SK3522LD

SK3522LD Multilayer Chip DIPLEXER Dual-band/dual-mode at 1.5GHz and 2.4GHz Revision 4 : Sept. 2019 上海洺太电子科技有限公司 SUNTEK MICRO LTD 1. Scope This specification applies to SK3522LD of Multilayer Chip Diplexer. 2. Product Description and Identification (Part Number) Multi-layer Chip Diplexer 3. Electrical Characteristics Part Number SK3522LD Application Low Band High Band Bandwidth (BW) 1570~1610 MHz 2400~2500 MHz I.L. in BW Attenuation(Absolute value) 0.45 dB max at 25℃ 0.5 dB max at 25℃ 0.6 dB max. at -40~85℃ 0.7 dB max. at -40~85℃ 20 dB min. at 2400~2500MHz 22 dB min. at 1570~1610MHz 20 dB min. at 1570~1610MHz Isolation 20 dB min. at 2400~2500MHz R.L. in BW 15 dB min 15 dB min Characteristic Impedance (Nom.) 50 ohm Power Capacity 3.0 W max. a) Operating and storage temperature range (individual chip without packing): -40℃~ +85℃. b) c) d) Storage temperature range (packaging conditions): -10℃~ +40℃ and RH 70% (Max.). Test equipment: Network Analyzer:E5071C Electrical Performance: See Fig. 3-1. 0 dB(S(1,3)) dB(S(1,2)) dB(S(1,1)) -10 -20 -30 -40 Port 1 : Ant Port 2 : LB Port 3 : HB 1 2 3 freq, GHz Fig. 3-1 上海洺太电子科技有限公司 SUNTEK MICRO LTD 4. Shape and Dimensions 1) Dimensions and terminal configuration: See Fig. 4-1 Fig. 4-1 2) Recommended Land Pattern: See Fig.4-2 * Line width should be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness. Fig. 4-2 5. Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 20 X magnifier 上海洺太电子科技有限公司 SUNTEK MICRO LTD 5.3 Reliability Test Items 5.3.1 Terminal Strength Requirements Test Methods and Remarks ① No visible mechanical damage. ② ③ Solder the inductor to the testing jig (glass epoxy board shown as the following figure) using leadfree solder. Then apply a force in the direction of the arrow. 5N force for1608 series. Keep time: 10±1sec. Chip 5N/10±1s Speed: 1.0mm/s Glass Epoxy Board Mounting Pad 5.3.2 Resistance to Flexure No visible mechanical damage. ① ② ③ ④ Solder the chip to the test jig (glass epoxy board) using a leadfree solder. Then apply a force in the direction shown as the following figure. Solder the chip to the test jig (glass epoxy board) using leadfree solder. Then apply a force in the direction. Flexure: 2mm Pressurizing Speed: 0.5mm/sec Keep time: ≥30 sec 20 Unit: mm 10 R10 Flexure: 2 45 5.3.3 Vibration No visible mechanical damage. 45 ① ② ③ Solder the chip to the testing jig (glass epoxy board shown as the following figure) using leadfree solder. The chip shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). Solder Mask Cu Pad Glass Epoxy Board 5.3.4 Dropping No visible mechanical damage. Drop the chip 10 times on a concrete floor from a height of 100 cm. 5.3.5 Solderability ① No visible mechanical damage. Wetting shall be exceeded 75% coverage. ① ② ③ ④ Solder temperature: 240±2℃ Duration: 3sec Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight No visible mechanical damage. ① ② ③ ④ ⑤ Solder temperature: 260±5℃ Duration: 5 sec Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight The chip shall be stabilized at normal condition for 1~2 hours before measuring. ② 5.3.6 Resistance to Soldering Heat 上海洺太电子科技有限公司 SUNTEK MICRO LTD Specifications for Multilayer Chip Diplexer ① 5.3.7 Thermal Shock ② ① No visible mechanical damage. Satisfy electrical Characteristic. ② ③ ④ Temperature and time: -40℃ for 30±3 min→85℃ for 30±3min Transforming interval: Max. 20 sec. Tested cycle: 100 cycles The chip shall be stabilized at normal condition for 1~2 hours before measuring. 30 min. 30 min. 85℃ Ambient 30 min. Temperature -40℃ 5.3.8 Damp Heat (Steady States) ① 5.3.9 Resistance to High temperature ① ② ② 6. 20sec. (max.) No visible mechanical damage. Satisfy electrical Characteristic. ① ② ③ ④ Temperature: 60±2℃ Humidity: 90% to 95% RH Duration: 500+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. No visible mechanical damage. Satisfy electrical Characteristic. ① ② ③ Temperature: 85±2℃ Duration: 500+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. Packaging and Storage 6.1 Packaging There is one type of packaging for the Diplexer. Please specify the packing code when ordering. 6.1.1 Tape Carrier Packaging: Packaging code: T a. Tape carrier packaging are specified in attached figure Fig. 6.1-1~3 b. Tape carrier packaging quantity please see the following table: (1) Type 1608[0603] Tape Paper Tape Quantity 4K Taping Drawings (Unit: mm) Paper Tape Top Tape Paper Tape Sprocket Hole Bottom Tape Chip Cavity Fig. 6.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. 上海洺太电子科技有限公司 SUNTEK MICRO LTD (2) Taping Dimensions (Unit: mm) Chip Cavity Sprocket Hole Φ1.5 (+0.1,0) 1.75±0.1 8.0±0.3 3.5±0.05 A B 4.0±0.1 P T 2.0±0.05 Direction of Feed Type Chip Thickness 0.60±0.10 SK3522LD (3) Fig. 6.1-2 A B 1.00±0.10 1.80±0.10 P T max 4.0±0.10 0.75 Reel Dimensions (Unit: mm) 4.3±0.2mm 10.0±1.5mm 2.45±0.2mm 4.0±0.1mm 5.0±0.1mm 58±2.0mm 13.5±0.2mm 3.0±0.1mm Fig. 6.1-3 178±2.0mm 6.2 Storage a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less. b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. c. d. HCl, sulfurous gas of H2S). Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. Solderability specified in Clause 5.3.6 shall be guaranteed for 6 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 6 months shall be checked solder-ability before use. 7. Recommended Soldering Technologies 7.1 Re-flowing Profile △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. △ △ Solder paste: Sn/3.0Ag/0.5Cu Allowed Reflow time: 2x max Peak 260℃ max 260℃ 217℃ Max Ramp Up Rate=3℃/sec. Max Ramp Down Rate=6℃/sec. 60∼90sec. 200℃ 150℃ [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and 60∼120sec. 25℃ Time 25℃ to Peak =8 min max process, and should not exceed the parameters as the Reflow profile shows.] 上海洺太电子科技有限公司 SUNTEK MICRO LTD 7.2 Iron Soldering Profile 3 sec. Max. △ Iron soldering power: Max.30W △ Pre-heating: 150 ℃ / 60 sec. △ Soldering Tip temperature: 350℃Max. Soldering Iron △ △ Soldering time: 3 sec Max. Solder paste: Sn/3.0Ag/0.5Cu Power: max. 30W △ Max.1 times for iron soldering [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 上海洺太电子科技有限公司 350℃ Diameter of Soldering Tc ℃ Iron 1.0mm max. SUNTEK MICRO LTD