ES2A THRU ES2J
HD BK 60
SMBG Plastic-Encapsulate Diodes
Super Fast Recovery Rectifier Diode
Features
●Io
2A
SMBG
●VRRM
50V-600V
●High surge current capability
●Glass passivated chip
● Polarity: Color band denotes cathode
Applications
● Rectifier
Marking
● ES2X
X : From A To J
Item
Symbol
Unit
ES2
Test Conditions
A
B
C
D
G
300
400
Repetitive Peak Reverse Voltage
VRRM
V
50
100
Maximum RMS Voltage
V RMS
V
35
70
Average Forward Current
IF(AV)
A
60HZ Half-sine wave, Resistance
load, TL=110℃
2.0
Surge(Non-repetitive)Forward
Current
IFSM
A
60Hz Half-sine wave ,1 cycle ,
Ta =25℃
50
TJ
℃
-55~+150
TSTG
℃
-55 ~ +150
Junction Temperature
Storage Temperature
150 200
E
H
J
500 600
105 140 210 280 350 420
Electrical Characteristics (Ta=25℃ Unless otherwise specified)
Item
Symbol
Unit
Peak Forward Voltage
VF
V
IF =2.0A
Maximum reverse recovery
time
trr
ns
IF=0.5A,IR=1.0A,Irr=0.25A
Peak Reverse Current
Thermal
Resistance(Typical)
IRRM1
μA
IRRM2
RθJ-A
Test Condition
VRM=VRRM
ES2
A
B
C
D
E
0.95
G
1.25
H
J
1.7
35
Ta =25℃
5.0
Ta =100℃
100
1)
Between junction and ambient
75
Between junction and terminal
20
℃/W
RθJ-L
1)
Notes:
Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.27" x 0.27" (7.0 mm x 7.0 mm)er
copper pad areas
High Diode Semiconductor
1
Typical Characteristics
FIG.2: MAXIMUM NON-REPETITIVE FORWARD URGE CURRENT
IFSM(A)
IO(A)
FIG.1: FORWARD CURRENT DERATING CURVE
3.5
50
3.0
8.3ms Single Half Sine Wave
40
2.5
30
2.0
1.5
20
1.0
0
10
60Hz Resistive or Inductive Load
P.C.B. Mounted on 0.27"×0.27"
(7.0mm×7.0mm)Copper Pad Areas
0.5
50
70
90
110
130
0
150
TL(℃)
1
10
FIG.4:TYPICAL REVERSE CHARACTERISTICS
IR(uA)
IF(A)
FIG.3: TYPICAL FORWARD CHARACTERISTICS
100
TJ=25℃
Pulse width=300us
1% Duty Cycle
ES2A-D
10
100
Number of Cycles
10000
Tj=150℃
1000
ES2E-G
Tj=125℃
Tj=100℃
100
ES2H-J
1.0
10
0.1
Tj=25℃
1.0
0.1
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
VF(V)
0
20
40
60
80
100
Voltage(%)
FIG.5: Diagram of circuit and Testing wave form of reverse recovery time
I
D
trr
IF
VR
IF
RL
t
0
IRR
IR
High Diode Semiconductor
2
SMBG
0.155(3.94)
0.130(3.30)
0.087 (2.20)
0.071 (1.80)
0.180(4.57)
0.160(4.06)
0.012(0.305)
0.006(0.152)
0.096(2.44)
0.084(2.13)
0.060(1.52)
0.030(0.76)
0.008(0.203)MAX.
0.220(5.59)
0.205(5.21)
Dimensions in inches and (millimeters)
SMBG
4.26
1.8
JSHD
JSHD
High Diode Semiconductor
3
Reel Taping Specifications For Surface Mount Devices-SMBG
G
High Diode Semiconductor
4
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