SiliconGo Internal Only
SiliconGo TLC eMMC Product Family
eMMC5.1 Specification Compatibility
SGM8000C-S03BBG
SGM8000C-S03BCG
Datasheet
V1.2
Copyright © 2021 SiliconGo Microelectronics, Inc.
All rights reserved
SiliconGo Microelectronics, Inc.
http//:www.SiliconGo.com
e•MMC5.1 Datasheet_V1.2
Revision History
Revision No.
0.1
1.0
1.1
1.2
SiliconGo Internal Only
Date
2019-03-05
2019-05-18
2019-07-10
2021-03-16
1.
1.
1.
1.
History
Initial Issue
Customer version for 16GB Product
Added 32GB/64GB Product.
EOL, Deleted SGM8000C-D03BAG product.
-2-
Remark
Draft
Final
Final
Final
e•MMC5.1 Datasheet_V1.2
TABLE OF CONTENTS
1
Introduction ............................................................................................................................ - 4 1.1
General Description ................................................................................................................... - 4 1.2
Product List ................................................................................................................................ - 4 1.3
Key Feature ................................................................................................................................ - 4 2 Package Configurations ......................................................................................................... - 6 2.1
153-FBGA Ball Array View ......................................................................................................... - 6 2.2
Ball Assignment .......................................................................................................................... - 7 2.3
Package Dimensions ................................................................................................................. - 7 2.4
Product Architecture ................................................................................................................... - 8 3 e•MMC Features .................................................................................................................... - 9 3.1
HS400 mode .............................................................................................................................. - 9 4 e•MMC 5.1 Features ............................................................................................................ - 10 4.1
Overview .................................................................................................................................. - 10 4.2
Command Queuing .................................................................................................................. - 10 4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
CMD Set Description ............................................................................................................... - 10 New Response: QSR (Queue Status Register) ...................................................................... - 11 Send Status: CMD13 ............................................................................................................... - 11 Mechanism of CMD Queue operation ..................................................................................... - 11 CMD Queue Register description............................................................................................ - 11 -
4.3
Enhanced Strobe Mode ........................................................................................................... - 12 4.4
RPMB Throughput improve...................................................................................................... - 12 5 Usage Overview ................................................................................................................... - 13 5.1
General Description ................................................................................................................. - 13 5.2
Partition Management .............................................................................................................. - 13 5.3
User Density ............................................................................................................................. - 14 5.4
Performance ............................................................................................................................. - 15 5.5
Boot Operation Mode ............................................................................................................... - 16 6 Device Register .................................................................................................................... - 17 6.1
OCR Register ........................................................................................................................... - 17 6.2
CID Register ............................................................................................................................. - 17 6.3
CSD Register ........................................................................................................................... - 17 6.4
Extended CSD Register ........................................................................................................... - 19 7 AC Parameter....................................................................................................................... - 24 7.1
Timing Parameter ..................................................................................................................... - 24 7.2
Bus Timing Parameters for DDR52 and HS200 are defined by JEDEC standard .................. - 24 7.3
Bus Timing Specification in HS400 mode ................................................................................ - 25 7.3.1
7.3.2
7.4
HS400 Device Input Timing ..................................................................................................... - 25 HS400 Device Output Timing .................................................................................................. - 26 -
Bus Signal Levels ..................................................................................................................... - 27 -
7.4.1
7.4.2
Open-Drain Mode Bus Signal Level ........................................................................................ - 27 Bus Signal Level (High-Voltage).............................................................................................. - 27 -
7.5
H/W Reset Operation ............................................................................................................... - 28 7.6
Power-up sequence ................................................................................................................. - 29 8 DC Electrical Characteristics ................................................................................................ - 29 8.1
Power Supply Voltage .............................................................................................................. - 29 8.2
Operating Current (RMS) ......................................................................................................... - 29 8.3
Standby Power Consumption .................................................................................................. - 30 8.4
Sleep Power Consumption....................................................................................................... - 30 8.5
Bus Signal Line Load ............................................................................................................... - 31 -
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e•MMC5.1 Datasheet_V1.2
1
Introduction
1.1 General Description
SiliconGo e•MMC is an embedded storage solution designed in a BGA package form. The operation of e•MMC is a simple
read and write to memory using e•MMC protocol v5.1 which is an industry standard.
The e•MMC consists of NAND flash and a MMC controller. 3.3V supply voltage is required for the NAND area (VCC)，
whereas 1.8V or 3.3V dual supply voltage (VCC or VCCQ) is supported for MMC controller.
There are several advantages of e•MMC. It is easy to be used on the standard interface, which allows the easy and widely
used integration with general CPU. Any revision or amendment of NAND is invisible to the host as the embedded e•MMC
controller insulates NAND technology from the host. It means that the host can support the newest processing flash without
updating its hardware or software.
SiliconGo e•MMC has high performance at a competitive-cost, high quality and low power consumption. e•MMC provides
capacities from 4GB to 64GB.
1.2 Product List
Capacity
Part Number
NAND Flash Type
Package Size
Package Type
32 GB
SGM8000C-S03BBG
TLC 256Gbx 1
11.5x13x1.0 (mm)
153 FBGA
64 GB
SGM8000C-S03BCG
TLC 256Gbx 2
11.5x13x1.0 (mm)
153 FBGA
1.3 Key Feature
◼
e•MMC v5.1 compatible. Detail description is referenced by JEDEC Standard
◼
Bus mode
◼
Data bus width: 1bit(default), 4bit and 8bit
Data transfer rate: up to 400MB/s (HS400) @ 200MHz DDR with 8bit bus width
MMC I/F Clock Frequency: 0~200MHz
MMC I/F Boot Frequency: 0~52MHz
Operating Voltage Range
◼
(Backward compatible to e•MMC v4.5 to v5.0)
VCC (NAND/Core): 2.7V ~ 3.6V
VCCQ (CTRL/IO): 1.7V ~ 1.95V / 2.7V ~ 3.6V
Temperature
-
Operation ( -25℃ ~ 85℃ )
Storage without operation ( -40℃ ~ 85℃ )
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e•MMC5.1 Datasheet_V1.2
◼
Supports Features
-
◼
HS400, HS200, DDR52, SDR52
High Priority Interrupt (HPI)
Background Operation, BKOPS Control
Packed CMD, Command Queuing
Cache, Cache Flushing Report, Cache Barrier (Optional)
Partitioning, Partition types, RPMB, RPMB Throughput Improve
Discard, Trim, Erase, Sanitize
Write Protect, Secure Write Protection (Optional)
Lock/Unlock
Power Off Notification(PON), Sleep/Awake
Enhance Reliable Write
Boot feature, Boot partition
Context IDs, Data Tag, Real Time Clock
HW/SW Reset
Configurable driver strength
Field Firmware Update
Secure Removal Type (Optional)
Device Health Report (Optional)
Production State Awareness (Optional)
Data Strobe pin, Enhanced Strobe (Optional)
(Bold features are added in eMMC5.1)
Others
-
This product is compliance with the RoHS directive.
SiliconGo Internal Only
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e•MMC5.1 Datasheet_V1.2
2
Package Configurations
2.1 153-FBGA Ball Array View
Ball Side down View
Ball No.
Name
Ball No.
Name
Ball No.
Name
Ball No.
Name
A3
DAT0
C2
VDDi
A4
DAT1
C4
VSSQ
J5
VSS
N4
VCCQ
J10
VCC
N5
VSSQ
A5
DAT2
C6
VCCQ
A6
VSS
E6
VCC
K5
RST_n
P3
VCCQ
K8
VSS
P4
VSSQ
B2
DAT3
E7
VSS
B3
DAT4
F5
VCC
K9
VCC
P5
VCCQ
M4
VCCQ
P6
VSSQ
B4
DAT5
G5
VSS
M5
CMD
--
--
B5
DAT6
H5
DS
B6
DAT7
H10
VSS
M6
CLK
--
--
N2
VSSQ
--
--
Note：
NC: No Connect, can be connected to ground or left floating.
RFU: Reserved for Future Use, should be left floating for future use.
VSF: Vendor Specific Function, shall be left floating.
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e•MMC5.1 Datasheet_V1.2
2.2 Ball Assignment
Signal
Ball No.
Description
CLOCK (CLK)
M6
Each cycle of the clock directs a transfer on the command line and on
the data lines.
COMMAND
(CMD)
M5
This signal is a bidirectional command channel used for device
initialization and command transfer.
The CMD Signal has 2 operation modes: open drain for initialization,
and push-pull for fast command transfer.
DATA (DAT0-DAT7)
A3~A5
B2~B6
RST_n
K5
Hardware Reset Input
DS
H5
Data Strobe: Return Clock signal used in HS400 mode
VCCQ
C6,M4,N4,P3,P5
VCC
E6,F5,J10,K9
VDDi
C2
VSS,VSSQ
A6, E7, G5, H10, J5,
K8, C4, N2, N5, P4,
P6
These are bidirectional data channels. The DAT signals operate in
push-pull mode.
Power supply for MMC interface and Controller, have two power mode:
High power mode:2.7V~3.6V; Lower power mode:1.7V~1.95V
Power supply for NAND flash memory, its power voltage range is:
2.7V~3.6V
VDDi is internal power mode.
Connect 0.1uF or 2.2uF capacitor from VDDi to ground
Ground lines
Note：All other pins are not connected [NC] and can be connected to GND or left floating.
2.3 Package Dimensions
Unit: mm
11.5mm×13mm×1.0mm Package Dimensions
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e•MMC5.1 Datasheet_V1.2
2.4 Product Architecture
e•MMC consists of NAND Flash and Controller. VCCQ is for Controller power and VCC is for flash power.
Parameter
Symbol
Unit
Min.
Typ.
Max.
VDDi capacitor value
CREG
uF
0.1
1.0+0.1
2.2
VCC capacitor value
CVCC
uF
-
2.2+0.1
-
VCCQ capacitor value
CVCCQ
uF
-
2.2+0.1
-
Note：
e•MMC recommends that the minimum value should be usually applied as the value of CREG; CREG shall be compliant
with X5R/X7R of EIA standard or B of JIS standard.
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e•MMC5.1 Datasheet_V1.2
e•MMC Features
3
3.1 HS400 mode
The HS400 mode has the following features
◼
◼
DDR Data sampling method
CLK frequency up to 200 MHz DDR – up to 400 MB/s
Only 8-bits bus width supported
Signaling levels of 1.8 V
Support up to 5 Drive Strengths
Data strobe signal is toggled only for Data out, CRC response and CMD Response
I/O driver strength types
Driver Type
Values
Support
Nominal
Impedance
Approximated driving
capability compared to
Type-0
0x0
Mandatory
50 Ω
x1
Default Driver Type.
Supports up to 200 MHz operation
0x1
Optional
33 Ω
x1.5
Supports up to 200 MHz operation.
0x2
Optional
66 Ω
x0.75
0x3
Optional
100 Ω
x0.5
0x4
Optional
40 Ω
x1.2
Remark
The weakest driver that supports up to
200 MHz operation.
For low noise and low EMI systems.
Maximal operating frequency is decided
by Host design
Note： Support of Driver Type-0 is mandatory for HS200 and HS400 device.
◼
Device type values (EXT_CSD Register: DEVICE_TYPE [196])
Bit
Device Type
Supportability
7
HS400 Dual Data Rate e•MMC @ 200 MHz - 1.2V I/O
Not support
6
HS400 Dual Data Rate e•MMC @ 200 MHz - 1.8V I/O
Support
5
HS200 Single Data Rate e•MMC @ 200 MHz - 1.2V I/O
Not support
4
HS200 Single Data Rate e•MMC @ 200 MHz - 1.8V I/O
Support
3
High-Speed Dual Data Rate e•MMC @ 52MHz - 1.2V I/O
2
High-Speed Dual Data Rate e•MMC @ 52MHz - 1.8V or 3V I/O
Support
1
High-Speed e•MMC @ 52MHz - at rated device voltage(s)
Support
0
High-Speed e•MMC @ 26MHz - at rated device voltage(s)
Support
Not support
Note：It is being discussed in JEDEC and is not confirmed yet. It can be modified according to JEDEC standard in the
future.
◼
Extended CSD revisions (EXT_CSD Register: EXT_CSD_REV [192])
Value
255–9
Timing Interface
Reserved
EXT_CSD Register Value
-
8
Revision 1.8 (for MMC v5.1)
0x08
7
Revision 1.7 (for MMC V5.0)
-
6
Revision 1.6 (for MMC V4.5, V4.51)
-
5
Revision 1.5 (for MMC V4.41)
-
4
Revision 1.4 (Obsolete)
-
3
Revision 1.3 (for MMC V4.3)
-
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e•MMC5.1 Datasheet_V1.2
2
Revision 1.2 (for MMC V4.2)
-
1
Revision 1.1 (for MMC V4.1)
-
0
Revision 1.0 (for MMC V4.0)
-
Note：Current e•MMC standard defined by JEDEC supports up to 0x08 for EXT_CSD_REV value.
◼
High Speed timing values (EXT_CSD Register: HS_TIMING [185])
Value
Timing Interface
Supportability
0x0
Selecting backwards compatibility interface timing
Support
0x1
High Speed
Support
0x2
HS200
Support
0x3
HS400
Support
e•MMC 5.1 Features
4
4.1 Overview
New Feature
JEDEC
Support
Cache Flushing Report
Mandatory
Yes
Background operation control
Mandatory
Yes
Command Queuing
Optional
Yes
Enhanced Strobe
Optional
Yes
RPMB Throughput improve
Optional
Yes
4.2 Command Queuing
To facilitate command queuing in eMMC, the device manages an internal task queue that the host can queue during data
transfer tasks.
Every task is issued by the host and initially queued as pending. The device works to prepare pending tasks for execution.
When a task is ready for execution, its state changes to “ready for execution”.
The host tracks the state of all queued tasks and may order the execution of any task, marked as “ready for execution”, by
sending a command indicating its task ID. The device executes the data transfer transaction after receiving the execute
command (CMD46/CMD47).
4.2.1
◼
CMD Set Description
CMD Set Description and Details
CMD
Type
Argument
CMD44
ac/R1
[31] Reliable Write Request
[30] DAT_DIR - "0" write / "1" read
[29] tag request
[28:25] context ID
[24] forced programming
[23] Priority: “0” simple / “1” high
[20:16] TASK ID
[15:0] number of blocks
CMD45
ac/R1
[31:0] Start block address
CMD46 adtc/R1 [20:16] TASK ID
SiliconGo Internal Only
Abbreviation
Purpose
QUEUED_TASK _PARAMS
Define direction of operation (Read or Write) and
Set high priority CMD Queue with task ID
QUEUED_TASK_ADDRESS
Indicate data address for Queued CMD
EXECUTE_READ_TASK
- 10 -
(Read) Transmit the requested number of data
blocks
e•MMC5.1 Datasheet_V1.2
CMD47 adtc/R1 [20:16] TASK ID
EXECUTE_WRITE_TASK
[20:16] Task ID
CMD48 ac/R1b
[3:0] TM op-code
4.2.2
(Write) Transmit the requested number of data
blocks
Reset a specific task or entire queue.
[20:16] when TM op-code = 2h these bits
represent TaskID. When TM op-code = 1h these
bits are reserved."
CMDQ_TASK _MGMT
New Response: QSR (Queue Status Register)
The 32-bit Queue Status Register (QSR) carries the state of tasks in the queue at a specific point in time. The host has read
access to this register through device response to SEND_STATUS command (CMD13 with bit[15]=”1”), R1’s argument will
be the 32- bit Queue Status Register (QSR). Every bit in the QSR represents the task who’s ID corresponds to the bit index.
If bit QSR[i] = “0”, then the queued task with a Task ID i is not ready for execution. The task may be queued and pending, or
the Task ID is unused. If bit QSR[i] = “1”, then the queued task with Task ID i is ready for execution.
4.2.3
Send Status: CMD13
CMD13 for reading the Queue Status Register (QSR) by the host. If bit[15] in CMD13’s argument is set to 1, then the device
shall send an R1 Response with the QSR instead of the Device Status. * There is still legacy CMD13 with R` response.
4.2.4
Mechanism of CMD Queue operation
Host issues CMD44 with Task ID number, Sector, Count, Direction, Priority to the device followed by CMD45 and host
checks the Queue Status check with CMD13 [15]bits to 1 . After that host issues CMD46 for Read or CMD47 for write During
CMD queue operation, CMD44/CMD45 is able to be issued at anytime when the CMD line is not in use
4.2.5
CMD Queue Register description
Configuration and capability structures shall be added to the EXT_CSD register, as described below
◼
CMD Queuing Support (EXT_CSD register : CMDQ_SUPPORT [308])
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Reserved
Bit0
CMD Queue supportability
This field indicates whether the device supports command queuing or not
0x0: CMD Queue function is not supported
0x1: CMD Queue function is supported
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Bit1
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e•MMC5.1 Datasheet_V1.2
◼
Command Queue Mode Enable(EXT_CSD register : CMDQ_MODE_EN [15])
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Reserved
Bit0
CMD Queue supportability
This field is used by the host enable command queuing
0x0: Queue function is not enabled
0x1: Queue function is enabled
◼
CMD Queuing Depth(EXT_CSD register : CMDQ_DEPTH [307])
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Reserved
Bit0
CMD Queue supportability
This field is used to calculate the depth of the queue supported by the device
Bit encoding:
[7:5]: Reserved
[4:0]: N,a parameter used to calculate the Queue Depth of task queue in the device.
Queue Depth = N+1.
4.3 Enhanced Strobe Mode
This product supports Enhanced Strobe in HS400 mode and refer to the details as described in eMMC5.1 JEDEC standard.
4.4 RPMB Throughput improve
[Table 11] Related parameter register in EXT_CSD : WR_REL_PARAM [166]
Name
Field
Bit
Type
Enhanced RPMB Reliable Write
EN_RPMB_REL_WR
4
R
Bit[4]: EN_RPMB_REL_WR(R)
0x0: RPMB transfer size is either 256B (single 512B frame) or 512B (Two 512B frame).
0x1: RPMB transfer size is either 256B (single 512B frame), 512B (Two 512B frame), or 8KB(Thirthy two 512B frames).
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e•MMC5.1 Datasheet_V1.2
5
Usage Overview
5.1 General Description
The e•MMC can be operated in 1, 4, or 8-bit mode. NAND flash memory is managed by a controller inside, which manages
ECC, wear leveling and bad block management. e•MMC provides easy integration with the host process that all flash
management hassles are invisible to the host.
5.2 Partition Management
The memory configuration initially consists (before any partitioning operation) of the User Data Area and RPMB Area
Partitions and two Boot Area Partitions.
The embedded device also offers the host the possibility to configure additional local memory partitions with independent
address spaces, starting from logical address 0x00000000, for different usage models.
Therefore, the memory block areas can be classified as follows:
-
Two Boot Area Partitions, whose size is multiple of 128 KB and where booting from e•MMC can be performed.
One RPMB Partition accessed through a trusted mechanism, whose size is defined as multiple of 128 KB.
Four General Purpose Area Partitions to store sensitive data or for other host usage models, whose sizes are a
multiple of a Write Protect Group.
Boot and RPMB Area Partitions' sizes and attributes are defined by the memory manufacturer (read-only), while General
Purpose Area Partitions' sizes and attributes can be programmed by the host only once in the device life-cycle (one-time
programmable).
Moreover, the host is free to configure one segment in the User Data Area to be implemented as enhanced storage media,
and to specify its starting location and size in terms of Write Protect Groups. The attributes of this Enhanced User Data Area
can be programmed only once during the device life-cycle (one-time programmable).
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e•MMC5.1 Datasheet_V1.2
A possible final configuration can be the following:
5.3 User Density
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e•MMC5.1 Datasheet_V1.2
◼
◼
Boot and RPMB Size
Boot1 Size
Boot2 Size
RPMB Size
Default
4096 KB
4096 KB
4096 KB
Max.
4096 KB
4096 KB
4096 KB
User Density Size
Capacity
User Area Capacity
SEC_COUNT in Extended CSD
32 GB
31,268,536,320 Bytes
(29820 MB)
0x3A3E000
64 GB
62,537,072,640 Bytes
(59640 MB)
0x747C000
5.4 Performance
Capacity
Part Number
Mode
Sequential Read
(MB/s)
SLC Sequential
Write (MB/s)
Sustained Sequential
Write (MB/s)
32 GB
SGM8000C-S03BBG
HS400
280
150
30
64 GB
SGM8000C-S03BCG
HS400
280
200
60
Test Condition:
Bus width x8, 200MHz DDR, 512KB data transfer, w/o file system overhead, measured on internal board.
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e•MMC5.1 Datasheet_V1.2
5.5 Boot Operation Mode
In boot operation mode, the master can read boot data from the slave (device) by keeping CMD line low or sending CMD0
with argument + 0xFFFFFFFA, before issuing CMD1. The data can be read from either boot area or user area depending on
register setting.
State diagram (boot mode)
Boot operation complete Clock = 400 kHz
(Compatible with the description which ≤400kHz)
State diagram (alternative boot mode)
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e•MMC5.1 Datasheet_V1.2
6
Device Register
6.1 OCR Register
The 32-bit operation conditions register (OCR) stores the VDD voltage profile of the Device and the access mode indication.
In addition, this register includes a status information bit. This status bit is set if the Device power up procedure has been
finished. The OCR register shall be implemented by all Devices.
OCR bit
VCCQ voltage window
e•MMC
[6:0]
Reserved
000 0000b
[7]
1.7–1.95
1b
[14:8]
2.0–2.6
000 0000b
[23:15]
2.7–3.6
1 1111 1111b
[28:24]
Reserved
000 0000b
[30:29]
Access Mode
00b (byte mode)
10b (sector mode)
[31]
Card power up status bit (busy)*
Note*：This bit is set to LOW if the e•MMC has not finished the power up routine. The supported voltage range is coded as shown in table.
6.2 CID Register
The Device IDentification (CID) register is 128 bits wide. It contains the Device identification information used during the
Device identification phase (e•MMC protocol). Every individual flash or I/O Device shall have a unique identification number.
Every type of e•MMC Device shall have a unique identification number. Table 75 lists these identifiers. The structure of the
CID register is defined in this section.
Name
Field
Width
CID-slice
CID Value
Manufacturer ID
MID
8
[127:120]
0xEA
Reserved
-
6
[119:114]
0x0
Card/BGA
CBX
2
[113:112]
0x1
OEM/Application ID
OID
8
[111:104]
0x0E
Product name
PNM
48
[103:56]
0x53 50 65 4D 4D 43
(SPeMMC)
Product revision
PRV
8
[55:48]
0x10
Product serial number
PSN
32
[47:16]
Serial number
Manufacturing date
MDT
8
[15:8]
Manufacturing date
CRC7 checksum
CRC
7
[7:1]
CRC7
Not used, always ‘1’
-
1
[0:0]
0x1
6.3 CSD Register
The Card-Specific Data register provides information on how to access the e•MMC contents. The CSD defines the data format,
error correction type, maximum data access time, data transfer speed, whether the DSR register can be used etc. The
programmable part of the register (entries marked by W or E, see below) can be changed by CMD27. The type of the entries
in the table below is coded as follows:
R:
Read only
W:
One time programmable and not readable.
R/W:
One time programmable and readable.
W/E:
Multiple writable with value kept after power failure, H/W reset assertion and any CMD0 reset and not readable.
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e•MMC5.1 Datasheet_V1.2
R/W/E:
R/W/C_P:
R/W/E_P:
W/E/_P:
Multiple writable with value kept after power failure, H/W reset assertion and any CMD0 reset and readable.
Writable after value cleared by power failure and HW/ rest assertion (the value not cleared by CMD0 reset)
and readable.
Multiple writable with value reset after power failure, H/W reset assertion and any CMD0 reset and readable.
Multiple writable with value reset after power failure, H/W reset assertion and any CMD0 reset and not
readable.
Name
Field
Width
Cell Type
CSD-slice
Value
CSD structure
CSD_STRUCTURE
2
R
[127:126]
0x3
System specification version
SPEC_VERS
4
R
[125:122]
0x4
Reserved
-
2
R
[121:120]
0x0
Data read access-time 1
TAAC
8
R
[119:112]
0x4F
Data read access-time 2 in CLK cycles (NSAC*100)
NSAC
8
R
[111:104]
0x1
Max. bus clock frequency
TRAN_SPEED
8
R
[103:96]
0x32
Card command classes
CCC
12
R
[95:84]
0xF5
Max. read data block length
READ_BL_LEN
4
R
[83:80]
0x9
Partial blocks for read allowed
READ_BL_PARTIAL
1
R
[79:79]
0x0
Write block misalignment
WRITE_BLK_MISALIGN
1
R
[78:78]
0x0
Read block misalignment
READ_BLK_MISALIGN
1
R
[77:77]
0x0
DSR implemented
DSR_IMP
1
R
[76:76]
0x0
Reserved
-
2
R
[75:74]
0x0
Device size
C_SIZE
12
R
[73:62]
0xFFF
Max. read current @ VDD min
VDD_R_CURR_MIN
3
R
[61:59]
0x6
Max. read current @ VDD max
VDD_R_CURR_MAX
3
R
[58:56]
0x6
Max. write current @ VDD min
VDD_W_CURR_MIN
3
R
[55:53]
0x6
Max. write current @ VDD max
VDD_W_CURR_MAX
3
R
[52:50]
0x6
Device size multiplier
C_SIZE_MULT
3
R
[49:47]
0x7
Erase group size
ERASE_GRP_SIZE
5
R
[46:42]
0x1F
Erase group size multiplier
ERASE_GRP_MULT
5
R
[41:37]
0x1F
Write protect group size
WP_GRP_SIZE
5
R
[36:32]
0xF
Write protect group enable
WP_GRP_MULT
1
R
[31:31]
0x1
Manufacturer default
ECC DEFAULT_ECC
2
R
[30:29]
0x0
Write speed factor
R2W_FACTOR
3
R
[28:26]
0x5
Max. write data block length
WRITE_BL_LEN
4
R
[25:22]
0x9
Partial blocks for write allowed
WRITE_BL_PARTIAL
1
R
[21:21]
0x0
Reserved
-
4
R
[20:17]
0x0
Content protection application
CONTENT_PROT_APP
1
R
[16:16]
0x0
File format group
FILE_FORMAT_GRP
1
R/W
[15:15]
0x0
Copy flag(OTP)
COPY
1
R/W
[14:14]
0x0
Permanent write protection
PERM_WRITE_PROTECT
1
R/W
[13:13]
0x0
Temporary write protection
TMP_WRITE_PROTECT
1
R/W/E
[12:12]
0x0
File format
FILE_FORMAT
2
R/W
[11:10]
0x0
ECC code
ECC
2
R/W/E
[9:8]
0x0
CRC
CRC
7
R/W/E
[7:1]
0x0
Not used, always ‘1’
-
1
-
[0:0]
0x1
SiliconGo Internal Only
- 18 -
e•MMC5.1 Datasheet_V1.2
6.4 Extended CSD Register
The Extended CSD register defines the e•MMC properties and selected modes. It is 512 bytes long.
The most significant 320 bytes are the Properties segment, which defines the e•MMC capabilities and cannot be modified by
the host. The lower 192 bytes are the Modes segment, which defines the configuration the e•MMC is working in. These modes
can be changed by the host by means of the SWITCH command.
R:
Read only
W:
One time programmable and not readable.
R/W:
One time programmable and readable.
W/E:
Multiple writable with value kept after power failure, H/W reset assertion and any CMD0 reset and not readable.
R/W/E:
Multiple writable with value kept after power failure, H/W reset assertion and any CMD0 reset and readable.
R/W/C_P:
Writable after value cleared by power failure and HW/ rest assertion (the value not cleared by CMD0 reset)
and readable.
R/W/E_P:
Multiple writable with value reset after power failure, H/W reset assertion and any CMD0 reset and readable.
W/E/_P:
Multiple writable with value reset after power failure, H/W reset assertion and any CMD0 reset and not
readable.
Name
Field
Size
(Bytes)
Cell
Type
CSD-slice
Value
6
TBD
[511:506]
All ”0”
Properties Segment
Reserved
-
Extended Security Commands Error
EXT_SECURITY_ERR
1
R
[505]
0x0
Supported Command Sets
S_CMD_SET
1
R
[504]
0x1
HPI features
HPI_FEATURES
1
R
[503]
0x1
Background operations support
BKOPS_SUPPORT
1
R
[502]
0x1
Max packed read commands
MAX_PACKED_READS
1
R
[501]
0x38
Max packed write commands
MAX_PACKED_WRITES
1
R
[500]
0x38
Data Tag Support
DATA_TAG_SUPPORT
1
R
[499]
0x1
Tag Unit Size
TAG_UNIT_SIZE
1
R
[498]
0x5
Tag Resources Size
TAG_RES_SIZE
1
R
[497]
0x1
Context management capabilities
CONTEXT_CAPABILITIES
1
R
[496]
0x5
Large Unit size
LARGE_UNIT_SIZE_M1
1
R
[495]
0x1
Extended partitions attribute support
EXT_SUPPORT
1
R
[494]
0x3
Supported modes
SUPPORTED_MODES
1
R
[493]
0x1
FFU features
FFU_FEATURES
1
R
[492]
0x1
Operation codes timeout
OPERATION_CODE_TIMEOUT
1
R
[491]
0xD
FFU Argument
FFU_ARG
4
R
[490:487]
0x0
Barrier support
BARRIER_SUPPORT
1
R
[486]
0x1
177
TBD
[485:309]
All ”0”
CMD Queuing Support
CMDQ_SUPPORT
1
R
[308]
0x1
CMD Queuing Depth
CMDQ_DEPTH
1
R
[307]
0x1F
Reserved
Reserved
-
1
TBD
[306]
0x0
Number of FW sectors correctly
programmed
NUMBER_OF_FW_SECTORS_CO
RRECTLY_PROGRAMMED
4
R
[305:302]
0x0
Vendor proprietary health report
VENDOR_PROPRIETARY_HEALT
H_REPORT
32
R
[301:270]
All “0”
Device life time estimation type B
DEVICE_LIFE_TIME_EST_TYP_B
1
R
[269]
0x1
Device life time estimation type A
DEVICE_LIFE_TIME_EST_TYP_A
1
R
[268]
0x1
SiliconGo Internal Only
-
- 19 -
e•MMC5.1 Datasheet_V1.2
Name
Field
Size
(Bytes)
Cell
Type
CSD-slice
Value
Pre EOL information
PRE_EOL_INFO
1
R
[267]
0x1
Optimal read size
OPTIMAL_READ_SIZE
1
R
[266]
0x40
Optimal write size
OPTIMAL_WRITE_SIZE
1
R
[265]
0x40
Optimal trim unit size
OPTIMAL_TRIM_UNIT_SIZE
1
R
[264]
0x7
Device version
DEVICE_VERSION
2
R
[263:262]
0x0
Firmware version
FIRMWARE_VERSION
8
R
[261:254]
FW version
Power class for 200MHz, DDR at VCC=
3.6V
PWR_CL_DDR_200_360
1
R
[253]
0x0
Cache size
CACHE_SIZE
4
R
[252:249]
0x300
Generic CMD6 timeout
GENERIC_CMD6_TIME
1
R
[248]
0x40
Power off notification(long) timeout
POWER_OFF_LONG_TIME
1
R
[247]
0x64
Background operations status
BKOPS_STATUS
1
R
[246]
0x0
Number of correctly programmed
sectors
CORRECTLY_PRG_SECTORS_N
UM
4
R
[245:242]
0x0
1st initialization time after partitioning
INI_TIMEOUT_AP
1
R
[241]
0xA
Cache Flushing Policy
CACHE_FLUSH_POLICY
1
R
[240]
0x1
Power class for 52MHz, DDR at VCC =
3.6V
PWR_CL_DDR_52_360
1
R
[239]
0x0
Power class for 52MHz, DDR at VCC =
1.95V
PWR_CL_DDR_52_195
1
R
[238]
0x0
Power class for 200MHz at VCCQ
=1.95V, VCC = 3.6V
PWR_CL_200_195
1
R
[237]
0x0
Power class for 200MHz, at
VCCQ=1.3V, VCC = 3.6V
PWR_CL_200_130
1
R
[236]
0x0
Minimum Write Performance for 8bit at
52MHz in DDR mode
MIN_PERF_DDR_W_8_52
1
R
[235]
0x0
Minimum Read Performance for 8bit
at 52MHz in DDR mode
MIN_PERF_DDR_R_8_52
1
R
[234]
0x0
1
TBD
[233]
0x0
Reserved
TRIM Multiplier
TRIM_MULT
1
R
[232]
0x2
Secure Feature support
SEC_FEATURE_SUPPORT
1
R
[231]
0x55
Secure Erase Multiplier
SEC_ERASE_MULT
1
R
[230]
0x1Bh
Secure TRIM Multiplier
SEC_TRIM_MULT
1
R
[229]
0x11
Boot information
BOOT_INFO
1
R
[228]
0x7
1
TBD
[227]
0x0
Reserved
Boot partition size
BOOT_SIZE_MULT
1
R
[226]
0x20
Access size
ACC_SIZE
1
R
[225]
0x6
High-capacity erase unit size
HC_ERASE_GRP_SIZE
1
R
[224]
0x1
High-capacity erase timeout
ERASE_TIMEOUT_MULT
1
R
[223]
0x1
Reliable write sector count
REL_WR_SEC_C
1
R
[222]
0x1
High-capacity write protect group size
HC_WP_GRP_SIZE
1
R
[221]
0x10
Sleep current [VCC]
S_C_VCC
1
R
[220]
0xD
Sleep current [VCCQ]
S_C_VCCQ
1
R
[219]
0xD
Production state awareness timeout
PRODUCTION_STATE_AWARENE
SS_TIMEOUT
1
R
[218]
0x6
Sleep/awake timeout
S_A_TIMEOUT
1
R
[217]
0x17
Sleep Notification Timout1
SLEEP_NOTIFICATION_TIME
1
R
[216]
0xA
Sector Count
SEC_COUNT
4
R
[215:212]
SiliconGo Internal Only
- 20 -
32GB: 0x3A3E000
64GB: 0x747C000
e•MMC5.1 Datasheet_V1.2
Name
Field
Size
(Bytes)
Cell
Type
CSD-slice
Value
Secure Write Protect Information
SECURE_WP_INFO
1
R
[211]
0x0
Minimum Write Performance for 8bit at
52MHz
MIN_PERF_W_8_52
1
R
[210]
0x0
Minimum Read Performance for 8bit
at 52MHz
MIN_PERF_R_8_52
1
R
[209]
0x0
Minimum Write Performance for 8bit at
26MHz, for 4bit at 52MHz
MIN_PERF_W_8_26_4_52
1
R
[208]
0x0
Minimum Read Performance for 8bit
at 26MHz, for 4bit at 52MHz
MIN_PERF_R_8_26_4_52
1
R
[207]
0x0
Minimum Write Performance for 4bit at
26MHz
MIN_PERF_W_4_26
1
R
[206]
0x0
Minimum Read Performance for 4bit
at 26MHz
MIN_PERF_R_4_26
1
R
[205]
0x0
1
TBD
[204]
0x0
Reserved
Power class for 26MHz at 3.6 V 1 R
PWR_CL_26_360
1
R
[203]
0x0
Power class for 52MHz at 3.6 V 1 R
PWR_CL_52_360
1
R
[202]
0x0
Power class for 26MHz at 1.95 V 1 R
PWR_CL_26_195
1
R
[201]
0x0
Power class for 52MHz at 1.95 V 1 R
PWR_CL_52_195
1
R
[200]
0x0
Partition switching timing
PARTITION_SWITCH_TIME
1
R
[199]
0x6
Out-of-interrupt busy timing
OUT_OF_INTERRUPT_TIME
1
R
[198]
0xA
I/O Driver Strength
DRIVER_STRENGTH
1
R
[197]
0x1
Device type
DEVICE_TYPE
1
R
[196]
0x57
1
TBD
[195]
0x0
1
R
[194]
0x2
1
TBD
[193]
0x0
EXT_CSD_REV
1
R
[192]
0x8
CMD_SET
1
R/W/E_
P
[191]
0x0
1
TBD
[190]
0x0
R
[189]
0x0
Reserved
CSD Structure Version
CSD_STRUCTURE
Reserved
Extended CSD Revision
Modes Segment
Command Set
Reserved
Command set revision
CMD_SET_REV
Reserved
Power class
1
TBD
[188]
0x0
R/W/E_
P
[187]
0x0
1
TBD
[186]
0x0
[185]
0x0
POWER_CLASS
Reserved
High Speed Interface Timing
HS_TIMING
1
R/W/E_
P
Strobe Support
STROBE_SUPPORT
1
R
[184]
0x1
Bus Width Mode
BUS_WIDTH
1
W/E_P
[183]
0x0
1
TBD
[182]
0x0
1
R
[181]
0x0
1
TBD
[180]
0x0
[179]
0x0
Reserved
Erased memory range
ERASE_MEM_CONT
Reserved
Partition Configuration
PARTITION_CONFIG
1
R/W/E &
R/W/E_
P
Boot Config protection
BOOT_CONFIG_PROT
1
R/W
&R/W/C
_P
[178]
0x0
Boot bus Conditions
BOOT_BUS_CONDITIONS
1
R/W/E
[177]
0x0
1
TBD
[176]
0x0
Reserved
SiliconGo Internal Only
- 21 -
e•MMC5.1 Datasheet_V1.2
Name
Field
Size
(Bytes)
Cell
Type
CSD-slice
Value
R/W/E
[175]
0x0
High-density erase group definition
ERASE_GROUP_DEF
1
Boot write protection status registers
BOOT_WP_STATUS
1
R
[174]
0x0
1
R/W
&R/W/C
_P
[173]
0x0
1
TBD
[172]
0x0
1
R/W,R/
W/C_P
&R/W/E
_P
[171]
0x0
1
TBD
[170]
0x0
Boot area write protect register
BOOT_WP
Reserved
User area write protect register
USER_WP
Reserved
FW configuration
FW_CONFIG
1
R/W
[169]
0x0
RPMB Size
RPMB_SIZE_MULT
1
R
[168]
0x20
Write reliability setting register
WR_REL_SET
1
R/W
[167]
0x1F
Write reliability parameter register
WR_REL_PARAM
1
R
[166]
0x14
Start Sanitize operation
SANITIZE_START
1
W/E_P
[165]
0x0
Manually start background operations
BKOPS_START
1
W/E_P
[164]
0x0
R/W &
R/W/E
[163]
0x0
Enable background operations
handshake
BKOPS_EN
1
H/W reset function
RST_n_FUNCTION
1
R/W
[162]
0x0
[161]
0x0
0x7
HPI management
HPI_MGMT
1
R/W/E_
P
Partitioning Support
PARTITIONING_SUPPORT
1
R
[160]
Max Enhanced Area Size
MAX_ENH_SIZE_MULT
3
R
[159:157]
Partitions attribute
PARTITIONS_ATTRIBUTE
1
R/W
[156]
0x0
Partitioning Setting
PARTITION_SETTING_COMPLET
ED
1
R/W
[155]
0x0
General Purpose Partition Size
GP_SIZE_MULT
12
R/W
[154:143]
0x0
Enhanced User Data Area Size
ENH_SIZE_MULT
3
R/W
[142:140]
0x0
Enhanced User Data Start Address
ENH_START_ADDR
4
R/W
[139:136]
0x0
Reserved
32GB: 0x4DA
64GB: 0x9B4
128GB:0x1368
1
TBD
[135]
0x0
Bad Block Management mode
SEC_BAD_BLK_MGMNT
1
R/W
[134]
0x0
Production state awareness
PRODUCTION_STATE_AWARENE
SS
1
R/W/E
[133]
0x0
Package Case Temperature is
controlled
TCASE_SUPPORT
1
W/E_P
[132]
0x0
Periodic Wake-up
PERIODIC_WAKEUP
1
R/W/E
[131]
0x0
Program CID/CSD in DDR mode
support
PROGRAM_CID_CSD_DDR_SUPP
ORT
1
R
[130]
0x0
2
TBD
[129:128]
0x0
[127:64]
0x0
Reserved
Vendor Specific Fields
NATIVE_SECTOR_SIZE
1
Native sector size
NATIVE_SECTOR_SIZE
1
R
[63]
0x0
Sector size emulation
USE_NATIVE_SECTOR
1
R/W
[62]
0x0
Sector size
DATA_SECTOR_SIZE
1
R
[61]
0x0
1st initialization after disabling sector
size emulation
INI_TIMEOUT_EMU
1
R
[60]
0x0
Class 6 commands control
CLASS_6_CTRL
1
R/W/E_
P
[59]
0x0
Number of addressed group to be
Released
DYNCAP_NEEDED
1
R
[58]
0x0
SiliconGo Internal Only
- 22 -
e•MMC5.1 Datasheet_V1.2
Name
Field
Size
(Bytes)
Cell
Type
CSD-slice
Value
R/W/E_
P
[57:56]
0x0
Exception events control
EXCEPTION_EVENTS_CTRL
2
Exception events status
EXCEPTION_EVENTS_STATUS
2
R
[55:54]
0x0
Extended Partitions Attribute
EXT_PARTITIONS_ATTRIBUTE
2
R/W
[53:52]
0x0
Context configuration
CONTEXT_CONF
15
R/W/E_
P
[51:37]
0x0
Packed command status
PACKED_COMMAND_STATUS
1
R
[36]
0x0
Packed command failure index
PACKED_FAILURE_INDEX
1
R
[35]
0x0
[34]
0x0
Power Off Notification
POWER_OFF_NOTIFICATION
1
R/W/E_
P
Control to turn the Cache ON/OFF
CACHE_CTRL
1
R/W/E_
P
[33]
0x0
Flushing of the cache
FLUSH_CACHE
1
W/E_P
[32]
0x0
Control to turn the Barrier ON/OFF
BARRIER_CTRL
1
R/W
[31]
0x0
Mode config
MODE_CONFIG
1
R/W/E_
P
[30]
0x0
Mode operation codes
MODE_OPERATION_CODES
1
W/E_P
[29]
0x0
Reserved
2
TBD
[28:27]
0x0
FFU status
FFU_STATUS
1
R
[26]
0x0
Pre loading data size
PRE_LOADING_DATA_SIZE
4
R/W/E_
P
[25:22]
0x0
Max pre loading data size
MAX_PRE_LOADING_DATA_SIZE
4
R
[21:18]
Product state awareness enablement
PRODUCT_STATE_AWARENESS_
ENABLEMENT
1
R/W/E &
R
[17]
0x3
Secure Removal Type
SECURE_REMOVAL_TYPE
1
R/W & R
[16]
0x1
1
R/W/E_
P
[15]
0x0
15
TBD
[14:0]
0x0
Command Queue Mode Enable
CMDQ_MODE_EN
Reserved
Note：Reserved bits should be read as “0”.
SiliconGo Internal Only
- 23 -
32GB: 0xE8F800
64GB: 0x1D1F000
e•MMC5.1 Datasheet_V1.2
7 AC Parameter
7.1 Timing Parameter
◼
Timing Parameter：
Timing Parameter
Max. Value
Unit
Normal
1
s
After partition setting
3
s
Read Timeout
150
ms
Write Timeout
350
ms
Erase Timeout
600
ms
Force Erase Timeout
3
min
Secure Erase Timeout
8
s
Secure Trim step1 Timeout
5
s
Initialization Time (tINIT)
Secure Trim step2 Timeout
3
s
Trim Timeout
300
ms
Partition Switching Timeout (after Init)
30
ms
Power Off Notification (Short) Timeout
100
ms
Power Off Notification (Long) Timeout
600
ms
Note：
-
Normal Initialization Time without partition setting
-
EXCEPTION_EVENT may occur and the actual timeout values may vary due to user environment
Initialization Time after partition setting, refer to INI_TIMEOUT_AP in EXT_CSD register
Be advised Timeout Values specified in Table above are for testing purposes under internal test pattern only and
actual timeout situations may vary
7.2 Bus Timing Parameters for DDR52 and HS200 are defined by JEDEC standard
SiliconGo Internal Only
- 24 -
e•MMC5.1 Datasheet_V1.2
7.3 Bus Timing Specification in HS400 mode
7.3.1
HS400 Device Input Timing
The CMD input timing for HS400 mode is the same as CMD input timing for HS200 mode.
NOTE VT = 50% of VCCQ, indicates clock reference point for timing measurements.
◼
HS400 Device Input Timing
Parameter
Symbol
Min
tPERIOD
5
SR
1.125
Max
Unit
Remark
Input CLK
Cycle time data transfer
mode
Slew rate
200 MHz(max), between rising edges
With respect to VT.
V/ns
With respect to VIH/VIL.
ns
Allowable deviation from an ideal 50%
duty cycle.
With respect to VT.
Includes jitter, phase noise
2.2
ns
With respect to VT.
tISUddr
0.4
ns
CDevice ≤ 6 pF
With respect to VIH/VIL.
Input hold time
tIHddr
0.4
ns
CDevice ≤ 6 pF
With respect to VIH/VIL.
Slew rate
SR
1.125
V/ns
With respect to VIH/VIL.
Duty cycle distortion
tCKDCD
0.0
Minimum pulse width
tCKMPW
Input set-up time
0.3
Input DAT (referenced to CLK)
SiliconGo Internal Only
- 25 -
e•MMC5.1 Datasheet_V1.2
7.3.2
HS400 Device Output Timing
The Data Strobe is used to read data in HS400 mode. The Data Strobe is toggled only during data read or CRC status
response.
NOTE VT = 50% of VCCQ, indicates clock reference point for timing measurements.
◼
HS400 Device Output Timing
Parameter
Symbol
Min
tPERIOD
5
SR
1.125
Max
Unit
Remark
Data Strobe
Cycle time data transfer
mode
Slew rate
200 MHz(max), between rising edges
With respect to VT.
V/ns
0.2
With respect to VOH/VOL and HS400
reference load
ns
Allowable deviation from the input CLK
duty cycle distortion (tCKDCD).
With respect to VT.
Includes jitter, phase noise
ns
With respect to VT.
Duty cycle distortion
TDSDCD
0.0
Minimum pulse width
tDSMPW
2.0
Read pre-amble
tRPRE
0.4
-
tPERIOD
Max value is specified by manufacturer.
Value up to infinite is valid
Read post-amble
tRPST
0.4
-
tPERIOD
Max value is specified by manufacturer.
Value up to infinite is valid
Output DAT (referenced to Data Strobe)
Output skew
tRQ
0.4
ns
With respect to VOH/VOL and HS400
reference load
Output hold skew
tRQH
0.4
ns
With respect to VOH/VOL and HS400
reference load
Slew rate
SR
V/ns
With respect to VOH/VOL and HS400
reference load
SiliconGo Internal Only
1.125
- 26 -
e•MMC5.1 Datasheet_V1.2
7.4 Bus Signal Levels
As the bus can be supplied with a variable supply voltage, all signal levels are related to the supply voltage.
7.4.1
Open-Drain Mode Bus Signal Level
Parameter
Symbol
Min
Output HIGH voltage
VOH
VCCQ - 0.2
Output LOW voltage
VOL
Max
0.3
Unit
Conditions
V
Note
V
IOL = 2mA
Note:
Because Voh depends on external resistance value (including outside the package), this value does not apply as
device specification. Host is responsible to choose the external pull-up and open drain resistance value to meet Voh
Min value.
7.4.2
Bus Signal Level (High-Voltage)
The device input and output voltages shall be within the following specified ranges for any V CCQ of the allowed voltage
range.
◼
Push-pull signal level—high-voltage e•MMC
Parameter
Symbol
Min
Max
Unit
Conditions
Output HIGH voltage
VOH
0.75 * VCCQ
--
V
IOH = -100uA @ VCCQ min
Output LOW voltage
VOL
--
0.125 * VCCQ
V
IOL = 100uA @ VCCQ min
Input HIGH voltage
VIH
0.625* VCCQ
VCCQ + 0.3
V
--
Input LOW voltage
VIL
VSS - 0.3
0.25 * VCCQ
V
--
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e•MMC5.1 Datasheet_V1.2
◼
Push-pull signal level—1.70 V -1.95 V VCCQ voltage Range
Parameter
Symbol
Min
Max
Unit
Conditions
Output HIGH voltage
VOH
VCCQ - 0.45
--
V
IOH = -2mA
Output LOW voltage
VOL
--
0.45
V
IOL = 2mA
VCCQ + 0.3
V
--
0.35*VCCQ (2)
V
--
Input HIGH voltage
VIH
0.65 * VCCQ
Input LOW voltage
VIL
VSS - 0.3
1
Note:
-
0.7 * VDD for MMC4.3 and older revisions.
0.3 * VDD for MMC4.3 and older revisions.
7.5 H/W Reset Operation
◼
H/W Reset waveform
◼
H/W Reset Timing Parameters
Symbol
Comment
tRSTW
RST_n pulse width
tRSCA
RST_n to Command time
tRSTH
RST_n high period (interval time)
Min
Max
1
μs
200 1
μs
1
μs
Note 1：74 cycles of clock signal required before issuing CMD1 or CMD0 with argument 0xFFFFFFFA.
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Unit
e•MMC5.1 Datasheet_V1.2
7.6 Power-up sequence
◼
8
Power-up parameter
Parameter
Symbol
Supply power-up for 3.3V
Supply power-up for 1.8V
Test
Min
Max
Remark
tPRUH
5 μs
35 ms
--
tPRUL
5 μs
25 ms
--
DC Electrical Characteristics
8.1 Power Supply Voltage
Parameter
Supply voltage1
（NAND/Core）
Supply voltage 2
（CTRL/IO）
Symbol
Test Conditions
Min
Max
Unit
VCC
--
2.7
3.6
V
VCCQ
--
1.7
1.95
V
2.7
3.6
V
Icc
Iccq
（Max）
（Max）
100
120
mA
8.2 Operating Current (RMS)
◼
Active Power Consumption during operation
Capacity
NAND Type
32 GB
256Gbx 1
64 GB
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256Gbx 2
Operation
Read
Unit
Write
80
95
mA
Read
120
120
mA
Write
120
120
mA
- 29 -
e•MMC5.1 Datasheet_V1.2
Note:
-
Power measurement conditions: Bus configuration =x8 @200MHz DDR
Max RMS current is the average RMS current consumption over a period of 100ms.
Temperature: 25℃
VCC=3.3V, VCCQ=1.8V
Not 100% tested
8.3 Standby Power Consumption
◼
Standby Power Consumption in auto power saving mode and standby state
Capacity
NAND Type
32 GB
256Gbx 1
64 GB
256Gbx 2
State
Standby
Icc
25℃
Iccq
Unit
85℃
25℃
85℃
15
60
160
600
uA
30
120
160
600
uA
Note:
-
Power measurement conditions: Bus configuration =x8, No CLK
VCC=3.3V, VCCQ=1.8V
Not 100% tested
8.4 Sleep Power Consumption
◼
Sleep Power Consumption in Sleep State
Capacity
NAND Type
32 GB
256Gbx 1
State
Icc
Iccq
Unit
25℃
85℃
25℃
85℃
0
0
160
600
uA
0
0
160
600
uA
Sleep
64 GB
256Gbx 2
Note:
-
Power measurement conditions: Bus configuration = x8, No CLK
Enter sleep state by CMD5, VCC power is switched off, VCCQ=1.8V
Not 100% tested
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e•MMC5.1 Datasheet_V1.2
8.5 Bus Signal Line Load
The total capacitance CL of each line of the e•MMC bus is the sum of the bus master capacitance CHOST, the bus capacitance
CBUS itself and the capacitance CDEVICE of the e•MMC connected to this line:
CL = CHOST + CBUS + CDEVICE
The sum of the host and bus capacitances should be under 20pF.
◼
Bus Signal Line Load
Parameter
Symbol
Min
Typ.
Max
Unit
Pull-up resistance for CMD
RCMD
4.7
--
100
kΩ
to prevent bus floating
Pull-up resistance for DAT0–DAT7
RDAT
10
--
100
kΩ
to prevent bus floating
Internal pull up resistance DAT1–
DAT7
Rint
10
--
150
kΩ
to prevent unconnected lines
floating
Bus signal line capacitance
CL
--
--
30
pF
Single Device
Single Device capacitance
CDEVICE
--
--
12
pF
Single Device capacitance
--
--
--
16
nH
fPP ≤ 52 MHz
Symbol
Min
Typ.
Max
Unit
RDS
10
--
100
kΩ
Maximum signal line inductance
Remark
HS400 Capacitance and Resistors
Parameter
Pull-down resistance for Data Strobe
Remark
Single Device capacitance
CDEVICE
6
pF
Single Device
Bus signal line capacitance
CL
13
pF
Single Device
Note:
Recommended maximum value is 50 kΩ for 1.8V interface supply voltages.
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