SK3637LD

SK3637LD Multilayer Chip Band Pass LC Fliter Revision3 : Sept. 2018 上海洺太电子科技有限公司 SUNTEK MICRO LTD 1. Scope This specification applies to SK3637LD of Multilayer Chip Band Pass LC Filter. 2. Product Description Description Multi-layer Chip Band Pass LC Filter 3. Electrical Characteristics SK3637LD Part Number Bandwidth(BW) 1805~2025 MHz Insertion Loss 1.65 dB Max. at 25°C 30 dB at 700~950 MHz 15 dB at 950~1050 MHz Attenuation(Absolute value) 25 dB at 2400~2500 MHz Min. 35 dB. at 2700~5400 MHz 20 dB at 5500~12500 MHz a) b) c) d) Return Loss 10 dB Min. Characteristic Impedance (Nom.) 50 ohm Operating and storage temperature range (individual chip without packing): -40℃~ +85℃. Storage temperature range (packaging conditions): -10℃~ +40℃ and RH 70% (Max.). Test equipment: Network Analyzer:E5071C. Electrical Performance: See Fig. 3-1. 0 dB(S(2,2)) dB(S(2,1)) dB(S(1,1)) -10 -20 -30 -40 -50 -60 0 1 2 3 4 5 6 7 8 9 10 11 12 freq, GHz Fig. 3-1 上海洺太电子科技有限公司 SUNTEK MICRO LTD 4. Shape and Dimensions 1) Dimensions and terminal configuration: See Fig. 4-1 Fig. 4-1 2) Recommended Land Pattern: See Fig.4-2 * Line width should be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness. Fig. 4-2 5. Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 20 X magnifier 上海洺太电子科技有限公司 SUNTEK MICRO LTD 5.3 Reliability Test Items 5.3.1 Terminal Strength Requirements Test Methods and Remarks No visible mechanical damage. ① ② ③ Solder the inductor to the testing jig (glass epoxy board shown as the following figure) using leadfree solder. Then apply a force in the direction of the arrow. 5N force for1608 series. Keep time: 10±1sec. Chip 5N/10±1s Speed: 1.0mm/s Mounting Pad 5.3.2 Resistance to Flexure No visible mechanical damage. ① ② ③ ④ Solder the chip to the test jig (glass epoxy board) using a leadfree solder. Then apply a force in the direction shown as the following figure. Solder the chip to the test jig (glass epoxy board) using leadfree solder. Then apply a force in the direction. Flexure: 2mm Pressurizing Speed: 0.5mm/sec Keep time: ≥30 sec 20 Unit: mm 10 R10 Flexure: 2 45 5.3.3 Vibration No visible mechanical damage. 45 ① ② ③ Solder the chip to the testing jig (glass epoxy board shown as the following figure) using leadfree solder. The chip shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). Glass Epoxy Board 5.3.4 Dropping No visible mechanical damage. 5.3.5 Solderability ① 上海洺太电子科技有限公司 Solder Mask Cu Pad Drop the chip 10 times on a concrete floor from a height of 100 cm. No visible mechanical damage. Wetting shall be exceeded 75% coverage. ① ② ③ ④ Solder temperature: 240±2℃ Duration: 3sec Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight No visible mechanical damage. ① ② ③ ④ ⑤ Solder temperature: 260±5℃ Duration: 5 sec Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight The chip shall be stabilized at normal condition for 1~2 hours before measuring. ② 5.3.6 Resistance to Soldering Heat Glass Epoxy Board SUNTEK MICRO LTD 5.3.7 Thermal Shock ① ② No visible mechanical damage. Satisfy electrical Characteristic. ① ② ③ ④ Temperature and time: -40℃ for 30±3 min→85℃ for 30±3min Transforming interval: Max. 20 sec. Tested cycle: 100 cycles The chip shall be stabilized at normal condition for 1~2 hours before measuring. 3 0 m in . -40℃ 85℃ Ambient Temperature 5.3.8 Damp Heat (Steady States) ① 5.3.9 Resistance to High temperature ① ② ② 6. 30 min. 30 min. 20sec. (max.) No visible mechanical damage. Satisfy electrical Characteristic. ① ② ③ ④ Temperature: 60±2℃ Humidity: 90% to 95% RH Duration: 500+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. No visible mechanical damage. Satisfy electrical Characteristic. ① ② ③ Temperature: 85±2℃ Duration: 500+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. Packaging and Storage 6.1 Packaging There is one type of packaging for the Diplexer. Please specify the packing code when ordering. 6.1.1 Tape Carrier Packaging: Packaging code: T a. Tape carrier packaging are specified in attached figure Fig. 6.1-1~3 b. Tape carrier packaging quantity please see the following table: (1) Type 1608[0603] Tape Paper Tape Quantity 4K Taping Drawings (Unit: mm) Paper Tape Top Tape Paper Tape Sprocket Hole Bottom Tape Chip Cavity Fig. 6.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. (2) Taping Dimensions (Unit: mm) Sprocket Hole Φ1.5 (+0.1,0) Chip Cavity 1.75±0.1 8.0±0.3 3.5±0.05 A B P 上海洺太电子科技有限公司 4.0±0.1 2.0±0.05 Direction of Feed T Fig. 6.1-2 SUNTEK MICRO LTD (3) Type Chip Thickness A B P T max SK3637LD 0.60±0.10 1.00±0.10 1.80±0.10 4.0±0.10 0.75 Reel Dimensions (Unit: mm) 4.3±0.2mm 10.0±1.5mm C 4.0±0.1mm 2.45±0.2mm 5.0±0.1mm 58±2.0mm 13.5±0.2mm 9 9 3.0±0.1mm ± Fig. 6.1-30 178±2.0mm . 6.2 Storage a. b. c. d. 7. 3 The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. Solderability specified in Clause 5.3.6 shall be guaranteed for 6 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 6 months shall be checked solder-ability before use. Recommended Soldering Technologies 7.1 Re-flowing Profile △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 7.2 Iron Soldering Profile △ Iron soldering power: Max.30W △ Pre-heating: 150 ℃ / 60 sec. △ Soldering Tip temperature: 350℃Max. △ Soldering time: 3 sec Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering Peak 260℃ max 260℃ Max Ramp Up Rate=3℃/sec. 217℃ Max Ramp Down Rate=6℃/sec. 150℃ 60～120sec. 25℃ Time 25℃ to Peak =8 min max 3 sec. Max. 350℃ Soldering Iron Power: max. 30W Diameter of [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] Soldering Tc ℃ 上海洺太电子科技有限公司 60～90sec. 200℃ Iron 1.0mm max. SUNTEK MICRO LTD