BTLB001608LXVKBD20

Form No.: QF-1274 Edition: 2 RoHS & Halogen Free & REACH Compliance. SPECIFICATION FOR APPROVAL Customer： Customer P/N： Drawing No： Quantity： Pcs. Chilisin P/N： Date : BTLB001608LXVKBD20 SPECIFICATION ACCEPTED BY: COMPONENT ENGINEER ELECTRICAL ENGINEER MECHANICAL ENGINEER APPROVED REJECTED 奇力新電子股份有限公司 東莞奇力新電子(東莞廠)有限公司 Chilisin Electronics Corp No. 29, Alley 301, Tehhsin Rd., Hukou,Hsinchu 303, Taiwan TEL：+886-3- 599-2646 FAX：+886-3- 599-9176 E-mail：sales@chilisin.com http：//www.chilisin.com Chilisin Electronics (Dongguan) Co., Ltd. No. 78, Puxing Rd., Yuliangwei Administration Area, Qingxi Town, Dongguan City, Guangdong,China TEL：+86-769-8773-0251~3 FAX： +86-769-8773-0232 E-mail：cect@chilisin.com 奇力新電子(越南廠)有限公司 奇力新電子(湖南廠)有限公司 Chilisin Electronics (Vietnam) Limited No 143 - 145, Road No 10, VSIP Hai Phong, Lap Le Commune, Thuy Nguyen Dist, Haiphong City, Vietnam Tel：84-316 255 688 Fax：84-316 255 689 E-mail：sales@chilisin.com HuNan Chilisin Electronics Technology Co., Ltd No. 8, Shaziao Liangshuijing Town, Yuanling County, Huaihua City, Hunan Province 419601, China Tel：86-745-867-5882 E-mail：cect@chilisin.com Drawn by Checked by Approved by YH CF Derek 1 BPF for 5 GHz band application. 1-1 Compact Size Miniaturized SMD packaged in low profile and lightweight. 1-2 Low loss Low insertion loss, high attenuation. 1-3 High Soldering Heat Resistance High quality termination allows both flow and re-flow soldering methods to be applied. 1-4 Characteristics Eliminate noise over a wide frequency range. Idea for high frequency and space limited designs. 1-5 Available in tape and reel packaging for automatic mounting B T L B 0 0   1 6 0 8 # # # x x   D 2 0    Product Code  Customer Code  Dimension Code  Series Type (### represents center frequency and xx represents material type)  Design Code  Version Code ■ Part No. Pass Band (MHZ) Freq. Insertion Loss (dB) Typ. Max. Return Loss (dB) Typ. Min. BTLB001608LXVKBD20 1 at 25°C 4900~5950 MHZ 0.68 1.1 at -40~85°C 17.7 12 Attenuation (dB/dB/MHz) Typ. Min. Freq. 39.9 38 30~2700 35.5 16 3453~3547 34.4 33 3677~3883 21.6 10 6900~7093 30.2 32 7333~7750 37.3 34 10600~11650 28.1 20 15540~17700 Operating Temperature Range：-40~85°C Power Capacity：3W max. 2 L W T a 1.60±0.10 0.80±0.10 0.65 max. 0.25±0.10 b c d e 0.23±0.10 0.40±0.10 0.55±0.10 0.60±0.10 NOTE：Dimensions in mm. Top Through View (1) I/O Port (2) GND (3) I/O Port Test Instrument： Agilent E5071C Network Analyzer. 3 ◎ Line width should be designed to match 50Ω characteristic impedance, depending on PCB material and thickness. ■ 4 ■ Mechanical Test Item Test Condition Specification Vibration 10 Hz/min~55 Hz/min~10 Hz/min vibration frequency with 1.5 mm amplitude for two hours in x, y, z directions No apparent damage Drop shock Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected. No apparent damage Soldering heat resistance Preheating temperature : 150±10℃ Preheating time : 1 to 2 minutes Solder bath temperature : 260±5℃ Bathing time : 10±1 seconds Loss of metallization on the edges of each electrode shall not exceed 25%. Bending test onto printed circuit board Solder specimen LTCC components on the test printed circuit board (L: 100 x W: 40 x T: 1.6mm) in appended recommended PCB pattern. Apply the load in direction of the arrow until bending reaches 2 mm. 60sec holding time. No apparent damage Unit: mm Solderability *Solder bath temperature：245±5℃ *Immersion time：3±1 seconds. Solder：Sn3Ag0.5Cu for lead-free At least 95% of a surface of each terminal electrode must be covered by fresh solder. Adhesive strength Standard is as follows 0605~1005 >0.1KgF 1109~2016 >0.5KgF 2520~>1KgF No apparent damage Thermal shock -40℃~85℃ for 100 cycles each cycle being 30 min No apparent damage Fulfill the electrical spec. after test Humidity resistance 85±2℃,80~90% R.H. for 1000 hours No apparent damage Fulfill the electrical spec. after test Environment Test High temperature 85±2℃ for 1000 hours resistance No apparent damage Fulfill the electrical spec. after test Low temperature resistance No apparent damage Fulfill the electrical spec. after test -40±3℃ for 1000 hours 5 Peel-off force 165¢XTO 180¢X TOP COVER TAPE BASE TAPE The force for peeling off cover tape is 10 grams in the arrow direction. Dimension (Unit: mm) F A B C D TYPE A B C D E F 8 mm 178±1 60+0.5 -0 - 13±0.2 9±0.5 12±0.5 12 mm 178±0.3 60±0.2 19.3±0.1 13.5±0.1 13.6±0.1 - E Taping quantity SERIES 5824 5724 5320 5220 4532 4516 3225 3216 2520 2012 1608 1109 1005 0605 PCS/Reel 5000 3000 1000 2000 2500 3000 4000 10000 P= 4 mm 6 Unit:cm W No. of Reels W L H 2 18±0.5 18±0.5 2.4±0.2 3 18±0.5 18±0.5 3.6±0.2 4 18±0.5 18±0.5 4.8±0.2 5 18±0.5 18±0.5 6.0±0.2 L H ` Level 1 -40℃~85℃ The temperature should be within -40~85℃ and humidity should be less than 75% RH. The product should be used within 6 months from the time of delivery. (a) PCB shall be designed so that products are not subjected to the mechanical stress for board wrapage. Product shall be located in the sideway direction to the mechanical stress. b a Length: a>b a b (Good example) (Poor example) (b) Products (A,B,C,D) shall be located carefully so that products are not subjected to the mechanical stress due to warping the board. Because they may be subjected to the mechanical stress in order of A>C>B≒D. Seam a C B A b D Slit Length: a>b 7 tP Temperature TP Critical Zone TL to TP Ramp-up TL tL Tsmax Tsmin Ramp-down tS Preheat t=25 ℃ to Peak Time Profile Feature Sn-Pb Pb-Free 60~120 seconds 60~180 seconds Tsmin 100℃ 150℃ Tsmax 150℃ 200℃ 3℃/second max. 3℃/second max. 183℃ 217℃ 60~150 seconds 60~150 seconds 230℃ 250~260℃ 10 seconds 10 seconds 6℃/sec max. 6℃/sec max. 6 minutes max. 8 minutes max. ts Preheat Average ramp-up rate (Tsmax to TP) Time main above Temperature (TL) Time (tL) Peak temperature (TP) Time within 5℃ of actual peak temperature (tP) Ramp-down rate Time 25℃ to peak temperature The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. 8