APPROVAL SHEET
(RoHS Compliant & Halogen Free)
CUSTOMER
:
CUSTOMER’S
PART NO.
:
DESCRIPTION
: Multi-layer Chip Diplexer for LTE
PART NO.
: LTD-1608-DFXJS-A1
DATE
:
AUTHORIZED BY : Derek Wei
FULLY
APPROVED
PARTIALLY
APPROVED
REJECTED
SIGN
SUGGESTION
美磊科技股份有限公司
MAG. LAYERS SCIENTIFIC-TECHNICS CO., LTD
HEAD OFFICE / PINGZHEN PLANT
270, Nan-Feng Road, Pingzhen District, Taoyuan City, Taiwan
TEL: 886-3-4159111 FAX: 886-3-4192255
http://www.maglayers.com.tw
E-mail:info@maglayers.com.tw
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MAG.LAYERS
LTD-1608-DFXJS-A1_V03 Apr. 2020
Version
Date
1
2018/12/06
2
3
Description
Approved by
Prepared by
Initial specification.
CF
LYW
2020/03/17
Modify recommended PCB layout and
land pattern.
CF
LYW
2020/04/17
Modify electrical requirements.
CF
LYW
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MAG.LAYERS
LTD-1608-DFXJS-A1_V03 Apr. 2020
GSM/WCDMA/LTE mobile communication systems.
■
■
■
■
■
Compact Size
Miniaturized SMD packaged in low profile and lightweight.
Low loss
Low insertion loss, high attenuation.
High Soldering Heat Resistance
High quality termination allows both flow and re-flow soldering methods to be
applied.
Characteristics
Eliminate noise over a wide frequency range. Idea for high frequency and space
limited designs.
Available in tape and reel packaging for automatic mounting
L T D
-
1 6 0 8
-
# # # x x
-
A1
-
□ □
Product Code
Dimension Code
Series Type (### represents center frequency and xx represents material type)
Design Code
Pattern Code
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MAG.LAYERS
LTD-1608-DFXJS-A1_V03 Apr. 2020
■
Low-Band
Item
Frequency Range(MHz)
Min.
Typ.
Max.
Insertion Loss (dB)
698~960
—
0.75
0.90
Return Loss (dB)
698~960
10
18.5
—
Attenuation (dB)
1710~2700
25
30
—
Item
Frequency Range(MHz)
Min.
Typ.
Max.
Insertion Loss (dB)
1710~2700
—
0.65
0.80
Return Loss (dB)
1710~2700
10
17
—
698~960
20
26.5
—
5150~5850
20
22
—
Frequency Range(MHz)
Min.
Typ.
Max.
698~960
10
17
—
1710~2700
10
17
—
Frequency Range(MHz)
Min.
Typ.
Max.
698~960
20
27
—
1710~2700
25
30
—
High-Band
Attenuation (dB)
Common
Item
Return Loss (dB)
Isolation
Item
Low to High (dB)
Operating Temperature Range: -40 ~ +85°C
Power Capacity: 3W max.
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LTD-1608-DFXJS-A1_V03 Apr. 2020
L
W
T
a
1.60±0.10
0.80±0.10
0.60±0.10
0.35±0.10
d
b
c
0.22±0.05
0.20±0.10
0.22±0.05
NOTE:Dimensions in mm
■
(1) GND
(2) Common Port
(3) GND
(4) High Frequency Port
(5) GND
(6) Low Frequency Port
■
Test Instrument:
Agilent E5071C Network Analyzer or
equivalent.
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MAG.LAYERS
LTD-1608-DFXJS-A1_V03 Apr. 2020
*
*
*
unit: mm
*Line width should be designed to match 50Ω characteristic impedance, depending on
PCB material and thickness.
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MAG.LAYERS
LTD-1608-DFXJS-A1_V03 Apr. 2020
■
Mechanical Test
Item
Test Condition
Specification
Vibration
10 Hz/min~55 Hz/min~10 Hz/min vibration
frequency with 1.5 mm amplitude for two
hours in x, y, z directions
No apparent damage
Drop shock
Dropped onto printed circuit board from
100cm height three times in x, y, z directions.
The terminals shall be protected.
No apparent damage
Soldering heat
resistance
Preheating temperature : 150±10℃
Preheating time : 1 to 2 minutes
Solder bath temperature : 260±5℃
Bathing time : 5±0.5 seconds
No apparent damage
Solder specimen LTCC components on the
test printed circuit board (L: 100 x W: 40 x T:
1.6mm) in appended recommended PCB
pattern.
Apply the load in direction of the arrow until
bending reaches 2 mm.
Bending test
onto printed
circuit board
No apparent damage
Unit: mm
The dipped surface of the terminal shall be at
least 75% covered with solder after dipped in
solder bath of 245±5℃ for 3±0.5 seconds.
No apparent damage
Thermal shock
-40℃~+85℃ for 100 cycles each cycle being
30 min
No apparent damage
Fulfill the electrical spec. after test
Humidity
resistance
85±2℃, 80~90% R.H. for 500 hours
No apparent damage
Fulfill the electrical spec. after test
Solderability
Environment Test
High temperature 85±2℃ for 500 hours
resistance
No apparent damage
Fulfill the electrical spec. after test
Low temperature
resistance
No apparent damage
Fulfill the electrical spec. after test
-40±3℃ for 500 hours
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MAG.LAYERS
LTD-1608-DFXJS-A1_V03 Apr. 2020
Peel-off force
165¢XTO 180¢X
TOP COVER TAPE
BASE TAPE
The force for peeling off cover tape is 10 grams in the arrow direction.
Dimension (Unit: mm)
F
A
B
TYPE
A
B
C
D
E
F
8 mm
178±1
60+0.5
-0
-
13±0.2
9±0.5
12±0.5
12 mm
178±0.3
60±0.2
19.3±0.1
13.5±0.1
13.6±0.1
-
C
D
E
Taping quantity
SERIES
5824
5724
5320
5220
4532
4516
3225
3216
2520
2012
1608
1005
PCS/Reel
5000
3000
1000
2000
2500
3000
4000
10000
P= 4 mm
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MAG.LAYERS
LTD-1608-DFXJS-A1_V03 Apr. 2020
Unit:cm
W
No. of
Reels
W
L
H
2
18±0.5
18±0.5
2.4±0.2
3
18±0.5
18±0.5
3.6±0.2
4
18±0.5
18±0.5
4.8±0.2
5
18±0.5
18±0.5
6.0±0.2
L
H
`
-40℃~+85℃
The temperature should be within -40 ~ 85℃ and humidity should be less than
75% RH. The product should be used within 6 months from the time of delivery.
(a) PCB shall be designed so that products are not subjected to the mechanical stress for
board wrapage. Product shall be located in the sideway direction to the mechanical
stress.
b
a
Length: a>b
a
b
(Good example)
(Poor example)
(b) Products (A,B,C,D) shall be located carefully so that products are not subjected to the
mechanical stress due to warping the board. Because they may be subjected to the
mechanical stress in order of A>C>B≒D.
Seam
a
C
B
A
b
D
Slit Length: a>b
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MAG.LAYERS
LTD-1608-DFXJS-A1_V03 Apr. 2020
tP
Temperature
TP
Critical Zone
TL to TP
Ramp-up
TL
tL
Tsmax
Tsmin
Ramp-down
tS
Preheat
t=25 ℃ to Peak
Time
Profile Feature
Sn-Pb
Pb-Free
60~120 seconds
60~180 seconds
Tsmin
100℃
150℃
Tsmax
150℃
200℃
3℃/second max.
3℃/second max.
183℃
217℃
60~150 seconds
60~150 seconds
230℃
250~260℃
10 seconds
10 seconds
6℃/sec max.
6℃/sec max.
6 minutes max.
8 minutes max.
ts
Preheat
Average ramp-up rate (Tsmax to TP)
Time main above
Temperature (TL)
Time (tL)
Peak temperature (TP)
Time within 5℃ of actual peak
temperature (tP)
Ramp-down rate
Time 25℃ to peak temperature
The contents of this data sheet are subject to change without notice. Please confirm
the specifications and delivery conditions when placing your order.
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MAG.LAYERS
LTD-1608-DFXJS-A1_V03 Apr. 2020
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