LTT-2012-MKLJQ-A1

APPROVAL SHEET (RoHS Compliant & Halogen Free) CUSTOMER : CUSTOMER’S PART NO. : DESCRIPTION : Multi-layer Chip Triplexer PART NO. : LTT-2012-MKLJQ-A1 DATE : AUTHORIZED BY : Derek Wei FULLY APPROVED PARTIALLY APPROVED REJECTED SIGN SUGGESTION 美磊科技股份有限公司 MAG. LAYERS SCIENTIFIC-TECHNICS CO., LTD HEAD OFFICE / PINGZHEN PLANT 270, Nan-Feng Road, Pingzhen District, Taoyuan City, Taiwan TEL: 886-3-4159111 FAX: 886-3-4192255 http://www.maglayers.com.tw E-mail：info@maglayers.com.tw 1/9 MAG.LAYERS LTT-2012-MKLJQ-A1_V01 Aug. 2019 ■ ■R Reevviissiioonn H Hiissttoorryy Version Date 1 2019/08/28 Description Initial specification. Approved by Prepared by CF JC 2/9 MAG.LAYERS LTT-2012-MKLJQ-A1_V01 Aug. 2019 ■ ■A AP PP PLLIIC CA ATTIIO ON N GSM/WCDMA/LTE mobile communication systems. ■ ■ FFE EA ATTU UR RE ES S ■ Compact Size Miniaturized SMD packaged in low profile and lightweight. ■ Low loss Low insertion loss, high attenuation. ■ High Soldering Heat Resistance High quality termination allows both flow and re-flow soldering methods to be applied. ■ Characteristics Eliminate noise over a wide frequency range. Idea for high frequency and space limited designs. ■ Available in tape and reel packaging for automatic mounting ■ ■P PR RO OD DU UC CTT IID DE EN NTTIIFFIIC CA ATTIIO ON N L T T –  2 0 1 2  – # # # x x – A1 - □ □     Product Code  Dimension Code  Series Type (### represents center frequency and xx represents material type)  Design Code  Pattern Code ■ ■E ELLE EC CTTR RIIC CA ALL R RE EQ QU UIIR RE EM ME EN NTTS S Part No. LTT-2012-MKLJQ-A1 Item Frequency Range (MHz) Insertion Loss (dB) Return Loss (dB) Attenuation (dB) Isolation (dB) Low Band 1560~1610 0.5 typ. 0.6 max. 10 min. 16 min. @2400~2500 MHz 14 min. @4900~5850 MHz Low to Middle band 17 min. @1560~1605 MHz 16 min. @2400~2500 MHz 2400~2500 0.7 typ. 0.85 max. 10 min. 17 min. @1560~1605 MHz 13 min. @4900~5850 MHz Middle to High band 20 min. @1560~1605 MHz 20 min. @2400~2500 MHz 14 min. @4900~5850 MHz 4900~5850 0.6 typ. 0.8 max. 10 min. 30 min. @ 825~1000 MHz 28 min. @1500~2100 MHz 27 min. @2400~2500 MHz Low to High band 20 min. @1560~1605 MHz 20 min. @2400~2500 MHz 13 min. @4900~5850 MHz 1560~1610 - - - 2400~2500 - - - Middle Band High Band Common 10 min. 4900~5850 Operating Temperature Range: -40~85°C Power Capacity: 3W max. 3/9 MAG.LAYERS LTT-2012-MKLJQ-A1_V01 Aug. 2019 ■ ■P PR RO OD DU UC CTT D DIIM ME EN NS SIIO ON N L W T a 2.0±0.1 1.25±0.1 0.95±0.1 0.3±0.1 b c g p 0.2±0.1 0.3+0.1/-0.2 0.35±0.1 0.65±0.05 NOTE：Dimensions in mm ■ ■ TTE ER RM MIIN NA ALL C CO ON NFFIIG GU UR RA ATTIIO ON N ① GND ② Common Port ③ GND ④ Low Frequency Port (1.5G) ⑤ GND ⑥ Middle Frequency Port (2.4G) ⑦ GND ⑧ High Frequency Port (5G) ■ ■M ME EA AS SU UR RIIN NG GD DIIA AG GR RA AM M Test Instrument: Agilent E5071C Network Analyzer or equivalent. 4/9 MAG.LAYERS LTT-2012-MKLJQ-A1_V01 Aug. 2019 ■ ■R RE EC CO OM MM ME EN ND DE ED DP PC CB B LLA AY YO OU UTT A AN ND D LLA AN ND DP PA ATTTTE ER RN N * * * * unit: mm *Line width should be designed to match 50Ω characteristic impedance, depending on PCB material and thickness. ■ ■E ELLE EC CTTR RIIC CA ALL C CH HA AR RA AC CTTE ER RIIS STTIIC CS S (( TT==2255℃ ℃)) 5/9 MAG.LAYERS LTT-2012-MKLJQ-A1_V01 Aug. 2019 ■ ■R RE ELLIIA AB BIILLIITTY Y TTE ES STT Mechanical Test Item Vibration Drop shock Soldering heat resistance Specification Test Condition No apparent damage 10 Hz/min~55 Hz/min~10 Hz/min vibration frequency with 1.5 mm amplitude for two hours in x, y, z directions No apparent damage Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected. No apparent damage Preheating temperature : 150±10℃ Preheating time : 1 to 2 minutes Solder bath temperature : 260±5℃ Bathing time : 5±0.5 seconds Solder specimen LTCC components on the test printed circuit board (L: 100 x W: 40 x T: 1.6mm) in appended recommended PCB pattern. Apply the load in direction of the arrow until bending reaches 2 mm. Bending test onto printed circuit board No apparent damage Unit: mm Solderability The dipped surface of the terminal shall be at least 75% covered with solder after dipped in solder bath of 245±5℃ for 3±0.5 seconds. No apparent damage Environment Test Item Thermal shock Humidity resistance High temperature resistance Low temperature resistance Specification Test Condition No apparent damage Fulfill the electrical spec. after test No apparent damage Fulfill the electrical spec. after test No apparent damage Fulfill the electrical spec. after test No apparent damage Fulfill the electrical spec. after test -40℃~+85℃ for 100 cycles each cycle being 30 min 85±2℃, 80~90% R.H. for 500 hours +85±2℃ for 500 hours -40±3℃ for 500 hours 6/9 MAG.LAYERS LTT-2012-MKLJQ-A1_V01 Aug. 2019 ■ ■P PA AC CK KA AG GIIN NG G FFO OR RS SM MC C Peel-off force 165¢XTO 180¢X TOP COVER TAPE BASE TAPE The force for peeling off cover tape is 10 grams in the arrow direction. Dimension (Unit: mm) F A B TYPE A B C D E F 8 mm 178±1 60 +0.5 -0 - 13 ±0.2 9 ±0.5 12 ±0.5 12 mm 178±0.3 60 ±0.2 19.3 ±0.1 13.5 ±0.1 13.6 ±0.1 - C D E Taping quantity SERIES 5824 5724 5320 5220 4532 4516 3225 3216 2520 2012 1608 1005 PCS/Reel 5000 3000 1000 2000 2500 3000 4000 10000 P= 4 mm 7/9 MAG.LAYERS LTT-2012-MKLJQ-A1_V01 Aug. 2019 ■ ■ TTA AP PE EP PA AC CK KIIN NG GC CA AS SE E Unit:cm W L H No. of Reels W L H 2 18±0.5 18±0.5 2.4±0.2 3 18±0.5 18±0.5 3.6±0.2 4 18±0.5 18±0.5 4.8±0.2 5 18±0.5 18±0.5 6.0±0.2 ` ■ ■O OP PE ER RA ATTIIO ON N TTE EM MP PE ER RA ATTU UR RE E -40℃~+85℃ ■ ■S STTO OR RA AG GE EC CO ON ND DIITTIIO ON N The temperature should be within -20 ~ 35℃ and humidity should be less than 75% RH. The product should be used within 6 months from the time of delivery. ■ ■A ATTTTE EN NTTIIO ON NR RE EG GA AR RD DIIN NG GP PC CB BB BE EN ND DIIN NG G (a) PCB shall be designed so that products are not subjected to the mechanical stress for board wrapage. Product shall be located in the sideway direction to the mechanical stress. b a Length: a>b a b (Good example) (Poor example) (b) Products (A,B,C,D) shall be located carefully so that products are not subjected to the mechanical stress due to warping the board. Because they may be subjected to the mechanical stress in order of A>C>B≒D. Seam a C B A b D Slit Length: a>b 8/9 MAG.LAYERS LTT-2012-MKLJQ-A1_V01 Aug. 2019 ■ ■R RE EC CO OM MM ME EN ND DE ED DR RE EFFLLO OW WS SO OLLD DE ER RIIN NG GP PR RO OFFIILLE E tP Temperature TP Critical Zone TL to TP Ramp-up TL tL Tsmax Tsmin Ramp-down tS Preheat t=25 ℃ to Peak Time Profile Feature Sn-Pb Pb-Free 60~120 seconds 60~180 seconds Tsmin 100℃ 150℃ Tsmax 150℃ 200℃ 3℃/second max. 3℃/second max. 183℃ 217℃ 60~150 seconds 60~150 seconds 230℃ 250~260℃ 10 seconds 10 seconds 6℃/sec max. 6℃/sec max. 6 minutes max. 8 minutes max. ts Preheat Average ramp-up rate (Tsmax to TP) Time main above Temperature (TL) Time (tL) Peak temperature (TP) Time within 5℃ of actual peak temperature (tP) Ramp-down rate Time 25℃ to peak temperature ■ ■N NO OTTE ES S The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. 9/9 MAG.LAYERS LTT-2012-MKLJQ-A1_V01 Aug. 2019