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SFS06R03DF

SFS06R03DF

  • 厂商:

    ORIENTALSEMI

  • 封装:

    TO-252-2

  • 描述:

    类型:-;漏源电压(Vdss):-;连续漏极电流(Id):-;功率(Pd):-;导通电阻(RDS(on)@Vgs,Id):-;阈值电压(Vgs(th)@Id):-;栅极电荷(Qg@Vgs):-;输入电...

  • 数据手册
  • 价格&库存
SFS06R03DF 数据手册
SFS06R03DF Enhancement Mode N-Channel Power MOSFET General Description ® FSMOS MOSFET is based on Oriental Semiconductor’s unique device design to achieve low RDS(ON), low gate charge, fast switching and excellent avalanche characteristics. The low Vth series is specially designed to use in synchronous rectification power systems with low driving voltage. Features  Low RDS(ON) & FOM  Extremely low switching loss  Excellent reliability and uniformity  Fast switching and soft recovery Applications  PD charger  Motor driver  Switching voltage regulator  DC-DC convertor  Switched mode power supply Key Performance Parameters Parameter Value Unit VDS, min @ Tj(max) 60 V ID, pulse 480 A RDS(ON) max @ VGS=10V 3.5 mΩ Qg 66.1 nC Marking Information Product Name Package Marking SFS06R03DF TO252 SFS06R03D Package & Pin information Oriental Semiconductor © Copyright Reserved V2.0 Page.1 SFS06R03DF Enhancement Mode N-Channel Power MOSFET Absolute Maximum Ratings at Tj=25°C unless otherwise noted Parameter Symbol Value Unit Drain source voltage VDS 60 V Gate source voltage VGS ±20 V ID 160 A ID, pulse 480 A IS 160 A IS, Pulse 480 A PD 168 W EAS 200 mJ Tstg,Tj -55 to 175 °C 1) Continuous drain current , TC=25 °C 2) Pulsed drain current , TC=25 °C 1) Continuous diode forward current , TC=25 °C 2) Diode pulsed current , TC=25 °C 3) Power dissipation , TC=25 °C 5) Single pulsed avalanche energy Operation and storage temperature Thermal Characteristics Parameter Thermal resistance, junction-case Thermal resistance, junction-ambient 4) Symbol Value Unit RθJC 0.89 °C/W RθJA 62 °C/W Electrical Characteristics at Tj=25°C unless otherwise specified Parameter Drain-source breakdown voltage Gate threshold voltage Drain-source on-state resistance Drain-source on-state resistance Symbol Min. BVDSS 60 VGS(th) 1.3 Typ. Max. Unit Test condition V VGS=0 V, ID=250 μA 2.5 V VDS=VGS, ID=250 μA RDS(ON) 3.0 3.5 mΩ VGS=10 V, ID=20 A RDS(ON) 3.5 4.5 mΩ VGS=4.5 V, ID=10 A 100 Gate-source leakage current IGSS Drain-source leakage current IDSS VGS=20 V nA -100 Oriental Semiconductor © Copyright Reserved V2.0 1 VGS=-20 V μA VDS=60 V, VGS=0 V Page.2 SFS06R03DF Enhancement Mode N-Channel Power MOSFET Dynamic Characteristics Parameter Symbol Min. Typ. Max. Unit Input capacitance Ciss 5377 pF Output capacitance Coss 1666 pF Reverse transfer capacitance Crss 77.7 pF Turn-on delay time td(on) 22.5 ns tr 6.7 ns td(off) 80.3 ns tf 26.8 ns Rise time Turn-off delay time Fall time Test condition VGS=0 V, VDS=25 V, ƒ=100 kHz VGS=10 V, VDS=30 V, RG=2 Ω, ID=25 A Gate Charge Characteristics Parameter Symbol Min. Typ. Max. Unit Total gate charge Qg 66.1 nC Gate-source charge Qgs 10.7 nC Gate-drain charge Qgd 10.9 nC Vplateau 2.9 V Gate plateau voltage Test condition VGS=10 V, VDS=30 V, ID=25 A Body Diode Characteristics Parameter Symbol Min. Typ. Max. Unit 1.3 V Diode forward voltage VSD Reverse recovery time trr 68.3 ns Reverse recovery charge Qrr 73.0 nC Peak reverse recovery current Irrm 1.9 A Test condition IS=20 A, VGS=0 V VR=30 V, IS=25 A, di/dt=100 A/μs Note 1) Calculated continuous current based on maximum allowable junction temperature. 2) Repetitive rating; pulse width limited by max. junction temperature. 3) Pd is based on max. junction temperature, using junction-case thermal resistance. 4) The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C. 5) VDD=30 V,VGS=10 V, L=0.3 mH, starting Tj=25 °C. Oriental Semiconductor © Copyright Reserved V2.0 Page.3 SFS06R03DF Enhancement Mode N-Channel Power MOSFET Electrical Characteristics Diagrams 10 V 7V VDS= 10 V Tj = 25 ℃ 4.5 V ID, Drain current(A) ID, Drain current (A) 1000 5V 6V 400 300 4V 200 3.5 V 100 10 1 100 3V VGS= 2.5 V 0 0 1 2 3 4 5 6 7 8 0.1 9 0 10 2 Figure 1. Typ. output characteristics 10 5 7.5 VGS, Gate-source voltage(V) C, Capacitance (pF) VDS = 30 V Ciss 10 2 10 1 10 ID = 25 A 4 3 8 10.0 VGS = 0 V 10 6 Figure 2. Typ. transfer characteristics f = 100 kHz 10 4 VGS, Gate-source voltage(V) VDS, Drain-source voltage (V) Coss 5.0 2.5 Crss 0 10 20 30 40 50 0.0 60 0 10 20 Figure 3. Typ. capacitances 50 60 70 7m ID = 250 μA VGS = 0 V 6m RDS(ON), On-resistance(W) BVDSS, Drain-source breakdown voltage (V) 40 Figure 4. Typ. gate charge 74 72 30 Qg, Gate charge(nC) VDS, Drain-source voltage (V) 70 68 66 ID = 20 A VGS = 10 V 5m 4m 3m 2m 1m 64 -50 0 50 100 150 Tj, Junction Temperature (℃) Figure 5. Drain-source breakdown voltage Oriental Semiconductor © Copyright Reserved V2.0 200 -50 0 50 100 150 Tj, Junction Temperature (℃) Figure 6. Drain-source on-state resistance Page.4 200 SFS06R03DF Enhancement Mode N-Channel Power MOSFET 2.2 100 1.8 IS, Source current (A) Vth, Threshold voltage (V) Tj = 25 ℃ ID = 250 μA 2.0 1.6 10 1.4 1.2 1.0 1 0.8 0.6 -50 0 50 100 150 200 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VSD, Source-Drain voltage (V) Tj, Junction Temperature (℃) Figure 7. Threshold voltage Figure 8. Forward characteristic of body diode 0.05 180 160 140 ID, Drain current (A) RDS(ON), On-resistance(W) 0.04 120 0.03 100 5V 4.5 V 4V 3.5 V VGS=3 V 0.02 80 60 40 0.01 6V 20 10 V 0.00 50 100 150 200 250 300 350 400 0 450 0 25 50 1000 ID, Drain current(A) 10 μs 100 μs RDS(ON) Limited 1 ms 10 ms DC 1 0.1 0.1 1 10 125 150 175 D= tp/T 100 10 100 Figure 10. Drain current zthjc Thermal Response(K/W) Figure 9. Drain-source on-state resistance 100 75 TC, Case Temperature (℃) ID, Drain current(A) 100 VDS, Drain-source voltage(V) Figure 11. Safe operation area TC=25 °C Oriental Semiconductor © Copyright Reserved V2.0 10-1 10-2 10-5 D= 1 0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse 10-4 10-3 10-2 10-1 100 tp Pulse width(s) Figure 12. Max. transient thermal impedance Page.5 SFS06R03DF Enhancement Mode N-Channel Power MOSFET Test circuits and waveforms Figure 1. Gate charge test circuit & waveform Figure 2. Switching time test circuit & waveforms Figure 3. Unclamped inductive switching (UIS) test circuit & waveforms Figure 4. Diode reverse recovery test circuit & waveforms Oriental Semiconductor © Copyright Reserved V2.0 Page.6 SFS06R03DF Enhancement Mode N-Channel Power MOSFET Package Information Symbol A A1 A2 b b3 c D D1 E E1 e H L L1 L2 L3 L4 θ Min 2.20 0.00 0.97 0.68 5.20 0.43 5.98 6.40 4.63 9.40 1.38 0.88 0.50 0˚ mm Nom 2.30 1.07 0.78 5.33 0.53 6.10 5.30 REF 6.60 2.286 BSC 10.10 1.50 2.90 REF 0.51 BSC - Max 2.38 0.20 1.17 0.90 5.46 0.61 6.22 6.73 10.50 1.75 1.28 1.00 8˚ Version 1: TO252-C package outline dimension Oriental Semiconductor © Copyright Reserved V2.0 Page.7 SFS06R03DF Enhancement Mode N-Channel Power MOSFET Package Information E c2 D1 L6 L3 θ1 b3 H θ1 L1 θ1 b2 L4 L5 D Φ K AR M E- 0.1 p To .30± 1 E1 A2 e b θ2 C L A1 A θ L2 C (L1) Symbol A A1 A2 b b1 b2 b3 c c1 c2 D D1 E E1 e H L L1 L2 L3 L4 L5 L6 θ θ1 θ2 Min 2.20 0.00 0.90 0.72 0.71 0.72 5.13 0.47 0.46 0.47 6.00 5.25 6.50 4.70 2.186 9.80 1.40 0.90 0.60 0.15 0˚ 5˚ 5˚ mm Nom 2.30 1.01 0.76 5.33 0.51 6.10 6.60 2.286 10.10 1.50 2.90 REF 0.508 BSC 0.80 1.80 REF 7˚ 7˚ Max 2.38 0.10 1.10 0.85 0.81 0.90 5.46 0.60 0.56 0.60 6.20 6.70 2.386 10.40 1.70 1.25 1.00 0.75 8˚ 9˚ 9˚ Version 2: TO252-J package outline dimension Oriental Semiconductor © Copyright Reserved V2.0 Page.8 SFS06R03DF Enhancement Mode N-Channel Power MOSFET Ordering Information Package Type Units/ Reel Reels / Inner Box Units/ Inner Box Inner Boxes/ Carton Box Units/ Carton Box TO252-C 2500 2 5000 5 25000 TO252-J 2500 2 5000 5 25000 Product Information Product Package Pb Free RoHS Halogen Free SFS06R03DF TO252 yes yes yes Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Oriental Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. For further information on technology, delivery terms and conditions and prices, please contact the Oriental Semiconductor sales representatives (www.orientalsemi.com). © Oriental Semiconductor Co.,Ltd. All Rights Reserved Oriental Semiconductor © Copyright Reserved V2.0 Page.9
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