SFS06R03DF
Enhancement Mode N-Channel Power MOSFET
General Description
®
FSMOS MOSFET is based on Oriental Semiconductor’s unique device design to achieve low
RDS(ON), low gate charge, fast switching and excellent avalanche characteristics. The low Vth series
is specially designed to use in synchronous rectification power systems with low driving voltage.
Features
Low RDS(ON) & FOM
Extremely low switching loss
Excellent reliability and uniformity
Fast switching and soft recovery
Applications
PD charger
Motor driver
Switching voltage regulator
DC-DC convertor
Switched mode power supply
Key Performance Parameters
Parameter
Value
Unit
VDS, min @ Tj(max)
60
V
ID, pulse
480
A
RDS(ON) max @ VGS=10V
3.5
mΩ
Qg
66.1
nC
Marking Information
Product Name
Package
Marking
SFS06R03DF
TO252
SFS06R03D
Package & Pin information
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SFS06R03DF
Enhancement Mode N-Channel Power MOSFET
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
Parameter
Symbol
Value
Unit
Drain source voltage
VDS
60
V
Gate source voltage
VGS
±20
V
ID
160
A
ID, pulse
480
A
IS
160
A
IS, Pulse
480
A
PD
168
W
EAS
200
mJ
Tstg,Tj
-55 to 175
°C
1)
Continuous drain current , TC=25 °C
2)
Pulsed drain current , TC=25 °C
1)
Continuous diode forward current , TC=25 °C
2)
Diode pulsed current , TC=25 °C
3)
Power dissipation , TC=25 °C
5)
Single pulsed avalanche energy
Operation and storage temperature
Thermal Characteristics
Parameter
Thermal resistance, junction-case
Thermal resistance, junction-ambient
4)
Symbol
Value
Unit
RθJC
0.89
°C/W
RθJA
62
°C/W
Electrical Characteristics at Tj=25°C unless otherwise specified
Parameter
Drain-source
breakdown voltage
Gate threshold
voltage
Drain-source
on-state resistance
Drain-source
on-state resistance
Symbol
Min.
BVDSS
60
VGS(th)
1.3
Typ.
Max.
Unit
Test condition
V
VGS=0 V, ID=250 μA
2.5
V
VDS=VGS, ID=250 μA
RDS(ON)
3.0
3.5
mΩ
VGS=10 V, ID=20 A
RDS(ON)
3.5
4.5
mΩ
VGS=4.5 V, ID=10 A
100
Gate-source
leakage current
IGSS
Drain-source
leakage current
IDSS
VGS=20 V
nA
-100
Oriental Semiconductor © Copyright Reserved V2.0
1
VGS=-20 V
μA
VDS=60 V, VGS=0 V
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SFS06R03DF
Enhancement Mode N-Channel Power MOSFET
Dynamic Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Input capacitance
Ciss
5377
pF
Output capacitance
Coss
1666
pF
Reverse transfer capacitance
Crss
77.7
pF
Turn-on delay time
td(on)
22.5
ns
tr
6.7
ns
td(off)
80.3
ns
tf
26.8
ns
Rise time
Turn-off delay time
Fall time
Test condition
VGS=0 V,
VDS=25 V,
ƒ=100 kHz
VGS=10 V,
VDS=30 V,
RG=2 Ω,
ID=25 A
Gate Charge Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Total gate charge
Qg
66.1
nC
Gate-source charge
Qgs
10.7
nC
Gate-drain charge
Qgd
10.9
nC
Vplateau
2.9
V
Gate plateau voltage
Test condition
VGS=10 V,
VDS=30 V,
ID=25 A
Body Diode Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
1.3
V
Diode forward voltage
VSD
Reverse recovery time
trr
68.3
ns
Reverse recovery charge
Qrr
73.0
nC
Peak reverse recovery current
Irrm
1.9
A
Test condition
IS=20 A,
VGS=0 V
VR=30 V,
IS=25 A,
di/dt=100 A/μs
Note
1) Calculated continuous current based on maximum allowable junction temperature.
2) Repetitive rating; pulse width limited by max. junction temperature.
3) Pd is based on max. junction temperature, using junction-case thermal resistance.
4) The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper,
in a still air environment with Ta=25 °C.
5) VDD=30 V,VGS=10 V, L=0.3 mH, starting Tj=25 °C.
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SFS06R03DF
Enhancement Mode N-Channel Power MOSFET
Electrical Characteristics Diagrams
10 V
7V
VDS= 10 V
Tj = 25 ℃
4.5 V
ID, Drain current(A)
ID, Drain current (A)
1000
5V
6V
400
300
4V
200
3.5 V
100
10
1
100
3V
VGS= 2.5 V
0
0
1
2
3
4
5
6
7
8
0.1
9
0
10
2
Figure 1. Typ. output characteristics
10
5
7.5
VGS, Gate-source voltage(V)
C, Capacitance (pF)
VDS = 30 V
Ciss
10
2
10
1
10
ID = 25 A
4
3
8
10.0
VGS = 0 V
10
6
Figure 2. Typ. transfer characteristics
f = 100 kHz
10
4
VGS, Gate-source voltage(V)
VDS, Drain-source voltage (V)
Coss
5.0
2.5
Crss
0
10
20
30
40
50
0.0
60
0
10
20
Figure 3. Typ. capacitances
50
60
70
7m
ID = 250 μA
VGS = 0 V
6m
RDS(ON), On-resistance(W)
BVDSS, Drain-source breakdown voltage (V)
40
Figure 4. Typ. gate charge
74
72
30
Qg, Gate charge(nC)
VDS, Drain-source voltage (V)
70
68
66
ID = 20 A
VGS = 10 V
5m
4m
3m
2m
1m
64
-50
0
50
100
150
Tj, Junction Temperature (℃)
Figure 5. Drain-source breakdown voltage
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200
-50
0
50
100
150
Tj, Junction Temperature (℃)
Figure 6. Drain-source on-state resistance
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200
SFS06R03DF
Enhancement Mode N-Channel Power MOSFET
2.2
100
1.8
IS, Source current (A)
Vth, Threshold voltage (V)
Tj = 25 ℃
ID = 250 μA
2.0
1.6
10
1.4
1.2
1.0
1
0.8
0.6
-50
0
50
100
150
200
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
VSD, Source-Drain voltage (V)
Tj, Junction Temperature (℃)
Figure 7. Threshold voltage
Figure 8. Forward characteristic of body diode
0.05
180
160
140
ID, Drain current (A)
RDS(ON), On-resistance(W)
0.04
120
0.03
100
5V
4.5 V
4V
3.5 V
VGS=3 V
0.02
80
60
40
0.01
6V
20
10 V
0.00
50
100
150
200
250
300
350
400
0
450
0
25
50
1000
ID, Drain current(A)
10 μs
100 μs
RDS(ON) Limited
1 ms
10 ms
DC
1
0.1
0.1
1
10
125
150
175
D= tp/T
100
10
100
Figure 10. Drain current
zthjc Thermal Response(K/W)
Figure 9. Drain-source on-state resistance
100
75
TC, Case Temperature (℃)
ID, Drain current(A)
100
VDS, Drain-source voltage(V)
Figure 11. Safe operation area TC=25 °C
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10-1
10-2
10-5
D= 1
0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
10-4
10-3
10-2
10-1
100
tp Pulse width(s)
Figure 12. Max. transient thermal impedance
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SFS06R03DF
Enhancement Mode N-Channel Power MOSFET
Test circuits and waveforms
Figure 1. Gate charge test circuit & waveform
Figure 2. Switching time test circuit & waveforms
Figure 3. Unclamped inductive switching (UIS) test circuit & waveforms
Figure 4. Diode reverse recovery test circuit & waveforms
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Page.6
SFS06R03DF
Enhancement Mode N-Channel Power MOSFET
Package Information
Symbol
A
A1
A2
b
b3
c
D
D1
E
E1
e
H
L
L1
L2
L3
L4
θ
Min
2.20
0.00
0.97
0.68
5.20
0.43
5.98
6.40
4.63
9.40
1.38
0.88
0.50
0˚
mm
Nom
2.30
1.07
0.78
5.33
0.53
6.10
5.30 REF
6.60
2.286 BSC
10.10
1.50
2.90 REF
0.51 BSC
-
Max
2.38
0.20
1.17
0.90
5.46
0.61
6.22
6.73
10.50
1.75
1.28
1.00
8˚
Version 1: TO252-C package outline dimension
Oriental Semiconductor © Copyright Reserved V2.0
Page.7
SFS06R03DF
Enhancement Mode N-Channel Power MOSFET
Package Information
E
c2
D1
L6
L3
θ1
b3
H
θ1
L1
θ1
b2
L4
L5
D
Φ
K
AR
M
E- 0.1
p
To .30±
1
E1
A2
e
b
θ2
C
L
A1
A
θ
L2
C
(L1)
Symbol
A
A1
A2
b
b1
b2
b3
c
c1
c2
D
D1
E
E1
e
H
L
L1
L2
L3
L4
L5
L6
θ
θ1
θ2
Min
2.20
0.00
0.90
0.72
0.71
0.72
5.13
0.47
0.46
0.47
6.00
5.25
6.50
4.70
2.186
9.80
1.40
0.90
0.60
0.15
0˚
5˚
5˚
mm
Nom
2.30
1.01
0.76
5.33
0.51
6.10
6.60
2.286
10.10
1.50
2.90 REF
0.508 BSC
0.80
1.80 REF
7˚
7˚
Max
2.38
0.10
1.10
0.85
0.81
0.90
5.46
0.60
0.56
0.60
6.20
6.70
2.386
10.40
1.70
1.25
1.00
0.75
8˚
9˚
9˚
Version 2: TO252-J package outline dimension
Oriental Semiconductor © Copyright Reserved V2.0
Page.8
SFS06R03DF
Enhancement Mode N-Channel Power MOSFET
Ordering Information
Package
Type
Units/
Reel
Reels /
Inner Box
Units/
Inner Box
Inner Boxes/
Carton Box
Units/
Carton Box
TO252-C
2500
2
5000
5
25000
TO252-J
2500
2
5000
5
25000
Product Information
Product
Package
Pb Free
RoHS
Halogen Free
SFS06R03DF
TO252
yes
yes
yes
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any
typical values stated herein and/or any information regarding the application of the device,
Oriental Semiconductor hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights of
any third party.
For further information on technology, delivery terms and conditions and prices, please
contact the Oriental Semiconductor sales representatives (www.orientalsemi.com).
© Oriental Semiconductor Co.,Ltd. All Rights Reserved
Oriental Semiconductor © Copyright Reserved V2.0
Page.9