BCIHP0412-R68M

ROHS Compliant 承 認 書 SPECIFICATION FOR APPROVA CUSTOMER: CUSTOMER P/N: CUSTOMER PA RT NO: DESCRIPTION: PRODUCTS NO: FIRST DA TE: DA TE: A PPROV A L BY SMD INDUCTOR BCIHP0412-R68M 2019-10-22 2019-10-22 PURCHA SER CONFIRMED CHECK BY BC REV : X 1 DRA W N BY REMA RK A PPROV A L BY Ouyang weijun PROV IDER ENGINEER DEPT. CHECK BY DRA W N BY Xuqiuyue chenlinli 誠陽實業有限公司 TAIPEI OFF ICE TAIWAN CHENG YANG COMPONENT CORP 2F-1, NO. 176, Chine-Yi Road., Zhonghe District, New Taipei City, TAIWAN(R.O.C) 新北市中和區建一路176號2樓之一 POSTAL CODE: 23500 TEL NO.:+886-2- 8228-0930 FAX NO.:+886-2-8228-0929 E-mail:h21803@ms29.hinet.net 寶誠電子有限公司 CHINA FACTORYZHUHAI BAO CHENG ELECTRONICSCO.,LTD Guan Tang Industrial Park, Tang Jia Wan Town, Zhuhai City, Guangdong Province, CHINA 中國廣東省珠海市塘家灣鎮官塘工業區 POSTAL CODE: 519085 TEL NO:86-756-3383187 FAX NO:86-756-3380704 E-mail: baocheng@baocheng.biz 昆山誠陽電子有限公司 CHINA FACTORYKUNSHAN CHENG YANG ELECTRONICSCO.,LTDP 江蘇省昆山市高科技工業園區強安路35號 POSTAL CODE: 215300 TEL NO:86-512-57823500 FAX NO:86-512-57823503 E-mail: kscy@taiwan-chengyang.com.tw 1/8 ROHS Compliant SPECIFICATION FOR APPROVAL DATE: 2019-10-22 CUSTOMER: CUSTOMER PART NO: FIRST DATE: DESCRIPTION: SMD INDUCTOR PRODUCTS NO: BCIHP0412-R68M BC REV: 2019-10-22 X1 1.CONFIGURATION DIMENSIONS DIMENSIONS（UNIT:mm） A: 4.35 Max B: 4.80 Max C: 1.20 Max D: 1.60 ±0.2 E 0.76 ±0.3 R68 Marking：激光刻字 2.RECOMMEND LAND PATTERN DIMENSIONS F: G: H 4.95 1.95 1.60 3.ELECTRICAL CHARACTER Inductance (uH) Part Number BCIHP0412-R68M 0A 0.765 0.00 1A 0.762 0.70 2A 0.749 2.90 3A 0.730 6.70 Typical 33.5 Max 39.0 4A 0.713 12.80 5A 0.686 20.70 (5) (6) (Irms)(A) Heat Rating Current DC Amps Typical 5.0 6A 0.669 29.50 (Isat)(A) Saturation Current DC Amps Typical 9.0 △T≦40℃ 7A 0.636 46.20 8A 0.609 73.0 △L≦30% 9A 0.582 94.0 (1) Tolerance of Inductance: M=±20%. (2) All test data is referenced to 25℃ ambient. (3) Inductance is measured at200kHz/0.25v/0A..25℃ ambient. TEMPERATURE (℃) INDUCTANCE(uH) Adc L(0.68uH) △T(℃) 200kHz/0.25v/0A. 0.68 ± 20% Rdc (mΩ) DC CURRENT ( AMPS ) (4) Operating Temperature Range -40℃ to +125℃. (5) DC current (Irms) (A) that will cause an Approximate △T≦40℃ (6) DC current (Isat) (A) that will cause L0 to drop approximately △L≦30% (7) The part Temperature (ambient + temp rise) should not exceed 125℃ under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature Part temperature should be verified in the end application. ※Irms : Heat Rating Current DC Amps. ※Isat : Saturation Current DC Amps. 2/8 ROHS Compliant SPECIFICATION FOR APPROVAL DATE: 2019-10-22 CUSTOMER: CUSTOMER PART NO: FIRST DATE: DESCRIPTION: SMD INDUCTOR PRODUCTS NO: BCIHP0412-R68M BC REV: 2019-10-22 X1 4.PACKAGING INFORMATION (1) Tape Dimension / Packaging Quantity DIMENSIONS（UNIT:mm） A: 330.0 ±2.00 B: 100.0 ±0.50 C: 13.5 ±0.50 W1: 12.80 ±0.30 W2: 17.00 ±0.50 Q`TY: 4,000 PCS DIMENSIONS（UNIT:mm） W: 12.00 ±0.30 A0: 4.30 ±0.10 B0: 4.60 ±0.10 K0: 1.50 ±0.10 P: 8.00 ±0.10 F: 5.50 ±0.10 T: 0.30 ±0.05 (2) Tearing Off Force The force tearing off cover 10 to 130 grams (0.1N to 1.3N) in the arrow direction under the following conditions. ●Storage conditions/Note things (1) Storage temperature and humidity conditions : 1. Product packing with Carrier tape: +5℃~+40℃ and less than 60% RH. 2. Product alone: -20℃~+60℃ and less than 60% RH. (2) Products should be used within 6 months. (3) The packaging material should be kept where no chlorine or sulfur exists in the air. (4) Do not touch the electrodes (soldering terminals) with fingers as this may lead to deterioration of solder ability (5) The use of tweezers or vacuum pick-ups is strongly recommended for individual components. (6) Bulk handling should ensure that abrasion and mechanical shock are minimized. 3/8 ROHS Compliant SAMPLE ACKNOWLEDGE CHANGE RESUME DATE: 2019-10-22 CUSTOMER: CUSTOMER PART NO: FIRST DATE: 2019-10-22 DESCRIPTION: SMD INDUCTOR REV X1 PRODUCTS NO: BCIHP0412-R68M Change content 00 首次 BC REV: X1 Change reason Modify Date 首次送样 chenlinli 2019-10-22 4/8 ROHS Compliant TEST DATA CUSTOMER: CUSTOMER PART NO: FIRST DATE: DESCRIPTION: SMD INDUCTOR PRODUCTS NO: BCIHP0412-R68M BC REV: (1) TEST DATA FOR SAMPLE TEST ITEM Inductance (uH) Rdc (mΩ) (6) (Isat)(A)Saturation Current DC Amps (5) (Irms)(A)Heat Rating Current DC Amps MEAS ITEM SUGGEST 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 max min σ X Cpk A 4.350 Max 4.04 4.05 4.04 4.05 4.06 4.06 4.05 4.04 4.05 4.06 4.06 4.04 0.008 4.05 12.91 B 4.800 Max 4.39 4.36 4.37 4.38 4.37 4.39 4.37 4.38 4.37 4.39 4.39 4.36 0.010 4.38 14.03 2019-10-22 X1 LOT NO. DIMENSIONS（UNIT:mm） A 4.35 Max B 4.80 Max C 1.20 Max D 1.60 ±0.2 E 0.76 ±0.3 R68 1 2 3 4 DATE: 2019-10-22 C 1.200 Max 1.11 1.13 1.13 1.11 1.13 1.14 1.14 1.12 1.12 1.13 D 1.600 ±0.2 SPEC 0.68 ± 20% 39.0 Max 9.0 △L≦30% 5.0 △T≦40℃ E 0.760 ±0.3 1.14 1.11 0.010 1.13 2.42 2.TEST CONDITION TEMP. R.H. 65% 25℃ 3.TEST INSTRUMENTS □HP-4284A METER □CH-3305 METER ■HP-4285A METER □CD1068+CD1320 METER METER □HP-4191A □VR113+VR712 METER □ CH101 LCR,METER □WK3260B+WK3265B METER ■ VR116+VR7220 METER□VR562 METER □CH-3200 METER ■CH-502B DCR METER □CH-310 METER TEST CONDITION 200kHz/0.25v/0A. ± 0.674 0.674 0.696 0.688 0.689 0.631 0.691 0.625 0.662 0.684 2 39.0 Max 32.4 32.56 32.01 33.71 31.92 34.73 32.61 33.82 32.37 32.78 3 9.0 △L≦30% 75% 76% 77% 75% 75% 76% 75% 75% 76% 78% 0.70 0.63 0.024 0.67 2.03 34.73 31.92 0.857 32.89 2.38 78.0% 75.0% 0.010 75.8% 280.40 1 0.68 20% APPROVED BY ouyangweijun CHECKED BY Xuqiuyue DRAWN BY chenlinli 5/8 ■GENERAL CHARACTERISTICS page.1 Operation Temperature -40℃ to +125℃ (Includes temperature when the coil is heated) External Appearance On visual inspection, the coil has no external defects. More than 90% of terminal electrode should be covered with solder. l After fluxing, component shall be dipped in a melted. Solder Ability Test dipped in a melted. Solder:bath at 235℃±5℃ for 5 ± 0.5senonds 1.Components should have not evidence of electrical and mechanical damage. 2.Inductance: within±10% of initial value. 3.Impedance: within±10% of initial value. Heat endurance of Soldering●Preheat:150±5℃ 60seconds. ●Solder temperature: 250±5℃. ●Flux: rosin. ●Dip time:10±0.5seconds. After soldering of X,Y withstanding at below conditions .The terminal should not Peel off. (Refer to figure at below) Terminal Strength 5N:60sec. Insulating Resistance Over 100MΩ at 100V D.C. between coil and core. Dielectric Strength No dielectric breakdown at 30V D.C. for 1 minute between coil and core. VibrationTest Inductance deviation within +10% after vibration for 1 hour. In each of three orientations at sweep vibration(10-~55-~10HZ)with 1.5mmP-P amplitudes Inductance deviation within +10% after being dropped once with 981m/s2 (100G) Drop test shock Attitude upon a rubber block method shock testing machine, in three different orientations  Application Notice/Handling 1. Storage Conditions To maintain the solder ability of terminal electrodes: 1. Storage Conditions To maintain the solder ability of terminal electrodes: (1) Temperature and humidity conditions: less than 40℃ and 70% RH. (2) Products should be used within 6 months. (3) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Handling (1) Do not touch the electrodes(soldering terminals)with fingers as this may lead to deterioration of solderability. (2) The use of tweezers or vacuum pick-ups is strongly recommended for individual components. (3) Bulk handling should ensure that abrasion and mechanical shock are minimized. ■GENERAL CHARACTERISTICS TEST Required Characteristics page.2 Test Method/Condition 1. No case deformation or change in appearance 2. △L/L≦10% High Temperature StorageTest 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: MIL-STD-202G Method108A Temperature:125℃±2℃ Time:96±2 hours. Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦10% Low Temperature Storage Test 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: IEC 68-2-1A 6.1 6.2 Temperature:-40℃±2℃ Time:96±2 hours. Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦10% 3. △Q/Q≦30% Humidity Test 4. △DCR/DCR≦10% Reference documents: MIL-STD-202G Method103B Thermal Shock Test 1. Dry oven at a temperature of 40℃±2℃ for 96hours 2. Measurements At the end of this period 3. Exposure: Temperature: 40℃±2℃. Humidity:93±2hoyrs. 4. Tested while the chamber. 5. Tested not less than 1 hour. Nor more than 2 hours at room temperature. 1. No case deformation or change in appearance 2. △L/L≦10% 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: MIL-STD-202G Method107G First–40℃ for 30 Minutes, last 125℃ for 30 Minutes as 1 cycle. Go through 20 cycles. ■Application Notice/Handling (1) Temperature and humidity conditions : less than 40℃ and 70% RH. (2) Products should be used within 6 months. (3) The packaging material should be kept where no chlorine or sulfur exists in the air. (4) Do not touch the electrodes (soldering terminals) with fingers as this may lead to deterioration of solder ability (5) The use of tweezers or vacuum pick-ups is strongly recommended for individual components. (6) Bulk handling should ensure that abrasion and mechanical shock are minimized. ■THE CONDITION OF REFLOW(RECOMMENDATION) TYPICAL WAVE SOLDER PROFILE FOR LEADED AND LEAD -FREE THROUGH-HOLE PACKAGES IPC/JEDEC J-STD-020C, Figure 5-1 page.3 TYPICAL IR REFLOW PROFILE FOR LEADED AND LEAD -FREE SURFACE MOUNT PACKAGES