104KT1608T-3P

■ High accuracy, SMD chip type thermistor KT Thermistor The KT series SMD thermistor features high accuracy with tight resistance and B-value tolerances of ± 1%, high performance, high reliability and complies with EIAJ standards (dimensions: 1005, 1608). ■ Product number explanation 103 ■ Dimensions Fig. 1 KT 1608T－ □□ Glass coating W R₂₅ tolerance 1P: ± 1% 2P: ± 2% 3P: ± 3% Size according to EIAJ standard: See Fig. 1 L Tin plated electrodes T L1 High accuracy SMD chip thermistor L1 Rated zero-power resistance at 25 ℃ E.g.: 103 = 10 x 10³ Ω Size Size (Metric / EIAJ) (Imperial) 1005 0402 1608 0603 ■ Applications Office automation equipment, communication equipment, IT equipment, mobile devices, battery packs, battery chargers, LCDs, hybrid ICs, AV equipment L (mm) W (mm) T (mm) L1 (mm) 1.00 ± 0.15 1.60 ± 0.15 0.50 ± 0.10 0.80 ± 0.15 0.6 max. 0.95 max 0.15 to 0.30 0.20 to 0.50 Unit: mm ■ Specifications Product number R25１ R25 tolerance Ｂ value２ 103KT1608T 503KT1608T 104KT1608T 103KT1005T 10 ｋΩ 50 ｋΩ 100 ｋΩ 10 ｋΩ ± 1％ ± 2% ± 3% 3435 Ｋ ± 1％ 4055 Ｋ ± 1％ 4390 Ｋ ± 1％ 3435 Ｋ ± 1％ : Rated zero-power resistance at 25 ℃ 1 Dissipation factor (mw / ℃) Thermal time constant (s)3 Rated power at Operating temperature 25 ℃ (mW) range (℃) approx. 0.9 approx. 5 4.5 approx. 0.7 approx. 2.2 3.5 ― 40 to 125 : B value calculated from rated zero-power resistance at 25 ℃ and 85 ℃ 2 : Time required to reach 63.2% of temperature difference. Measured with sensor suspended in mid-air. 3 ■ Caution ■ Reliability data Item Test conditions Criteria Resistance to soldering heat 10 s at 260 ℃ (wave soldering) 5 s at 235 ℃ Flux material: Rosin 25%, ethyl alcohol Solderability 75% After mounting the thermistor body is Electrode connection strength vs. pushed horizontally with a jig with a force circuit board (horizontal) of 5 N for 10 s. After mounting the circuit board is bent Electrode connection strength vs. from the back side to a maximum of 2 mm circuit board (vertical) for 5 s. A force of 10 N is applied vertically with a Strength of NTC body jig for 10 s. Dry heat 1000 hours at 125 ℃ Damp heat 1000 hours at 40 ℃ and 90% humidity 50 cycles as below: 1. - 25 ℃ for 30 minutes Temperature cycle 2. Room temperature for 15 minutes (thermal shock) 3. 100 ℃ for 30 minutes 4. Room temperature for 15 minutes ΔR, ΔB ± 3% More than 75% soldered • Before and after soldering always make sure the circuit board is not bent or warped. • The size of the soldering pad should be the same for both the left and the right side. ΔR, ΔB ± 3% and visual inspection ΔR, ΔB ± 3% ■ Recommended temperature profile for wave soldering ■ Recommended soldering pad size D Soldering 260 ± 5 Temperature (℃) 220 ± 5 190 ± 15 Cooling period Size (EIAJ) 1005 1608 120 ± 30 B C A 0.6 1.0 B 0.5 1.0 C 0.6 1.0 D 0.6 1.2 Unit: mm 10 max. 120 1 to 2 ℃ / s 16 A 60 Preheating (in mid-air) Time (s) ■ Resistance / temperature characteristics Product number Temperature (℃) 103KT1608T - 40 221.9 - 30 125.1 503KT1608T 104KT1608T 1920 103KT1005T 5218 223.9 126.1 981.8 2530 - 20 73.38 525.2 1285 - 10 44.72 293.3 682.0 44.91 73.87 0 28.16 169.7 376.8 28.22 10 18.25 101.7 216.1 18.27 20 12.14 62.90 128.3 12.15 25 10.00 50.00 100.0 10.00 30 8.283 40.05 78.55 8.282 40 5.781 26.20 49.56 5.778 50 4.120 17.56 32.13 4.119 60 2.996 12.04 21.36 2.992 70 2.214 8.431 14.53 2.212 80 1.665 6.021 10.10 1.664 85 1.451 5.122 8.487 1.451 90 1.271 4.376 7.164 1.271 100 0.9832 3.237 5.176 0.9840 110 0.7707 2.433 3.803 0.7710 120 0.6114 1.855 2.839 0.6115 125 0.5469 1.627 2.466 B25/85 3435 K 4055 K 0.5470 4390 K 3435 K Unit: kΩ ■ Taping dimensions ●1608: 4.000 pcs / reel φ1.5 ＋0.1 0 4.0 ± 0.1 1.2 max. 4.0 ± 0.1 2.0 ± 0.05 2.0 ± 0.05 4.0 ± 0.1 1.75 ± 0.1 8.0 ± 0.3 3.5 ± 0.05 1.75 ± 0.1 0.75 ± 0.02 8.0 ± 0.3 3.5 ± 0.05 1.0 ± 0.1 0.9 max 0.66 ± 0.03 2.0 ± 0.10 0.6 ± 0.10 1.10 ± 0.10 1.5 ＋0.1 0 1.85 ± 0.1 0.6 max. ●1005: 10.000 pcs / reel Unit: kΩ 17