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MXD8641H

MXD8641H

  • 厂商:

    MAXSCEND(卓胜微电子)

  • 封装:

    QFN-14-EP(2x2)

  • 描述:

    SP4T Switch for 2G/3G/4G Application

  • 数据手册
  • 价格&库存
MXD8641H 数据手册
MXD8641H SP4T Switch for 2G/3G/4G Application VED APPRO This document contains information that is confidential and proprietary to Maxscend Technologies Inc. (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Page 1 of 7 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8641H – SP4T for LTE diversity and RX General Description Applications The MXD8641H is a SOI SP4T switch suitable for GSM/LTE/UMTS/CDMA transmit and receive  2G/3G/4G TRX applications  Cellular modems and USB Devices applications. The MXD8641H features very low insertion loss, high isolation and excellent Features linearity performance down to 1.0V control  voltage at high frequency up to 2.7GHz. In Excellent insertion loss and isolation performance addition, this switch is able to handle high power - 0.5 dB Insertion Loss at 2.7GHz signals up to 36dBm. The MXD8641H has - 25 dB Isolation at 2.7GHz internal ESD protection devices to achieve excellent ESD performances. No DC Blocking capacitors are required for all RF ports unless DC is biased externally. And the compact QFN-  Multi-Band operation 100MHz to 3000MHz  P0.1dB of 36dBm  Compact 2mm x 2mm in QFN-14 package  No DC blocking capacitors required (unless 14L 2mm×2mm×0.55mm package is adopted. external DC is applied to the RF ports) Functional Block Diagram and Pin Function RF1 3 VDD 4 12 2 NC RF3 13 1 ANT ANT RF3 NC 14 RF2 NC RF1 Ground Paddle 11 NC 10 RF4 9 RF2 8 NC RF4 6 7 V3 V2 V1 V2 5 VDD V1 V3 Figure 1 Functional Block Diagram and Pinout (Top View) Page 2 of 7 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8641H – SP4T for LTE diversity and RX ANT Application Circuit RF1 VDD VDD 12 RF1 13 14 RF3 RF3 NC ANT NC NC 1 11 2 10 3 9 4 8 NC RF4 RF2 RF4 RF2 NC C4 100pF V1 C2 100pF V2 V3 C1 100pF 7 6 5 V3 V2 V1 C3 100pF Figure 2 MXD8641H Evaluation Board Schematic Table 1. Pin Description Pin No. 1 2 3 4 5 6 7 Ground Paddle Name NC RF3 RF1 VDD V3 V2 V1 GND Description No connection RF port3 RF port1 Power supply Control logic 3# Control logic 2# Control logic 1# Ground Pin No. 8 9 10 11 12 13 14 Name NC RF2 RF4 NC NC ANT NC Description No connection RF port2 RF port4 No connection No connection Antenna port No connection Note: Bottom ground paddles must be connected to ground. Page 3 of 7 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8641H – SP4T for LTE diversity and RX Truth Table Table 2. Control pins V1 0 0 0 0 Note: V2 0 0 1 1 Switched RF Outputs V3 0 1 0 1 RF1 Insertion Loss Isolation Isolation Isolation RF2 Isolation Insertion Loss Isolation Isolation RF3 Isolation Isolation Insertion Loss Isolation RF4 Isolation Isolation Isolation Insertion Loss “1” = 1.0 V to 3.0 V. “0” = 0 V to 0.3 V. Recommended Operation Range Table 3. Recommended Operation Condition Parameters Operation Frequency  Power supply  Switch Control Voltage High  Switch Control Voltage Low  Symbol f1  VDD  VH  VL  Min 0.1  2.5  1.0  0  Typ ‐  2.8  1.8  0  Max 3.0  3.0  3.0  0.3  Units GHz  V  V  V  Specifications Table 4. Electrical Specifications Parameter  Test Condition (Note 2)  Symbol  Min  Typical  Max  Units DC Specifications Supply voltage  VDD       2.5  2.8  3.0  V  Supply current  IDD  VCTL_H  VCTL_L  ICTL         40       1.35  1.80   VCTL = 1.8 V      0.5  60  3.0  0.3  1.0  uA  V  V  μA  10% to 90% RF    1  2  ìs  Time from VDD=0V to part  ON and RF at 90%     5  10  ìs  0.50   0.55   0.60  35  28  22  20  18  15  0.40  0.45  0.50  40  33  25  25  22  20       dB  dB  dB  dB  dB  dB  dB  dB  dB  36       Control voltage: High Low  Control current  Switching  Speed,  on  RF  to  another  Turn‐on time    ton  RF Specifications Insertion loss (ANT pin to  RF1/2/3/4 pins)   IL  Isolation (ANT pin to  RF1/2/3/4 pins)   Iso  Input return loss (ANT pin to  RF1/2/3/4 pins)    RL  0.1 dB Compression Point  (ANT pin to RF1/2/3/4 pins)    P0.1dB  0.1 to 1.0 GHz  1.0 to 2.0 GHz   2.0 to 2.7 GHz  0.1 to 1.0 GHz   1.0 to 2.0 GHz   2.0 to 2.7 GHz  0.1 to 1.0 GHz  1.0 to 2.0 GHz   2.0 to 2.7 GHz       0.1 GHz to 3.0 GHz              dBm Page 4 of 7 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8641H – SP4T for LTE diversity and RX Absolute Maximum Ratings Table 5. Maximum ratings Parameters Symbol Minimum Maximum Units Supply voltage Control voltage (V1, V2, and V3) RF input power (RF1 to RF4) Operating temperature Storage temperature Electrostatic Discharge, Human Body Model (HBM), Class 1C VDD 2.5 +3.0 V VCTL 0 +3.0 V +36 dBm +85 +125 ℃ ℃ 1000 V PIN TOP TSTG –20 –40 ESD Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device Page 5 of 7 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8641H – SP4T for LTE diversity and RX Package Outline Dimension Figure 3 package outline dimension Page 6 of 7 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8641H – SP4T for LTE diversity and RX Reflow Chart tP Critical Zone TL to TP P Ramp‐up Temperature L TSmax tL TSmin Ramp‐down tS Preheat t 25 ℃ to Peak Time Figure 4 Recommended Lead-Free Reflow Profile Table 6. Reflow condition Profile Parameter Ramp-up rate(TSmax to Tp) Preheat temperature(TSmin to TSmax) Preheat time(ts) Time above TL , 217℃(tL) Peak temperature(Tp) Time within 5℃ of peak temperature(tp) Ramp-down rate Time 25℃ to peak temperature Lead-Free Assembly, Convection, IR/Convection 3℃/second max. 150℃ to 200℃ 60 - 180 seconds 60 - 150 seconds 260℃ 20 - 40 seconds 6℃/second max. 8 minutes max. ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be used when handling these devices. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant. Page 7 of 7 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential
MXD8641H 价格&库存

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MXD8641H
  •  国内价格
  • 5+0.74715
  • 50+0.61755
  • 150+0.55275
  • 500+0.50415

库存:973