SS32F THRU SS320F
HD AF50
SMAF Plastic-Encapsulate Diodes
Features
●Io
3A
SMAF
●VRRM
20V-200V
●High surge current capability
● Polarity: Color band denotes cathode
● Chip Size
1.27mm X 1.27mm
Applications
● Rectifier
Marking
● SS32F-SS320F : SS32-SS320
SS3
Item
Symbol Unit
Test Conditions
2F 3F 4F 5F 6F 8F 10F 15F 20F
Repetitive Peak Reverse Voltage
VRRM
V
20
30
40
50
60
80
100
150
200
Maximum RMS Voltage
V RMS
V
14
21
28
35
42
56
70
105
140
Average Forward Current
IF(AV)
A
60HZ Half-sine wave, Resistance
3.0
Surge(Non-repetitive)Forward
Current
IFSM
A
60Hz Half-sine wave ,1 cycle ,
Ta =25℃
70
TJ
℃
Storage Temperature
TSTG
℃
IEC61000-4-2 ESD Voltage
V ESD
KV
Junction Temperature
-55~+125
-55~+150
-55 ~ +150
Air Model
_ 15
+
_ 8
+
Contact Model
Electrical Characteristics (T =25℃ Unless otherwise specified)
Item
Peak Forward Voltage
Symbol Unit
VF
IRRM1
Peak Reverse Current
Thermal
Resistance(Typical)
IRRM2
RθJ-C
IF =3.0A
V
mA
RθJ-A
RθJ-L
Test Condition
℃/
W
VRM=VRRM
SS3
2F
3F
4F
0.55
5F
6F
0.7
8F
10F 15F 20F
0.85
0.95
Ta =25℃
0.5
0.1
Ta =100℃
10
5.0
Between junction and ambient
55
Between junction and terminal
17
Between junction and case
50
Notes:
Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper
pad areas
High Diode Semiconductor
1
Typical Characteristics
FIG.2: MAXIMUM NON-REPETITIVE FORWARD URGE CURRENT
IFSM(A)
IO(A)
FIG.1: FORWARD CURRENT DERATING CURVE
3.0
SS32F-SS34F
90
SS35F-SS320F
2.5
8.3ms Single Half Sine Wave
JEDEC Method
80
2.0
70
1.5
60
1.0
50
Resistive or Inductive Load
P.C.B. Mounted on 0.2"×0.2"
(5mm×5mm)Copper Pad Areas
0.5
40
0
0
25
50
75
125
100
1
150
TL(℃ )
2
20
100
Number of Cycles
FIG.4:TYPICAL REVERSE CHARACTERISTICS
FIG.3: TYPICAL FORWARD CHARACTERISTICS
100
IR(mA)
IF(A)
10
TJ=25℃
Pulse width=300us
1% Duty Cycle
100
SS32F-SS36F
SS38F-SS320F
10
10
Tj=75℃
1.0
1.0
Tj=75℃
0.1
SS32F-SS34F
SS35F-SS36F
SS38F-SS310F
SS315F-SS320F
0.1
0.01
Tj=25℃
0.001
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
.
1.4
VF(V)
0
20
40
High Diode Semiconductor
60
80
100
Voltage(%)
2
SMAF
.193(4.90)
.173(4.40)
.047(1.20)
.035(0.90)
.146(3.70)
.130(3.30)
.063(1.60)
.106(2.70) .051(1.30)
.094(2.40)
.007(0.18)
.005(0.12)
.051(1.30)
.031(0.80)
Dimensions in inches and (millimeters)
SMAF
1.9
4.65
0.55
JSHD
JSHD
High Diode Semiconductor
3
Reel Taping Specifications For Surface Mount Dev ices- SMAF
High Diode Semiconductor
4
SMAF P acking Information
Inner Box
Inner Box
12000pcs
Inner Box
180*182*70
120,000pcs
High Diode Semiconductor
390*390*250
5
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