SK3632LD

SK3632LD Low Pass LC Filter Revision 2 : Sept. 2017 上海洺太电子科技有限公司 SUNTEK MICRO LTD  1. Scope 2. Product Description This specification applies to SK3632LD of Low Pass LC Filter. Multi-layer Chip Low Pass LC Filter 3. Electrical Characteristics Part Number Band edge Max. IL in BW (@25°C) 2025.0 MHz Bandwidth(BW) SK3632LD Attenuation(Absolute value) Max. RL in BW (@25°C) Characteristic Impedance (Nom.) 1805~2025 MHz 1.4 dB max 10 dB min. at 2400~2500MHz 25 dB min. at 3760~4050MHz 25 dB min. at 5150~6000MHz 15 dB min 50 ohm a) Operating and storage temperature range (individual chip without packing): -40°C~ +85°C. d) Electrical Performance: See Fig. 3-1. b) c) Storage temperature range (packaging conditions): -10°C~ +40°C and RH 70% (Max.). Test equipment: Network Analyzer:E5071C. 0 -10 dB(S(2,2)) dB(S(1,2)) dB(S(1,1)) -20 -30 -40 0 1 2 3 freq, GHz 4 5 6 Fig. 3-1 上海洺太电子科技有限公司  SUNTEK MICRO LTD  4. Shape and Dimensions 1) Dimensions and terminal configuration: See Fig. 4-1 1.000±0.05 0.500±0.05 1.000±0.05 0.180±0.05 (4) (5) (6) (1) (2) (3) (1) (3) : NC (2) (5) : GND (4) : Out (6) : In M : MARK Unit : mm 0.380±0.05 0.150±0.05 0.125±0.05 0.180±0.05 Fig. 4-1 2) Recommended Land Pattern: See Fig.4-2 0.180 0.130 0.180 Land Solder Resist Through Hole Diameter : 0.2 Unit : mm * 5. Line width should be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness. Fig. 4-2 Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. b. Ambient Temperature: 20±15°C Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa If any doubt on the results, measurements/tests should be made within the following limits: a. b. c. Ambient Temperature: 20±2°C Relative Humidity: 65±5% Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 20 X magnifier 上海洺太电子科技有限公司 SUNTEK MICRO LTD  5.3 Reliability Test Items 5.3.1 Terminal Strength Requirements Test Methods and Remarks No visible mechanical damage. Solder the inductor to the testing jig (glass epoxy board apply a force in the direction of the arrow. 5N force for1608 series. Keep time: 10±1sec. shown as the following figure) using leadfree solder. Then Chip 5N/10±1s Speed: 1.0mm/s Glass Epoxy Board Mounting Pad 5.3.2 Resistance to Flexure No visible mechanical damage. Solder the chip to the test jig (glass epoxy board) using a leadfree solder. Then apply a force in the direction shown as the following figure. Solder the chip to the test jig (glass epoxy board) using leadfree solder. Then apply a force in the direction. Flexure: 2mm Pressurizing Speed: 0.5mm/sec Keep time: ≥30 sec 20 Unit: mm 10 R10 45 5.3.3 Vibration No visible mechanical damage. Flexure: 2 45 Solder the chip to the testing jig (glass epoxy board shown as the following figure) using leadfree solder. The chip shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). Solder Mask Glass Epoxy Board 5.3.4 Dropping No visible mechanical damage. 5.3.5 Solderability 5.3.6 Resistance to Soldering Heat No visible mechanical damage. Wetting shall be exceeded 75% coverage. No visible mechanical damage. 上海洺太电子科技有限公司 Cu Pad Drop the chip 10 times on a concrete floor from a height of 100 cm. Solder temperature: 240±2°C Solder temperature: 260±5°C Duration: 3sec Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight Duration: 5 sec Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight The chip shall be stabilized at normal condition for 1~2 hours before measuring. SUNTEK MICRO LTD  5.3.7 Thermal Shock Temperature and time: -40°C for 30±3 min→85°C for No visible mechanical damage. Satisfy electrical Characteristic. 30±3min Transforming interval: Max. 20 sec. Tested cycle: 100 cycles The chip shall be stabilized at normal condition for 1~2 hours before measuring. 30 min. 85 Ambient Temperature 5.3.8 No visible mechanical Damp Heat (Steady States) Satisfy electrical Characteristic. 5.3.9 No visible mechanical Satisfy electrical Characteristic. Resistance to High temperature damage. damage. -40 30 min. Temperature: 60±2°C Temperature: 85±2°C Duration: 500+24 hours 30 min. 20sec. (max.) Humidity: 90% to 95% RH Duration: 500+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. The chip shall be stabilized at normal condition for 1~2 hours before measuring. 6. Packaging and Storage 6.1 Packaging There is one type of packaging for the Low pass filter. Please specify the packing code when ordering. 6.1.1 Tape Carrier Packaging: Packaging code: T a. b. Tape carrier packaging are specified in attached figure Fig. 6.1-1~3 Tape carrier packaging quantity please see the following table: Type 1005[0402] Tape Paper Tape Quantity 4K (1) Taping Drawings (Unit: mm) Paper Tape Top Tape Paper Tape Sprocket Hole Bottom Tape Chip Cavity Fig. 6.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. (2) Taping Dimensions (Unit: mm) Sprocket Hole Φ1.5 (+0.1,0) Chip Cavity 1.75±0.1 A 8.0±0.3 3.5±0.05 B P 上海洺太电子科技有限公司 4.0±0.1 2.0±0.05 Direction of Feed T Fig. 6.1-2 SUNTEK MICRO LTD  Type Chip Thickness SK3632LD 4.0±0.1mm 1.10±0.10 T max 4.0±0.05 0.6 10.0±1.5mm 2.45±0.2mm 5.0±0.1mm 13.5±0.2mm 3.0±0.1mm 178±2.0mm Fig. 6.1-3 6.2 Storage a. b. c. d. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40°C or less and 70% RH or less. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. Solderability specified in Clause 5.3.6 shall be guaranteed for 6 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 6 months shall be checked solder-ability before use. 7. Recommended Soldering Technologies 7.1 Re-flowing Profile Preheat condition: 150 ~200°C/60~120sec. Allowed time above 217°C: 60~90sec. Peak 260°C max Max temp: 260°C Solder paste: Sn/3.0Ag/0.5Cu 217 200 150 Max time at max temp: 10sec. Allowed Reflow time: 2x max qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 7.2 Iron Soldering Profile Iron soldering power: Max.30W 260 [Note: The reflow profile in the above table is only for 0.6±0.1 P 58±2.0mm 4.3±0.2mm 0.60±0.10 B (3) Reel Dimensions (Unit: mm) A Pre-heating: 150 °C / 60 sec. Soldering Tip temperature: 350 Max. Soldering time: 3 sec Max. Solder paste: Sn/3.0Ag/0.5Cu Max.1 times for iron soldering [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] Max Ramp Up Rate=3 /sec. 60～90sec. 60～120sec. 25 Time 25 to Peak =8 min max 3 sec. Max. 350 Soldering Iron Power: max. 30W Diameter of Soldering Tc 上海洺太电子科技有限公司 Max Ramp Down Rate=6 /sec. Iron 1.0mm max. SUNTEK MICRO LTD