
◎ 12mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3)
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material: Matte Tin (Sn))
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.
Revision:26-Sep-17
www.brightking.com
SMD1812 SERIES
Packaging
Tape
Dimensions (mm)
Symbol
B035TF/30
B010TF
B050TF/30,B075TF/33
B050TF
B014TF
B110TF/24,B110TF/33
B075TF
B020TF
B150TF/16,B150TF/24
B110TF
B020TF-J
B160TF/16
B125TF/6,4L
B075TF/24
B200TF/12,B200TF/16
B150TF/8
B110TF/16
B200TF/12,B200TF/16
B160TF/8(4L)
B125TF/16
B260TF/12,B260TF/16
B200TFT,
B150TF/12
B300TFT
B260TFT
Reel
W
12.00±0.30
12.00±0.30
12.00±0.10
F
5.50±0.05
5.50±0.05
5.50±0.05
E
1.75±0.10
1.75±0.10
1.75±0.10
D0
1.55±0.05
1.55±0.05
1.55±0.05
D1
1.55(MIN)
1.50±0.10
1.55(MIN)
P0
4.00±0.10
4.00±0.10
4.00±0.10
P1
8.00±0.10
8.00±0.10
8.00±0.10
P2
2.00±0.05
2.00±0.05
2.00±0.05
A0
3.58±0.10
3.50±0.10
3.58±0.10
B0
4.93±0.10
4.85±0.10
4.93±0.10
T
0.25±0.10
0.25±0.10
0.25±0.10
K0
0.87±0.10
1.25±0.10
2.10±0.10
Leader min.
390
390
390
Trailer min.
160
160
160
C
Φ178.0±1.0
D
Φ60.2±0.5
H
16.0±0.5
W
13.2±1.5
Part Number System
Revision:26-Sep-17
www.brightking.com