SLFBF21-2R450G-A13T

Sunlord Specifications for Balanced Filter Page 1 of 7 PRELIMINARY S P E C I F I C AT I O N S 天河星 Customer Product Name Balanced Filter Sunlord Part Number SLFBF21-2R450G-A13T Customer Part Number [ New Released, Revised] SPEC No.: SLFBF190004 【This SPEC is total 8 pages including specifications and appendix.】 【ROHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China Tel: 0086-755-29832660 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Approved By Comments: Full Verified By Date: Restricted Re-checked By Rejected Checked By 518110 Sunlord Specifications for Balanced Filter Page 2 of 8 【Version change history】 Rev. 01 Effective Date Jul.18,2019 Changed Contents Change reasons Approved By New release / Hai Guo Sunlord Specifications for Balanced Filter Page 3 of 8 Caution All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our products in the following applications. 1. Aircraft equipment 2. Aerospace equipment 3. Undersea equipment 4. nuclear control equipment 5. military equipment 6. Power plant equipment 7. Medical equipment 8. Transportation equipment (automobiles, trains, ships,etc.) 9. Traffic signal equipment 10. Disaster prevention / crime prevention equipment 11. Data-processing equipment 12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above Sunlord 1. Specifications for Balanced Filter Page 4 of 8 Scope This specification applies to SLFBF21-2R450G-A13T of Balanced Filter. Product Description and Identification (Part Number) 1) Description: Multi-layer Chip Balanced Filter 2) Product Identification (Part Number) SLFBF ① 21 ② ① -2R450G ③ SLFBF ③ T ⑤ ② External Dimensions (L×W) (mm) ④ Center Frequency ⑤ 2.0 × 1.2 21 Balanced Filter 2R450G Series Code A13 2450.0 MHz Packing T 3. -A13 ④ Type Tape Carrier Package Electrical Characteristics Part Number SLFBF-212R450G-A13T Unbalance Port Impendance 50 ohm Balance Port Impendance Conjugate match to MTK 5931 Frequency Range(BW) 2450.0±50.0 MHz 2.5 dB max. at 25 ℃ Insertion Loss in BW 2.6 dB max. at -40 to +85 ℃ 35.0 dB min at 880.00~960.00MHz 30.0 dB min at 1710.00~1880.00MHz Attenuation(Absolute value) 20.0 dB min at 1880.00~1990.00MHz 25.0 dB min at 4850.00~4900.00MHz 25.0 dB min at 7200.00~7500.00MHz a) b) c) d) Unbalance Port V.S.W.R in BW 2.00 max. Balance Port V.S.W.R in BW 2.00 max. Amplitude balance 1.0 dB max Phase differential 180±10 Deg. Power Capacity 500 mW max. Operating and storage temperature range (individual chip without packing): -40℃~ +85℃. Storage temperature range (packaging conditions): -10℃~ +40℃ and RH 70% (Max.). Test equipment: Network Analyzer:E5071C. Electrical Performance: See Fig. 3-1 0 -10 dB(S(1,1)) dB(Sds21) dB(Sdd22) 2. -20 -30 -40 -50 0 1 2 3 4 freq, GHz Fig. 3-1 5 6 7 8 Sunlord Specifications for Balanced Filter Page 5 of 8 4. Shape and Dimensions 1) Dimensions and terminal configuration: See Fig. 4-1 (3) 0.90±0.10 2.00±0.15 (2) (1) (6) (7) (1):Unbalance Port (2):NC(DC feed Port) (3):NC (4)(6)(8):GND (5)(7):Balance Port M:MARK 0.30±0.15 Unit:mm 0.65±0.10 Fig. 4-1 2) Recommended Land Pattern: See Fig.4-2 0.35 0.75 0.5 0.35 0.65 1.5 0.5 LAND Fig. 4-2 5. Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 20 X magnifier 5.3 Reliability Test Items 5.3.1 Terminal Strength Requirements No visible mechanical damage. Test Methods and Remarks ① ② ③ Solder the inductor to the testing jig (glass epoxy board shown as the following figure) using leadfree solder. Then apply a force in the direction of the arrow. 10N force for 2012 series. Keep time: 10±1sec. Chip 10N/10±1s Speed: 1.0mm/s Glass Epoxy Board Mounting Pad 0.5 0.75 (5) 0.30±0.15 M (4) 0.20±0.10 1.20±0.15 0 0.2±0.10 (8) Sunlord 5.3.2 Resistance to Flexure Specifications for Balanced Filter No visible mechanical damage. ① ② ③ ④ 20 Unit: mm Page 6 of 8 Solder the chip to the test jig (glass epoxy board) using a leadfree solder. Then apply a force in the direction shown as the following figure. Solder the chip to the test jig (glass epoxy board) using leadfree solder. Then apply a force in the direction. Flexure: 2mm Pressurizing Speed: 0.5mm/sec Keep time: ≥30 sec 10 R10 Flexure: 2 45 5.3.3 Vibration No visible mechanical damage. 45 ① ② ③ Solder the chip to the testing jig (glass epoxy board shown as the following figure) using leadfree solder. The chip shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). Solder Mask Cu Pad Glass Epoxy Board 5.3.4 Dropping No visible mechanical damage. Drop the chip 10 times on a concrete floor from a height of 100 cm. 5.3.5 Solderability ① No visible mechanical damage. Wetting shall be exceeded 75% coverage. ① ② ③ ④ Solder temperature: 240±2℃ Duration: 3sec Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight 5.3.6 Resistance to Soldering Heat No visible mechanical damage. ① ② ③ ④ ⑤ Solder temperature: 260±5℃ Duration: 5 sec Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.3.7 Thermal Shock ① ① Temperature and time: -40℃ for 30±3 min→85℃ for 30±3min Transforming interval: Max. 20 sec. Tested cycle: 100 cycles. The chip shall be stabilized at normal condition for 1~2 hours before measuring. ② ② No visible mechanical damage. Satisfy electrical Characteristic. ② ③ ④ 30 min. 30 min. 85℃ Ambient 30 min. Temperature -40℃ 20sec. (max.) Sunlord Specifications for Balanced Filter 5.3.8 Damp Heat (Steady States) ① 5.3.9 Resistance to High temperature ① ② ② ① ② ③ ④ Temperature: 60±2℃ Humidity: 90% to 95% RH Duration: 500+24 hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. No visible mechanical damage. Satisfy electrical Characteristic. ① ② ③ Temperature: 85±2℃ Duration: 500+24 hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. Packaging and Storage 6.1 Packaging There is one type of packaging for the Balanced Filters. Please specify the packing code when ordering. 6.1.1 Tape Carrier Packaging: Packaging code: T a. Tape carrier packaging are specified in attached figure Fig. 6.1-1~3 b. Tape carrier packaging quantity please see the following table: (1) Taping Drawings (Unit: mm) Type 2012[0805] Tape Embossed Tape Quantity 4K Embossed Tape Top Tape Embossment Sprocket Hole Chip Cavity Fig. 6.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. (2) Taping Dimensions (Unit: mm) Fig. 7.1-6 Chip Cavity Sprocket Hole Φ1.5 (+0.1,0) 1.75±0.1 3.5±0.05 B 8.0±0.3 A 50 B 6. Page 7 of 8 No visible mechanical damage. Satisfy electrical Characteristic. T 4.0±0.1 4.0±0.1 2.0±0.05 K Direction of Feed Fig. 6.1-2 Type Chip Thickness A B K max T max SLFBF21 0.90±0.10 1.42±0.10 2.25±0.10 1.14 0.27 Sunlord (3) Specifications for Balanced Filter Page 8 of 8 Reel Dimensions (Unit: mm) 4.3±0.2mm C 4.0±0.1mm 8.4+1.5/-0.0mm 2.45±0.2mm 5.0±0.1mm 58±2.0mm 13.5±0.2mm 3.0±0.1mm max＜14.4mm 178±2.0mm Fig. 6.1.3 6.2 Storage a. b. c. d. 7. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. Solderability specified in Clause 5.3.6 shall be guaranteed for 6 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 6 months shall be checked solder-ability before use. Recommended Soldering Technologies 7.1 Reflow Profile △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max Peak 260℃ max 260℃ Max Ramp Up Rate=3℃/sec. 217℃ Max Ramp Down Rate=6℃/sec. 60～90sec. 200℃ 150℃ [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 7.2 Iron Soldering Profile △ Iron soldering power: Max.30W △ Pre-heating: 150 ℃ / 60 sec. △ Soldering Tip temperature: 350℃Max. △ Soldering time: 3 sec Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering 60～120sec. 25℃ Time 25℃ to Peak =8 min max 3 sec. Max. 350℃ Soldering Iron Power: max. 30W Diameter of Soldering [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 8. Tc ℃ Supplier Information a) Supplier: Shenzhen Sunlord Electronics Co., Ltd. b) Manufacturer: Shenzhen Sunlord Electronics Co., Ltd. c) Manufacturing Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China Zip: 518110 Iron 1.0mm max.